1 2 3 4 5 6 7 8 9 10 11 microqsfp Draft Mechanical Specification Rev 1.0 Draft Mechanical Specification for micro QUAD SMALL FORM-FACTOR PLUGGABLE FOUR CHANNEL PLUGGABLE TRANSCEIVER, HOST CONNECTOR, & CAGE ASSEMBLY FORM FACTOR Rev 1.0 January 7, 2016 12 Abstract: The Draft Mechanical Specification for micro QUAD SMALL FORM-FACTOR PLUGGABLE 13 (µqsfp or microqsfp) defines mechanical characteristics of a form factor supporting up to 14 four electrical channels, higher system density, and a thermally-enhanced solution. 15 Support for 28 Gb/s signal rates on each channel enables many applications including 10 16 Gigabit Ethernet, 25 Gigabit Ethernet, 50 Gigabit Ethernet, 100 Gigabit Ethernet, 16GFC, 17 32GFC and 128GFC, where higher densities are required than are possible with existing 18 form factors. Included are definitions of electrical, mechanical, and management 19 interfaces, electrical connector, guide rail (cage), front panel and host PCB layout, and 20 optical connector options. By addressing the thermal, signal integrity, electromagnetic 21 and electrostatic challenges of a higher density solution, the µqsfp Specification 22 enables higher density networking solutions that are critical to support the continuing 23 network demand. 24 25 This document provides a common specification for systems manufacturers, system 26 integrators, and suppliers of modules. 27 28 This specification is made available for MSA review, and written comments are solicited 29 from contributing members. Comments received by the members will be considered for 30 inclusion in future revisions of this specification. It is not the final version and 31 therefore changes may occur to the specification before the final version is released. 32 33 POINTS OF CONTACT: 34 35 Nathan Tracy Joshua Sechrist 36 Chairman Technical Editor 37 TE Connectivity TE Connectivity 38 3101 Fulling Mill Road 3101 Fulling Mill Road 39 Middletown, PA 17057 Middletown, PA 17057 40 Ph: 717-986-7546 Ph: 717-986-7243 41 ntracy at te dot com Joshua dot Sechrist at te dot com 42 43 Limitation on use of Information: 44 This specification is provided AS IS with NO WARRANTIES whatsoever, including any 45 warranty of merchantability, non-infringement, fitness for any particular purpose, or any 46 warranty otherwise arising out of any proposal, specification or sample. The μqsfp 47 promoters disclaim all liability, including liability for infringement of any proprietary 48 rights, relating to use of information in this specification. In no event shall the μqsfp 49 promoters, contributors or adopters be liable for any direct, indirect, special, 50 exemplary, punitive, or consequential damages, including, without limitation, lost 51 profits, even if advised of the possibility of such damages. 52 53 Permissions: 54 You are authorized to download, reproduce and distribute this document. All other rights 55 are reserved. The provision of this document should not be construed as the granting of 56 any right to practice, make, use or otherwise develop products that are based on the 57 document. Any and all IP rights related to this document and the designs disclosed 58 within, except for the rights expressly mentioned above, are reserved by the respective 59 owners of those IP rights. 60 FORM FACTOR Page 1
61 62 EXPRESSION OF SUPPORT BY MANUFACTURERS 63 64 As of the publication date, the following are promoter member companies of the µqsfp MSA. 65 66 Broadcom 67 Brocade 68 Cisco 69 Dell 70 Foxconn Interconnect Technology 71 Huawei 72 Intel 73 Lumentum 74 Juniper Networks 75 Microsoft 76 Molex 77 TE Connectivity 78 79 80 81 As of the publication date, the following are contributor member companies of the µqsfp 82 MSA. 83 FORM FACTOR Page 2
84 Change History: 85 Revision Date Changes 1.0 January 14, 2016 -First Public Release 86 87 FORM FACTOR Page 3
