Vivek Tyagi- Director Business Development - SanDisk Automotive Storage Update August 2017

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Transcription:

Vivek Tyagi- Director Business Development - SanDisk Automotive Storage Update August 2017 c

Western Digital/SanDisk Overview Trends in Automotive storage Flash Solutions for storage in Car Electronics

Western Digital MOBILE COMPUTE AUTO Global leader in Storage Revenue $19B in 2016-2017 Global leader in technology 13,500 active patents worldwide Global leader in technology and storage solutions Enabling IoT from Edge to Core INDUSTRIAL HOME DATACENTER 2017 Western Digital Corporation or its affiliates. A ll rights reserved. 3

Captive NAND Supply Critical to Serving a Robust Platform Japan China Malaysia Semiconductor Fabs Die Packaging & Test Integrated SSD / China backup facility Market leading NAND technology, assembly & test Complex, multi-die package assembly NAND focus & full vertical integration, critical to quality control, supply chain efficiency Shipping almost 2 Million products daily 2017 Western Digital Corporation or its affiliates. A ll rights reserved. C onfidential 4

Connected Cars Driving Data *McKinsey - 2030 5G Telematics /OTA Delivery Services Insurance Auto OEM V2X Fleet Management Traffic Management Center AD Agency Parking/ Charging Station 2017 Western Digital Corporation or its affiliates. A ll rights reserved.

Evolving Ecosystem.... AUTONOMOUS DRIVING Public Infrastructure V2X Comm Tech Sensors for Automation Tier 1s CONNECTED CAR 3D Digital Maps Software SoC Car OEMs Software Service Data & Information Navigation Mobile Device Cloud-based Network TRADITIONAL MOBILITY Wireless Network Edge Capability Services Partnerships 2000 s Present Future Source: Ipsos Consulting 2017 Western Digital Corporation or its affiliates. A ll rights reserved.

Growth of NAND Flash Requirements in the Car Large 3D/HD maps Larger OS New apps/ai/ar OTA Update Buffer Cluster AutoDrive/ Sensors UP TO 1TB PER CAR V2X Dashcams 2017 Western Digital Corporation or its affiliates. A ll rights reserved. 7

The Automotive Industry is Changing... Generating 2GB per day... ~20 microprocessors... storage... Generating 4000GB per day... 100s of microprocessors... > storage AUTONOMOUS VEHICLES >1TB per car IVI Systems + Digital Cluster 256-512GB V2X Computer 32GB OTA Gateways 32GB Autonomous Drive Computer 512-1TB+ GB

Diversified Portfolio Tailored for Focus Markets Commercial Industrial Automotive Connected Home Designed for OEM applications Enables applications with wide range of performance needs Extended roadmap support High Endurance Both -40C to +85C and -25C to 85C support Extended temp range: -40C to +105C Special production flow for automotive quality AEC-Q100 / PPAP Optimized for write endurance up to 50K P/E cycles Value add features High operating temp support 9

Automotive Portfolio SD CARDS inand e.mmc Removable Solutions for applications such as maps, dash cameras Embedded Solutions for applications such as IVI, digital clusters, telematics, autonomous drive systems 2017 Western Digital Corporation or its affiliates. A ll rights reserved. 10

Automotive Design Considerations Automotive quality High reliability design Advanced automotive feature set High temp operating support 2017 Western Digital Corporation or its affiliates. A ll rights reserved. 11

Next Generation SanDisk Automotive inand e.mmc 5.1 Optimized for Read & Write Intensive Applications Navigation Connected Car Autonomous Drive Read Intensive Write Intensive Key Product Features 8-64 GB 1,2, HS400 High Reliability Design Advanced Automotive feature set P/E cycles (MLC/SLC): 3K/30K Operating Temp: -40 o C to +85 o C; -40 o C to 105 o C (Grade 3,2) Quality: Low manufacturing DPPM Flow, AEC-Q100, PPAP 1 1GB=1,000,000,000 bytes. Actual user storage less. 2 Based on internal testing; performance may vary based on capacity, application and usage. 1MB=1,000,000 bytes. 12

7250A Features Designed for Automotive Advanced Health Status Smart Partitioning Auto and Manual Refresh Provides detailed report of device health SLC area dedicated for sensitive data (boot code etc.) Automatically refresh memory Manual option available Wide Operating Temp Fast Boot Enhanced Power Immunity -40 o C to +105 o C operating range Boot in <50mS allows faster system (back mirror) on time Robust data protection from rare unexpected power events 13

Quality & Reliability Focus Zero defect strategy, emlc memory, advanced LDPC ECC Full vertical integration AEC-Q100 compliance, APQP/PPAP Excellent track record, dedicated RMA support Low manufacturing DPPM flows for grade 2 and grade 3 Power off DR: 15 years@55 o C (fresh) 20 months@55 o C (cycled)

SanDisk Automotive SD Cards Key Product Features 8-64 GB 1,2, Ultra High Speed Advanced Automotive feature set Operating Temp: -40 o C to +85 o C Quality: Low manufacturing DPPM Flow, AEC-Q100, PPAP 1 1GB=1,000,000,000 bytes. Actual user storage less. 2 Based on internal testing; performance may vary based on capacity, application and usage. 1MB=1,000,000 bytes. 15

World Class Features Enhance Reliability and Utility Advanced Health Status Enhanced Power Immunity Automatic Refresh Maximize card usage by signaling when to replace it Protects data from unexpected power events Automatically refresh memory to maximize read endurance and data retention Programmable String Host Lock Secured FFU ID a qualified/original card by OEM name, project, date etc. Protect the privacy & security of data on card w/ host enabled PW Secured Field FW Upgrade 16

SDSDAG3 SDSDAG2 5-Year Automotive SD Card Roadmap 2017 2018 2019 2022 1Z B2 B3 B4 B5 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 1Y 64Gb X2 8-64GB -40 o C to +85 o C MP now 1Ynm SD Cards 1Z 64Gb X2 8-64GB -40 o C to +85 o C 8/16GB CS Aug 17 32/64GB CS Sep 17

Long term automotive focus Shipping automotive grade e.mmc and SD cards since 2008 Stable and mature 19nm technology with support through 2020 Full vertical integration ensures superior quality and Industry leading support Introducing 15nm e.mmc for next gen automotive applications High reliability design Application specific feature set 3D NAND planned for 2018 Introduce higher capacity storage solutions e.mmc and UFS interface 18

SOC Support Plan Partner SOC Status Qualcomm 8064 (SD602a) SDIN8 on internal ref design SD820a e.mmc 5.1 Target nvidia Parker e.mmc 5.1 Target Intel Apollo Lake e.mmc 5.1 Target Gemini Lake e.mmc 5.1 Target Freescale NXP imx8 e.mmc 5.1 Target Renesas AutoChips (MTK) AC8317 Internal bring-up platform 19

Contact us Vivek.tyagi@sandisk.com, +91 9844070240 Naresh.rana@sandisk.com Leo.jose@sandisk.com

2017 Western Digital Corporation or its affiliates. A ll rights reserved. C onfidential