Introduction to AWR Design Flow and New Features for V10

Similar documents
Chip/Package/Board Design Flow

AXIEM EM Simulation/Verification of a Cadence Allegro PCB

New Technologies in CST STUDIO SUITE CST COMPUTER SIMULATION TECHNOLOGY

Outline. Darren Wang ADS Momentum P2

TQPED MMIC Design Training

O N C A D E N C E V I R T U O S O. CHEN, Jason Application Engineer, Keysight Technologies

Realize Your Product Promise. DesignerRF

Lecture 2: Introduction

Microwave Office Getting Started Guide

Using Sonnet Interface in Eagleware-Elanix GENESYS. Sonnet Application Note: SAN-205A JULY 2005

What's New in AWRDE 13

Lecture 7: Introduction to HFSS-IE

Introducing Virtuoso RF Designer (RFD) For RFIC Designs

Joe Civello ADS Product Manager/ Keysight EEsof EDA

HFSS 14 Update for SI and RF Applications Markus Kopp Product Manager, Electronics ANSYS, Inc.

Getting Started with RF & Microwave Design with AWR Micrawave Office Andriy Gordiyenko, RF-Engineering & Consulting Aribonenstr 15, D-81669, München

HFSS for ECAD: Package Modeling, MMIC and on-die extraction

AWR. White Paper. Exactly How Electromagnetic Should Be Part of a Design Flow! introduction

Welcome. Joe Civello ADS Product Manager Agilent Technologies

Simulation and Modeling Techniques for Compact LTCC Packages

New paradigm for MEMS+IC Co-development

High-Frequency Algorithmic Advances in EM Tools for Signal Integrity Part 1. electromagnetic. (EM) simulation. tool of the practic-

Microwave Office Training

Using Sonnet in a Cadence Virtuoso Design Flow

Analysis of a silicon piezoresistive pressure sensor

TABLE OF CONTENTS 1.0 PURPOSE INTRODUCTION ESD CHECKS THROUGHOUT IC DESIGN FLOW... 2

For functionality and CAD/EDA import filter, see technical specifications of the CST STUDIO SUITE

Engineering 1000 Chapter 6: Abstraction and Modeling

Simulation Advances for RF, Microwave and Antenna Applications

Genesys 2012 Tutorial - Using Momentum Analysis for Microwave Planar Circuits

Enabling SI Productivity Part 2. Venkatesh Seetharam Aaron Edwards

Comparing SYMMIC to ANSYS and TAS

EM Analysis of High Frequency Printed Circuit Boards. Dr.-Ing. Volker Mühlhaus

Chapter 4 Determining Cell Size

Layer Stackup Wizard: Intuitive Pre-Layout Design

Efficient Meshing in Sonnet

Electrical optimization and simulation of your PCB design

Finite Element Analysis using ANSYS Mechanical APDL & ANSYS Workbench

LAB EXERCISE 3B EM Techniques (Momentum)

EE 210 Lab Assignment #2: Intro to PSPICE

MRI Induced Heating of a Pacemaker. Peter Krenz, Application Engineer

Application Note. Pyramid Probe Cards

m/matl - The EM Technology File Editor for RFIC

Expert Layout Editor. Technical Description

EXPERIMENT 1 INTRODUCTION TO MEMS Pro v5.1: DESIGNING a PIEZO- RESISTIVE PRESSURE SENSOR

Achieve more with light.

Cadence Virtuoso Schematic Design and Circuit Simulation Tutorial

LAB EXERCISE 2 EM Basics (Momentum)

Getting started. Starting Capture. To start Capture. This chapter describes how to start OrCAD Capture.

