ST10F271B/E, ST10F272B/E Errata sheet

Similar documents
AN2261 APPLICATION NOTE

ST21NFCB. Near field communication controller. Features. RF communications. Hardware features. Communication interfaces. Electrical characteristics

AN4321 Application note

Description SPC564A-DISP. March 2014 DocID Rev 3 1/5

LD A very low drop adjustable positive voltage regulator. Description. Features

AN4113 Application note

Main components USB charging controller with integrated power switch

AN2667 Application note

AN2061 APPLICATION NOTE

STM32 embedded target for MATLAB and Simulink release 3.1. Summary for STM32 embedded target for MATLAB and Simulink release 3.1:

ST33F1M, ST33F1M0, ST33F896, ST33F768, ST33F640, ST33F512

STEVAL-CCM002V1. TFT-LCD panel demonstration board based on the STM32 as LCD controller. Features. Description

STEVAL-PCC010V1. ST802RT1A Ethernet PHY demonstration board with STM32F107 controller add-on board. Features. Description

STEVAL-SPBT4ATV3. USB dongle for the Bluetooth class 1 SPBT2632C1A.AT2 module. Features. Description

AN3996 Application Note

Description of STM8 LIN software package (STSW-STM8A-LIN) release 4.1. Table 1. Release information. STM8 LIN package

AN2672 Application note

AN4274 Application note

AN2676 Application note

AN4440 Application note

AN1335 APPLICATION NOTE

AN4308 Application note

STA bit single chip baseband controller for GPS and telematic applications. Features

EMIF03-SIM06F3. 3-line IPAD, EMI filter including ESD protection. Description. Features. Application. Complies with the following standards:

UM1719 User manual. The STPM3x evaluation software. Introduction

AN2143 Application note

AN2825 Application Note

ECMF02-3F3. Common mode filter with ESD protection. Features. Description. Applications. Complies with the following standard:

AN626 Application note

ST19WR08 Dual Contactless Smartcard MCU With RF UART, IART & 8 Kbytes EEPROM Features Contactless specific features

AN3279 Application Note

AN4464 Application note

AN2202 Application note

UM1572 User manual. STEVAL-IPE020V1: ST energy meter application based on the Android platform. Introduction

ST33F1M. Smartcard MCU with 32-bit ARM SecurCore SC300 CPU and 1.25 Mbytes high-density Flash memory. Features. Hardware features.

STM32-MP3NL/DEC. STM32 audio engine MP3 decoder library. Description. Features

UM0401 User manual. User manual for eight bit port expander STMPE801 demonstration board. Introduction

STLC2500D. Bluetooth V2.1 "Lisbon" + EDR. Features. Description

AN2470 Application note TS4871 low voltage audio power amplifier Evaluation board user guidelines Features Description

AN3250 Application note

STM8-SK/RAIS STM8-D/RAIS ST7-SK/RAIS ST7-D/RAIS

STM3210B-SK/KEIL STR91X-SK/KEI, STR7-SK/KEIL

UM1488 User manual. STPMC1 evaluation software. Introduction

AN3354 Application note

ST19NP18-TPM-I2C Trusted Platform Module (TPM) with I²C Interface Features

AN2855 Application note

STM8 I 2 C optimized examples

EV-VNQ5E050AK VNQ5E050AK evaluation board

STTS V memory module temperature sensor. Features

AN3154 Application note

AN3348 Application note

AN2737 Application note Basic in-application programming example using the STM8 I 2 C and SPI peripherals Introduction

UM0792 User manual. Demonstration firmware for the DMX-512 communication protocol transmitter based on the STM32F103Zx.

OSPlus USB Extension. OSPlus USB 2.0 extension. Description. Features. Application. TCP/IP stack NexGenOS NexGenIP VFS. FAT Ext2 LVM Device layer

UM0693 User manual. 1 Introduction. STM8L101-EVAL demonstration firmware

STM32-SK/KEIL STR91X-SK/KEI, STR7-SK/KEIL

SOT23-6L ESDALCL6-2SC6

AN3965 Application note

STM3220G-SK/KEI. Keil starter kit for STM32F2 series microcontrollers (STM32F207IG MCU) Features. Description

STEVAL-VNH5019A. Motor driver evaluation board based on VNH5019A. Description. Features

EVAL6235PD. L6235 three-phase brushless DC motor driver demonstration board. Features. Description

AN3980 Application note

AN3362 Application note

AN3964 Application note

AN2673 Application note

AN2430 Application note

This document describes the hardware architecture of the board, how to configure the jumpers and to enable specific functions.

