ES_LPC81xM. Errata sheet LPC81xM. Document information

Similar documents
LPC81x, LPC82x, LPC83x Errata Sheet and Datasheet Update for Vdd.1 Errata

ES_LPC5410x. Errata sheet LPC5410x. Document information

UM NVT2008PW and NVT2010PW demo boards. Document information

AN10955 Full-duplex software UART for LPC111x and LPC13xx

UM NVT2001GM and NVT2002DP demo boards. Document information

ES_LPC5411x. Errata sheet LPC5411x. Document information LPC54113J256UK49, LPC54114J256UK49, LPC54113J128BD64, LPC54113J256BD64, LPC54114J256BD64

OM13071 LPCXpresso824-MAX Development board

UM NXP USB PD shield board user manual COMPANY PUBLIC. Document information

QPP Proprietary Profile Guide

UM PCAL6524 demonstration board OM Document information

Using LPC11Axx EEPROM (with IAP)

UM10766 User manual for the I2C-bus RTC PCF85263A demo board OM13510

AN LPC82x Touch Solution Quick Start Guide. Document information. Keywords

AN10917 Memory to DAC data transfers using the LPC1700's DMA

NXP AN11528 sensor Application note

How to use the NTAG I²C plus for bidirectional communication. Rev June

LPC540xx_LPC54S0xx. Errata sheet LPC540xx_LPC54S0xx. Document information

UM PR533 - PCSC Tool. User manual COMPANY PUBLIC. Rev November Document information

OM bit GPIO Daughter Card User Manual

CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling.

IoT Sensing SDK. Getting started with IoT Sensing SDK (ISSDK) v1.7 middleware. Document information. IoT Sensing SDK, ISSDK, MCUXpresso, middleware

AN NTAG I²C plus memory configuration options. Application note COMPANY PUBLIC. Rev June Document information

Broadband system applications i.e. WCDMA, CATV, etc. General purpose Voltage Controlled Attenuators for high linearity applications

UM EEPROM Management of PN746X and PN736X. User manual COMPANY PUBLIC. Rev February Document information

UM OM bit GPIO Daughter Card User Manual. Document information. Keywords Abstract

PNP 500 ma, 50 V resistor-equipped transistor; R1 = 2.2 kω, R2 = open

AN CBTL08GP053 Programmer's Guide. Document information. Keywords Abstract

AN10942 MFRX852 Evaluation Board- Quick start up Guide

NWP2081T. 1. General description. 2. Features and benefits. 3. Applications. 4. Ordering information. Half-bridge driver IC

UM User Manual for LPC54018 IoT Module. Rev November Document information

UM LPC54018 IoT module. Document information. LPC54018, OM40007, Amazon FreeRTOS, AWS, GT1216 LPC54018 IoT module user manual

Wafer Fab process Assembly Process Product Marking Design

QSG DAC1x08D+ECP3 DB

AN BGA GHz 18 db gain wideband amplifier MMIC. Document information. Keywords. BGA3018, Evaluation board, CATV, Drop amplifier.

74ABT General description. 2. Features and benefits. 3. Ordering information. Quad 2-input AND gate

AN BGA301x Wideband Variable Gain Amplifier Application. Document information. Keywords

Release notes for ISSDK v1.7

UM User manual for the BGU MHz LNA evaluation board. Document information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

300 V, 100 ma PNP high-voltage transistor

AN Over-the-Air top-up with MIFARE DESFire EV2 and MIFARE Plus EV1. Document information

AN Automatic RS-485 address detection. Document information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

UM LPC General Purpose Shield (OM13082) Rev November Document information. Keywords

STB-CE v Overview. 2 Features. Release notes for STB-CE v What's new in STB-CE v2.5

AN Sleep programming for NXP bridge ICs. Document information

SOD Package summary

NCR402T. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data

UM OM11057 quick start guide. Document information

UM OM13500 & OM13500A, PCA9620 & PCx8537 demo board. Document information. Keywords

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

PESD18VV1BBSF. Very symmetrical bidirectional ESD protection diode

AN MIFARE Type Identification Procedure. Application note COMPANY PUBLIC. Rev August Document information

MMBZ16VAL. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data

LPC-Link2 Debug Probe Firmware Programming. Rev June, 2017 User Guide

General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device (SMD) plastic package.

