3D AOI system NEW BF-3Di series The 3D AOI system that meets every need in the market.
3D measurement + auto inspection with side cameras + 2D inspection = BF-3Di series The BF-3Di series combines the strength of Saki's unique technologies to maximize automatic inspection coverage, utilization, and return on investment. All inspection capabilities are incomparably enhanced by 3D inspection with our unique optical height measurement technology, automatic inspection with side cameras and no impairment to production efficiency, and the advantages inherited from our 2D line scan inspection technology. The "BF-3Di-L1" for L boards, "BF-3Di-Z1" for XXL boards, and "BF-3Di-D1" for Dual lane, make the BF-3Di series the ideal 3D AOI solution for any production line. Hardware and Software that provide absolute measurement The BF-3Di series provides reduced noise from reflected light, with dynamic range extension, a highly rigid frame, automatic board surface detection, high-speed height calculation, and reduced blind spots by optimizing the quadphase projector system, thereby enabling absolute 3D measurement with high image quality. Saki s unique optical design The BF-3Di series accurately measures component by projecting stripe patterns (slices) from the same focal point. Whenever a stripe reflects off a component, its height is accurately measured. Chip mounted between capacitors Image without blind spots Chip IC
Technologies that support high-accuracy inspection of the entire PCB High-speed and high-accuracy A 30% reduction in the weight of the optical head, along with the implementation of Saki's new dual-drive positioning system, provides a significant increase in image acquisition speed. The BF-3Di series employs the highest accuracy measurement technology, and plays a key role in the Smart Factory environment. The BF-3Di series offers high-accuracy position measurement, a high rigidity frame, high-accuracy linear control, and absolute accuracy of the XYZ positioning system, with automated board surface detection. Seamless FOV imaging technology The BF-3Di series inspects the entire PCB and provides seamless merging of the acquired images into a single image, even for multiple FOVs of very large components. This unique and valuable technology is derived from enhancements on Saki's powerful 2D line scan technology. Component image using 4 merged fields-of-view(fovs) 3D Extra Component Detection T h e B F - 3 D i s e r i e s u t i l i z e s t h e e x c e l l e n t functionality of Saki's 2D ECD, upgraded with our seamless 3D imaging technology. Using these combined technologies of 3D seamless imaging a n d 3 D E C D p r o v i d e s a d d i t i o n a l i n s p e c t i o n verification and reliable inspection, regardless of board and component colors.
Complete Image Memory (CIM) Technology The BF-3Di series optimizes programming and setup efficiency with our unique CIM technology, which provides the greatest flexibility to accommodate changing production situations. By acquiring the entire board image just once, the BF-3Di series allows the user to perform data edits and adjustments of any FOV and/or all FOVs--all without acquiring additional board images. The BF-3Di-D1 (Dual-Lane) machine, with completely independent lane functionality, permits editing of inspection program data, while performing auto inspection of the PCB on the other lane. Simple and easy operation Reduces library creation time Saki's Auto Programming Software significantly reduces library creation time. Optimal inspection libraries are automatically assigned and created by utilizing gerber and CAD data. The BF-3Di series uses pad shape information to provide automatic inspection based on IPC standards. Reliable threshold settings are determined from statistical information, and model images are provided in the offline debug feature, installed as standard on every machine. This greatly improves the reliability of inspection performance and results, regardless of user skill level. Gerber/CAD data import Auto Programming Debug
High speed auto inspection with side cameras (*) Saki's BF-3Di series accurately detects defects on QFN packages, J-leaded, and connector components, which are difficult to inspect using just an overhead camera, via quad-directional automatic inspection, with no impact to cycle time. (*) factory-installed option Image acquired by overhead camera Image acquired by side camera Saki integrates its unique 2D line scan imaging technology to enhance the power of its 3D systems Integration of Saki's 2D inspection technology, such as our patented coaxial top-light illumination, and vast knowhow from more than 20 years of experience, enhance the power of the BF-3Di series, providing accurate and reliable polarity detection, character recognition (OCR/OCV), bridge detection, and alignment inspection, which are difficult to inspect with 3D imaging technology. Camera Lens Coaxial top light Top light Side and Low light Polarity inspection and character recognition using 2D imaging technology
さ External View Product Specifications Model Name BF-3Di-L1 BF-3Di-Z1 BF-3Di-D1 Front View Horizontal Resolution 18μm BF-3Di-L1 / BF-3Di-D1 Height Resolution 1μm Repeatability 2μm (3 ) or greater 1500 mm 2000 mm PCB Size 50 x 60-460 x 510mm (1.97 x 2.36 to 18.11 x 20.08 in.) 50 x 60-686 x 870mm (1.97 x 2.36 to 27 x 34.3 in.) 50 x 60-460 x 510mm (1.97 x 2.36 to 18.11 x 20.08 in.) (Single) 50 x 60-320 x 510mm (1.97 x 2.36 to 12.60 x 20.08 in.) (Dual lane) PCB Thickness 0.6 to 5.2mm (0.02 to 0.20 in.) (*) PCB Warp +/- 2mm (0.08 in.) 1040 mm PCB Clearance Top: 40mm (1.57 in.), Bottom: 40mm (1.57 in.) Roated Component Support Available for 0 to 359 rotation (unit of 1 ) BF-3Di-Z1 Inspection Categories Presence/Absence, Misalignment, Tombstone, Inverted, Polarity, Bridge, Absence of Solder, Insufficient Solder, Lifted Lead, Lifted Chip, and Fillet Defect Camera CMOS Area Camera Lighting Quad projection system with multi-direction ring light 1500 mm 2000 mm FOV Size Image capture time 36 x 36mm (1.42 in. x 1.42 in.) 390 ms/fov Load/Unload Time Approx. 5 sec. 730 mm 1000 mm Conveyor Method Conveyor Height Flat Belt Transfer 880 to 965mm (34.65 to 37.99 in.) 1040 mm 1340 mm Width Adjustment Operating System Automatic Windows 7 English Version (*) PCB Thickness includes PCB warpage. Side View BF-3Di-L1 / BF-3Di-D1 / BF-3Di-Z1 (1140 mm) (900 mm) System Requirements Electric Power Power Consumption Air Requirement Usage Environment Noise Level Dimensions Weight Single Phase 200 to 240 V +/-10%, 50/60 Hz 700VA 0.5 MPa, 5 L/min (ANR) 15 C (59 F) to 30 C (86 F) / 15 to 80 % RH (Non-condensing) 68 db BF-3Di-L1 / BF-3Di-D1: 1040 x 1530 x 1500 mm (40.94 x 60.24 x 59.06 in.) BF-3Di-Z1: 1340 x 1530 x 1500 mm (52.76 x 60.24 x 59.06 in.) Approx. 950 kg (2,094.39 lbs) 240 mm 1530 mm Optional Systems Repair terminal, Offline Programming System, Side camera (factory-installed option) Saki Corporation Headquarters Ogawa Building, 4-14-7, Nakanobu, Shinagawa-ku, Tokyo, Japan, 142-0053 TEL: +81-3-5788-6280 FAX: +81-3-5788-6295 E-mail:sakicorp@sakicorp.com Global Network http://www.sakicorp.com Published September 2016. SJ38DCB01-01.3E 2016 Saki Corporation. All Rights Reserved. Specifications contained in this brochure are subject to change without notice.