COMPREHENSIVE CHIPSET SYSTEM SOLUTION PORTFOLIO

Similar documents
COMPREHENSIVE CHIPSET SYSTEM SOLUTION PORTFOLIO

ULE for IoT Applications. The Smarter Home Automation Technology

INVESTOR PRESENTATION APRIL 2017

SmartBond DA Smallest, lowest power and most integrated Bluetooth 5 SoC. Applications DA14585

SAM A5 ARM Cortex - A5 MPUs

Investor Presentation

Silicon Motion s Graphics Display SoCs

Hugo Cunha. Senior Firmware Developer Globaltronics

MYD-JA5D2X Development Board

Hi3536 H.265 Decoder Processor. Brief Data Sheet. Issue 03. Date

MYC-C7Z010/20 CPU Module

AT-501 Cortex-A5 System On Module Product Brief

DevKit7000 Evaluation Kit

RZ/G1 SeRieS embedded microprocessors

The Mobile Internet: The Potential of Handhelds to Bring Internet to the Masses. April 2008

i.mx Product Family and Freescale codec offering to meet Automotive and Industrial Requirements

Oberon M2M IoT Platform. JAN 2016

Cirrus is a leader in audio, video, and precision mixed-signal ICs for consumer entertainment, automotive, and industrial applications

Cypress PSoC 6 Microcontrollers

MYD-C7Z010/20 Development Board

The TechNexion Difference

Connectivity and Audio

New STM32 F7 Series. World s 1 st to market, ARM Cortex -M7 based 32-bit MCU

Join the forward thinkers who rely on Toshiba for wireless connectivity ICs.

YOUR PARTNER IN INNOVATION

DesignWare IP for IoT SoC Designs

. SMARC 2.0 Compliant

DECT and ULE Addressing the requirements of IMT2020

STM32MP1 Microprocessor Continuing the STM32 Success Story. Press Presentation

ARM and x86 on Qseven & COM Express Mini. Zeljko Loncaric, Marketing Engineer, congatec AG

Wireless Factory December 15. Michel Windal

Your Strategic Partner for Renesas RZ/G1x Products & Solutions

STM32F7 series ARM Cortex -M7 powered Releasing your creativity

iw-rainbow-g3 / G3V FAQs:

Technology for Innovators TM TI WIRELESS TECHNOLOGY DELIVERING ALL THE PROMISE OF 3G

High-Performance, Highly Secure Networking for Industrial and IoT Applications

Wireless standards--home automation, energy, care and security

MeshConnect. Voice over

Introduction to Sitara AM437x Processors

Zatara Series ARM ASSP High-Performance 32-bit Solution for Secure Transactions

HiSilicon STB Push-to-Talk Development Kit for Amazon AVS

Product Brief: SDC-MCF10G g Miniature CF Module with Antenna Connectors

Qualcomm Wi-Fi Connectivity Selector Guide

Hi3719C V100 Hi3719C V100 Brief Data Sheet

SABRE Board for Smart Devices

Freescale i.mx Applications Processors based on ARM Technology Connected Multimedia

Renesas Synergy MCUs Build a Foundation for Groundbreaking Integrated Embedded Platform Development

mbed OS Update Sam Grove Technical Lead, mbed OS June 2017 ARM 2017

StreetWise IoT Solutions

Microsemi Adaptec Trusted Storage Solutions. A complete portfolio of 12 Gbps Host Bus Adapters, RAID Adapters, SAS Expander and Cables

Building Ultra-Low Power Wearable SoCs

MYD-IMX28X Development Board

Zynq-7000 All Programmable SoC Product Overview

Yealink Audio Conferencing Solution Easy Conferencing, Clear Communication

arm MULTICORE PLATFORMS FOR ADVANCED APPLICATIONS Product Longevity

Sustaining profitable growth in Mobile

Blackfin Products. ...maximum performance at minimum space

RZ Embedded Microprocessors

Questions & Answers SC14CVMDECTDEVKT

Product overview. Technology in Quality. ColdFire Module ARM Moduls System Integration Kit s Complete Systems

ID 730L: Getting Started with Multimedia Programming on Linux on SH7724

HotChips An innovative HD video and digital image processor for low-cost digital entertainment products. Deepu Talla.

