TCA connectors. ept GmbH & Co. KG I Phone +49 (0) 88 61/ I Fax +49 (0) 88 61/55 07 I I

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ept GmbH & Co. KG I Phone +49 (0) 88 61/25 01 0 I Fax +49 (0) 88 61/55 07 I E-mail sales@ept.de I www.ept.de 11

Definitions AdvancedTCA /MicroTCA To give consideration to increasing data traffic and new communication services, the PICMG has developed and adopted the AdvancedTCA specification (ATCA). AdvancedTCA is mainly aimed at the infrastructure of telecommunications systems requiring maximum availability. With AdvancedTCA it is possible to set up modular systems with modules from different manufacturers. This technology thus offers the possibility to develop flexible and low-cost systems faster than previously possible with proprietary systems. AdvancedTCA is a scalable, powerful architecture with a high degree of functionality, availability and future safety. Many future-oriented applications can be implemented on this platform. Further advantages are scalable data rates of several Tbit/s, support of multi-protocols, new services can be integrated, the convergence of access, core and optical networks as well as the integration of computer center functions. Interfaces for Gigabit Ethernet, Fibre Channel, Infiniband, StarFabric, PCI- Express and RapidIO are evidence of the high flexibility of the AdvancedTCA architecture. Another core feature of the systems is their high availability of 99.999 %. AdvancedTCA is mainly used for telecommunications applications and can be optimally used, for example, for: Wireless Wireline Voice over IP Video on Demand Media gateways Broadband platform services In order to make the described AdvancedTCA system even more cost-effective, the PICMG has developed the AdvancedMC standard (Advanced Mezzanine Card). The AdvancedMC modules are small cards that are plugged in parallel onto a "Carrier Board" (a carrier board in the form of an AdvancedTCA subcard) as Mezzanine application. The Carrier Board contains only management functions, the actual application is implemented by means of the AdvancedMC modules. MicroTCA is based on the approach to plug the AdvancedMC modules direct into the backplane. The objective is to create smaller and more flexible systems that do not depend on Carrier Boards and AdvancedTCA. MicroTCA is targeted at applications that do not require a very high computing performance but rather where low space requirements and low costs are important. This also opens up further application possibilities in the mid and low-end range - not only for telecommunication technology but also: Communication Base stations Media gateways Video on demand Industrial automation Process automation Military technology Mobile applications Medical technology Image processing Automotive 12 ept GmbH & Co. KG I Phone +49 (0) 88 61/25 01 0 I Fax +49 (0) 88 61/55 07 I E-mail sales@ept.de I www.ept.de

Definitions ept GmbH & Co. KG I Phone +49 (0) 88 61/25 01 0 I Fax +49 (0) 88 61/55 07 I E-mail sales@ept.de I www.ept.de 13

Technical specifications Technical specifications AdvancedTCA and MicroTCA signal connector System AdvancedTCA MicroTCA Type AMC B+ Signal connector CardEdge AMC Signal connector CardEdge Specification PICMG AMC.0 PICMG MTCA.0 R1.0 No. of contacts 170 170 Contact spacing 0.75 mm 0.75 mm Clearance and creepage distance between the contacts min. 0.1 mm min. 0.1 mm Operational current of 8 power contacts according to specification 1.52 A @ 70 C max. 30 C temperature rise 1.52 A @ 70 C max. 30 C temperature rise Operating temperature range 55 C to + 105 C 55 C to + 105 C Test voltage 80 V r.m.s 80 V r.m.s Contact resistance max. 60 mω (ground contacts) max. 90 mω (signal, power, general purpose contacts) max. 25 mω Insulation resistance 10 8 Ω 10 8 Ω Mating cycles 200 200 Termination technology Compliant Pin Compliant Pin Engaging force max. 100 N max. 100 N Separating force max. 65 N max. 65 N Impedance (nominal differential) 100 Ω ± 10 % 100 Ω ± 10 % Cross talk (NEXT pair to pair) @ 30 ps rise time Basic to basic < 0.6 % Basic to extended < 0.9 % Extended to extended < 0.6 % Diagonal < 0.3 % Multiline < 3.0 % Basic to basic < 0.5 % Basic to extended < 0.2 % Diagonal < 0.1 % Multiline < 2.0 % Differential signal propagation time Differential signal propagation difference Basic side: 125 ps Extended side: 145 ps Between basic and extended side: 20 ps Within basic and extended side: ± 2 ps Basic side: 75 ps Extended side: 75 ps Between basic and extended side: ± 2 ps Within basic and extended side: ± 2 ps Insulator material LCP, UL 94-V0 LCP, UL 94-V0 Contact material Copper alloy Copper alloy Contact surface Pd/Ni Pd/Ni Environment /approvals RoHS compliant /UL (file: E130314) RoHS compliant /UL (file: E130314) 14 ept GmbH & Co. KG I Phone +49 (0) 88 61 / 25 01 0 I Fax +49 (0) 88 61 / 55 07 I E-mail sales@ept.de I www.ept.de

