Design an Intelligent Distributed Control System with S12 MagniV Mixed-Signal MCUs

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Design an Intelligent Distributed Control System with S12 MagniV Mixed-Signal MCUs FTF-AUT-F0085 Vincent McNeil, Ph.D. Product Line Manger A P R. 2 0 1 4 TM External Use

Agenda Introduction Overview of Motor Drive Applications in Body Electronics: Overview of Intelligent Distributed Control Products Product architecture Example of existing product applications Family of IDC products for Relay Driven Motors Tools and Product Enablement Conclusion External Use 1

Objectives Educate session participants about the features and capabilities of the IDC product family based on S12 MCU Explain about the evolution of the IDC relay driver products Inform participants about the tools available to start quickly evaluating or developing applications with the product External Use 2

Integrated BCM Gateways What s Behind Body Electronics? Door SLP AFS ripple cnt Front Light / Light / Light LED ctrl LED ctrl MCU Input CAN Gateway 32bit 176 pin Monitor LIN SBC (208/256) BCM Output Driver W/D & Front Light / RF Light / Safety Light LED ctrl Rx LED ctrl MCU AFS Door SLP ripple cnt Rear Light Input Switches etc. Output Interior lighting etc. Rear Light Comfort Features Vehicle Networking Safety Related Security Door Module Window Lift Seat Module HVAC Electric sunroof/shade Interior lighting Central Body Control Module Central Gateways: CAN, LIN, Flexray, Ethernet, MOST Steering column lock Steering column adjustment Seat positioning Wipers and rain sensors Lighting and light sensors Convertible top Anti-pitch power windows Immobilizer Keyless Entry Preventing hacking and counterfeit modules Body systems embrace a broad variety of applications inside the cabin Body systems cover the widest range of performance requirements Small 8-bit controllers and watchdogs General purpose 16-bit controllers High performance 32-bit compute engines External Use 3

What is Intelligent Distributed Control (IDC)? Example: Distributed Door > 34 nodes per car Networked motor driver system solution for body electronics optimized per application Designed for LIN/CAN distributed systems Well-suited for distributed motor control applications Distributed systems architecture can address both low end and high end requirements, due to its plug and play nature LIN/CAN Distributed Systems Standard interface (LIN) allows a wide selection of products without changing door concepts, and keeping a simple wire harness Optimized products with an integrated intelligent unit (MCU) External Use 4

Intelligent LIN-Based Body Electronic Motor Drivers Windshield wipers Sun-roof / Sun-shade Adaptive Front-lighting System (AFS) Electric Windows (Window-lift) External Power Mirrors External Use 5

Full Discrete Semi Integrated TM IDC / MagniV Concept VREG CAN or LIN phy 2+ 2+ MCU or DSC 20+ Relay / Motor / Bulb/LED Driver PCB space savings Op-amps IDC ASSP MCU or DSC 16-24 ASIC / ASSP (H-bridge+ HSD / LSD + VREG+ LIN+ Current sense) External Use 6

Intelligent Distributed Control (IDC) Solution Architecture S08 S12 LIN or CAN Physical Layer External Use 7

What s S12 MagniV? System Solutions Discrete Solution (Multi-package) Standard MCU Multi-die SiP Single package Multi-die (MCU + analog) Monolithic SoC MCU and Analog on the same die 16 BIT MCU Application Specific Analog IC (ASIC /ASSP) Analog ASSP Body Electronics system solution integrating an S12 MCU, LIN transceiver, SBC, analog, and High Voltage power drivers in a single package. External Use 8

H-bridge Driven DC Motors Relay-Driven DC Motors H-bridge Driven DC & Stepper Motors TM IDC Product Portfolio MM912_634 MM912xF634 Window lift /Sun roof MM908E624 MM908E622 Mirror MM908E621 MM908E626 Light-leveling MM908E625 8-bit MCU 16-bit MCU External Use 9

> 10 Years of IDC system solutions for Body Electronics MM908E622/1 8-bit HC08 + Analog Mirror Driver MM912G634 16-bit S12I32 + Analog Relay & Switch Driver MM908E624 8-bit HC08 + Analog Relay Driver MM908E626 HC08 + Analog AFS Stepper Driver MM908E630 8-bit HC08 (SOG) + Analog Relay Driver 200 2003 2004 2005 2006 2007 2008 2009 2010 SiP Architecture HC08 Microcontroller with flash (0.5um) SMOS5 (0.8um) 54ld SOIC Package SMOS8 (0.25um) QFN Package MM912F634 16-bit S12I32 + Analog Relay & Switch Driver S12 Core (0.25um) Architecture Repartitioning S12VR64 (first part of MagniV family S12ZVM S12ZVH S12ZVL S12ZVC 2011 2012 2013 2014 LL18UHV technology Monolithic SoC S12Z Core Products Technologies 2015 2nd Gen 3rd Gen 4th Gen External Use 10