STEVAL-IHM028V1. 2 kw 3-phase motor control demonstration board featuring the IGBT intelligent power module STGIPS20K60. Features.

AN2361 Application note

Main components 1 A, high efficiency adjustable single inductor dual mode buckboost DC-DC converter

AN2240 Application note

AN2592 Application note

AN2474 Application note

AN3988 Application note

UM1084 User manual. CR95HF development software user guide. Introduction. Reference documents

STEVAL-IDW001V1. Wi-Fi daughterboard for STM32F0DISCOVERY. Description. Features

STICE CF/Stice_Connect AD/Stice_Connect AS/Stice_Connect

EMIF02-SPK02F2. 2-line IPAD, EMI filter and ESD protection. Features. Application. Description. Complies with the following standards

STM32-SK/RAIS,STR91X-SK/RAI,STR7-SK/RAIS STM32-D/RAIS,STR9-D/RAIS,STR7-D/RAIS

TN0132 Technical note

AN3001 Application note

AN2548 Application note

AN2594 Application note

Obsolete Product(s) - Obsolete Product(s)

AN3140 Application note

EMIF01-SMIC01F2 IPAD. Single line EMI filter including ESD protection. Main application. Description. Benefits. Pin configuration (Bump side view)

Obsolete Product(s) - Obsolete Product(s)

AN3423 Application note

AN2860 Application note

AN2781 Application note

EMIF02-MIC01F2 2-line IPAD, EMI filter including ESD protection Features Application Description Complies with the standards:

AN2408 Application note

SMP75. Trisil for telecom equipment protection. Features. Description. Applications. Benefits

b. Typical values, independent of external clock frequency and supply voltage. a. TCG website:

AN2734 Application note S-Touch design procedure Introduction

AN2557 Application note

AN3265 Application note

AN2618 Application note

AN4371 Application note

AN4290 Application note

Transcription:

Errata sheet BAG silicon version Introduction Note: This errata sheet describes all the functional and electrical problems known in the BAG silicon version of ST10F271B, ST10F271E, ST10F272B and ST10F272E microcontrollers (MCUs). The ST10F271B, ST10F271E, ST10F272B and ST10F272E devices are commercial products based on the same silicon. Therefore the present errata sheet is valid for the four devices. The major revision of the device can be read in the IDCHIP register (@F07Ch) which is set to 1102h for all these devices. September 2013 Rev 2 1/9 www.st.com

Contents ST10F271B/E, ST10F272B/E Contents 1 Functional problems summary................................ 4 1.1 Functional problems summary of the ST10F271B/E................. 4 1.2 Functional problems summary of the ST10F272B/E................. 4 2 Functional problems description............................... 5 3 Specification issues......................................... 7 3.1 Documentation update........................................ 7 3.2 DC and AC parameters modifications............................ 7 3.3 Flash commands timings updated............................... 7 3.4 Main voltage regulator must be OFF in Power Down mode............ 7 4 Revision history............................................ 8 2/9

Errata list Errata list.................................................................. 5.................................................................. 5............................................................... 6............................................................... 6 3/9

Functional problems summary ST10F271B/E, ST10F272B/E 1 Functional problems summary 1.1 Functional problems summary of the ST10F271B/E Table 1. Functional problems of the ST10F271B-BAG Functional Problem Short Description Spurious BREQ pulse in Slave mode during external bus arbitration phase Table 2. Functional problems of the ST10F271E-BAG Functional Problem Short Description Spurious BREQ pulse in Slave mode during external bus arbitration phase 1.2 Functional problems summary of the ST10F272B/E Table 3. Functional problems of the ST10F272B-BAG Functional Problem Short Description Spurious BREQ pulse in Slave mode during external bus arbitration phase Table 4. Functional problems of the ST10F272E-BAG Functional Problem Short Description Spurious BREQ pulse in Slave mode during external bus arbitration phase 4/9