UM NXP USB Type-C Shield 2 Demo Kit User Manual COMPANY PUBLIC. Document information

SiGe:C Low Noise High Linearity Amplifier

UM10760 User manual for the I²C-bus RTC PCF8523 demo board OM13511

Bidirectional ESD protection diode

QPP Programming Guide

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

AN10913 DSP library for LPC1700 and LPC1300

GreenChip synchronous rectifier controller. The TEA1792TS is fabricated in a Silicon-On-Insulator (SOI) process.

PESD18VF1BL. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data. 5. Pinning information

AN Entering ISP mode from user code. Document information. ARM ISP, bootloader

Installation Manual Installation Manual for the MicroWave Office design kit version v1.0

D (double) Package type descriptive code. TSSOP8 Package type industry code. TSSOP8 Package style descriptive code

UM LPC54114 Audio and Voice Recognition Kit. Rev February Document information. Keywords

DC connector: 5VDC, 2,5A, round; 2,1x5,5x10 mm, inside positive External power supply: AC 230V 50/60Hz, 5V 2,5A out

UM Gaming suitcase demo system. Document information

QN908x. DK User s Guide. Document information. QN9080-DK, QN9080, QN9083, BLE, USB Dongle This document is an introduction to the QN908x DK V1.

PESD5V0X2UM. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data

PTVSxS1UR series. 1. Product profile. 400 W Transient Voltage Suppressor. 1.1 General description. 1.2 Features and benefits. 1.

AN10688_1. PN532C106 demoboard. Document information. NFC, PN532, PN532C106, demoboard. This document describes PN532C106 demoboard.

ESD protection for ultra high-speed interfaces

PESD24VF1BSF. Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit C d diode capacitance f = 1 MHz; V R = 0 V

Unidirectional ESD protection diode

PESD5V0C1USF. in portable electronics, communication, consumer and computing devices.

General-purpose Zener diodes in an SOD523 (SC-79) ultra small and flat lead Surface-Mounted Device (SMD) plastic package.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

D (double) Package type descriptive code. SOD2 Package type industry code. DSN Package style descriptive code

AN LPC1700 Ethernet MII Management (MDIO) via software. Document information. LPC1700, Ethernet, MII, RMII, MIIM, MDIO

Installation Manual. Installation Manual for the ADS design kit version v2.1. ADS Design kit Windows Linux Unix Instruction Manual RF small signal

MF1ICS General description. Functional specification. 1.1 Key applications. 1.2 Anticollision. Product data sheet PUBLIC

plastic surface-mounted package; 5 leads D (double) Package type descriptive code TSOP5 Package type industry code

AN QN902x Quick Start Guide. Document information

SOT404-REFLOW REL Major version date Minor version date Security status

45 V, 100 ma NPN general-purpose transistors

PESD12VV1BL. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data

S (single) Package type descriptive code. DPAK Package type industry code. DPAK Package style descriptive code

D (double) Package type descriptive code. SMT3; MPAK Package type industry code. SMT3; MPAK Package style descriptive code

AN12119 A71CH Quick start guide for OM3710A71CHARD and i.mx6ultralite

SOD123W. 1. Package summary. plastic, surface mounted package; 2 terminals; 2.6 mm x 1.7 mm x 1 mm body 9 April 2018 Package information

UM LPCXpresso Rev th November Document information. LPCXpresso54102, LPC54100 LPCXpresso54102 User Manual

AN LPC1700 secondary USB bootloader. Document information. LPC1700, Secondary USB Bootloader, ISP, IAP

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

ES_LPC11U2x. Errata sheet LPC11U2x. Document information

UM LPCXpresso845MAX. Document information. LPCXpresso845MAX, OM13097, LPC845, LPC844 LPCXpresso845MAX User Manual

UM NTAG I²C plus Explorer Kit Peek and Poke. Rev September User manual COMPANY PUBLIC. Document information

Transcription:

Rev. 3.2 3 April 2018 Errata sheet Document information Info Keywords Abstract Content LPC810M021FN8; LPC811M001JDH16; LPC812M101JDH16; LPC812M101JD20; LPC812M101JDH20, LPC812M101JTB16, LPC81xM errata This errata sheet describes both the known functional problems and any deviations from the electrical specifications known at the release date of this document. Each deviation is assigned a number and its history is tracked in a table.

