Product End-of-Life Disassembly Instructions Product Category: Monitors and Displays Marketing Name / Model [List multiple models if applicable.] HP 25f 25-in Display Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 22/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1. Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Quantity Item Description Notes of items included in product Printed Circuit Boards (PCB) or Printed Circuit With a surface greater than 1 sq cm 2 Assemblies (PCA) Batteries All types including standard alkaline and lithium coin or button style batteries Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Liquid Crystal Displays (LCD) with a surface greater than 1 sq cm Includes background illuminated displays with gas discharge lamps Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height External electrical cables and cords 3 Gas Discharge Lamps Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above) Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent including liquids, semi-liquids (gel/paste) and toner chambers, and service stations. Components and waste containing asbestos Components, parts and materials containing EL-MF877- Page 1 Template Revision B PSG instructions for this template are available at EL-MF877-1 1
refractory ceramic fibers Components, parts and materials containing radioactive substances 2. Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Description #1 SCREW DRIVER(Plum flower head) Description #2 Screwdriver PH2 Description #3 Hex nut screwdriver M5 Description #4 Description #5 3. Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. Release base stand by pushing a white button then strip screw to separate base and hinge 2. Strip the screws from rear cover so that the rear cover can be removed, then remove deco 3. Remove all material under rear cover contain rear cover supporter 4. Separate main board and shielding 5. Release all materials and put some by ESD 3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations). EL-MF877- Page 2 Template Revision B PSG instructions for this template are available at EL-MF877-1
24-7-21 Appendix 3 Product End-of-Life Disassembly instructions Product Identification: Marketing Name / Model HP 25f Display Description HP 25f 25-inch Display Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment. 1. Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Item Description Notes Quantity of items included in product. Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) Batteries Mercury containing components Liquid Crystal Displays (LCD) with a surface greater than 1 square cm With a surface greater than 1 square cm All types including standard alkaline and lithium coin or button style batteries For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Includes background illuminated displays with gas discharge lamps Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB / PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height External electrical cables and cords 3 Gas Discharge Lamps Plastics containing Brominated Flame Retardants Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. 2 1 Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials Page 1
24-7-21 containing radioactive substances 2. Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Screwdriver Hex nut screwdriver Tool Size (if applicable) PH2 M5 3. Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1 release base stand by pushing a white button then strip screw to separate base and hinge 2 Strip the screws from rear cover so that the rear cover can be removed, then remove deco 3 Remove all material under rear cover contain rear cover supporter ; 4 Separate main board and shielding 5 Release all materials and put some by ESD; 3.2OPTIONAL: Depending upon the complexity of the disassembly process, a graphic depicting the locations of items contained within the product which require selective treatment (with descriptions and arrows identifying locations) can be inserted below: Page 2
24-7-21 Step 1 Quick release Base stand (1).Pull out base and stand Press the white button a. Press white button with one hand b. Pull out stand & base with another hand (2).Disassy base and stand Twist out the screw Page 3
24-7-21 Step 2: Strip the screws from rear cover, then move rear cover follow the below way,at last remove deco Remove the screws with Screwdriver Dismantle the rear cover first from the two marked position Remove the 8pin FFC from main board then remove rear cover Page 4
Step 3: To remove the shielding(contain the other material ); (3.1) Dismantle the rear cover supporter (3.2) Pull out the LVDS/ LED FFCs to separate the base assembly from the unit; (3.3) Remove the four screws to separate shielding from CB 24-7-21 Page 5
24-7-21 Step 4: Strip the screws *8pcs Page 6
24-7-21 Step 5: Release all materials and put some by ESD; Can follow the picture as bellow; Page 7