2010: TRANSITION & TRANSFORMATION

SoundClear. Product Guide

Dialog Semiconductor. Capital Markets Day 16 September 2015, London. connected

. Micro SD Card Socket. SMARC 2.0 Compliant

VIA ProSavageDDR KM266 Chipset

Hi3518E V200 Economical HD IP Camera SoC. Brief Data Sheet. Issue 02. Date

MYD-IMX28X Development Board

Connect with Simplicity

Datasheet. Enterprise VoIP Phone with Touchscreen. Models: UVP, UVP-Pro, UVP-Executive. High-Definition, Multi-Touch Color Display. Powered by Android

ESP-01 WiFi Module Version1.0

Wearable Technologies and the IoT. David Lamb Market Development Manager, North Europe STMicroelectronics

Fujitsu Semiconductor Wireless Products, Inc. Corporate Profile 2011

Signal Processing IP for a Smarter, Connected World. May 2017

Fujitsu SOC Fujitsu Microelectronics America, Inc.

STM32F7 series ARM Cortex -M7 powered Releasing your creativity

VOCUS IP TEL POLYCOM HANDSET GUIDE

Product Brief: SDC-MSD30AG a/g Miniature SDIO Module with Antenna Connectors

Product Brief: SDC-PE15N n PCIe Module with Antenna Connectors

The Evolution of Mobile

Datasheet. Enterprise VoIP Phone with Touchscreen. Models: UVP-X, UVP, UVP-Pro, UVP-Executive. High-Definition, Multi-Touch Color Display

Product Brief: SDC-PC10AG a/g Compact Flash Module with Antenna Connectors

SOM PRODUCTS BRIEF. S y s t e m o n M o d u l e. Engicam. SOMProducts ver

Microsemi Secured Connectivity FPGAs

Compact form factor. High speed MXM edge connector. Processor. Max Cores 4. Max Thread 4. Memory. Graphics. Video Interfaces.

TI SimpleLink dual-band CC1350 wireless MCU

.org. IoT Development Platform

џ џ џ џ џ џ џ џ џ џ џ џ .976 REAL CINEMA

M I T E L 5200 IP Desktop

STM32F429 Overview. Steve Miller STMicroelectronics, MMS Applications Team October 26 th 2015

NXP Microcontrollers Selection Guide

DevKit8000 Evaluation Kit

Hi3520D V300 H.264 CODEC Processor. Brief Data Sheet. Issue 04. Date

VIDEO BRIDGING SOLUTION PROMISES NEW LEVEL OF DESIGN FLEXIBILITY AND INNOVATION

A-307. Mobile Data Terminal. Android OS Platform Datasheet

Creator Ci20 quick start guide

SABRE for Automotive Infotainment Quick Start Guide. Smart Application Blueprint for Rapid Engineering Based on the i.mx 6 Series

Polycom RealPresence Trio

VOCUS POLYCOM HANDSET GUIDE

Transcription:

COMPREHENSIVE CHIPSET SYSTEM SOLUTION PORTFOLIO

APPLICATION SHAPING CONVERGED COMMUNICATIONS Leveraging over two decades of leadership in semiconductor development and innovation in signal processing and wireless communications, DSP Group offers a comprehensive portfolio of System-On-Chip (SoC) solutions for consumer electronics (CE) end products at home, in the office and on-the-go. Our complete solutions enable OEMs/ODMs to introduce innovative products that embed smart processing and converged communications, addressing the growing demand for more cost-effective design, innovative applications/technologies and low-power processing. Our complete SoC solutions include hardware development kits (HDKs), embedded software packages, and software development kits (SDKs) everything you need to develop innovative, cost-effective and power-efficient products. Our advanced technologies are positioning DSP Group as an enabler in the burgeoning Internet of things, smart voice processing for mobile and wearable devices, and enterprise telephony markets. SOLUTIONS DSP Group continues to play a key role in the rapidly-changing communications arena. OEMs/ODMs, telecommunication operators, and service providers use our market-leading solutions to rapidly bring to market innovative products for mobile, home, and enterprise environments. Complementing our traditional offering, our new solutions for mobile voice and audio enhancement (HDClear ), always-on voice activation and sensor hub,, home automation and security (ULE), and enterprise telephony (VoIP) are enabling our customers to develop a new wave of products by raising the bar in both voice processing and converged communications. Cordless Leading the cordless phone market with over 70% market share, DSP Group continues to offer cost-effective, fully-featured and comprehensive solutions - delivering unrivaled range, unmatched listening experience and robust processing power, while enabling rich GUI functionality. For entry-level to high-end applications, our products feature the industry s smallest footprint, the highest level of integration, and the lowest power consumption. Our solutions include reference designs for the following applications: CAT-iq reference design with advanced GUI DECT/CAT-iq module Wireless audio and cordless headset PSTN cordless phone Video Monitoring over DECT Home Gateways, CAT-iq and FMC DSP Group s DCX DECT/CAT-iq SoC solution for home gateways and fixed-mobile convergence (FMC) provides advanced DECT cordless capabilities including HD voice quality, multi call, multi-line, and ULE functionality. Our DCX solutions support multiple lines and handsets while complying with the CAT-iq 2.0, 2.1, 3.0 (SUOTA) and ULE standards. Our solutions include reference designs for the following applications: DECT cordless phones DECT/CAT-iq modules DECT/ULE-enabled gateways 3

