Errata to MPC8569E PowerQUICC III Integrated Processor Reference Manual, Rev. 2

Similar documents
MC56F825x/MC56F824x (2M53V) Chip Errata

Design Recommendations to Implement Compatibility Between the MC13783VK and the MC13783VK5

MPC5200(b) ATA MDMA, UDMA Functionality BestComm Setup Recommendations

MPC7410 RISC Microprocessor Hardware Specifications Addendum for the MPC7410TxxnnnLE Series

SGTL5000 I 2 S DSP Mode

MPC8349E-mITX-GP Board Errata

Utilizing Extra FC Credits for PCI Express Inbound Posted Memory Write Transactions in PowerQUICC III Devices

MTIM Driver for the MC9S08GW64

Updating the Firmware on USB SPI Boards (KITUSBSPIEVME, KITUSBSPIDGLEVME)

Differences Between the DSP56301, DSP56311, and DSP56321

Upgrade the Solution With No Changes 2 Upgrade the Solution With No Changes If a Codebase does not contain updates to its properties, it is possible t

Using the PowerQUICC II Auto-Load Feature

MPR121 Jitter and False Touch Detection

MCF54451, MCF54452, MCF54453, MCF54454,

IIC Driver for the MC9S08GW64

Using an I 2 C EEPROM During MSC8157 Initialization

Errata to the MPC8280 PowerQUICC II Family Reference Manual, Rev. 1

PowerQUICC HDLC Support and Example Code

Using the ColdFire+ Family Enhanced EEPROM Functionality Melissa Hunter Derrick Klotz

MSC8144AMC-S Getting Started Guide

Managing Failure Detections and Using Required Components to Meet ISO7637 pulse 1 on MC33903/4/5 Common Mode Choke Implementation

PCB Layout Guidelines for the MC1321x

MC33696MODxxx Kit. 1 Overview. Freescale Semiconductor Quick Start Guide. Document Number: MC33696MODUG Rev. 0, 05/2007

Using the Kinetis Family Enhanced EEPROM Functionality

Migrating from the MPC852T to the MPC875

etpu General Function Set (Set 1) David Paterson MCD Applications Engineer

USB Bootloader GUI User s Guide

PDB Driver for the MC9S08GW64

Changing the i.mx51 NAND Flash Model for Windows Embedded CE TM 6.0

Using DMA to Emulate ADC Flexible Scan Mode on Kinetis K Series

MPR121 Proximity Detection

MPC8260 IDMA Timing Diagrams

Introduction to the S12G Family EEPROM Including a Comparison between the S08DZ, S12XE, and S12P Families

Electrode Graphing Tool IIC Driver Errata Microcontroller Division

Interfacing MPC5500 Microcontrollers to the MFR4310 FlexRay Controller Robert Moran MCD Applications, East Kilbride, Scotland

Interfacing and Configuring the i.mx25 Flash Devices

Using the Asynchronous DMA features of the Kinetis L Series

Using the CAU and mmcau in ColdFire, ColdFire+ and Kinetis

Mask Set Errata for Mask 2M40J

EchoRemote Evaluation Software for Windows

1 Introduction. 2 Problem statement. Freescale Semiconductor Engineering Bulletin. Document Number: EB727 Rev. 0, 01/2010

SCI Driver for the MC9S08GW64

Use of PGA on MC56F800x Interaction of PDB, PGA and ADC

i.mx31 PDK Power Measurement with GUI

16-bit MCU: S12XHY256 Automotive Cluster Demo by: Jose M. Cisneros Steven McLaughlin Applications Engineer Microcontroller Solutions Group, Scotland

VortiQa Enterprise Quick Start Guide

MCF5445x Configuration and Boot Options Michael Norman Microcontroller Division

Power Cycling Algorithm using the MMA73x0L 3-Axis Linear Accelerometer

Mask Set Errata for Mask 5L35K

Using GCR4 to Adjust Ethernet Timing in MSC8144 DSPs

Using the Project Board LCD Display at 3.3 volts

56F8300 BLDC Motor Control Application

MPC8569E Instruction RAM Microcode Package Release 169

etpu Automotive Function Set (Set 2)

Component Development Environment Installation Guide

Errata to MPC8308 PowerQUICC II Pro Processor Reference Manual, Rev. 0

MPR083 Proximity Evaluation Kit User s Guide

Support for IEEE 1588 Protocol in PowerQUICC and QorIQ Processors

Pad Configuration and GPIO Driver for MPC5500 Martin Kaspar, EMEAGTM, Roznov Daniel McKenna, MSG Applications, East Kilbride