CoventorWare 10 Overview

Amplifier Simulation Tutorial. Design Kit: Cadence 0.18μm CMOS PDK (gpdk180) (Cadence Version 6.1.5)

Keysight EEsof EDA EMPro

FOUNDRY SERVICES. RF & mm-wave Applications. 1GHz 2GHz 5GHz 10GHz 20GHz 50GHz 100GHz

SmartSpice Analog Circuit Simulator Product Update. Yokohama, June 2004 Workshop

PTC Creo Simulate. Features and Specifications. Data Sheet

Introduction to FEM calculations

Virtuoso - Enabled EPDA framework AIM SUNY Process

Process technology and introduction to physical

Schematic/Design Creation

First Steps with ADS and Coax Modeling

Sorting Through EM Simulators

INFN - Thermal analysis of crate with motherboards, daughterboards and AM chips

HFSS Solver On Demand for Package and PCB Characterization Using Cadence. Greg Pitner

Introduction to Abaqus. About this Course

Large-Scale Full-Wave Simulation

Virtuoso Custom Design Platform GXL. Open Database. PDKs. Constraint Management. Customer IP

AMS Behavioral Modeling

By Joe Grimm, Business Development Manager, RFIC Switches, California Eastern Laboratories

TINA-TI Simulation Software. Application Note

At Sonnet, we've been developing 3D planar high frequency EM software since 1983, and our software has earned a solid reputation as the world's most

Powerful features (1)

A Coupled 3D/2D Axisymmetric Method for Simulating Magnetic Metal Forming Processes in LS-DYNA

Introduction to Solid Modeling Parametric Modeling. Mechanical Engineering Dept.

HFSS Solver-On-Demand for Package and PCB Characterization Using Cadence Greg Pitner

GETTING STARTED WITH ADS

Package on Board Simulation with 3-D Electromagnetic Simulation

There are three windows that are opened. The screen that you will probably spend the most time in is the SCHEMATIC page.

HFSS 3D Components. Steve Rousselle, ANSYS. Build, Share, Conquer Release. Release ANSYS, Inc.

Ansys Designer RF Training Lecture 2: Introduction to the Designer GUI

MAXREFDES108#: NON-ISOLATED 12V/1A POE POWERED DEVICE POWER SUPPLY

MAX2009/MAX2010 Evaluation Kits

Skill Development Centre by AN ISO CERTIFIED COMPANY

Creating Database Reports

EE 330 Spring 2018 Laboratory 2: Basic Boolean Circuits

Chapter 5 Modeling and Simulation of Mechanism

TEMPERATURE SENSOR/FAN CONTROL BOARD USER'S MANUAL

PDK-Based Analog/Mixed-Signal/RF Design Flow 11/17/05

DEVELOPMENT OF PARAMETERIZED CELL OF SPIRAL INDUCTOR USING SKILL LANGUAGE

EE 330 Laboratory Experiment Number 11 Design, Simulation and Layout of Digital Circuits using Hardware Description Languages

Process Design Kit for for Flexible Hybrid Electronics (FHE-PDK)

Brüel & Kjær Sound & Vibration Measurement A/S. Copyright All Rights Reserved. LASER USB Vibration Control System

Digital Design Methodology (Revisited) Design Methodology: Big Picture

Failure Analysis of Electrostatic Discharge and Electrical Overstress Failures of GaAs MMIC

CoventorWare Tutorial. Presented by Brian Pepin 11/07/2011

pre- & post-processing f o r p o w e r t r a i n

A New Methodology for Interconnect Parasitic Extraction Considering Photo-Lithography Effects

Introduction to ANSYS DesignModeler

Laker 3 Custom Design Tools

Digital Design Methodology

Virtuoso System Design Platform Unified system-aware platform for IC and package design

Transcription:

Introduction to AWR Design Flow and New Features for V10

What s New In Version 10

imatch Matching Network Synthesis Matching Network Synthesis Tight integration with AWR tools Excellent starting point for further AWR analysis EM verification and EM synthesis 26/11/2012 2012 AWR Corporation. All rights reserved. 3

VSS / LabVIEW Integration LabVIEW VI s can be instantiated in system diagrams Signal Processing Modulated waveform creation and demodulation Comparing simulated and measured data Created behavioral models Measurements include ACPR, EVM Bit Error Rate, etc., Co-design with VSS and LabVIEW 26/11/2012 2012 AWR Corporation. All rights reserved. 4

Circuit Envelope Simulation Arbitrary circuit schematics in VSS for DPD / envelope tracking Monitor or control node current, node voltage, or PAE 26/11/2012 2012 AWR Corporation. All rights reserved. 5