88 TABLE OF CONTENTS 89 90 91 1. Scope 5 92 1.1 Description of Clauses... 5 93 2. References 5 94 2.1 Industry Documents... 5 95 2.2 SFF Specifications... 5 96 2.3 Sources... 5 97 2.4 Conventions... 5 98 3. Introduction 6 99 4. Electrical Interface 6 100 5. Mechanical and Board Definition 7 101 5.1 Introduction... 7 102 5.2 µqsfp Reference Datums and Component Alignment... 8 103 5.3 µqsfp Module Mechanical Package Dimensions... 9 104 5.3.1 Mating of µqsfp Module PCB to µqsfp Electrical Connector... 10 105 5.4 Host PCB Layout... 11 106 5.4.1 Insertion, Extraction and Retention Forces for µqsfp Modules... 13 107 5.5 Labeling of µqsfp Modules... 13 108 5.6 Bezel for Systems using µqsfp Modules... 14 109 5.6.1 Bezel for the Thru Bezel Cage Assembly... 14 110 5.7 µqsfp Electrical Connector Mechanical... 15 111 5.8 Individual µqsfp Cage Assembly... 17 112 5.9 EMI Cover... 18 113 5.10 Optical Interface... 18 114 6. Thermal Management Considerations 20 115 FORM FACTOR Page 4
116 1. Scope microqsfp Draft Mechanical Specification Rev 1.0 117 This Specification defines: (i) a plug s mechanical form-factor with latch interface 118 features for a 1, 2, or 4-channel (up to 28 Gb/s per channel) transmit/receive hot- 119 pluggable module; and (ii) aspects of a host board electrical edge connector with a cage 120 together capable of mating with such plug; these aspects are listed in clause 3. 121 1.1 Description of Clauses 122 Clause 1 contains the Scope and Purpose 123 124 Clause 2 contains Referenced and Related Standards and Specifications 125 126 Clause 3 begins the specification 127 128 Clause 4 contains electrical interface characteristics 129 130 Clause 5 contains mechanical specifications and printed circuit board recommendations 131 132 Clause 6 contains thermal considerations 133 134 2. References 135 The µqsfp MSA activities support the requirements of the networking, computing, and 136 storage industries. 137 2.1 Industry Documents 138 The following interface standards and specifications are relevant to this Specification. 139 140 - GR-253-CORE 141 - IEEE Std 802.3-2015 142 - IEEE Std 802.3by 25 Gb/s Ethernet, draft amendment to 802.3-2015 143 - InfiniBand Architecture Specifications FDR and EDR 144 - FC-PI-5, FC-PI-6, FC-PI-6P 145 - FC-PI-7 64GFC/256GFC Project 146 - SAS 4.0 147 - Optical Connectors: MPO: IEC 61754-7, Dual LC: IEC 61754-20 148 - Aligned key (Type B) MPO patch cords: TIA-568 149 - Dual LC optical patch cord: NEBS GR-63 150 - SFF-8665 QSFP+ 28 Gb/s 4X Pluggable Transceiver Solution (QSFP28) 151 - SFF-8636 Management Interface for Cabled Environment 152 - SFF-8679 QSFP28 4X Base Electrical Specification 153 - SFF-8472 Diagnostic Monitoring Interface for Optical Transceivers 154 2.2 SFF Specifications 155 A possible action of the MSA is to create appropriate SFF specifications based on this 156 MSA. 157 2.3 Sources 158 This document can be obtained via the www.microqsfp.com web site 159 2.4 Conventions 160 The ISO convention of numbering is used i.e., the thousands and higher multiples are 161 separated by a space and a period is used as the decimal point. This is equivalent to the 162 English/American convention of a comma and a period. 163 164 English French ISO 165 0.6 0,6 0.6 166 1,000 1 000 1 000 167 1,323,462.9 1 323 462,9 1 323 462.9 FORM FACTOR Page 5
168 3. Introduction microqsfp Draft Mechanical Specification Rev 1.0 169 This Specification covers the following items: 170 171 a) Electrical interface of the Module card edge. 172 173 b) Mechanical definitions including package outline with latching detail and optical 174 Connector receptacle detail, electrical Connector mechanical details for both the Module 175 and host PCB halves, front panel cut-out recommended dimensions. 176 177 c) Optical interfaces (including the optical Connector receptacle and mating fiber optic 178 Connector plug and recommended breakout cable assembly.) The optical specifications are 179 left to the applicable standards for each protocol. 180 181 d) Thermal requirements and considerations. 182 183 e) Electromagnetic interference (EMI) recommendations (including necessary shielding 184 features to seal the OEM chassis front panel output with and without the µqsfp Module 185 installed in the Cage.) 186 187 The Specifications will provide a common solution for combined four-channel ports that 188 support OTN and/or Ethernet and/or InfiniBand and/or Fibre Channel specifications. This 189 specification encompasses design(s) capable of supporting multimode, single-mode Modules, 190 passive copper, active copper and active optical cables. 