Using IIC to Read ADC Values on MC9S08QG8

ColdFire Convert 1.0 Users Manual by: Ernest Holloway

Mechanical Differences Between the 196-pin MAP-BGA and 196-pin PBGA Packages

Interrupts in Decoupled Parallel Mode for MPC5675K Configuration and Usage

Converting Earlier Versions of CodeWarrior for StarCore DSPs Projects to Version

HC912D60A / HC912Dx128A 0.5µ Microcontrollers Mask sets 2K38K, 1L02H/2L02H/3L02H & K91D, 0L05H/1L05H/2L05H

Using the Multi-Axis g-select Evaluation Boards

PowerQUICC II Parity and ECC Capability

Interfacing MPC5xx Microcontrollers to the MFR4310 FlexRay Controller David Paterson MCD Applications, East Kilbride

Using the Knock Window etpu Function

Keil uvision 4 Kinetis Support for Freescale MQX RTOS Release Notes

56F805. BLDC Motor Control Application with Quadrature Encoder using Processor Expert TM Targeting Document. 56F bit Digital Signal Controllers

Functional Differences Between the DSP56307 and DSP56L307

MSC8144 Device Reset Configuration For the MSC8144ADS Board

Mask Set Errata for Mask REV3.1_2N89D

i.mx31 PDK 1.3 to PDK 1.4 Revision Changes Linux

Clock Mode Selection for MSC8122 Mask Set K98M

Booting from Serial RapidIO / PCI Express on PowerQUICC III and QorIQ P1xx/P2xx

Interfacing MC33903/4/5 With MC9S08DZ60

Sensorless BLDC Motor Control Based on MC9S08PT60 Tower Board User Guide

Optically-Isolated Multilink BDM Interface for the S08/S12 Microcontrollers by Michael A. Steffen

Interfacing HCS12 Microcontrollers to the MFR4200 FlexRay Controller

MC9S08DZ60 Migrating from the 3M05C to M74K Mask Set D. Scott Brown Applications Engineering Microcontrollers Solutions Group Austin, TX, USA

MC33897 Single-Wire CAN Transceiver Reliability and Quality Documents

Mask Set Errata for Mask 2N40C

Freescale Semiconductor. Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MP3V5050.

PMSM Vector Control with Encoder on Kinetis Setup Guide for Demo Kits without a Tablet PC

MPC8260 SDRAM Timing Diagrams

ADC Driver for MC9S08GW64

Writing Touch Sensing Software Using TSI Module

NetComm Software Errata

DSP56F827 Digital Signal Controller

MC33794 Touch Panel System Using E-Field Sensor Setup Instructions

Symphony SoundBite: Quick Start with Symphony Studio. Installation and Configuration

56F805. Digital Power Factor Correction using Processor Expert TM Targeting Document. 56F bit Digital Signal Controllers. freescale.

Gallium Arsenide PHEMT RF Power Field Effect Transistor

MC9S08DZ60 Flash Usage Considerations Andy McKechan Applications Engineer East Kilbride

Addendum to HPCN User s Guide: Quick-Start Guide

Configuring the MCF5445x Family for PCI Host Operation

MPC5200B (M62C) Errata Microcontroller Division

ORDERING INFORMATION. Device Marking MPXC2011DTI Tape and Reel 423A Date Code, Lot ID MPXC2012DTI Tape and Reel 423A Date Code, Lot ID

Transcription:

Freescale Semiconductor Addendum Document Number: MPC8569ERMAD Rev. 2.1, 12/2011 Errata to MPC8569E PowerQUICC III Integrated Processor Reference Manual, Rev. 2 This errata describes corrections to the MPC8569E PowerQUICC III Integrated Processor Reference Manual, Revision 2. For convenience, the section number and page number of the errata item in the reference manual are provided. Items in bold are new since the last revision of this document. To locate any published updates for this document, visit our website listed on the back cover of this document. Freescale Semiconductor, Inc., 2011. All rights reserved.

