ArrayC-60035-4P Overview SensL s C-Series low-light sensors feature an industry-leading low dark-count rate, combined with high PDE. Here, a 2x2 array of 6mm, SMT packaged devices have been mounted on a PCB with minimal deadspace. The four anodes and the common cathode are routed to the back of the PCB and can be accessed with via a ball grid array (-PCB version) or 8-pin DIL socket compatible (-EVB version). If the four anode outputs are summed then the ArrayC- 60035-4P forms a single channel, large-area sensor that can be used as a solid-state alternative to the 1/2 PMT. This User Manual covers all aspects of using and understanding the ArrayC-60035-4P. More details can be found in the Product Brief. The C-Series SiPM sensors used in the ArrayC-60035-4P are based on a P-on-N diode structure (Figure 1) that results in a high PDE (Photon Detection Efficiency) and sensitivity into the UV. Unlike other C-Series sensors, the ArrayC-60035-4P does not have access to the fast output. Instead, the standard signal is read from the anode-cathode output. There is an individual output from the anode from each of the four sensors, and single common cathode that is the sum of the four individual cathode outputs. The four anode outputs and the common cathode are available either via a ball grid array (ArrayC-60035-4P-PCB) or from the 8-pin DIL-socket-compatible pins (ArrayC-60035-4P-EVB) of the evaluation board. The provision of the four anode outputs allows the option of using this product either as a quadrant sensor (reading out four signals individually) or as a single, large-area sensor (by summing the four anodes together). C-Series Figure 1, P-on-N structure of the C-Series sensors Figure 2, Electrical layout of the ArrayC-60035-4P SensL 2015 1
Contents Overview...1 Biasing and Readout...3 Recommended Biasing...3 Recommended Readout and Amplification...3 Schematics, Pad Identification and Solder Footprint...4 ArrayC-60035-4P-PCB...4 ArrayC-60035-4P-PCB - Solder Footprint...4 Schematics & Pin Identification...5 ArrayC-60035-4P-EVB...5 Handling and Soldering...6 Safe Handling of Sensors...6 Product Summary...6 Creating Arrays of ArrayC-60035-4P-PCB Sensors...7 Solder Reflow Conditions...7 SensL 2015 2
Biasing and Readout Recommended Biasing The Array-60035-4P can be biased with either a positive or negative bias. For most applications SensL recommends that a positive bias voltage be applied to the cathode. The anodes should then be connected to zero volts. For multi-channel use the anodes can be individually readout. An example circuit for a single channel is shown in Figure 4. For single-channel use the anodes can be summed together prior to amplification. Recommended Readout and Amplification Figure 4 shows how the C-Series devices can be connected to a standard high-speed, transimpedance amplifier, such as the OPA656, to convert the output signal current to a voltage. If higher dynamic range is required, R1 can be changed from 470W to 120W. Figure 3, Generic biasing set-up with decoupling capacitors. Figure 4, Example circuit for readout of the ArrayC-60035-4P. If higher dynamic range is required, R1 can be changed from 470W to 120W. SensL 2015 3
Schematics, Pad Identification and Solder Footprint ArrayC-60035-4P-PCB Bump No. Function A1 Anode 1 A2 Anode 2 B1 Anode 3 B2 Anode 4 A3, B3, C1, C2, C3 Common Cathode ArrayC-60035-4P-PCB - Solder Footprint The diagram below, shows the recommended solder footprint for use with the the ArrayC-60035-4P-PCB. SensL 2015 4
Schematics & Pin Identification ArrayC-60035-4P-EVB Pin No. Function 1 Anode 1 3 Anode 3 6 Anode 4 8 Anode 2 2, 4, 5, 7 Common Cathode The pins of the ArrayC-60035-4P-EVB are compatible with a standard 8-pin DIL socket. An example is the 110-93-308-41- 001000 from Mill-Max. SensL 2015 5
Handling and Soldering Safe Handling of Sensors When unpacking, care should be taken to prevent dropping or misorienting the sensors. The type of packaging the sensors are shipped in will depend upon the quantity of parts ordered. Remember that the SiPM is a sensitive optoelectronic instrument; always handle the sensor as carefully as possible. The sensor should be disconnected from the bias supply when not in use. SiPM sensors are ESD sensitive. The following precautions are recommended: Ensure that personal grounding, environmental controls and work surfaces are compliant with recommendations in JESD625. Ensure that all personnel handling these devices are trained according to the recommendations in JESD625. Devices must be placed in an ESD approved carrier during transport through an uncontrolled area. Product Summary The ArrayC-60035-4P is composed of MicroFC-60035-SMT sensors reflow soldered onto PCB. The ArrayC- 60035-4P-EVB has pins on the back of the PCB and is suitable for use with an 8-pin DIL socket for evaluation purposes. Alternatively, the pins can be directly soldered into through-holes in the user s PCB. For high-volume use the ArrayC-60035-4P-PCB is recommended. This has a ball-grid array that can be mounted onto a readout board using standard reflow solder processes (J-STD-20). The recommended solder footprint is given in the CAD section on page 4. The sensors are shipped in moisture barrier bags (MBB) according to the J-STD 033 standard. An unopened MBB should be stored at a temperature below 40 O C with humidity below 90%RH. After the MBB has been opened, the devices must be reflow soldered within a period of time depending on the moisture sensitivity level (MSL), which is MSL4. See Table 1 for details. MSL Exposure time Condition 4 72 hours 30 C/60% RH Table 1, MSL definitions applicable to SensL products (reference J-STD 020). The components are resilient to commonly used SMT flux cleaning detergents. It is important to allow the PCB to cool to room temperature after reflow and before flux cleaning in order to avoid excessive thermal shock. A solution of 20% Isopropyl alcohol can be used for cleaning the sensors. 100% Isopropyl alcohol should not be used. SensL 2015 6
Creating Arrays of ArrayC-60035-4P-PCB Sensors If multiple ArrayC-60035-4P-PCB parts are to be mounted in close proximity (e.g. 1D or 2D arrays), the following recommendations may be helpful. These should be discussed with your contract manufacturer. Minimum spacing between parts of 200mm. Use of FR4 PCB as the substrate material Use commercial automatic placement machines to achieve the necessary placement accuracy to give the above spacing and planarity. Take into account the MSL 4 specifications of the array when assembling. Hold the PCB board in a rigid frame to avoid warping due to the heat process. Solder Reflow Conditions The ArrayC-60035-4P-PCB product must be mounted according to specified soldering pad patterns as given on page 4. Solder reflow conditions must be in compliance with J-STD-20, table 5.2. This is summarized in Figure 5. The number of reflow solder passes shall not be more than 2. Temperature ( O C) 300 250 200 150 100 Solder Reflow Profile Max 4 O C/sec 60 to 120 sec Max 260 O C 217 O C 180 O C Max 10sec at 260 O C 60~100sec 50 0 0 50 100 150 200 250 300 Time (sec) Figure 5, Reflow solder profile for use with the ArrayC-60035-4P-PCB All specifications are subject to change without notice www.sensl.com sales@sensl.com +353 21 240 7110 (International) +1 650 641 3278 (North America) Rev. 1.1 March 2015 SensL 2015 7