APPLICATION Home Automation & Security Based on best-in-class ULE technology, our home automation and security solutions offer low cost of ownership together with marketleading performance. Utilized in a wide variety of sensors, ULE is an ideal short range wireless technology for security, safety, home automation, energy management, climate control, and healthcare applications connected via consumer premise equipment (CPE) such as home gateways and over the top boxes (OTT s). Combination of ULE with Voice and Video capabilities places DECT/ULE in the unique position in IoT world. Our solutions include reference designs for the following applications: ULE nodes ULE-enabled gateways Enterprise VoIP A leading VoIP silicon providers for enterprise voice, DSP Group offers comprehensive, best-in-class, yet highly-affordable VoIP solutions. Powering the full range of IP desktop phones and analog telephone adapters (ATAs), DSP Group s scalable, green solutions are ideal for all enterprise segments They deliver enterprise-grade acoustics and exceptional HD voice quality, while featuring the industry s lowest power consumption. Our solutions include reference designs for the following applications: Entry level IP phones Mid-range to High-end IP phones ATAs HDClear Voice and Audio Enhancement for Mobile HDClear by DSP group is a revolutionary technology for eliminating background noise and enhancing voice quality. In mobile phones, wearable devices, PCs and tablets, HDClear suppresses background noise and promotes high speech intelligibility for unparalleled voice communications and user experience. HDClear also effectively filters ambient noise of any kind and delivers cleaner speech to ASR applications, resulting in best-in-class accuracy, enhanced ASR consistency, and improved productivity. HDClear is an ideal solution for mobile and wearable devices, bringing a better user experience to voice communications, command and activation all with ultra-low power consumption. Our solutions include reference designs for the following applications: Mobile phones Wearable devices 4

APPLICATION Always-On Voice Activation and Sensor Hub Functions for Smartphones and Wearables DSP Group s solution for smartphones, wearable devices and other mobile devices provides excellent performance of voice-trigger, voice command and sensor hub function while maintaining extremely low power consumption. Our solution includes pre-process algorithms that improves the voice trigger hit-rate in noisy environments. DSP Group s solution is based on DSP Group s SoC and embedded software and advanced voice activation and sensor fusion algorithms, providing simultaneous analysis of data from multiple sensor sources in addition to voice activation. DSP Group s solution includes audio input and output port and can be used as a Codec for wearable devices. Our solution includes reference designs for smartphones and wearable devices and can be used for voice activation in other appliances. 5