1.4.9, 1-12 In Section 1.4.9, Enhanced Secure Digital Host Controller (esdhc), remove SDIO reference from the first paragraph. The updated paragraph reads as follows: The enhanced secure digital host controller (esdhc) provides an interface between the host system and SD/MMC cards. The esdhc acts as a bridge, passing host bus transactions to SD/MMC cards by sending commands and performing data accesses to or from the cards. It handles SD/MMC protocols at the transmission level. 4.5, 4-28 In Section 4.5, Initialization/Applications Information, update the third sentence from: Two different configurations are provided for boot from the on-chip ROM: boot from espi and boot from esdhc. to: The only configuration provided for boot from the on-chip ROM is through esdhc. 4.5.1.1, 4-29 In Section 4.5.1.1, Overview, remove occurrence of SDIO from the second row of the first paragraph. The updated row reads as follows: This device can be either a SD card or MMC card, or other variants compatible with these devices. 4.5.2, 4-37 In Section 4.5.2, Default e500 Addressing During System Boot, update the first sentence from: During boot from the on-chip ROM (for boot targets of either espi or SD/MMC), the user specifies 32-bit addresses for several fields (Target Address for copying the user s code, and the Execution Starting Address). to: During boot from the on-chip ROM (for boot target of SD/MMC), the user specifies 32-bit addresses for several fields (Target Address for copying the user s code, and the Execution Starting Address). 8.3.2.1, 8-9 In Table 8-3, Memory Interface Signals Detailed Signal Descriptions, update the cross-reference to point towards Section 8.4.1.36, DDR Control Driver Register 1 (DDRCDR_1) for the Dn_MDIC[0:1] signal. The updated signal description reads as follows: Table 8-3. Memory Interface Signals Detailed Signal Descriptions Signal I/O Description Dn_MDIC[0:1] I/O Driver impedance calibration. Note that the MDIC signals require the use of resistors; MDIC0 must be pulled to GND, while MDIC1 must be pulled to GVDD. See Section 8.4.1.36, DDR Control Driver Register 1 (DDRCDR_1), for more information on these signals. State These pins are used for automatic calibration of the DDR IOs. Meaning Timing These are driven for four DRAM cycles at a time while the DDR controller is executing the automatic driver compensation. 2 Freescale Semiconductor

8.4.1.21, 8-42 In Figure 8-22, DDR Write Leveling Control Register (DDR_WRLVL_CNTL), update the bit range for WRLVL_START from 27 31 to 28 31. The updated figure is shown below: Offset 0x174 Access: Read/Write R W Reset 0 1 4 5 7 8 9 11 12 13 15 16 19 20 21 23 24 27 28 31 WRLVL_ EN WRLVL_ MRD WRLVL_ ODTEN WRLVL_ DQSEN All zeros WRLVL_ SMPL WRLVL_WL R Figure 8-22. DDR Write Leveling Control Register (DDR_WRLVL_CNTL) WRLVL- START In addition, for Table 8-27, DDR_WRLVL_CNTL Field Descriptions, update the bit range for Reserved from 24 28 to 24 27 and WRLVL_START bit range from 27 31 to 28 31. 8.4.1.38, 8-63 In Table 8-44, CAPTURE_ECC Field Descriptions, update the description for ECE bit (bits 16 31) for 24:31. The updated description reads as follows: Table 8-44. CAPTURE_ECC Field Descriptions Bits Name Description 16 31 ECE Error capture ECC. Captures the ECC bits on the data path whenever errors are detected. 16:23 8-bit ECC for the 32 bits in beats 0, 2, 4 and 6 in 32-bit bus mode; should be ignored for 64-bit bus mode 24:31 8-bit ECC for the 32 bits in beats 1, 3, 5, and 7 in 32-bit bus mode; should be used for every beat in 64-bit bus mode 8.5, 8-69 In Section 8.5, Functional Description, update the third sentence of the fourth paragraph from: Using ECC, the DDR memory controller detects and corrects all single-bit errors within the 64- or 32-bit data bus, detects all double-bit errors within the 64- or 32-bit data bus, and detects all errors within a nibble. to: Using ECC, the DDR memory controller detects and corrects all single/double-bit errors within the data bus, and detects all errors within a nibble. 8.5.7, 8-86 In Section 8.5.7, DDR SDRAM Refresh, remove the last sentence To ensure that the latency caused... requied by the SDRAM from the first paragraph. 8.6.1, 8-100 In Table 8-70, Programming Differences Between Memory Types, update the Difference column for ODT_CFG from LPDDR to DDR3. The updated row reads as follows: Freescale Semiconductor 3