SYMMIC Thermal Simulator Design-state thermal analysis of MMIC PA s Thermal stackups defined by process simplifying setup for new circuits Generate thermal impedance networks for transient simulation 26/11/2012 2012 AWR Corporation. All rights reserved. 6

Antenna Magus Interface Antenna evaluation, selection and synthesis Searchable database of antennas Synthesized planar antennas can be directly exported to MWO/AXIEM 26/11/2012 2012 AWR Corporation. All rights reserved. 7

Analyst 3D FEM Solver Finite Element, Open Boundary 3D Solver Over a Decade in Development in Collaboration with the Dept of Energy and DoD. Employed at Nearly all US National Labs and Accelerators as Well as Several Commercial Suppliers of X-Ray Equipment Highly Distributed, Very High Capacity Fully Integrated into AWR framework 26/11/2012 2012 AWR Corporation. All rights reserved. 9

Analyst Integration Goal: Make 3D-EM Simulation Easier Analyst and AXIEM will both take advantage of the AWR Extract Flow.* Same Schematic and Schematic- Layout in MWO as always 3D Pcells Setup Automatically *The extract flow for Analyst will be supported post AWR2012 release 26/11/2012 2012 AWR Corporation. All rights reserved. 10

Analyst Integration Continued Supports extruded 2D shapes and 3D pcells today Support arbitrary 3D documents in future release Encapsulant Port 2 Port 1 Rogers 4003 GaAs die 26/11/2012 2012 AWR Corporation. All rights reserved. 11

Other V10 Improvements

Microwave Office: Highlights Key New Features Floating windows Project import Yield analysis and optimizers Layout setup wizard New example design kits RF aware short checker ADS Schematic Importer 26/11/2012 2012 AWR Corporation. All rights reserved. 13

AXIEM: Highlights Key New Features Asynchronous simulation Datasets Yield and optimization Improved de-embedding Rule-based shape modifiers User-defined X-models Frequency dependent materials New licensing model 26/11/2012 2012 AWR Corporation. All rights reserved. 14

AXIEM Geometry Simplification A Plated Line in MMIC(no Simplification) Etch Layer Expanded for Easy Visualization Insets will Increase Unknowns # Unknowns 3669 26/11/2012 2011 AWR Corporation. All rights reserved. 15

AXIEM Geometry Simplification Shape Pre- Processor optimizes the geometry before simulation Insets eliminated by Axiem # Unknowns 1320 26/11/2012 2011 AWR Corporation. All rights reserved. 16

AXIEM Geometry Simplification Example 2 A line Connected to Top Plate of Cap An airbridge is created by metal being deposited over a layer of some material that is then etched away Airbrige(Auto Generated by Bridge code in Layout) EM Extracted 3D View(No Simplification) 26/11/2012 2011 AWR Corporation. All rights reserved. 17

AXIEM Geometry Simplification Example 2 Geometry Simplification allows auto Air Bridge Creation The rules can do many powerful things such as create layers based on the geometry Rules Part of MMIC PDK (no end user input required) Can Be Easily customized Automatically Applied from AWR s EXTRACT Flow Preview Mode Allows Quick Visualization and De-bugging 26/11/2012 2011 AWR Corporation. All rights reserved. 18

Rules Based Simplification - Advantages Rules Support Intelligent Detection of Caps(to maintain Area and Prevent Snapping) and Resistors Boolean and resize Operations Shape Snapping Intelligently remove vertices with Extreme Angles Circle and Circle Arc Re-Shaping Can Distinguish Between Ground and Trace Shapes Merge and Reshape Vias and Via Fields 26/11/2012 2011 AWR Corporation. All rights reserved. 19

More Design features: EM Sweeps EM Structure s layouts can now be swept and then used in schematics 2011 AWR Corporation. All rights reserved. Slide 26/11/2012 20

Geometric Simplification Example Two Stage AMP No Simplification # Unknowns 35316 26/11/2012 2011 AWR Corporation. All rights reserved. 21

Geometric Simplification Example Two Stage AMP With Simplification - # Unknowns 26772 26/11/2012 2011 AWR Corporation. All rights reserved. 22

