5.0mm x 5.0mm FULL-COLOR SURFACE MOUNT LED LAMP ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Part Number: KAAF-5050RGBS-13 Features Description Chips can be controlled separately. The device is based on light emitting diode chip Suitable for all SMT assembly and solder process. made from AlGaInP. Available on tape and reel. The source color devices are made with InGaN Light White SMD package, silicone resin. Emitting Diode. Package: 500pcs / reel. The source color devices are made with InGaN Light Moisture sensitivity level : level 3. Emitting Diode. RoHS compliant. Static electricity and surge damage the LEDS. Package Dimensions It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded. BLUE GREEN RED Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAM4651 REV NO: V.2B DATE: APR/10/2013 PAGE: 1 OF 8
Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H 2 S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. Detailed application notes are listed on our website. http://www.kingbright.com/application_notes SPEC NO: DSAM4651 REV NO: V.2B DATE: APR/10/2013 PAGE: 2 OF 8
Selection Guide Part No. Dice Lens Type (AlGaInP) Iv (mcd) [2] @ 30mA Iv (mcd) [2] @ 50mA Viewing Angle [1] Min. Typ. Min. Typ. 2θ1/2 - - 1000 1400 KAAF-5050RGBS-13 (InGaN) Water Clear 1000 1400 - - (InGaN) 300 420 - - 120 Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous Intensity / Luminous Flux: +/-15% 3. Luminous intensity value is traceable to the CIE127-2007 compliant national standards. Electrical / Optical Characteristics at TA=25 C Symbol Parameter Device Typ. Max. Units Test Conditions λpeak λd [1] Δλ1/2 C VF [2] IR Peak Wavelength Dominant Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current 640 520 465 625 525 470 25 35 22 27 100 100 2.5 3.3 3.5 3.2 4.1 4.5 Notes: 1.Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V. 3.Wavelength value is traceable to the CIE127-2007 compliant national standards. 10 50 50 nm nm nm pf V ua IF=50mA IF=50mA IF=50mA VF=0V;f=1MHz IF=50mA VR=5V Absolute Maximum Ratings at TA=25 C Parameter Units Power dissipation [1] 350 mw DC Forward Current 50 30 30 ma Peak Forward Current [2] 150 100 100 ma Reverse Voltage 5 V Operating Temperature -40 C To +85 C Storage Temperature -40 C To +85 C Notes: 1. Within 350mW at all chips are lightened. 2. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAM4651 REV NO: V.2B DATE: APR/10/2013 PAGE: 3 OF 8
KAAF-5050RGBS-13 SPEC NO: DSAM4651 REV NO: V.2B DATE: APR/10/2013 PAGE: 4 OF 8
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KAAF-5050RGBS-13 Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Tape Dimensions (Units : mm) Reel Dimension SPEC NO: DSAM4651 REV NO: V.2B DATE: APR/10/2013 PAGE: 7 OF 8
PACKING & LABEL SPECIFICATIONS KAAF-5050RGBS-13 SPEC NO: DSAM4651 REV NO: V.2B DATE: APR/10/2013 PAGE: 8 OF 8