General Purpose ESD Protection - AQ126 SP126 Series AQ126 Series 15pF 3kV Bidirectional Discrete TVS RoHS Pb GREEN Description Avalanche breakdown diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD. These robust diodes can safely absorb repetitive ESD strikes at ±3kV (contact discharge, IEC 61-4-2 without performance degradation. Additionally, each diode can safely dissipate 5A of 8/2µs surge current (IEC 61-4-5 2 nd edition with very low clamping voltages. Features Pinout Pin 1 Pin 2 ESD, IEC 61-4-2, ±3kV contact, ±3kV air EFT, IEC 61-4-4, 4A (5/5ns Lightning, IEC 61-4-5 2 nd edition, 5A (8/2µs Low leakage current of.5µa (MAX at 5V Space efficient 21 footprint AEC-Q11 qualified Halogen free, lead free and RoHS compliant Moisture Sensitivity Level(MSL -1 Functional Block Diagram Applications 1 Mobile phones Smart phones Smart watches Tablets Application Example Portable navigation components Portable medical components Automotive Applications 2 Keypads P1 I/O Controller P2 Outside World P3 P4 IC AQ126(X4 SP126 (x4 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. 217 Littelfuse, Inc.
General Purpose ESD Protection - SP126 AQ126 Series Absolute Maximum Ratings Symbol Parameter Value Units I PP Peak Pulse Current (t p =8/2μs 5 A T OP Operating Temperature -4 to 15 C T STOR Storage Temperature -55 to 15 C CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units Maximum Junction Temperature 15 C Maximum Lead Temperature (Soldering 3s 26 C Electrical Characteristics (T OP =25ºC Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V RWM 6. V Breakdown Voltage V BR I R =1mA (Pin 1 to 2 7.8 V Leakage Current I LEAK V R =5V.1.5 μa I Clamp Voltage 1 pp =1A, t p =8/2µs (Pin 1 to 2 12. V V C I pp =2A, t p =8/2µs (Pin 1 to 2 13.4 V Dynamic Resistance R DYN (V C2 - V C1 / (I PP2 - I PP1 1.4 Ω IEC 61-4-2 (Contact Discharge ±3 kv ESD Withstand Voltage 1 V ESD IEC 61-4-2 (Air Discharge ±3 kv Reverse Bias=V 15 pf Diode Capacitance 1 C D Reverse Bias=2.5V 12 pf Note: 1 Parameter is guaranteed by design and/or component characterization. Capacitance vs. Reverse Bias Insertion Loss (S21 I/O to GND 2 Capacitance (pf 15 1 5 Attenuation (db -5-1 -15-2 -25.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Bias Voltage (V -3 1 1 1 Frequency (MHz 217 Littelfuse, Inc.
Temperature TVS Diode Arrays (SPA Diodes General Purpose ESD Protection - SP126 AQ126 Series Clamping Voltage vs. I PP 2 Transmission Line Pulsing(TLP Plot 2 Clamp Voltage (V C 18 16 14 12 1 8 6 4 2 1 2 3 4 5 Peak Pulse Current-I PP (A TLP Current (A 15 1 5 5 1 15 2 25 TLP Voltage (V Soldering Parameters Reflow Condition Pb Free assembly - Temperature Min (T s(min 15 C Pre Heat - Temperature Max (T s(max 2 C - Time (min to max (t s 6 18 secs Average ramp up rate (Liquidus Temp (T L to peak 3 C/second max T S(max to T L - Ramp-up Rate 3 C/second max Reflow - Temperature (T L (Liquidus 217 C - Temperature (t L 6 15 seconds Peak Temperature (T P 26 +/-5 C Time within 5 C of actual peak Temperature (t p 2 4 seconds Ramp-down Rate 6 C/second max T P T L T S(max T S(min 25 t S Preheat Ramp-up time to peak temperature t P t L Ramp-down Time Critical Zone TL to TP Time 25 C to peak Temperature (T P 8 minutes Max. Product Characteristics Lead Plating Lead Material Substrate material Body Material Flammability Pre-Plated Frame Copper Alloy Silicon Molded Epoxy UL Recognized epoxy meeting flammability rating V-. Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. 217 Littelfuse, Inc.
General Purpose ESD Protection - AQ126 SP126 Series Package Dimensions μdfn-2 (21 Package μdfn-2 (21 JEDEC MO-236 TOP VIEW SIDE VIEW.32 Symbol Millimeters Inches Min Max Min Max A.23.33.9.13 A1..5..2 A2.1 REF.4 REF Pin2 Pin1.24 b.18.3.7.12 D.55.65.22.26.14 E.25.35.1.14 BOTTOM VIEW.24 L1.12.24.5.9 L2.12.23.5.9.32 K1.165 REF.6 REF SOLDERING PATTERN Part Numbering System Automotive Grade TVS Diode Arrays (SPA Diodes Series AQ 126 1 U T G Number of Channels Package G= Green T= Tape & Reel U: μdfn-2 Ordering Information Part Number Package Marking Min. Order Qty. AQ126-1UTG μdfn-2 I I 15 Part Marking System 217 215 Littelfuse, Inc.
General Purpose ESD Protection - SP126 Embossed Carrier Tape & Reel Specification μdfn-2 P P2 P1 D Symbol Millimetres Inches Min Max Min Max E A.33.4.13.16 W F B.63.7.25.28 D 1.4 1.6.55.63 E 1.65 1.85.65.73 F 3.45 3.55.136.14 A º MAX K T B.2 ±.5 º MAX K.3.39.12.15 P 1.9 2.1.75.83 P1 1.95 2.5.77.81 P2 3.9 4.1.154.161 T.13.25.5.1 W 7.9 8.3.311.327 8mm TAPE AND REEL Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. 217 215 Littelfuse, Inc.