XMC1000 EEPROM emulation and data retention

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AP32384 EEPROM emulation and data retention About this document Scope and purpose This document provides a brief introduction to the use of the Microcontroller family with emulated EEPROM. Intended audience This document is intended for engineers who wish to develop an emulated EEPROM application with the Microcontroller family. Applicable products XMC1100 series XMC1200 series XMC1300 series XMC1400 series References Infineon: DAVE http://www.infineon.com/dave Infineon: XMC Family http://www.infineon.com/ Table of contents About this document... 1 Table of contents... 1 1 EEPROM emulation... 2 2 Main use case... 3 3 Temperature dependency... 4 4 References and Notes... 5 Revision history... 6 Application Note Please read the Important Notice at the end of this document V1.0 www.infineon.com

EEPROM emulation and data retention EEPROM emulation 1 EEPROM emulation In an application with emulated EEPROM the same flash type is used in two different modes: One part is used for program flash. One part is used for EEPROM emulation. The difference between both modes is the number of erase cycles. In this document program flash and EEPROM flash are defined as: Table 1 Erase/write cycles per flash usage 1 Program flash [cycles] EEPROM flash [cycles] Erase/write cycles [2] 100 10 000 Flash structure The flash is structured in blocks, pages and sectors: Block = 16 Byte A block represents the smallest data portion that can be written. Page = 16 Blocks = 256Byte A page represents the smallest data portion that can be erased. Sector = 16 pages = 4kByte Page and Sector erases In this Application the page erase is limited to 10 000 times for each page. A page can be erased by a page erase or by a sector erase when the page is in this sector. Either method counts as one erase. The complete flash can have up to 2 000 000 erases in total. Independently, if one page is erased multiple times or different pages are erased by a page erase, each page erase counts as one erase. A sector erase which erases 16 pages counts as one erase. Therefore, it is recommended to erase 16 pages by 1 sector erase instead of 16 page erases, to not exceed the 2 000 000 erase limit. 1 See References and Notes Application Note 2 V1.0

EEPROM emulation and data retention Example use-case 2 Example use-case The use-case is valid for a program flash usage of up to 64kByte and an EEPROM usage of up to 4kByte. The program flash and the EEPROM flash support data retention of up to 20 years. This means that after the last write cycle the flash content from the last write operation is valid for 20 years. Frequent cycling stresses the flash. To ensure the high reliability the EEPROM size is limited. The following table shows the Program flash data retention and the emulated EEPROM data retention with 5k cycles or 10k cycles. Note: The total EEPROM size must not exceed 4kByte. Table 2 Program flash and emulated EEPROM data retention 1 T J [ C] [1] Data retention [years] Flash size [kbyte] Program flash [2] -40 to 85 20 64 EEPROM with 5k cycle [2] -40 to 85 7.5 4 EEPROM with 10k cycle [2] -40 to 85 4.5 4 A block (16Byte) represents the smallest data portion that can be written. A page (256Byte) represents the smallest data portion that can be erased. The 4 096Byte emulated EEPROM is represented by 256 blocks, or 16 pages, or 1 sector. The erase cycles are limited to 10 000 for each page. A cycle consists of one or many writes and one erase. The number of writes can be calculated by: (EEPROM_size / Byte_per_write) * write_erase_cycles = writes cycles. The maximum numbers of writes for EEPROM @10k cycles is: (4 096Byte / 16Byte) * 10 000 cycles = 2 560 000 writes cycles. The maximum numbers of writes for EEPROM @5k cycles is: (4 096Byte / 16Byte) * 5 000 cycles = 1 280 000 writes cycles. 1 See References and Notes Application Note 3 V1.0

EEPROM emulation and data retention Temperature dependency 3 Temperature dependency The flash data retention depends strongly on the junction temperature of the Flash memory. The temperature dependency of the data retention for the flash can be seen in the following table: Table 3 Temperature dependency 1 T J [ C] [1] Data retention [years] Flash size [kbyte] Program flash [2] -40 to 85 20 64-40 to 100 8 64-40 to 115 4 64 EEPROM with 5k cycle [2] -40 to 85 7.5 4-40 to 100 4 4-40 to 115 2 4 EEPROM with 10k cycle [2] -40 to 85 4.5 4-40 to 100 2 4-40 to 115 1 4 The following calculation is for the data retention time for a program flash with a size up to 64kByte. This is the temperature profile: 115 C (T J ) 0.3425 years (3000h) 100 C (T J ) 0.5708 years (5000h) 85 C (T J ) To be calculated The percentage of time used in 115 C (T J ) and 100 C (T J ) is calculated: 115 C (T J ): 0.3425 years / 4.0 years = 8.56% 100 C (T J ): 0.5708 years / 8.0 years = 7.13% Both percentages are summarized and the time for 85 C (T J ) is reduced: 8.56% + 7.13%= 15.70% 85 C (T J ): 20 years * (100%-15.70%) = 16.86 years In the last step the total data retention is calculated. 0.3425 years + 0.5708 years + 16.86 years = 17.77 years 1 See References and Notes Application Note 4 V1.0

EEPROM emulation and data retention References and Notes 4 References and Notes Note: The Data retention time describes flash behavior. This is independent of whether the microcontroller is powered or not. [1] The ambient temperature T A can be calculated out of T J in combination with the Package thermal resistance, the current consumption, and the Voltage. For example: TSSOP38 R thja = 70.3 K/W, I = 12 ma, U = 5.5 V, P = 5.5V * 12 ma = 66 mw T j/a = 70.3K *66mW = 4.64 K [2] Cycles are equally distributed over the life-time. Application Note 5 V1.0

EEPROM emulation and data retention Revision history Revision history Major changes since the last revision Page or Reference All Description of change First release. Application Note 6 V1.0

Trademarks of Infineon Technologies AG AURIX, C166, CanPAK, CIPOS, CoolGaN, CoolMOS, CoolSET, CoolSiC, CORECONTROL, CROSSAVE, DAVE, DI-POL, DrBlade, EasyPIM, EconoBRIDGE, EconoDUAL, EconoPACK, EconoPIM, EiceDRIVER, eupec, FCOS, HITFET, HybridPACK, Infineon, ISOFACE, IsoPACK, i-wafer, MIPAQ, ModSTACK, my-d, NovalithIC, OmniTune, OPTIGA, OptiMOS, ORIGA, POWERCODE, PRIMARION, PrimePACK, PrimeSTACK, PROFET, PRO-SIL, RASIC, REAL3, ReverSave, SatRIC, SIEGET, SIPMOS, SmartLEWIS, SOLID FLASH, SPOC, TEMPFET, thinq!, TRENCHSTOP, TriCore. Trademarks updated August 2015 Other Trademarks All referenced product or service names and trademarks are the property of their respective owners. Edition Published by Infineon Technologies AG 81726 Munich, Germany 2017 Infineon Technologies AG. All Rights Reserved. Do you have a question about this document? Email: erratum@infineon.com Document reference AP32384 IMPORTANT NOTICE The information contained in this application note is given as a hint for the implementation of the product only and shall in no event be regarded as a description or warranty of a certain functionality, condition or quality of the product. Before implementation of the product, the recipient of this application note must verify any function and other technical information given herein in the real application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this application note. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office (www.infineon.com). WARNINGS Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.