191 4. Electrical Interface 192 193 Figure 1 shows the signal symbols and contact numbering for the µqsfp Module edge 194 Connector. The diagram shows the Module PCB edge as a top and bottom view. There are 38 195 contacts intended for high speed, low speed signals, power and ground connections. 196 197 198 199 200 Figure 1 µqsfp Module Pad Layout FORM FACTOR Page 6
201 5. Mechanical and Board Definition microqsfp Draft Mechanical Specification Rev 1.0 202 5.1 Introduction 203 The Module defined in this clause is illustrated in Figure 2. All Pluggable Modules and 204 direct attach cables are designed to mate to the Connector and Cage design defined in 205 this specification. Several Cage to bezel options are allowed. Both metal spring finger 206 and elastomeric EMI solutions are permitted. The µqsfp optical interface shall meet one 207 of the Optical Interfaces defined in subclause 5.10, and shall mate and unmate with the 208 plug on the optical fiber cabling. Latching mechanism pull tabs are not defined and are 209 not shown. 210 211 The overall package dimension shall conform to the indicated dimensions and tolerances 212 indicated in clause 5. The mounting features shall be located such that the products are 213 mechanically interchangeable with the Cage and Connector system. In addition, the overall 214 dimensions and mounting requirements for the Cage and Connector system on a circuit board 215 shall be configured such that the products are mechanically, electrically, and thermally 216 interchangeable and the overall dimensions and insertion requirements for the optical 217 Connector and corresponding fiber optic cable plug shall be such that the products are 218 mechanically and optically interchangeable. 219 220 Note: All dimensions are in mm. 221 222 223 224 Figure 2 µqsfp Pluggable Module and Direct Attach Cable Rendering FORM FACTOR Page 7
225 microqsfp Draft Mechanical Specification Rev 1.0 5.2 µqsfp Reference Datums and Component Alignment 226 A listing of the reference datums for the various components is contained in Table 2. 227 The alignments of some of the datums are noted. The relationship of the Module, Cage, and 228 Connector relative to the Host Board and Bezel is illustrated in Figure 3 by the location 229 of the key datums of each of the components. In order to reduce the complexity of the 230 drawings, all dimensions are considered centered unless otherwise specified. 231 232 Table 2 Definition of Reference Datums Datum Description Figure Location A Bottom surface of Module Figure 4 B Latching surface of Module Figure 4 C Width of Module Figure 4 D Pad surface of Module pc board Figure 5 E Front leading surface of Module pc board Figure 5 F Width of Module pc board Figure 5 G Top surface of host pc board Figure 6 & 7 H *Host board thru hole #1 to accept Connector guide post Figure 6 & 7 J Host board thru hole #2 to accept Connector guide post Figure 6 & 7 K Seating surface of Electrical Connector Figure 10 L Rear surface of Electrical Connector Figure 10 M Connector slot width Figure 10 N *Electrical Connector alignment pin Figure 10 P Top Surface of Electrical Connector Figure 10 R Seating plane of Cage on host pc board Figure 11 S Front surface of Cage Figure 11 T Width of inside of Cage Figure 11 U **Host board thru hole #1 to accept Cage Pin Figure 6 V **Cage Pin #1 Figure 11 233 * Datums H & N are aligned when assembled (see Figure 3) ** Datums U & V are aligned when assembled (see Figure 3) FORM FACTOR Page 8
234 235 236 Figure 3 µqsfp Datum Alignment, Depth 237 5.3 µqsfp Module Mechanical Package Dimensions 238 A common mechanical outline is used for all µqsfp Modules and direct attach cables. The 239 Module shall provide a means to self-lock with the Cage upon insertion. The package 240 dimensions for the µqsfp Module are defined in Figure 4 and Figure 5. 241 FORM FACTOR Page 9
