LS9100. Archimedes Series. Dimmable High Voltage LED Direct AC Driver

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LS900 Dimmable High Voltage LED Direct AC Driver Archimedes Series Features Integrated Bridge Rectifier and MOSFET Driver Wide AC input range up to 30 Vac 50/60Hz 50mA DC output current Ultra simple circuit solution. Requires Only One R passive component Thermal Turndown Protections Voltage Shutdown Protections Thermal Enhanced SOP-8 and Heat Sink PAD package TRIAC Dimmable (Leading/Trailing Edge) Programmable LED Current with an external sense resistor Applications LED Driver Current Source limiter General Illumination Commercial and Industrial Lighting Description The LS900 is a High Voltage full-bridge rectifier combined with a current limiter source circuit and protection circuit. Its rugged design is optimized for driving LED banks directly from the main utility line eliminating external components by merging them into a monolithic package, drastically reducing the board space and cost. The thermal turndown located in the center of the IC protects itself from operating in atypical conditions. The voltage shutdown protection circuit safeguards the IC and the system s LEDs from voltage surges that can overstress the system. Ordering Information Part Number LS900X-S LS900X-STR Description SOP-8: Tape and Reel (000/Reel) L RS0 RS RS2 2 3 4 8 7 6 L2 HS LS 5 LS0 LS900-70306-A- 206 LSI Computer Systems, Inc.

PIN Configuration L RS0 RS RS2 2 3 4 8 7 6 L2 HS LS 5 LS0 Top View PIN # Name Description L Input AC 2 RS0 Current sense resistor input 0 3 RS Current sense resistor input 4 RS2 Current sense resistor input 2 5 LS0 Low Side input 0 6 LS Low Side input 7 HS High side output 8 L2 Input 2 AC PAD xpad Current sense resistor input 0 Block Diagram HS 7 LS0 5 LS 6 L L2 8 LS900 Bridge Rectifier Ckt High Voltage Protection Ckt Thermal Turndown Ckt RS0 2 Current Control Ckt RS 3 RS2 4 LS900-70306-2

Maximum Rating And Electrical Characteristics Rating at 25 C ambient temperature unless otherwise specified (Note). Parameter Symbol Min Typ Max Unit Repetitive peak reverse voltage (Input L-L2) Vrrm 500 V DC Blocking voltage (Input L-L2) Vdc 500 V RMS Voltage (Input L-L2) Vrms 30 V Instantaneous forward voltage (L-2/HV) Vf 0.75 V Average forward current (L-2/HV) Iav 50 ma Peak Forward surge current (Note 2) Ifsm 80 ma DC reverse current @TA=25 C @TA=00 C Ir.5.00 ua Low Side peak voltage (Input LS0-) Vls 00 350 V Low Side Voltage Shutdown Protection (Input LS0-) Vshdw 5 30 45 V Total Low Side Current (Input LS0-) 50 40 ma Package Power Dissipation (Note 3) PDpkd 2500 mw Typical Thermal resistance (Note 3) Rɵja 45 C/W Typical Junction capacitance (PIN,8) Cj 45 pf Operating Junction Temperature Tj -40 +25 C Current Thermal turndown Itdw -0.32 %A/ C Storage temperature Tstrg -55 +25 C Junction Temperature Tjmax +50 C Lead Temperature (0 second soldering) Tsld +300 C Notes:. Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. 2. msec half sine wave superimposed on rated load 3. Power dissipated from junction to lead PCB mounted on suggested PAD Layout. Derate 20mW/ C when the ambient temperature is above 25 C. Special care of the thermal dissipation in the PCB design must be taken. 4. ESD protection. HBM : kv at all Pins. LS900-70306-3

Electrostatic Discharge Sensitivity This integrated circuit can be damaged by ESD. LSI/CSI recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Typical Application 0VAC 60HZ Surge Protection CKT N L 8 L L2 7 RS0 HS 2 6 RS LS 3 5 RS2 LS0 4 Rsns DANGER!: THE READER IS WARNED THAT CAUTION MUST BE USED IN THE CONSTRUCTION, TESTING AND USE OF THIS CIRCUIT. LETHAL HIGH VOLTAGE POTENTIALS ARE PRESENT IN THIS CIRCUIT. EXTREME CAUTION MUST BE USED IN WORKING WITH, AND MAKING CONNECTIONS TO, THIS CIRCUIT. USE CAUTION. LS900-70306-4

Typical Characteristics At Tamb = + 25, unless otherwise noted. Output Current (Icsns) vs. External Resistor (Rcsns) Rcsns (Ω) 00 0 Tj,+25 C Tj,+85 C Tj,+25 C Tj, 0 C Tj,-40 C 0 00 Icsns (ma) 3000 Total Power Dissipation (mw) vs. Ambient Temperature (Ta) 2500 Power Dissipation (mw) 2000 500 000 500 0 0 20 40 60 80 00 20 Ambient Temperature ( C) LS900-70306-5

Package Information 8-Lead SOP Exposed Pad Plastic Package Notes: A. All linear dimension are in inches. B. The thermal pad is design to be solder on the PCB. C. This drawing is subject to change without notice. LS900-70306-6

Package Mounting The figure below provides the minimum recommended PCB layout for the LS900 device. For lowest overall thermal resistance, it is best to solder the heat sink Pad directly to the circuit board. Adding more area to the heat sink improves heat dissipation. 0.2 0.05 0.022 0.600 Solder mask over copper Top Side 0.096 0.05 0.05 0x 0.02 Via Plated holes 0.600 0.32 Bottom Side 0.600 Notes: A. All linear dimension are in inches (not to scale). B. This drawing is subject to change without notice. C. This package mounting is a guideline example and does not cover all applications. D. Conformal Coating material must be applied to act as protection against moisture and harsh environments. LS900-70306-7

IMPORTANT NOTICE The information included herein is believed to be accurate and reliable. However, LSI Computer Systems, Inc. assumes no responsibilities for inaccuracies, nor for any infringements of patent rights of others which may result from its use. LSI Computer Systems reserves the right to change circuitry and specifications at any time without notification to the customer. LSI Computer Systems assumes no liability for applications assistance or the design of Buyers products. Buyers are the only responsible for their products and applications using LSI Computer Systems components. To minimize the risks associated with Buyers products and applications, Buyers should provide adequate design and operating safeguards. LS900-70306-8