Functional problems description 2 Functional problems description Spurious BREQ pulse in slave mode during external bus arbitration phase Description: When using external bus arbitration via the HOLD function with the ST10F271B/E - ST10F272B/E configured as a slave, sporadic bus errors may occur. After the slave has been granted the bus, the slave deactivates BREQ sporadically for a short time, even though the bus access of the slave has not been completed. The master then starts its own bus access, leading to a bus conflict between master and slave. Workaround: In order not to produce any spurious BREQ pulse during a Slave External Bus Arbitration Phase, it is necessary to guarantee that the time between the HOLDA assertion (Bus Acknowledge from Master device) and the following HOLD falling edge (Bus Request from Master) is greater than three clock cycles. This can be implemented by delaying the HOLD signal with an RC circuit as shown in Figure 1. Figure 1. ST10 in Slave mode HOLD HLDA BREQ (P6.7) HLDA (P6.6) Master BREQ HOLD (P6.5) ST10 in Slave mode V SS Description: Workaround: When coming back from Idle mode, the Flash response time is slower than in running mode. This can lead to an incorrect data read or code fetch when the CPU frequency is greater than 55 MHz. As a consequence, the use of IDLE instruction is not allowed for frequencies greater than 55 MHz. There is no workaround for frequencies greater than 55 MHz. 5/9

Functional problems description ST10F271B/E, ST10F272B/E Description: When instruction PWRDN is executed while pin NMI is at a high level (if PWDCFG bit is cleared in SYSCON register) or while at least one of the Port 2 pins used to exit from Power Down mode (if PWDCFG bit is set in SYSCON register) is at the active level, Power Down mode is not entered and the PWRDN instruction is ignored. However, under the conditions described below, the PWRDN instruction is not ignored, and no further instructions are fetched from external memory, that is, the CPU is in a quasi-idle state. This problem only occurs in the following situations: The instructions following the PWRDN instruction are located in an external memory and a multiplexed bus configuration with memory tristate waitstate (bit MTTCx = 0) is used. The instruction preceding the PWRDN instruction writes to external memory or an XPeripheral (such as XRAM or CAN) and the instructions following the PWRDN instruction are located in external memory. In this case, the problem occurs for any bus configuration. Note: The on-chip peripherals still work correctly, in particular the Watchdog Timer. If the Watchdog Timer is not disabled, it resets the device upon an overflow. Interrupts and PEC transfers, however, cannot be processed. If NMI is asserted low while the device is in this quasi-idle state, Power Down mode is entered. No problem occurs if the NMI pin is low (if PWDCFG = 0) or if all Port 2 pins used to exit from Power Down mode are at inactive level (if PWDCFG = 1): The chip normally enters Power Down mode. Workaround: Ensure that no instruction that writes to external memory or to an XPeripheral precedes the PWRDN instruction. Otherwise, insert a NOP instruction in front of PWRDN. When a multiplexed bus with memory tristate wait state is used, the PWRDN instruction must be executed from internal RAM or XRAM. Description: Workaround: When waking up from interruptible Power Down mode, the Flash response time is slower than in Running mode. This can lead to an incorrect data read or code fetch when the CPU frequency is greater than 55 MHz. As a consequence, exiting from Interruptible Power Down mode with an external interrupt is not supported for frequencies greater than 55 MHz. There is no workaround for frequencies greater than 55 MHz. Note: Exiting from Interruptible Power Down mode with an external reset is supported at all frequencies. 6/9

Specification issues 3 Specification issues 3.1 Documentation update Previous references: ST10272B/E Datasheet (Custom data), Rev. 2.0, September 2005 ST10272B/E Datasheet, Rev. 0.9, September 2005 New references: ST10272B/E Datasheet, Rev. 1, July 2006 3.2 DC and AC parameters modifications The following parameters are corrected and are now compliant with the target specifications: V HYS (Input Hysteresis in TTL threshold): This parameter is now 400mV instead of 500mV. VCO frequency range: The VCO frequency range is now 64 to 128 MHz instead of 40 to 128 MHz. t LOCK : The PLL Lock-in time for x10 multiplication factor is now 300µs instead of 250µs. 3.3 Flash commands timings updated Characterization and validation results show that the typical programming and erasing times for the Flash are longer than the values previously specified in the ST10F272 Preliminary Data. This point was formerly referenced as FLASH.3 in the errata sheet of the previous silicon versions of the ST10. Timings for erase and programing are corrected. 3.4 Main voltage regulator must be OFF in Power Down mode Characterization and validation results show that the main voltage regulator must be switched off during Power Down to meet power consumption specification and avoid possible CPU wake-up. This point was formerly referenced as PWRDN.3 in the errata sheet of the previous silicon versions of the ST10. The main voltage regulator must be turned off in Power Down by setting bit VREGOFF in XMISC register (bit XMISC.3). The new documentation is fully compliant with this specification change. 7/9

Revision history ST10F271B/E, ST10F272B/E 4 Revision history Table 5. Revision history Date Revision Description of changes 27-Nov-2006 1 Initial release for the BAG silicon version 25-Sep-2013 2 Updated disclaimer. 8/9

Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. 2013 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9