Table 8-70. Programming Differences Between Memory Types Parameter Description Differences Section/page ODT_CFG ODT Configuration DDR3 Should be set to 00 8.4.1.9/8-27 DDR2 Can be set for termination at the IOs according to system topology. Typically, if ODT is enabled, then the internal IOs should be set up for termination only during reads to DRAM. 12.6.4.4.1, 12-92 In Table 12-38, RAM Word Field Descriptions, add the following note for the LAST bit (bit 31): UPM continue to execute RAM words until it finds LAST, irrespective of the assigned region for various patterns like RSS. 13.7, 13-45 Replace Table 13-28, MPC8569E DMA Paths, with the following table: Table 13-28. MPC8569E DMA Paths DMA Controllers L2 On-Chip Targets Configuration Registers QE DDR Local Bus Off-Chip Targets DUART FIFO Serial RapidIO PCI Express On-chip esdhc Y NS Y Y Y Y Y Y 4 Channel Y NR Y Y Y Y Y Y QE Y NS Y Y Y NS Y Y Off-chip Serial RapidIO Y Y Y Y Y Y Y PCI Express Y Y Y Y Y Y Y Note: On-chip target configuration registers include I 2 C data register. Note: On-chip 4-channel controller can serve external masters. Note: QE DMA can be utilized only through micro code packages. 15.5.1.17, 15-36 In Table 15-26, PCI Express Error Capture Status Register Field Descriptions, update bit range for GSID bit from 23 30 to 26 30. 16.6.2.2, 16-46 In Figure 16-26, Flow Chart for Reset of esdhc, update the caption to Flow Chart for Reset of esdhc and replace with the following figure: Write 1 to RSTA Bit to Reset esdhc Send 80 Clocks to Card Send CMD0 to Card to Reset Card Voltage Validation Figure 16-26. Flow Chart for Reset of esdhc 4 Freescale Semiconductor

{ } software_reset() In addition, replace the pseudocode with the following: Configure the I/O muxes to select SD signals; set_bit(sysctl, RSTA); // software reset the host set SYSCTL[DTOCV and SDCLKFS]; // get the SDHC_CLK of frequency around 400 khz poll PRSSTAT[CIHB and CDIHB]; // wait until both bits are cleared set_bit(sysctrl, INTIA); // send 80 clock ticks for card to power-up If the card is SD/MMC send_command(cmd_go_idle_state, <other parameters>);// reset the card with CMD0 16.6.5, 16-55 In Table 16-27, Commands for MMC/SD, add the following row for CMD8 for SD card immediately below the row for CMD7: Table 16-27. Commands for MMC/SD CMD INDEX Type Argument Resp Abbreviation Description CMD8 bcr [31:12] reserved bits [11:8] supply voltage(vhs) [7:0] check pattern R7 SEND_IF_COND Sends SD Memory Card interface condition, which includes host supply voltage information and asks the card whether card supports voltage. Reserved bits shall be set to 0. In addition, for Table 16-27, Commands for MMC/SD, add the following note immediately after the note Command SWITCH is for high-speed MMC cards... and below Table 16-28, EXT_CSD Access Modes. The added note is shown below: CMD8 differs for MMC and SD cards. For SD cards, CMD8 is referred to as SEND_IF_COND. For MMC cards, CMD8 is referred to as SEND_EXT_CSD. 17.7.7.7, 17-156 In Table 17-72, PKEU Interrupt Status Register Field Descriptions, update the bounds of KSE (bit 54) from 1 256 to 1 512 and the bounds of DSE (bit 55) from 97 4096 to 33 4096. The updated rows reads as follows: Table 17-72. PKEU Interrupt Status Register Field Descriptions Bits Name Description 54 KSE Key size error. Value outside the bounds of 1 512 bytes was written to the PKEU key size register 0 No error detected 1 Key size error detected 55 DSE Data size error. Value outside the bounds 33 4096 bits was written to the PKEU data size register 0 No error detected 1 Data size error detected 18.4.1.1, 18-7 In Table 18-3, PORPLLSR Field Descriptions, update the bit settings from 00110 12:1 to 01100 12:1 and from 00111 Synchronous mode to 00110 Freescale Semiconductor 5

Synchronous mode for DDR_Ratio (bits 18 22). The updated description reads as follows: Table 18-3. PORPLLSR Field Descriptions Bits Name Description 18 22 DDR_Ratio Establish the clock ratio between the DDR3 data rate and SYSCLK. The values correspond to the values on cfg_ddr_pll[0:2] at the negation of HRESET. Patterns not shown are reserved. 00011 3:1 00100 4:1 00101 5:1 00110 6:1 01000 8:1 01010 10:1 01100 12:1 00110 Synchronous mode 6 Freescale Semiconductor

How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. Exchange Building 23F No. 118 Jianguo Road Chaoyang District Beijing 100022 China +86 10 5879 8000 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center 1-800 441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor @hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters which may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale and the Freescale logo are trademarks or registered trademarks of Freescale Semiconductor, Inc. in the U.S. and other countries. All other product or service names are the property of their respective owners. The Power Architecture and Power.org word marks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org. Freescale Semiconductor, Inc., 2011. All rights reserved. Document Number: MPC8569ERMAD Rev. 2.1 12/2011