Organics in Photonics: Opportunities & Challenges Louay Eldada DuPont Photonics Technologies
Market Drivers for Organic Photonics Telecom Application Product Examples Requirements What Organics Offer Dynamic optical signal control (signal routing, switching, power level control, etc.) [WAN, MAN, Enterprise] Static optical signal distribution [Access, FTTX] ROADM OXC Protection switches VOA arrays VMUX DCE DGE Splitters Athermal mux/demux Low cost (capex & opex for OEM & carrier) High reliability Small size Low power dissipation Ease of scalability Simple fiber management Low capex for OEM & carrier Low opex for OEM & carrier High reliability Athermal passive behavior Lowest power consumption dynamic thermo-optic components Practical hybrid integration enabling complex functionality PLCs today in materials with state of the art performance Low cost, high volume replication techniques (stamping, etc.) Athermal AWG with substrate of proper CTE Technology Needed Cost-effective pick-and-place assembly technology Low cost fiber arrays Timing of Market Need Now Now Thermo-optic polymeric components are Telcordia qualified, mass manufactured, and commercially deployed November 17, 2005 communications technology roadmap 2
Market Drivers for Organic Photonics Telecom Cost Reduction Factor per Element vs 2005 Cost 100 1,000 10,000 100,000 1,000,000 1000 2 db / yr Average Cost Reduction 100 10 Number of Optical Elements Integrable per Chip 1 db / yr Average Cost Reduction 1 2005 2010 2015 2020 2025 Year How do we get there? November 17, 2005 communications technology roadmap 3
Hybrid PICs in Organic Platform Tunable Optical Transmitter Tunable External Cavity Laser InP/InGaAsP MQW Chip Polymer Phase Shifter Polymer Tunable Bragg Grating Glass Plate LiNbO 3 Modulator M M +V Silicon Substrate Polymer Waveguide NdFeB Magnet Ag-Glass Polarizer (TE) YIG Faraday Rotator (45 ) LiNbO 3 Half-Wave Plate (fast axis @22.5 to TE) Ag-Glass Polarizer (TE) NdFeB Magnet Isolator Pick & place assembly is labor intensive today November 17, 2005 communications technology roadmap 4
Polymeric Electro-optic Modulators EO Polymers Myth EO polymers have large EO coefficients but low thermal stability Reality EO polymers developed to date have either large EO coefficient OR thermal stability, not both What is needed is a new paradigm that will allow the simultaneous realization of: Large EO coefficient (for low Vπ) High thermal stability Low optical loss November 17, 2005 communications technology roadmap 5
Market Drivers for Organic Photonics Datacom (Computer, Automotive, Aerospace, etc.) Application Product Examples Requirements What Organics Offer Short reach data links for control systems and entertainment in Enterprise, Digital Home, Vehicles Computing Plastic Optical Fiber (POF) Optical interconnects on backplanes/boards/ MCM for servers and workstations, eventually personal computers Ease of splicing and connecting Light weight Low bending loss Resiliency to mechanical impact Low cost Low loss Ease of connecting PCB lamination (temp & pressure) compatibility Multimode graded index POF meeting all requirements. With transparency windows at 850, 670 and 530 nm, it is compatible with silicon or polymer photodetectors, and silica or polymer waveguide circuits. Easy to manufacture and cost effective large area optics (larger than common photomasks) Technology Needed POF that competes with loss of silica fiber and cost of copper Dustresistant connectors Timing of Market Need Now 5-10 years Computing On-chip optical interconnects for workstations and servers, eventually personal computers Low cost Low loss Ease of connecting Light weight Low bending loss CMOS compatibility Ease of coating on CMOS chips Processability with reduced temperature excursions Rapid and cost-effective manufacturing Compact and inexpensive integrated transceivers, amplifiers, etc. 20-30 years November 17, 2005 communications technology roadmap 6
Board-Level Optical Interconnects Glass Fiber vs. Polymer Interconnects Glass Fiber Interconnects Pros: Widely available technology Optical loss (0.00002-0.0005 db/cm) 50 m @ 20 Gbps Cons: Costly Labor intensive Bulky Point-to-point only (no passives) Planar Polymer Interconnects Pros: Dense, compact integration Cost efficient ($1/Gbps 10-50m) 20 Gbps bandwidth @ 1-10 m Passive structures possible Embedded in board, compatible with lamination pressure and 260 C Pb-free wave soldering Cons: Optical loss (0.0005-0.05 db/cm) Availability of best polymers Stability of some polymers November 17, 2005 communications technology roadmap 7
Chip-Level Optical Interconnects Why Organics? CMOS Compatibility: Conform to topography Planarization easy Fabricated on finished CMOS chip Minimal temperature excursion (process temperature < 100 C) Low temperature dissipation for dynamic functions Manufacturability: Rapid processes (stamping, etc.) Low cost Ready now Compatible with high temperatures (up to 400 C) Adaptability: All elemental functions achievable Widely tunable refractive index contrast Post-fab trimming/rework possible 3D routing possible (2-photon polymerization, etc.) November 17, 2005 communications technology roadmap 8
Organic Packaging Use of Organics in Packaging Organic Coatings: Broadly used for chip passivation, planarization, etc. Organic Adhesives: Broadly used for pigtailing of optical chips, die attach, surface mount, flip-chip underfills, etc. Organic Sealants: Provide low cost semi-hermetic sealing of packages (at lid, ferrule, etc.) for moderate-length lifetimes (5-10 years) Plastic Packages: Very low cost packages/cases/enclosures/boxes for non-hermetic components Organic Encapsulants: Ultra-low cost packaging using glob-top coating, dam and fill encapsulants, etc. November 17, 2005 communications technology roadmap 9
Organic Photonics Opportunities & Challenges Organic PICs: Ultra-high n / density PICs: fab, coupling, FIT, etc. Cost-effective pick-and-place assembly technology Large EO coef / stable / low-loss EO polymers Order volumes needed to fully realize low cost potential Standardization, MSA (Multi-Source Agreements) Polymer Optical Interconnects: Commercial availability of highest-performance materials Order volumes needed to fully realize low cost potential Standardization (MM vs. SM, n, λ, etc.) Plastic Packaging: Lifetime: is 20 yrs really needed? Initiative for new standards Closer collaborations in the industry November 17, 2005 communications technology roadmap 10
Thank You louay.eldada@usa.dupont.com DuPont Photonics Technologies http://www.photonics.dupont.com November 17, 2005 communications technology roadmap 11