Connectivity Checker Connectivity checker allows users to color code DC connections in their 2 and 3-D layouts Normal Layout View Trace one DC connection at time Trace All DC Connections All Connections 3-D 26/11/2012 2011 AWR Corporation. All rights reserved. 23

Visual System Simulator: Highlights Key New Features Radar library Envelope simulation RFB spreadsheet wizard Nonlinear co-simulation block passed parameters LabVIEW co-simulation 26/11/2012 2012 AWR Corporation. All rights reserved. 25

Nonlinear Behavioural Modelling

Introduction Modeling domains Modeling effects Model types Simulator compatibility Other considerations Conclusions 26/11/2012 2012 AWR Corporation. All rights reserved. 27

Modeling Domains Circuit Level Harmonic Balance, transient, and circuit envelope Models formulated in time or frequency domain Voltages, currents, power, etc. Microwave Office System Level Generally fixed time step, time domain (data flow) One or more samples in, one or more samples out EVM, ACPR, etc. Visual System Simulator 26/11/2012 2012 AWR Corporation. All rights reserved. 28

Modeling Effects Linear Memory Frequency dependant behavior Caused by linear capacitances and inductances Nonlinear Memory Previous operating condition dependant behavior (e.g. Hysteresis) Caued by interaction of low frequency mixing products with bias circuitry, self heating effects, trapping, etc. 26/11/2012 2012 AWR Corporation. All rights reserved. 29

Memory Modeling Model Types Non-Linear Memory Compact Model Behavioral Volterra TDNN Linear Memory S-Parameters Polyharmonic Model AM/AM & AM/PM No Memory Linear Weakly Nonlinear Strongly Nonlinear Operating Region System Level Simulation Steady State Circuit Simulation Only Circuit Level Simulation 26/11/2012 2012 AWR Corporation. All rights reserved. 30

Simulator Compatibility Model Types Compact Models Poly Harmonic Distortion Model Discrete Time System Model * ** Behavioral Model Extraction Circuit/System Co-Simulation Simulation Types Time Domain Circuit Level Simulation Steady State Circuit Level Simulation System Level Simulation * A system model can be extracted, but is equivalent to an AM/AM & AM/PM model ** Currently, this path does not model linear or non-linear memory effects 26/11/2012 2012 AWR Corporation. All rights reserved. 31

Extraction and Distribution Measurement Time Time to generate data needed to generate model Can be simulated or hardware measurement based Model Extraction Time Time to generate the model from measurement data Simulator Evaluation Time How quickly model evalutes in intended simulators File Size Generated model file size Important for model distribution 26/11/2012 2012 AWR Corporation. All rights reserved. 32

Extraction and Distribution Details 26/11/2012 2012 AWR Corporation. All rights reserved. 33

Behavioral Modeling Conclusions Simulation tool support is important Polyharmonic distortion models in the real world System level modeling rapidly emerging 26/11/2012 2012 AWR Corporation. All rights reserved. 34

Product Roadmaps

Microwave Office Roadmap Proposed Features Datasets for circuit simulators Asynchronous simulation for circuit simulators Circuit Envelope improvements Improved board tool integration (Zuken, Mentor, Cadence, etc.) General performance improvements 26/11/2012 2012 AWR Corporation. All rights reserved. 36

EM Roadmap Proposed features Distributed Simulation Problem Decomposition Matrix Frequency Parametric Yield / Opt Trial Thin Vertical Walls Arbitrary 3D Editor General Performance Improvements 26/11/2012 2012 AWR Corporation. All rights reserved. 37

Visual System Simulator Roadmap Proposed Features Datasets LabVIEW Integration Improvements Model Extraction Communications Libraries Signal Processing General Performance Improvements 26/11/2012 2012 AWR Corporation. All rights reserved. 38

Conclusions V10 Release Circuit Envelope Simulation 3D EM and Thermal Simulation Nonlinear Behavioral Modeling Read and Write X-parameters LabVIEW and TDNN Roadmap 26/11/2012 2012 AWR Corporation. All rights reserved. 39

Questions? 26/11/2012 2012 AWR Corporation. All rights reserved. 40