Features Support 9.95 Gb/s to 11.3 Gb/s serial optical and electrical interface Temperature Stabilized DWDM EML Transmitter 1550nm cooled EML transmitter with TEC and PIN receiver Both 40Km and 80Km Units Available over single mode fiber +5V, +3.3V, +1.8V power supply XFI electrical interface and Hot pluggable XFP MSA package with duplex LC connector 2-wire interface for integrated Digital Diagnostic monitoring Excellent EMI performance High reliability Low power consumption less than 3.5 W Operating case temperature: -5~+70 C Applications 10GBASE-ER/EW (ZR)10Gigabit Ethernet SONET OC-192 IR-2(LR-2) Other optical links Standard Compatible with XFP MSA Compatible with IEEE 802.3ae Compliant with ITU-T G.691 Compatible with IEC 60825-1 Class 1 laser eye safe FDA 21 CFR 1040.10 and 1040.11, class 1 RoHS 6 compliance Description HXFP-XDX1XX is a high performance, cost effective and optimized for 10 Gb/s XFP optical transceiver, This device RoHS compliant is a full duplex serial electric, serial optical device with both transmit and receive functions contained in a single module. It is designed for use in a variety of 10G SDH/SONET, 10G Ethernet and other fiber optic transmission applications. Support data rates from 9.95Gbps to 11.3Gbs and transmission distance to 40 km or 80 km on 9/125 μm SMF The transceiver consists of two sections: The transmitter section incorporates an cooled 1550nm EML laser, (1550nm, ITU channel specific laser) driver and re-timer circuits, The receiver section consists of an APD or PIN photodiode integrated with a transimpedance preamplifier (TIA) and CDR. A block diagram of the HXFP-XDX1XX XFP optical transceiver is shown below Page 1 of 12
The module is hot pluggable into the 30-pin XFI connector. The high-speed electrical interface is base on low voltage logic, with nominal 100 Ohms differential impedance and AC coupled in the module. The optical output can be disabled by LVTTL logic high-level input of TX_DIS. Loss of signal (RX_LOS) output is provided to indicate the loss of an input optical signal of receiver. The user can access transceiver monitoring and configuration data via the 2-wire XFP Management Interface. This interface uses a single address, A0h, with a memory map divided into a lower and upper area. Basic digital diagnostic (DD) data is held in the lower area while specific data is held in a series of tables in the high memory area. Absolute Maximum Ratings Parameter Symbol Min. Max. Unit Storage Temperature T S -40 +85 0 C VCC5-0.3 6.0 V Supply Voltage VCC3-0.5 3.6 V VCC2-0.3 2.0 Operating Relative Humidity RH 85 % Recommended Operating Environment Parameter Symbol Min. Typical Max. Unit Operating Case Temperature T C 0 +70 C VCC5 4.75 5.0 5.25 v Supply Voltage VCC3 3.14 3.3 3.47 v VCC2 1.71 1.8 1.89 v ICC5 100 ma Power Supply Current ICC3 900 ma ICC2 - ma Power Dissipation PD 3.5 W Data Rate T OP 9.95 11.30 Gbps Notes: VCC2 not required for this design. Page 2 of 12
Optical Characteristics Transmitter Section Parameter Symbol Min. Typical Max. Unit Operating Data Rate B 9.95 11.30 Gbps Output Center Wavelength λ C 1530 ITU-grid 1565 nm Spectral Width (-20dB from Peak ) FW20 0.25 0.3 nm Average Optical Output Power Po -2 - +2 dbm Extinction Ratio Er 9.5 db Side Mode Suppression Ratio SMSR 30 db Compatible with IEEE 802.3ae, 10GBASE_ER Optical Eye Mask Compliant with ITU-T G.691 and GR-253-CORE Channel Spacing f 100 GHZ Wavelength Stability Δλ +/-40 pm Relative Intesity Noise RIN -130 db /Hz Receiver Section Parameter Symbol Min. Typical Max. Unit Operating Data Rate B 9.95 11.30 Gbps Output Center Wavelength λ C 1260 1600 1600 nm Receiver Sensitivity,PIN SEN -16.0 dbm Receiver Overload,PIN POL 0. dbm Receiver Sensitivity,APD SEN -24.0 dbm Receiver Overload,APD POL -6 dbm LOS Assert LOSA -35 dbm LOS Deassert LOSD -32 dbm LOS Hysteresis LOSH 1 db Optical Return Loss ORL - -27 db Jitter Tolerance JTL GR-253-CORE/ITU-T G.691 Notes: 1. Higher transmit powers are available, please consult factory. 2. Receiver sensitivity defined at 1e-12 BER performance, using a worst case ER across the entire operational temperature range. Electrical Characteristics Parameter Symbol Min. Typical Max. Unit Notes High-speed Signal (CML) Interface Specification Input Data Rate 9.95 11.30 Gbps Input Differential Impedance RI 80 100 120 Ω 1 Differential Data Input Swing VTin,p-p 50 700 mv Page 3 of 12
Output Data Rate 9.95 11.30 Gbps Differential Data Output Swing VRin,p-p 360 770 mv Jitter XFI Compliant Output Differential Impedance 80 100 120 Ω 1 Low-speed Signal (LVTTL) Interface Specification (Low speed control and sense signals (detailed specification in XFP MSA INF8077i Rev. 4.5) Input Low Voltage 0.0 0.4 V Input High Voltage Vcc-0.5 Vcc+0.3 V Output Low Voltage -0.3 VCC3*0.3 V Output High Voltage VCC3*0.7 VCC3+0.5 V Notes: Internally AC coupled 2-wire Serial Digital Diagnostic Memory Map Management Interface The s Figure 1. Digital Diagnostic Memory Map tructure of the memory map is shown in Figure 1which is accessible over a 2 wire erial interface at the Page 4 of 12