Revision history Rev Date Description 3.2 20180403 Added VDD.1 3.1 20140401 Added details on how to determine revision identifier for TSSOP16. 3 20130827 Added CMP.1. 2 20130530 Added revision 4C. Updated SYSOSC.1. Added CMP.1. 1 20130307 Initial version Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Errata sheet Rev. 3.2 3 April 2018 2 of 12

1. Product identification 2. Errata overview The LPC81xM devices typically have the following top-side marking: LPC81x xxxxx xxxxxxxx xxywwxr[x] The last two letters in the last line (field xr ) identify the boot code version and device revision. Table 1. Device revision table Revision identifier (xr) Revision description 1A Initial device revision with boot code version 13.1 2A Second device revision with boot code version 13.2 4C Third device revision with boot code version 13.4 Field Y states the year the device was manufactured. Field WW states the week the device was manufactured during that year. Remark: On the TSSOP16 package, the last line includes only the date code xxyww. In order to determine the revision identifier, use the ISP command Read Boot code version (for more details, refer to Chapter 21 of the LPC81x user manual (UM10601)). Table 2. Functional problems table Functional problems Short description Revision identifier Detailed description CMP.1 On the LPC810M021FN8 revision A device, the comparator is not functional. 1A, 2A Section 3.1 DPD.1 FLASHCFG.1 I2C.1 PD.1 SYSOSC.1 VDD.1 In Deep Power-down mode, the current consumption can be higher than anticipated The flash access time must be set to 2 system clocks before performing In-System/In-Application programming calls, and power profile API calls. In I2C slave mode, the SLVPENDING bit does not clear when the slave function is disabled. Reset wake-up sources cannot be used to wake up the device from power-down mode. When using an external crystal oscillator, the V DD supply voltage must be 1.9 V or above for device revision 4C, and 2.3 V or above for device revisions 1A and 2A. The minimum wait time of the power supply ramp must be minimum 2 ms. 1A, 2A Section 3.2 1A, 2A Section 3.3 1A, 2A Section 3.4 1A, 2A Section 3.5 1A, 2A, 4C Section 3.6 1A, 2A, 4C Section 3.7 Errata sheet Rev. 3.2 3 April 2018 3 of 12

Table 3. AC/DC deviations table AC/DC deviations Short description Detailed description n/a n/a n/a Table 4. Errata notes Note Short description Detailed description n/a n/a n/a Errata sheet Rev. 3.2 3 April 2018 4 of 12

3. Functional problems detail 3.1 CMP.1 The LPC810M021FN8 part features a comparator which can be used to compare voltage levels on external pins and internal voltages. On the LPC810M021FN8 revision A only, the comparator is not functional. None. This errata is fixed on the LPC810M021FN8 revision C. 3.2 DPD.1 The LPC800 supports four low-power modes: sleep, deep-sleep, power-down, and deep power-down modes. The LPC800 datasheet specifies 220 na typical deep power-down current (wake-up timer disabled) at 25 C, and 1 µa typical deep power-down current (wake-up timer enabled) at 25 C. The deep power-down current can be approximately 30 µa higher than the specified typical values in the datasheet. None. Errata sheet Rev. 3.2 3 April 2018 5 of 12

3.3 FLASHCFG.1 On the LPC800, access to the flash memory can be configured with various access times by writing to the FLASHCFG register. The user can write a value of 0x0 (1 system clock flash access time) or a value of 0x1 (2 system clocks flash access time) in the FLASHCFG register. The default value is set to 0x1. The LPC800's ROM supports flash In-System Programming (ISP)/In-Application Programming (IAP) calls, and power profile API calls. If the user application is using 1 system clock flash access time (FLASHCFG register set to 0x0), the In-System/In-Application Programming calls and power profile API calls will not always operate correctly with this setting. Before performing the In-System/In-Application programming calls, and/or power profile API calls, the user must ensure that the FLASHCFG register is set to 2 system clocks flash access time. The user can use 1 system clock flash access time when these API calls are not performed. Errata sheet Rev. 3.2 3 April 2018 6 of 12