242 243 244 245 Figure 4 Drawing of µqsfp Module 246 5.3.1 Mating of µqsfp Module PCB to µqsfp Electrical Connector 247 The µqsfp Module contains a printed circuit board that mates with the µqsfp electrical 248 Connector. The pads are designed for a sequenced mating: 249 250 First mate ground contacts 251 Second mate power contacts 252 Third mate signal contacts 253 254 The pattern layout for the µqsfp Printed Circuit Board is shown in Figure 5. FORM FACTOR Page 10
255 256 257 Figure 5 Pattern Layout for µqsfp Printed Circuit Board 258 5.4 Host PCB Layout 259 A typical host board mechanical layout for attaching the µqsfp Connector and Cage System 260 is shown in Figure 6 and Figure 7. Location of the pattern on the host board is 261 application specific. See Subclause 5.6 for details on the location of the pattern 262 relative to the bezel. 263 264 To achieve 28Gb/s performance pad dimensions and associated tolerances shall be adhered 265 to and attention paid to the host board layout. FORM FACTOR Page 11
266 267 268 Figure 6 µqsfp Host PCB Mechanical Layout FORM FACTOR Page 12
269 270 Figure 7 µqsfp Host PCB Mechanical Layout 271 5.4.1 Insertion, Extraction and Retention Forces for µqsfp Modules 272 The requirements for insertion forces, extraction forces and retention forces are 273 specified in Table 3. The µqsfp Cage and Module design combinations shall ensure 274 excessive force applied to a cable does not damage the µqsfp Cage or host Connector. If 275 any part is damaged by excessive force, it should be the cable or media Module and not 276 the Cage or host Connector which is part of the host system. Cable to µqsfp Module 277 retention shall be appropriate to the application, performance can be verified by 278 following industry test methods such as EIA-364-36B or other appropriate specifications. 279 280 Table 3 Insertion, Extraction and Retention Forces Measurement Min Max Units Comments µqsfp Module insertion 0 60 N Module insertion into host Connector & Cage. µqsfp Module extraction 0 30 N Module extraction from host Connector & Cage µqsfp Module 90 N/A N No damage to Module below 90N 281 retention Cage retention in Host Board Insertion / removal cycles, Connector / Cage Insertion / removal cycles, µqsfp Module 282 5.5 Labeling of µqsfp Modules 90 N/A N Force to be applied in a direction normal to host board top surface, no damage to Cage 100 N/A Cyc. Number of cycles for the Connector and Cage with multiple Modules. 50 N/A Cyc. Number of cycles for an individual Module. 283 Each µqsfp Module shall be clearly labeled. The complete labeling need not be visible 284 when the µqsfp Module is installed and the bottom of the device is the recommended 285 location for the label. Labeling shall include: 286 287 Appropriate manufacturing and part number identification 288 289 290 Appropriate regulatory compliance labeling A manufacturing traceability code 291 The label should also include clear specification of the external port characteristics 292 such as: FORM FACTOR Page 13
293 294 Optical wavelength 295 Required fiber characteristics 296 Operating data rate 297 Interface standards supported 298 Link length supported 299 300 The labeling shall not interfere with the mechanical, thermal or EMI features. 301 5.6 Bezel for Systems using µqsfp Modules 302 Host enclosures that use µqsfp devices should provide appropriate clearances between the 303 µqsfp Modules to allow insertion and extraction without the use of special tools and a 304 bezel enclosure with sufficient mechanical strength. The µqsfp Module insertion slot 305 should be clear of nearby moldings and covers that might block convenient access to the 306 latching mechanisms, the µqsfp Module, or the cables that plug directly into the Cage. 307 5.6.1 Bezel for the Thru Bezel Cage Assembly 308 The front surface of the Cage assembly passes through the bezel. 309 310 Two EMI solutions may be implemented for the thru bezel Cage. If EMI spring fingers are 311 used, they make contact to the inside of the bezel cutouts. If an EMI gasket is used, it 312 makes contact to the inside surface of the bezel. To accept all Cage designs, both bezel 313 surfaces shall be conductive and connected to chassis ground. 314 315 The minimum recommended host board thickness for belly to belly mounting of the Connector 316 and Cage assemblies is 2.2 mm. 317 318 319 320 321 322 Figure 8 Recommended Bezel Design for Cages that extend into or thru Bezel FORM FACTOR Page 14