8-bit address 1010000X (A0h). The normal 256 Byte I2C address space is divided into lower and upper blocks of 128 Bytes. The lower block of 128 Bytes is always directly available and is used for the diagnostics and control function. The monitoring specification is shown in Table 6. Multiple blocks of memories are available in the upper 128 Bytes of the address space. These are individually addressed through a table select Byte which the user enters into a location in the lower address space. Thus, there is a total available address space of 128 * 256 = 32Kbytes in this upper memory space. The contents of Table 01h are list in table 7 below. PLS refer INF-8077i (Revision 4.0) for detailed information Digital Diagnostic Monitor Characteristics Parameter Symbol Min. Max Unit Temperature monitor absolute error DMI_Temp -2.5 2.5 degc Laser power monitor absolute error DMI_TX -2.5 2.5 db RX power monitor absolute error DMI_RX -2.5 2.5 db Supply voltage monitor absolute error DMI_VCC -0.08 0.08 V Bias current monitor DMI_Ibias -10% 10% ma Pin Function Definitions Pin Logic Symbol Name/Description Ref. Page 5 of 12
1 GND Module Ground 1 2 VEE5 Optional 5.2 Power Supply Not required 3 LVTTL-I Mod-Desel 4 LVTTL-O Interrupt Module De-select; When held low allows the module to, respond to 2-wire serial interface commands Interrupt (bar); Indicates presence of an important condition which can be read over the serial 2-wire interface 5 LVTTL-I TX_DIS Transmitter Disable; Transmitter laser source turned off 6 VCC5 +5 Power Supply 7 GND Module Ground 1 8 VCC3 +3.3V Power Supply 9 VCC3 +3.3V Power Supply 10 LVTTL-I SCL Serial 2-wire interface clock 2 11 LVTTL- I/O 12 LVTTL-O Mod_Abs SDA Serial 2-wire interface data line 2 Module Absent; Indicates module is not present. Grounded in the module. 13 LVTTL-O Mod_NR Module Not Ready; 2 14 LVTTL-O RX_LOS Receiver Loss of Signal indicator 2 15 GND Module Ground 1 16 GND Module Ground 1 17 CML-O RD- Receiver inverted data output 18 CML-O RD+ Receiver non-inverted data output 19 GND Module Ground 1 20 VCC2 +1.8V Power Supply 21 LVTTL-I P_Down/RST Power Down; When high, places the module in the low power stand-by mode and on the falling edge of P_Down initiates a module reset Reset; The falling edge initiates a complete reset of the module including the 2-wire serial interface, equivalent to a power cycle. 22 VCC2 +1.8V Power Supply Not required 23 GND Module Ground 1 24 PECL-I RefCLK+ 25 PECL-I RefCLK- Reference Clock non-inverted input, AC coupled on the host board Not required Reference Clock inverted input, AC coupled on the host board Not required 26 GND Module Ground 1 27 GND Module Ground 1 28 CML-I TD- Transmitter inverted data input 29 CML-I TD+ Transmitter non-inverted data input 2 2 3 3 Page 6 of 12
30 GND Module Ground 1 Note: 1. Module circuit ground is isolated from module chassis ground within the module. 2. Open collector; should be pulled up with 4.7k 10k ohms on host board to a voltage between 3.15Vand 3.6V. 3. A Reference Clock input is not required. OSNR Performance Parameters Performance Test Condition Dispersion ps/nm OSNR Threshold Adjustment Optical Loopback Sensitivity 9.95Gb/s at 1e-12 BER -100 to 1600 >30dB No -22dBm 10.7Gb/s at 1e-12 BER -100 to 1600 >30dB No -21dBm 9.95Gb/s at 1e-5 BER -100 to 1600 20dB Yes -19dBm 10.7Gb/s at 1e-5 BER -100 to 1600 20dB Yes -18Bm OSNR measurements performed with a Resolution Bandwidth of 0.1nm. OSNR Sensitivity using APD Receiver, assuming worst case Transmit ER. Optical loopback sensitivity is defined as a transmitter looped back to a receiver within the same transceiver, though fiber loop and OSNR impairments added. Mechanical Design Diagram Mechanical Design Diagram XFP transceivers are compliant with the dimensions defined by the XFP Multi-Sourcing Agreement (MSA). Page 7 of 12
Application Schematics Recommended Host Board Power Supply Circuit Page 8 of 12
The recommended interface circuit Page 9 of 12
DWDM code: Page 10 of 12
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Ordering information HXFP Transmission Distance 0:Ultra Long Reach 1:Long Reach 2:Intermediate 3:Short Reach Wavelength 3: 1310nm 5: 1550nm 8: 850nm C: CWDM D: DWDM LD Type 1: FP-LD/ PIN-TIA 2: DFB-LD / PIN-TIA 3: VCSEL/ PIN-TIA 4: EML / PIN-TIA 5: EML / APD Costomer Specific Code Channel Code 01~08: CWDM 1310 range (1270nm~1450nm) 09~16: CWDM 1550 range (1470nm~1610nm) 17~61: DWDM 1550 range (191.7~196.1THz) (1563.86nm~1528.77nm) Operation Temperature 1:0 ~ +70 C 2:-10 ~ +85 C 3:-40 ~ +85 C Page 12 of 12