Technical specifications Technical specifications AdvancedTCA and MicroTCA Power connector System AdvancedTCA MicroTCA Type Power connector Female and male connector Power connector Backplane and power module output Specification PICMG 3.0 R2.0 PICMG MTCA.0 R1.0 No. of contacts 30 96 Power contacts 8 24 Signal contacts 22 72 Operational current Power contacts: max. 16 A Signal contacts: max. 1 A Power contacts: max. 12 A Signal contacts: max. 1 A Operating temperature range 55 C to + 125 C 55 C to + 105 C Test voltage Contact 1 16 1000 V r.m.s 80 V Contact 17 34 2000 V r.m.s r.m.s Contact resistance Power contacts: 3 mω Signal contacts: 10 mω Power contacts: 5 mω Signal contacts: 25 mω Insulation resistance 10 10 Ω 10 8 Ω Mating cycles 250 200 Termination technology Compliant Pin Compliant Pin Engaging force max. 67 N max. 50 N Separating force max. 67 N max. 50 N Insulator material PBT, UL 94-V0 PBT, UL 94-V0 Contact material Copper alloy Copper alloy Contact surface Au Power: Au Signal: Pd/Ni Environment /approvals RoHS compliant /UL (file: E130314) RoHS compliant /UL (file: E130314) ept GmbH & Co. KG I Phone +49 (0) 88 61 / 25 01 0 I Fax +49 (0) 88 61 / 55 07 I E-mail sales@ept.de I www.ept.de 15

Derating diagrams Derating diagrams Derating diagram AdvancedTCA Power 40 35 30 Current [A] 25 20 15 10 5 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 Ambient temperature [C ] Derating, alcontac tsunder loadac. ATCA Spec. PIC MG Derating, Imax x 0.8 (DINIEC 512) 3.0 R2.0 Derating diagram MicroTCA Power 15 Current Current x 0.8 10 Current [A] 5 0 65 75 85 95 105 Ambient temperature [C ] 16 ept GmbH & Co. KG I Phone +49 (0) 88 61/25 01 0 I Fax +49 (0) 88 61/55 07 I E-mail sales@ept.de I www.ept.de

Hole specifications AMC signal connector for AdvancedTCA and MicroTCA Nominal hole Ø 0.55 mm Imm. Sn printed circuit boards A PCB thickness min. 1.4 mm B Plated hole Ø 0.55 ± 0.05 mm C Drill hole Ø 0.64 ± 0.01 mm D Cu plating min. 25 µm E Imm. Sn plating max. 1.5 µm F Annular ring min. 0.15 mm Ni, Au printed circuit boards A PCB thickness min. 1.4 mm B Plated hole Ø 0.55 ± 0.05 mm C Drill hole Ø 0.64 ± 0.01 mm D Cu plating min. 25 µm E Ni, Au plating 0.05 0.2 µm Au over 2.5 5 µm Ni F Annular ring min. 0.15 mm AdvancedTCA Power male connector Nominal hole Ø 1.0 mm Ø 1.6 mm Imm. Sn printed circuit boards A PCB thickness min. 1.4 mm min. 1.4 mm B Plated hole Ø 1 + 0.09/ 0.06 mm Ø 1.6 + 0.09/ 0.06 mm C Drill hole Ø 1.15 ± 0.025 mm Ø 1.75 ± 0.025 mm D Cu plating min. 25 µm min. 25 µm E Imm. Sn plating max. 1.5 µm max. 1.5 µm F Annular ring min. 0.15 mm min. 0.15 mm Ni, Au printed circuit boards A PCB thickness min. 1.4 mm min. 1.4 mm B Plated hole Ø 1 + 0.09/ 0.06 mm Ø 1.6 + 0.09/ 0.06 mm C Drill hole Ø 1.15 ± 0.025 mm Ø 1.75 ± 0.025 mm D Cu plating min. 25 µm min. 25 µm E Ni, Au plating 0.05 0.2 µm Au over 2.5 5 µm Ni 0.05 0.2 µm Au over 2.5 5 µm Ni F Annular ring min. 0.15 mm min. 0.15 mm ept GmbH & Co. KG I Phone +49 (0) 88 61/25 01 0 I Fax +49 (0) 88 61/55 07 I E-mail sales@ept.de I www.ept.de 17