PRODUCTS PRODUCTS Targeting home, enterprise, and mobile markets, DSP Group s comprehensive chipset portfolio reduces development risk costs, and shortens time to market. ODMs and service providers use our system-on-chips (SoCs), hardware reference packages (HDKs) and software development packages (SDKs) to rapidly and cost-effectively develop cuttingedge consumer electronics and business products. CHIPSET PRODUCT FAMILIES Home Enterprise Mobile Cordless Gateways Home Automation & Security Voice Over IP (VoIP) HDMobile DCX (ARM9) DECT BB, DECT RF Voice AFE, PMU DCX (ARM9) DECT BB, DECT RF PMU DHX91 (ARM9) DECT ULE BB, DECT ULE RF Voice AFE, PMU DVF99 (2xARM9) VoIP DSP, Voice AFE, Security HW, 2D GPU PMU, Opt: DECT BB DBM11 (DSP) TL-DSP Noise Cancellation DCE (DSP) DECT BB Voice AFE, PMU RF19 DECT RF RF24 2.4DECT RF DVF99 (2xARM9) DECT ULE BB, DECT ULE RF VoIP DSP, Voice AFE, PMU DCX (ARM9) DECT ULE BB, DECT ULE RF Voice AFE, PMU DVFD8 (ARM9+DSP) VoIP DSP, Voice AFE, PMU, Opt: DECT BB DRF19: DECT RF, PMU DVF1100 (Dual Cortex- A9@1.5GHz) Quad core GPU, Video ENC/ DEC Voice AFE,Security HW, HDMI RX/TX, PCIe, USB3 DBMD2 (DSP) TL-III-DSP Noise Cancellation Voice Trigger Voice Authentication Voice Command Sensory Hub DECT CORDLESS DCE AND DCX FAMILIES A market leader in DECT and next-generation CAT-iq cordless technology, DSP Group offers a wide range of costeffective, highly-integrated SoC solutions. Delivering high-quality audio with notably low power consumption, our fieldproven chipset solutions are ideal for totally integrated digital cordless telephony, home automation and security, and DECT-enabled gateways. DSP Group s cordless chipset solutions are available in two chipset families: The DCE family is a highly integrated, low-power ROM-based chipset solution, delivering enhanced audio and extended range for entry-level applications. The DCX SoC family is a low-power, Flash and ROM-based chipset solution targeting mid-to-high-range cordless applications. The cost-effective DCX is based on an open powerful ARM9 core platform capable of advanced HD voice processing for multi-line and multi-call use cases as well as support for large LCDs and video applications. 6

PRODUCTS DE56 + RF19Z/RF24 DCE DCE58 + RF19Z/RF24 DCX DCX79 DCX81 DCXD1 + DRF1912 Function Baseband + RF Baseband + RF Single Chip Single Chip Baseband + RFAPU Segment Entry Level Mid-Range High-End Radio Frequency DECT (EUR) RF19Z RF19Z DECT 6.0 (US) RF19Z RF19Z K-DECT RF19Z RF19Z J-DECT RF19Z RF19Z 2.4 GHz RF24 RF24 Memory External QSPI Flash External SRAM Internal RAM Internal Flash ROM Processing and Features Processor TeakLite TeakLite ARM968 ARM926 ARM926 MIPS 74-110 MHz 74-99 MHz 124MHz 208MHz 208MHz Cache I+D I+D Hardware Accelerators ADPCM ADPCM ADPCM MLSE JPEG DMA ADPCM MLSE JPEG DMA ADPCM MLSE Non-Blind Slot Integration RF PA RF Switches Embedded LCD Controller I /O Keypad GPIO UART USB PCM/IOM/TDM I2S SPI PWM External Bus 8-bit 16-bit 7

PRODUCTS DECT-ENABLED HOME GATEWAY (HGW) DCX81 DSP Group s DCX81 SoC for HGW and FMC provide advanced DECT cordless capabilities including HD voice, multiline, multi-handset and ULE support, while integrating the most advanced CAT-iq 2.0, 2.1, 3.0 (SUOTA) stack. The DCX81 is a low-power flash-based SoCs based on an open ARM9 core processor with unsurpassed range, capable of advanced HD voice processing for multi-line, multi-call applications together with support of ULE standard for home automation applications. Function Standards ULE DECT Radio Frequency DECT (EUR) DECT 6.0 (US) K-DECT J-DECT Memory External QSPI Flash Internal RAM Processing and Features Processor MIPS Cache Non-Blind Slot Integration RF PA RF Switches I/O Keypad GPIO UART USB PCM/IOM/TDM SPI DCX81 Single Chip ARM926 208 MHz I+D 8

