COM Express Compact and Qseven embedded PC Module based on Intel Atom Processor Presented by: congatec AG Christof Riederer
COM Express Dimensions Compact (95mm x 95mm) Perfect for limited space apps. Suitable for ultra low voltage CPUs Ideal for Intel Atom based Modules Basic (125mm x 95mm) Intended for mobile and space constrained stationary systems More powerful CPUs, SO-DIMM Extended (155mm x 110mm) High performance CPUs, DIMM Dual channel memory applications For high end market applications For all modules the connector pinout is the same!
Benefits Faster time-to-market Cost effective customization alternatives Improved form-fit-function, minimizing current and future design risks Lower product life cycle costs Module scalability Interchangeability Smooth transition from legacy to legacy free (PCI, IDE) + (PCI Express, SATA) (PCI Express, SATA) Headroom for growth of emerging technologies (2.5 GHz PCI Express, SATA-150) (5 GHz PCI Express, SATA-300) PICMG embedded standard Safeguards R&D investment and lowers total cost of ownership
conga-ca COM Express Compact Module CPU: Intel Atom processor Z5xx series - 45nm Z510: 1.1 GHz, 512kB L2 Cache Z530: 1.6 GHz, 512kB L2 Cache with Hyperthreading Chipset: Intel SCH US15W Ultra low power 3D graphics HD video decoder, 256MB UMA 24bit LVDS (max. 1366x768) and SDVO (max. 1280x1024) Integrated DDR2 memory controller 1GB soldered memory onboard Limited PCI Express (optional) 2 onboard SDIO slots Controller congatec controller for reset and power sequencing
conga-ca COM Express Compact Module Interfaces (not provided by US15SW) 2 Serial ATA channels PCI Bus (Rev. 2.3) Gigabit Ethernet congatec Embedded Features Embedded BIOS Board Controller Multistage Watchdog Battery Management 32 Bit API (CGOS)
conga-ca COM Express Compact Module Form Factor: COM Express (Pinout Type 2, compact size) SDRAM: soldered 1GB (DDR2 533MT/s) EPI/DisplayID Support (Embedded Panel Interface) Power Management ACPI 3.0 Suspend to RAM Operating Systems WinXP, 2000, XPe, CE 6.0, Linux, QNX Power Consumption <5Watt @12V COM Express Features 2 Serial ATA Channel PCI Bus (Rev. 2.3) 8 USB 2.0 Ports HDA Interface LPC Bus Ethernet (100/1000Base-Tx) EIDE Channel (UDMA-100) I²C Bus (Fast Mode, Multimaster) SM Bus
conga-ca Block Diagram
conga-ca Board Controller congatec Board Controller Multistage Watchdog EEPROM Serial No. EAN code HW/FW rev. Manuf. date Repair. date... User Data I2C Controller Bootcounter Runningtime meter Low cost solution for US15W glue logic Firmware completely engineered by congatec
conga-ca Application Example Low-Power Intel In-Vehicle Infotainment Reference Design Design Highlights Specifically designed for automotive vendors High-performance, highly integrated, low-power solutions conga-ca COM Express module from congatec Combination with the base board 3D navigation Rear-seat entertainment Cameras Internet connectivity,... Dual independent display www.intel.com/go/infotainment
conga-ivi In Vehicle Infotainment starter Kit 165-mm wide by 175-mm deep supports standard DIN slot
conga-ceval Evaluation Platform Designed to accommodate COM Express Modules 4x1 PCI Express, 1x ExpressCard 1x16 PCI Express Graphics Port 1x Mini PCI Express Card Gigabit Ethernet, 8x USB AC97 compatible codec HDA optional via connector 4xSATA, PATA, 2xCOM, LPT, FD PS/2 kbd./mouse, LPC POST code Beeper, Power button, Reset button, Battery CRT connector, LVDS interface ATX connector, 12V/GND banana jacks
COM Express Engineering Tools Debug Card POST Code Display LPC Firmware Hub Socket Debug Interfaces SATA, VGA, USB,... Flat Panel Adaptation Module EPI/DisplayID Conform LVDS and TTL In and Out For 18 and 24 bit panels Backlight Control SDVO/DVI Evaluator SDVO to DVI-D (ADD2 card) HDA Evaluator
Smart Battery Manager Solution Instant Battery Solution Supports 2S1P up to 4S3P, Parallel or sequential battery operation S3 support (suspend to RAM) Input voltage of 19V, max. 4.5A with input power delimitation Starter Kit Smart Battery Manager Module and carrier board Complete set of cables SMART Battery for testing with the evaluation carrier board
Heatspreaders and Heatsinks Heatspreader With 2.7mm non threaded stand-offs With M2.5 mm threaded stand-offs Heatsink Passive or active with 12V fan Non threaded or threaded stand-offs
A new Standard for Computer-On-Modules Why do we need a new Standard? To provide the features of latest 45nm mobile chipsets and processors. To provide the ability to use the successful Computer-On-Module concept for mobile and ultra mobile embedded applications. To support the latest graphic standards such as DisplayPort and HDMI. Small form factor for easy integration. What is special about Qseven? Legacy free only new serial buses are defined Flexible graphics new graphic standards are supported Embedded API Software interface for easy interchangeability
Mechanic and Cooling Compact size Quadratic 7 cm (2¾ x 2¾ ) Solid mechanical mounting Cost efficient direct edge connector Rugged 1.2 mm PCB thickness Cooling interface Top edge defined for heat transfer Heat transfer from CPU, Chipset and DRAM enhanced via copper layers Heatspreader defined for high power versions (max. 12 W)
MXM Connector MXM edge connector Foxconn ASOB3 series Currently used for notebook MXM graphics cards 230 positions,.020 pitch, SMT 5.5 and 7.8 mm height versions Certified for rugged mobile applications and for high speed serial buses (PEG bus) Low cost connector
Interfaces Legacy free interfaces only 4x PCI Express lanes 2x SATA, 8x USB 2.0 2x ExpressCard SDIO I²C Bus, LPC High Definition Audio (HDA) 1x Gigabit Ethernet LVDS 2x24 Bit (with DisplayID flat panel detection) SDVO, DisplayPort and HDMI Battery Management Power 5V power rail for low cost implementation Additional power management signals
Summary Qseven Freely available industry standard Defined for low product cost High performance serial interfaces Compact size Perfect for new SFF low power chipsets and processors
Qseven Supporting Members Founding Members Participating Members Supporting Members Apply for your free membership at: www.qseven-standard.org
conga-qa Qseven Intel Atom Module CPU: Intel Atom processor Z5xx series - 45nm Z510: 1.1 GHz, 512kB L2 Cache Z530: 1.6 GHz, 512kB L2 Cache with Hyperthreading Chipset: Intel SCH US15W Ultra low power 3D graphics Integrated DDR2 memory controller 1GB soldered memory onboard Interfaces 2x PCI Express lane* 2x SATA* Gigabit Ethernet* 8x USB 2.0, ExpressCard SDIO, I²C Bus, LPC, HDA LVDS 1x24 Bit, SDVO