3.4 I2C.1 The I2C peripheral on the LPC800 supports independent Master, Slave, and Monitor functions. In the I2C slave mode, the slave function internally resets when the slave function is disabled. This is controlled using the SLVEN bit in the I2C Configuration register (CFG). The SLVPENDING bit in the I2C status register (STAT) indicates whether the slave function is waiting to continue communication and needs software service. If the SLVPENDING bit is read as '0', the slave function does not need service, and if read as '1', the slave function needs service and an interrupt can be generated. The SLVPENDING bit in the I2C status register (STAT) automatically clears when a '1' is written to the SLVCONTINUE bit in the Slave Control register (SLVCTL) or when the slave function is disabled via the SLVEN bit in the I2C Configuration register (CFG). When the slave function is disabled, the SLVPENDING bit in the I2C status register (STAT) does not clear, and as a result, an interrupt will be generated when the I2C slave function is re-enabled. After disabling the slave function, the SLVPENDING bit in the I2C status register (STAT) should be cleared by writing a '1' to the SLVCONTINUE bit in the Slave Control register (SLVCTL). Errata sheet Rev. 3.2 3 April 2018 7 of 12

3.5 PD.1 The LPC800 supports four low-power modes: sleep, deep-sleep, power-down, and deep power-down modes. In power-down mode, the LPC800 can wake up from the following wake-up sources: 1. Interrupts from USARTs, SPI, I2C 2. Pin interrupts 3. Brown-Out Detect (BOD) interrupt and reset 4. Windowed Watchdog Timer (WWDT) interrupt and reset 5. External Reset Pin 6. Self Wake-Up Timer (WKT) The BOD reset, WWDT reset, and the external reset pin wake-up sources cannot be used to wake up the device from power-down mode. Use the other wake-sources (mentioned above) to wake up the device from power-down mode. Errata sheet Rev. 3.2 3 April 2018 8 of 12

3.6 SYSOSC.1 On the LPC800, the V DD supply voltage range is from 1.8 V to 3.6 V. The LPC800 has various clock sources such as the internal oscillator (IRC), system oscillator, CLKIN, and watchdog oscillator. An external crystal oscillator can be connected between the XTALIN and XTALOUT pins to use the system oscillator as a clock source. The system oscillator can also be bypassed by setting the BYPASS bit in the SYSOSCCTRL register, and an external clock source can be fed directly to the XTALIN pin. An external crystal oscillator connected to the system oscillator does not function when the V DD power supply is below 1.9 V for device revision 4C, and below 2.3 V for device revisions 1A and 2A. The V DD supply voltage must be 1.9 V or above for device revision 4C, and 2.3 V or above for device revisions 1A and 2A when connecting an external crystal oscillator to the system oscillator. If the V DD supply voltage is below 1.9 V for device revision 4C, and below 2.3 V for device revisions 1A and 2A, an external clock source can be fed to the XTALIN by bypassing the system oscillator or the other clock sources mentioned above can be used. 3.7 VDD.1 On the LPC81x, the V DD supply voltage range is from 1.8 V to 3.6 V. The LPC81x datasheet specifies a power-up ramp condition for the user application. Before ramping up, the minimum wait time (t wait ) of the power supply on the V DD pin (200 mv or below) is 12 s. The device might not always start-up if the minimum wait time (t wait ) is 12 s. The required minimum time (t wait ) specification is 2 ms. None. Errata sheet Rev. 3.2 3 April 2018 9 of 12

4. AC/DC deviations detail 5. Errata notes n/a 5.1 Note.1 n/a Errata sheet Rev. 3.2 3 April 2018 10 of 12

6. Legal information 6.1 Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 6.2 Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer s applications and products planned, as well as for the planned application and use of customer s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer s applications or products, or the application or use by customer s third party customer(s). Customer is responsible for doing all necessary testing for the customer s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer(s). NXP does not accept any liability in this respect. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 6.3 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Errata sheet Rev. 3.2 3 April 2018 11 of 12

7. Contents 1 Product identification.................... 3 2 Errata overview......................... 3 3 Functional problems detail................ 5 3.1 CMP.1................................ 5............................5...............................5...........................5 3.2 DPD.1................................ 5............................5...............................5...........................5 3.3 FLASHCFG.1.......................... 6............................6...............................6...........................6 3.4 I2C.1................................. 7............................7...............................7...........................7 3.5 PD.1................................. 8............................8...............................8...........................8 3.6 SYSOSC.1............................ 9............................9...............................9...........................9 3.7 VDD.1................................ 9............................9...............................9...........................9 4 AC/DC deviations detail................. 10 5 Errata notes........................... 10 5.1 Note.1............................... 10 6 Legal information....................... 11 6.1 Definitions............................ 11 6.2 Disclaimers........................... 11 6.3 Trademarks........................... 11 7 Contents.............................. 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. NXP B.V. 2018. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 3 April 2018 Document identifier: ES_LPC81XM