PRODUCTS HOME AUTOMATION AND SECURITY ULE (ULTRA LOW ENERGY) FAMILY DSP Group is leading the ULE revolution to meet the growing demand in the Home Area Network (HAN) market for efficient low-power, wireless IoT solutions. An extension of DECT, the new ULE standard enables development of multi-year, battery-run HAN applications that enjoy all of the advantages of DECT, such as interference-free connectivity, extended range, voice and video support and more. Leveraging its long-term technological and market leadership in DECT applications, DSP Group designed the architecture for ULE and is driving its adoption, together with the DECT Forum and the ULE Alliance. DSP Group offers an advanced ULE family of chips, as well as a comprehensive ULE and HAN FUN (Transport and Application layer) protocol. The DHX91 isa low-power chipset solution for home automation and security. Equipped with audio capabilities and a powerful ARM926 processor, it implements hibernation features to deliver advanced ULE. The ULE base utilizes existing and proven cordless SoCs, functioning as a standalone ULE over the top box (DVF99) and embedded module for home gateways (DCX81). Base Node Function DVF99 DCX81 DHX91 Segment ULE Radio Frequency DECT (EUR) DECT 6.0 (US) K-DECT J-DECT Memory Internal RAM External QSPI Flash Processing and Features Processor 2 x ARM926 ARM926 ARM926 MIPS 2 x 400MHz 208MHz 208MHz Cache I+D I+D I+D Hardware Accelerators Security JPEG ADPCM MLSE JPEG ADPCM MLSE Non-Blind Slot Hibernation Integration RF PA RF Switches I /O Keypad GPIO UART USB PCM/IOM/TDM I2S SPI PWM External Bus 8-bit ULE I/O 9

PRODUCTS ENTERPRISE VOICE DVF FAMILY As the leading silicon vendor for enterprise voice, DSP Group offers the DVF chipset family. Our DVF SoCs family is a comprehensive solution for developing affordable, scalable and green VoIP home and office products.. DVF enables development of low-power enterprise IP Phones, analog terminal adapters (ATAs) and home VoIP phones that offer superb acoustic echo cancellation, high-quality HD voice, multi-line capabilities, and an enhanced user interface (UI). Built on an open platform with ARM processors running on Linux OS, DVF includes IPfonePro, an extensive SDK for IP phones and ATAs. DVF99xx provides outstanding cost/performance value for mid-range to high-end IP phones. Designed especially to meet Tier 1 requirements, DVF99 fully complements existing DSP Group solutions, including DVFD818x VoIP processors for low- and mid-range applications. DVF1100 is the latest member of the DVF family, The DVF1100 is a dual-core System on a Chip (SoC) for Video and Voice over IP (V2oIP) solutions. It provides an ideal solution for high-end voice and video conferencing terminals with rich GUI, HD Video streaming and other multimedia content targeting media IP phones. It implements a high-performance, dual-core architecture with advanced memory support, while reducing power consumption and supporting green features. DVF1100 integrates high-quality HD video engines, hardware-based security and advanced graphics. DVF99 Family Outline DVF9919 DVF9929 DVF9918 Applications Processor ARM926 up to 600 MHz ARM926 @ up to 500 MHz ARM926 up to 400 MHz CSS Processor ARM926 up to 500 MHz ARM926 @ up to 456 MHz ARM926 up to 400 MHz DDR3/3L, DDR2, mddr DDR2/3/3L (one CS) x SDRAM x x RGB LCD I/F x x CPU LCD I/F CPU16/8 CPU8, supporting monochrome and up to WQVGA color displays Through memory bus 2D GUI Engine x x NAND & QSPI Flash Controllers Parallel NOR Flash Controller x x Security Hardware Accelerator Ethernet (G)MAC (RGMII/RMII/MII) (RGMII/RMII, no MII) (RGMII/RMII) DECT Support High-speed USB OTG x Full-speed USB x DVF9919 DVF9929 DVF9918 SDIO Interface (4-bit) TDM 2 1 1 SPI 2 1 1 Fast UART 2 2 2 I2C 2 1 1 Keyboard Scanner 10x8 keys 7x8 keys 7x8 keys Touch Panel x x GPIOs in IP-phone App >24 >16 >16 Audio Front-End 2 SWB codecs, 3+2 mics, 3 speakers 2 SWB codecs, 3 mics, 3 speakers 2 SWB codecs, 3 mics, 3 speakers Class D PA 2W 2W 1W Force Mute HW Package 16x16 mm TFBGA (19x19 ball array), 0.8 mm pitch 16x16 mm TFBGA (19x19 ball array), 0.8 mm pitch Pin-compatible with DVF9919 12.5x12.5 mm TFBGA (15x15 ball array), 0.8 mm pitch Availability In Production In Production In Production 10