323 5.7 µqsfp Electrical Connector Mechanical 324 The µqsfp Connector is a 38-contact, right angle surface mount Connector and is shown in 325 Figure 9. The mechanical specifications for the Connector are listed in Table 3 and shown 326 in Figure 10. 327 328 FORM FACTOR Page 15
329 330 331 Figure 9 µqsfp Module Electrical Connector Illustration FORM FACTOR Page 16
332 333 334 Figure 10 µqsfp Electrical Connector Specification 335 5.8 Individual µqsfp Cage Assembly 336 For µqsfp a Cage Assembly is utilized that passes through the bezel. The detailed 337 drawings for the Cage assembly options are shown in Figure 11. The purpose of the 338 blocking tab is to prevent damage to the Connector should a Module be inserted in an 339 incorrect orientation. 340 FORM FACTOR Page 17
341 342 Figure 11 1-by-1 Thru Bezel Cage Design 343 5.9 EMI Cover 344 In order to prevent contamination of the internal components and to optimize EMI 345 performance, it is recommended that an EMI Cover be inserted into the Cage assembly when 346 no Module is present. The conductivity of the materials should be chosen for the EMI 347 Cover to block EMI emissions. The EMI cover shall be designed such that is can be 348 inserted into a Cage and Connector as defined in this specification. 349 350 5.10 Optical Interface 351 The µqsfp optical interface port shall be either a male MPO connector as specified in IEC 352 61754-7 (see Figure 12a) or a dual LC as specified in IEC 61754-20 (see Figure 12b). 353 354 The four fiber positions on the left as shown in Fig. 13a, with the key slot up, are used 355 for the optical transmit signals (Channel 1 through 4). The fiber positions on the right 356 are used for the optical receive signals (Channel 4 through 1). 357 FORM FACTOR Page 18
358 359 microqsfp Draft Mechanical Specification Rev 1.0 The central four fibers may be physically present. Two alignment pins are present. 360 361 362 363 364 Figure 12a µqsfp Optical Receptacle and Channel Orientation for MPO Connector (Viewed from Front of Module) 365 366 367 368 Figure 12b QSFP+ Optical Receptacle and Channel Orientation for dual LC Connector (Viewed from Front of Module) 369 5.11 MPO Optical Cable connection 370 Aligned key (Type B) MPO patchcords should be used to ensure alignment of the signals 371 between the Modules. The aligned key patchcord is defined in TIA-568 and shown in Figure 372 12c. The optical Connector is orientated such that the keying feature of the MPO 373 receptacle is on the top. FORM FACTOR Page 19
374 375 Figure 12b µqsfp MPO Optical Patchcord 376 6. Thermal Management Considerations 377 378 For µqsfp cooling is typically achieved by allowing front to back airflow to pass through 379 the Module. Ambient air outside the chassis is intended to enter the chassis around the 380 µqsfp Module and through Cage instead of only through other openings in the chassis 381 bezel. This ambient air shall pass around cooling features of the Module, pass into the 382 Cage assembly, and then exit the Cage assembly into the chassis. This design intent 383 allows for increased port density within a chassis rack, while allowing ambient air to 384 not only cool the Module but also allow that air to pass through into the chassis to cool 385 components deeper inside the chassis. 386 387 Additionally, the µqsfp Cage should have ventilation holes as allowed in Figure 11. The 388 dimensions of these vent holes are determined by the Cage manufacturers within the bounds 389 set forth in Figure 11. Care should be taken to ensure adequate ventilation through the 390 Cage is attained and that EMI is prevented from penetrating the Cage. FORM FACTOR Page 20