COMPANY BRIEFING September 2011 PAGE 1
Safe Harbor Notice Nan Ya PCB s statements of its current expectations are forward-looking statements subject to significant risks and uncertainties and actual results may differ materially from those contained in the forward-looking statements. Except as required by law, we undertake no obligation to update any forward-looking statement, whether as a result of new information, future events, or otherwise. PAGE 2
Vertical Integration within FPG FPG Introduction Copper Copper Ore Ore Crude Crude Oil Oil Sand Sand Copper Copper Refinery Refinery Oil Oil Refinery Refinery Naphtha Naphtha Cracker Cracker 1998 1998 Glass Glass Yarn Yarn 1991 1991 Wafer Wafer 1998 1998 External Procurement Copper Copper Foil Foil 1992 1992 Epoxy Epoxy 1986 1986 Glass Glass Cloth Cloth 1990 1990 DRAM DRAM 1995 1995 Copper Copper Clad Clad Laminate Laminate 1986 1986 Nan Ya PCB Mass Prod. (in FPG) LCD LCD 1995 1995 PCB PCB 1985 1985 Substrate Substrate 2000 2000 Electronic Electronic Field Field PAGE 3
Milestone Company Introduction Year 1985 Start up PCB mass production Year 1997 Establish Na Ya PCB Corporation Year 2000 Start up wire bond substrate mass production Year 2001 Start up flip chip substrate mass production Year 2002 Start up Kunshan PCB mass production Year 2006 IPO (TWSE Ticker No.: 8046) Year 2010 Start up flip chip substrate back-end process production for CPU products PAGE 4
Company Introduction Production Allocation and Monthly Capacity Flip Chip P1+P5 15M Units + P6 8M Units + P7 7M Units + P8 (Potential 15M Units) Wire Bond P2 180KSF + KS 300KSF PCB, HDI + P3 145KSF KS 1.65MSF Note: KS=Kunshan Kunshan China manufacturing campus PAGE 5
Structure of Shareholders Orbis Asia Fund excl. Japan Chunghwa Post Cathay Life Insurance 2.1% 2.0% 1.7% Others 22.1% The Boston Company AM Emerging Market Fubon Life Insurance Shin Kong Life Insurance 1.2% 1.1% 0.7% Nan Ya Plastics 67.3% Taiwan Labor Pension Fund 0.6% Taiwan Public Service Pension Fund DIF First Emerging Market Fund 0.6% 0.6% Total Shares: 643,027,487 shares Date: August, 2011 PAGE 6
Company Current Status NT$ M 4,500 4,000 3,500 3,000 2,500 2,000 1,500 1,000 500 0 2010~2011 Monthly Revenue in Taiwan 2010 2011 2,958 2,949 3,240 3,190 2,998 3,013 3,015 3,016 3,180 3,429 2,993 2,979 3,159 3,352 2,855 3,070 2,671 2,600 2,364 Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec 2011 July Sales = NT$ 3.4 Billion;MoM MoM=+7.5% =+7.5%;YoY=+7.8% Accumulated 2011 Sales = NT$ 21.2 Billion ; YoY=+4.8% PAGE 7
Company Current Status 2011 Sales Breakdown by Application Automotive 3% Consumer 4% Networking & Communication 4% PC & Peripheral 15% IC Substrate 74% PAGE 8
NAN YA PCB CORPORATION Products & Applications-PC GPU FC-BGA 35mm*35mm PCH FC-BGA 25mm*25mm CPU FC-PGA/LGA 37.5mm*37.5mm DRAM (WB-BGA) DRAM Module (PCB) PAGE 9
Company Current Status Products & Applications-Game Console A B MPU FC-BGA 27mm*27mm 2/2/2 Integrated Chipset FC-BGA 35mm*35mm 3/2/3 C Integrated Chipset FC-BGA 42.5mm*42.5mm 3/2/3 MPU FC-BGA 33mm*33mm 2/2/2 MPU FC-BGA 21mm*21mm 2/2/2 Integrated Chipset FC-BGA 31mm*31mm 2/2/2 PAGE 10
Company Current Status Products & Applications-Others Set-Top Box 37.5mm*37.5mm 2/2/2 HDTV Chipset 35mm*35mm 2/2/2 Set-Top Box and HDTV started to migrate to flip-chip design in 2007, and annual demand has been expected to increase dramatically in 2010. PAGE 11
Thank You Q & A PAGE 12
Appendix 1 IC Substrate Introduction Wire Bonding Substrate Outline: By using gold wires to connect electrical pads with the so-call wire bonding substrate which plays the function as the buffer between chips and motherboard. Wire Bond Substrate Motherboard Flip Chip Substrate Outline: The die is directly attached to the substrate which plays as the connections between the chip and motherboard by using solder bumps rather than gold wires. Flip Chip Substrate Motherboard PAGE 13
Appendix 2 Types of Wire Bonding Substrates Ball Grid Array (BGA) Plastic Ball Grid Array (PBGA) Window BGA Chip Scale Package (CSP) Wire Bonding CSP (WB-CSP) Flip Chip CSP (FC-CSP) PAGE 14
Appendix 3 Types of Flip Chip Substrates FC-Pin Grid Array (FC-PGA) FC-Land Grid Array (FC-LGA) FC-Ball Grid Array (FC-BGA) PAGE 15
CPU Development (GHz) 3.33 FC Substrate Development Trend Multi-Chipset Packaging Status 1 Integrated-Chipset Packaging Status 2 Integrated Package Appendix 4 2.66 Dual-Core Multi-Core 5+4+5 37.5x37.5mm 4+4+4 37.5x37.5mm 4+2+4 37.5x37.5mm 2.33 1.66 Pentium 4 2+4+2 37.5mmSQ 2+4+2 37.5mmSQ (Mainly for high-end product) Chip on Board FCCSP-PoP 1.33 1+4+1 37.5mmSQ 0.40 Wafer Process Technology Evolution (Nanometer) 2002 2005 2006 2007 2008 2009 2010 2011 90 65 45 32 28/22 2012 2013 (Source: Intel Web, DigiTimes Lab) PAGE 16