PRODUCTS DVF1100 Feature List Applications Processor DDR2/3/3L Memory Video Decoder Video Encoder DVF1100 Dual core Cortex-A9 @ 1.2 1.5 GHz 16-/32-bit up to 1066 MHz H.264 AVC up to L4.2 1080p60 H.265 up to L4.1 1080p60 Also: VC-1, MPEG4, MPEG2, AVS, AVS+, Flash, DivX, Xvid, MJPEG, WMV H.264 AVC up to L4.1 1080p30 3D GPU Engine OpenGLES 1.1/2.0 & OpenVG 1.1 2D GUI Engine Display Interfaces Camera Interfaces Flash Controller Security Hardware Accelerator Yes HDMI 1.4b RX & TX @ 2160p30 DVO @ 1080p60 Proprietary 720p30 YUV4:2:0 Serial NOR, SLC NAND, e.mmc/sd AES, DES/3DES, RC, SHA-1, SHA-2 + OTP Ethernet MAC 10/100/1000 USB Host PCIe RC/EP / esata2/3 1x USB3.0, 2x USB2.0 2x 1-lane Gen2 e.mmc4.5 / SD3.0 / SDIO3.0 2 TDM 2 Fast UART SSC (I2C / SPI) 4 + 2 always on + 1 IrDA 6 + 3 always on Key Matrix 4 x 4 Touch Panel Package Yes FCBGA 25mm x 25mm 11

PRODUCTS VOICE ENHANCEMENT AND ALWAYS-ON DBM FAMILY DSP Group s DBM family of SoCs offers enhanced voice enhancement, voice activation and sensor hub functionality, enabling ultra-low power, always-on capabilities in smartphones, wearable devices and other mobile devices. The DBM chipsets are available in small footprints and embed DSP Group s advanced HDClear technology. DBM chipsets dramatically suppress background noise for far-end users, enhance privacy for near-end speakers, and maximize performance of Automatic Speech Recognition (ASR) engines. DBM11 DBMD2 Function Always-on voice activation Low power consumption Noise reduction Enhanced Maximized ASR AEC Supported voice bandwidth NB NB, WB Segment Mobile phone Wearable devices BT headset Tablets Toys DSP Processor 16 bits CEVA-TeakLite-III 32 bits Program memory ROM RAM I/O GPIO 13 UART PCM/ I 2 S 4 I 2 C SPI SLIMbus AFE Audio In Digital, 3 ADCs Digital and analog microphones Audio Out 1 Headphone AMP, DAC Digital Package Size 5.5 x 5.5 mm 2.4 x 2.4 mm 12

TECHNOLOGIES TECHNOLOGIES DSP Group offers a broad portfolio of integrated technologies for diverse voice, audio, data and multimedia applications maintaining extensive expertise and a leading position in DECT/DECT6.0/JDECT, CAT-iq 1.0/2.0/2.1/3.0 (SOUTA), 2.4GHz, PSTN, and VoIP. We also leverage 25 years of audio processing experience to an array of new technologies that are shaping converged communications at home, in the office and in mobile devices. These advanced technologies include a revolutionary HDClear algorithm for the mobile applications, Ultra Low Energy (ULE) and VoIP. Voice and Audio Providing the wireless industry s most advanced chipset solutions, DSP Group offers innovative voice/audio technologies and advanced algorithms that extend the effective range of clear voice communications for CAT-iq and worldwide DECT - without increasing power and emission levels. In addition, we implement noise-reduction, acoustic echo cancellation and voice-enhancement algorithms that improve voice intelligibility and provide better user experience. ULE (Ultra Low Energy) DSP Group is spearheading development of ULE for home area network (HAN) applications, including home automation, security and safety, energy management, climate control and healthcare. Leading design of the ULE architecture, we are driving ULE s adoption by ETSI, DECT Forum, and the ULE Alliance. DSP Group is one of the founding companies of the ULE Alliance, continues to be a promoter member, holding a position on the board and chairing the Technical Working Group. Voice Intelligibility and Noise Reduction HDClear technology eliminates the traditional tradeoff between voice intelligibility and noise reduction. It delivers measurably higher and more consistent voice quality and intelligibility to mobile users, even in noisy surroundings. HDClear low power and small footprint enable easy integration in mobile and wearable devices. HDClear technology extends voice data acquisition from multi microphones. After the combined input is processed, our Vocal algorithm is applied to the acquired data to enable diverse voice processing tasks such as: echo and background noise cancellation, maximized effectiveness of automatic speech recognition (ASR) engines, loudness equalization, and general voice enhancement. Cordless Telephony The world leader in cordless telephony for over two decades, DSP Group promotes both traditional and next-generation cordless technologies. The company is an active member of the DECT Forum, holding a position on the board and chairing a number of key working groups (WGs), including WG USA, WG Marketing and WG Japan.. This involvement is complemented by our active participation in other relevant Forum working groups, as well as in the ETSI Technical Committee for DECT (TC DECT). 13