Hole specifications AdvancedTCA Power female connector Nominal hole Ø 1.0 mm Ø 1.6 mm Imm. Sn printed circuit boards A PCB thickness min. 2.9 mm min. 2.9 mm B Plated hole Ø 1 + 0.09/ 0.06 mm Ø 1.6 + 0.09/ 0.06 mm C Drill hole Ø 1.15 ± 0.025 mm Ø 1.75 ± 0.025 mm D Cu plating min. 25 µm min. 25 µm E Imm. Sn plating max. 1.5 µm max. 1.5 µm F Annular ring min. 0.15 mm min. 0.15 mm Ni, Au printed circuit boards A PCB thickness min. 2.9 mm min. 2.9 mm B Plated hole Ø 1 + 0.09/ 0.06 mm Ø 1.6 + 0.09/ 0.06 mm C Drill hole Ø 1.15 ± 0.025 mm Ø 1.75 ± 0.025 mm D Cu plating min. 25 µm min. 25 µm E Ni, Au plating 0.05 0.2 µm Au over 2.5 5 µm Ni 0.05 0.2 µm Au over 2.5 5 µm Ni F Annular ring min. 0.15 mm min. 0.15 mm MicroTCA Power (backplane and power module output) Nominal hole Ø 0.60 mm Imm. Sn printed circuit boards A PCB thickness min. 1.4 mm B Plated hole Ø 0.60 ± 0.05 mm C Drill hole Ø 0.70 ± 0.02 mm D Cu plating min. 25 µm E Imm. Sn plating max. 1.5 µm F Annular ring min. 0.15 mm Ni, Au printed circuit boards A PCB thickness min. 1.4 mm B Plated hole Ø 0.60 ± 0.05 mm C Drill hole Ø 0.70 ± 0.02 mm D Cu plating min. 25 µm E Ni, Au plating 0.05 0.5 µm Au over 2.5 5 µm Ni F Annular ring min. 0.15 mm 18 ept GmbH & Co. KG I Phone +49 (0) 88 61/25 01 0 I Fax +49 (0) 88 61/55 07 I E-mail sales@ept.de I www.ept.de

AdvancedTCA Signal AMC B+ Direct connector Pos. 170 Pos. 1 Dimensions in mm Hole pattern No. of contacts Press-fit technology Without peg With peg Part number 170 512-22170-453 512-23170-453 Accessories Press-fit tool (see page 194) Support tool (see page 195) Cross reference Function GuideSpring/con:card+ (see page 13) ept GmbH & Co. KG I Phone +49 (0) 88 61/25 01 0 I Fax +49 (0) 88 61/55 07 I E-mail sales@ept.de I www.ept.de 19

AdvancedTCA Power Male connector Dimensions in mm Hole pattern Press-fit technology No. of contacts Part number 22 Signal 8 Power 511-50500-163 26 Signal 8 Power 511-50501-163 On request Other contact numbers Accessories Press-fit tool (see page 194) Support tool (see page 195) 20 ept GmbH & Co. KG I Phone +49 (0) 88 61/25 01 0 I Fax +49 (0) 88 61/55 07 I E-mail sales@ept.de I www.ept.de

AdvancedTCA Power Female connector Dimensions in mm Hole pattern Press-fit technology No. of contacts Part number 22 Signal 8 Power 512-50500-163 26 Signal 8 Power 512-50501-163 On request Other contact numbers Accessories Press-fit tool (see page 194) Support tool (see page 195) ept GmbH & Co. KG I Phone +49 (0) 88 61/25 01 0 I Fax +49 (0) 88 61/55 07 I E-mail sales@ept.de I www.ept.de 21

Notes 22 ept GmbH & Co. KG I Phone +49 (0) 88 61/25 01 0 I Fax +49 (0) 88 61/55 07 I E-mail sales@ept.de I www.ept.de

MicroTCA Signal AMC Direct connector Dimensions in mm Pos. 170 Pos. 01 Hole pattern Press-fit technology No. of contacts Part number 170 502-12170-153 On request With peg Accessories Press-fit tool (see page 196) Support tool (see page 197) Cross reference Function GuideSpring/con:card+ (see page 13) ept GmbH & Co. KG I Phone +49 (0) 88 61/25 01 0 I Fax +49 (0) 88 61/55 07 I E-mail sales@ept.de I www.ept.de 23

MicroTCA Power Backplane connector Dimensions in mm Hole pattern Press-fit technology No. of contacts Part number 72 Signal 24 Power 502-50096-183 Accessories Press-fit tool (see page 196) Support tool (see page 197) 24 ept GmbH & Co. KG I Phone +49 (0) 88 61/25 01 0 I Fax +49 (0) 88 61/55 07 I E-mail sales@ept.de I www.ept.de

MicroTCA Power Power module output Dimensions in mm Hole pattern Press-fit technology No. of contacts Part number 72 Signal 24 Power 501-50096-183 Accessories Press-fit tool (see page 196) Support tool (see page 197) ept GmbH & Co. KG I Phone +49 (0) 88 61/25 01 0 I Fax +49 (0) 88 61/55 07 I E-mail sales@ept.de I www.ept.de 25