MM908E625: Integrated Quad Half H-Bridge with Power Supply, Embedded MCU and LIN Serial Communication Key Characteristics MCU / Memory : HC08 /16K Power Outputs : 4 X HB / 1 XHS PL / WD : LIN / Yes Stop/Sleep current : 65µA / 35µA ESD : +/- 4 KV Operating voltage : 8V 18 V Operating temp.: -40 C < Ta < 85 C Package : SOIC 54 EP Key Features HC08 µc with Timer, ESCI, A/D, on chip oscillator 16k of Flash Memory 4 x Half Bridge Outputs (425 mw) 1 x High Side Output (600 mw) 1 x switched 5V output Voltage regulator 5V/60mA Protection / Diagnostic Current Control / Current Recopy LIN Physical Layer with selectable slew rate 3 x Hall sensor Inputs 1 x Analog Inputs with Current Source In Production External Use 11

MM908E622: Integrated Quad Half H-Bridge / Triple High Side with Power Supply, Embedded MCU, and LIN Serial Interface Key Characteristics MCU / Memory : HC08 /16K Power Outputs : 4 X HB / 3 XHS PL / WD : LIN / Yes Stop/Sleep current : 50µA / 20µA ESD : +/- 4 KV Operating voltage : 7.5V 20 V Operating temp.: -40 C < Ta < 85 C Package : SOIC 54 EP Key Features HC08 µc with Timer, ESCI, on chip oscillator 16k of Flash Memory 4 x Half Bridge s (2 x 750mW / 2 x 2750mW) 3 x High Side s (2 x 440 mw, 1 x 185mW) 1 x Switchable 5V output Voltage Regulator 5V/60mA Protection / Diagnostic / Current Recopy LIN Physical Layer with selectable slew rate 1 x Hall sensor Input 1 x Analog Input with current source 1 x Wake Up Input Electro-chrome feature In Production External Use 12

Window Lift Application Background Typical Anti-Pinch Window Lifter ECU Module Mounting Point Function DC Motor Key Up/Down Function Basic Features Implementation Relay Driver Wakeup Input Additional Features Implementation Anti-Pinch Hall Sensor / Current Sensing Ramp Up/Down Safety Features Communication Motor Current Nominal Voltage MOSFET (PWM) Watchdog Supply Voltage Sensor LIN Transceiver Technical Data Typ. 2-5 A, 12-20 A pk 12V DC External Use 13

MM912_634: An Intelligent Relay Driver for DC Motors External Use 14

MM912_634 Family Relay-driven Motor Driver G P I O LIN -PHY SCI SPI BDM TIM 16b 4ch Digital Components KWU PWM 2ch 8b E-Vreg 18V/ 80 ma MCU Core and Memories Win Wdog RCosc. +/-1.3% 5V Analogue Components High-Voltage Components 32/48/64kB Flash (ECC) 2 kb-4kb D-Flash Pierce Osc. PLL S12 CPU with 20 MHz Bus 6 HV Inputs 2 kb-6kb RAM Vbat sense Temp Sense Vreg 80 ma 2 HS Drivers 2 LS Drivers 10-Bit ADC Current Sense Vsup sense Key Features S12 16-bit CPU (up to 20 MHZ) Operating voltage: 5.5V to 18V (functional up to 27V) Voltage regulator operating directly from car battery. Vreg capable of driving 18V/80 ma for off- chip components (E-Vreg) LIN physical layer: LIN 2.x / J2602 compliant; ± 8kV ESD rated Two protected low-side drivers: Drive relays with 10 khz PWM, energy clamp, and current limit for motor and device protection (Eclamp = 10 mj @ 125 C) Two protected high side drivers: 50 khz PWM and current limit. Used for driving control switches and indicator LEDs 6 high voltage inputs: 12V inputs for switch monitoring On-chip RC oscillator: trimmed to ±1.3% tolerance over full temperature range On-chip SRAM: 2kB to 6kB Integrated current sense: Used for sensing motor position/load 10-bit ADC with 15 inputs External Use 15

MM912_634 Family Relay-driven Motor Driver (Continued) Target Applications: Automotive electric window-lift /sunroof motors with anti-pinch Generic LIN-controlled relay-driver LIN nodes Family Options: Flexible flash options: 32 kb, 48 kb, and 64 kb Flexible SRAM options: 2 kb to 6 kb 48-pin LQFP package with/without exposed pad (EP) EP used for better thermal performance C*/ V / M temperature options (up to 125 C Ta) C* is for IMM market and will operate up to 30V supply External Use 16