TECHNOLOGIES CAT-iq DSP Group has been deeply involved in all stages of defining CAT-iq since its inception, including participating in the DECT Forum and defining ETSI DECT NG specifications. DSP Group is also supports CableLabs specification activities. VoIP DSP Group is recognized for its worldwide leadership in VoIP, maintaining the fastest growing market share in this domain and offering the advantage of seamless scalability to DECT. DSP Group provides best-in-class audio quality and cost-effective solutions for low-to-mid-range VoIP applications, which can be seamlessly extended to high-end applications. Radio Frequency (RF) DSP Group is a leading provider of RF chips, covering all RF bands used in cordless and wireless applications. These bands include 1.7 GHz-1.9 GHz (DECT for the EU, US, LATAM Japan-DECT and Korea), 2.4 GHz (EDCT/WDCT and FHSS DECT), 5.8 GHz (EDCT/WDCT), and Wi-Fi (2.4 GHz and 5 GHz). Designed with CMOS technology, DSP Group s new generation of chips incorporates all required RF functionality on a single chip, including RF transceiver, LNA, PA and channel filters. 14

CUSTOMERS CUSTOMER ADVANTAGES AND BENEFITS Advantages Reflecting DSP Group s two decades of leadership in wireless semiconductor development, our offering features a number of advantages for CE manufacturers and OEMs: Comprehensive product portfolio of complete reference designs of HW, SW and System Mature, field -proven chipset solutions Highly integrated SoCs Operational excellence anoutstanding customer support Broad international standards compliance and support Green, low-power offering Benefits DSP Group s chipset solutions offer CE manufacturers and OEMs a range of benefits to help them better compete in today s rapidlyevolving residential communications market: Low development effort, risk and cost Fast time to market Small design footprint Easy customization and integration of features Supply reliability Innovative revenue-generating applications Expanded market opportunities Customers DSP Group is a customer-centric company that proactively partners with our consumer electronics (CE) manufacturer customer base. We also team with service providers who are focused on bringing innovative residential and enterprise converged communications solutions to market. Based on a deep understanding of market needs, we encourage customer involvement in our roadmap development, and offer customers access to our internal R&D resources. A reliable long-term industry supplier, DSP Group maintains a proven track record of operational excellence and successful delivery. With office across Asia, Europe and North America, we provide our customers with outstanding local service and support worldwide. 15

DSP Group, Inc. (NASDAQ: DSPG) is a leading global provider of wireless chipset solutions for converged communications. Delivering semiconductor system solutions with software and hardware reference designs, DSP Group enables OEMs/ODMs, consumer electronics (CE) manufacturers and service providers to cost-effectively develop new revenue-generating products with fast time to market. At the forefront of semiconductor innovation and operational excellence for over two decades, DSP Group provides a broad portfolio of wireless chipsets integrating DECT/CAT-iq, ULE, Wi-Fi, PSTN, HDClear, video and VoIP technologies. DSP Group enables converged voice, audio, video and data connectivity across diverse mobile, consumer and enterprise products from mobile devices, connected multimedia screens, and home automation & security to cordless phones, VoIP systems, and home gateways. Leveraging industry-leading experience and expertise, DSP Group partners with CE manufacturers and service providers to shape the future of converged communications at home, office and on the go. For more information, visit www.dspg.com. Copyright 2014, DSP Group, Inc. All rights reserved. DSP Group, Inc. and DSP Group Logo are trademarks of DSP Group, Inc. Other third party trademarks are property of their respective owners. All product information, dates and figures are not warranted as accurate or complete, and may be revised based on further information without notice. DSP Group, Inc. 161 S San Antonio Rd, Suite 10, Los Altos CA 94022 Tel: +1-408-986-4300 Fax: +1-408-986-4323 www.dspg.com info@dspg.com