IDC MM912_634 Relay Driver Product Family Overview Products MM912F634 MM912xF634 MM912G634 MM912G634 / MM912H634D -up to 16MHz - up to 2k RAM - LIN Tx/Rx - Battery Sense - Vreg - 4 HVIOS - 6 GPIOs - 3 ADC/TIMERS - 2 HS Switches - 2 Relay drivers (LS) - SPI -up to 20MHz - up to 2k RAM - LIN Tx/Rx - Battery Sense - Current Sense - Vreg - 6 HVIOs - 6 GPIOs - 3 ADC/TIMERS - 2 HS Switches - 2 Relay drivers (LS) - SPI - up to 16MHz - up to 2k RAM - 2k Data Flash - LIN Tx/Rx - Battery Sense - Vreg - 4 HVIOs - 8 GPIOs - 3 ADC/TIMERS - 2 HS Switches - 2 Relay drivers (LS) - SPI - up to 32MHz - up to 6k RAM - Up to 4k Data Flash - LIN Tx/Rx & CAN - Battery Sense - Current Sense - Vreg - 6 HVIOs - 8 GPIOs - 3 ADC/TIMERS - 2 HS Switches - 2 Relay drivers (LS) - SPI MCU Mixed-Signal Die Freescale S12 ( 16-Bit ) Implemented in FSL SMOS process Technology Package LQFP 48 - NEP LQFP 48 - NEP LQFP 48 - EP LQFP 48 - EP External Use 17

Application Performance TM MagniV Product Positioning 12V-Vreg MM912H634 S12 Core LIN-PHY 64K Flash MM912G634 12V-Vreg S12 Core LIN-PHY 48K Flash 2 HSD / 2 LSD 2K RAM 4/6 HV Inputs* 2k Data 5-18V Hall Sup. Current Sense* 48 LQFP /LQFP-EP* 2 HSD / 2 LSD 6K RAM 6 HV Inputs 4k Data 5-18V Hall Sup. Current Sense 48 LQFP / LQFP-EP S12VR MM912F634 12V-Vreg S12 Core 12V-Vreg S12 Core LIN-PHY 48-64K Flash* LIN-PHY 32K Flash 2 HSD* / 2 LSD 2K RAM 2 HSD / 2 LSD 2K RAM 4 HV Inputs 512 EEPROM 4/6 HV Inputs* S12VR 12V-Vreg LIN-PHY 5V Hall Supply Additional SCI 48 LQFP S12 Core 48-64K Flash* 5-18V Hall Sup. Current Sense* 48 LQFP / LQFP-EP* Digital Components 5V Analogue Components 1 HSD* / 2 LSD 2K RAM 4 HV Inputs 512 EEPROM 5V Hall Supply Additional SCI 32 LQFP MCU Core and Memories * Optional Feature Price High-Voltage Components EP = Exposed Pad External Use 18

MM912_634 EcoSystem: Evaluation Kit Fast evaluation of performance: EVBs for MM912_634 Easy to use debugging tool (register or module access) CodeWarrior compiler Programs S12 P&E 1. LEDs indicate HS and LS switching 2. Input power connectors 3. Prototype area 4. TBDML interface 5. LIN connector 6. Wake-up button 7. Reset button 8. BDM connector for external programming/debugging BDM interface 9. MM912_634 External Use 19

MM912_634 EcoSystem: Evaluation Kit Documentation Complete technical documentation to ease design Datasheets, EVB contents Official EMC reports from external laboratories External Use 20

MM912_634 EcoSystem: Tools and Software FreeMASTER Direct Register Access Control Page FreeMASTER Modules Access Control Page 1 Six tabs with registers 2 Register address 3 Register name 4 Bit field - by clicking the button the bit value is toggled 5 Numerical value of the register 6 Read and Write buttons 7 BDM communication error 8 Back button to return to the start page 9 Read all Registers button 10 Selection of number format for all read register values 11 Message box stating whether the correct register value was entered 1 Status Field : last reset and wake-up events, volathe monitor & watchdog enabler 2 LIN module 3 High side, low side switches and PWM control 4 ADC module 5 Low power modes control 6 BDM communication error 7 Backbutton to return to the start page External Use 21

Session Summary You have been introduced to Freescale s IDC product line for body electronics motor drivers. Relay Driven DC motors (window-lift) Power Mirrors AFS (Adaptive Front-lighting System) This architecture has evolved in to the S12 MCU based MagniV product moniker Introduction to available enablement tools to assist customers in getting started quickly in using the product. External Use 22

www.freescale.com 2014 Freescale Semiconductor, Inc. External Use