Low Capacitance TVS Diode ESD / transient protection of highspeed data lines in. / 5 / V applications according to: IEC6000 (ESD): up to ± 5 KV (contact) IEC6000 (EFT): 0 A (5/50 ns) IEC60005 (surge): up to.5 A (8/0 µs) Smallest form factor down to.0 x 0.6 x 0. mm Max. working voltage: 8 / + V or +8 / V Ultra low dynamic resistance down to 0. Ω Very low capacitance down to pf Very low reverse current < na typ. Very low series inductance down to 0. nh Pbfree (RoHS compliant) package Applications USB.0, 0/00 Ethernet, Firewire, DVI Mobile communication Consumer products (STB, MP, DVD, DSC...) LCD displays, camera Notebooks and destop computers, peripherals ESD8V0LB0EL ESD8V0LB0LRH ESD8V0LB0L D D Type Package Configuration Marking ESD8V0LB0EL ESD8V0LB0LRH ESD8V0LB0L TSLP8 TSLP7 TSLP channel, bidirectional channel, bidirectional channels, bidirectional E7 B B 0006
Maximum Ratings at T A = 5 C, unless otherwise specified Parameter Symbol Value Unit ESD contact discharge ) ESD8V0LB... ESD8V0LB..., between all pins Peak pulse current (t p = 8 / 0 µs) ) ESD8V0LB... ESD8V0LB... V ESD I pp kv 5 5 A.5 Operating temperature range T op 55...5 C Storage temperature T stg 65...50 V ESD according to IEC6000 I pp according to IEC60005 0006
Electrical Characteristics at T A = 5 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Characteristics Reverse working voltage V RWM 8 V Breakdown voltage I (BR) = ma, from pin to, ESD8V0LB... I (BR) = ma, from pin to, ESD8V0LB... I (BR) = ma, from pin / to, ESD8V0LB... I (BR) = ma, from pin to /, ESD8V0LB... I (BR) = ma, from pin to, ESD8V0LB... V (BR).5 8.5.5 8.5 Reverse current V R = V, between all pins Clamping voltage (contact) ) V ESD = +5 kv, from pin to, ESD8V0LB... V ESD = 5 kv, from pin to, ESD8V0LB... V ESD = +5 kv, from pin / to, ESD8V0LB... V ESD = 5 kv, from pin / to, ESD8V0LB... I R < 50 na V CL V 6 6 0 Line capacitance ) C T pf V R = 0 V, f = MHz, ESD8V0LB... 8.5 V R = 0 V, f = MHz, ESD8V0LB..., from pin / to 7 from pin to, pin is not connected Dynamic resistance ( tp=0ns ) R D Ω ESD8V0LB... 0. ESD8V0LB... 0.6 V ESD according to IEC6000 Total capacitance line to ground 0006
Reverse current I R = ƒ(v R ) T A = Parameter Diode capacitance C T = ƒ (V R ) f = MHz 0 0 pf na 0 0 TA = 85 C 8 7 ESD8V0LB... ESD8V0LB..., pins / to ESD8V0LB..., pins to IR CT 6 TA = 5 C 5 0 0 0 6 8 0 V V R 0 0 5 V 5 V R 0006
Application example ESD8V0LB... channels, bidirectional Connector protected signal lines, level up to 8V/+V I/O ESD sensitive I/O device The protection diode should be placed very close to the location where the ESD or other transients can occur to keep loops and inductances as small as possible. Pin should be connected directly to a ground plane on the board. Application example ESD8V0LB... highspeed channel, bidirectional Connector Protected highspeed signal line, level up to ±V (bidirectional) ESD sensitive I/O device Pin (or pin ) should be connected directly to a ground plane on the board. Pin is not connected. Application example ESD8V0LB... channel, bidirectional Connector Protected signal line, level up to 8/+V or +8/ V I/O ESD sensitive device Pin (or Pin ) should be connected directly to a ground plane on the board. 5 0006
TSLP7 (mm) ESD8V0L... Package Outline Top view +0.0 0.9 0.0 Bottom view 0.05 MAX. 0.6 ±0.05 Cathode marking 0.65 ±0.05 ) Dimension applies to plated terminal ) 0.5 ±0.05 ) 0.5 ±0.05 ±0.05 Foot Print For board assembly information please refer to Infineon website "Packages" 0.6 0.5 0.5 0. 0.75 0.95 0.5 0.75 0.75 Copper Solder mask Stencil apertures Marking Layout (Example) BAR900LRH Type code Cathode marking Laser marking Standard Packing Reel ø80 mm = 5.000 Pieces/Reel Reel ø0 mm = 50.000 Pieces/Reel (optional) 0.5.6 8 Cathode marking 0.76 6 0006
TSLP8 (mm) ESD8V0L... 7 0006
TSLP (mm) ESD8V0L... Package Outline Top view Bottom view 0.05 MAX. 0. +0. 0.6 ±0.05 ) 0.5 ±0.05 0.65 ±0.05 ) 0.5 ±0.05 ±0.05 Pin marking ) Dimension applies to plated terminal 0.5 ±0.05 ) x0.5 ±0.05 Foot Print For board assembly information please refer to Infineon website "Packages" 0.5 0.5 Copper Solder mask Stencil apertures Marking Layout (Example) BFR9L Type code Pin marking Laser marking Standard Packing Reel ø80 mm = 5.000 Pieces/Reel 0.5.6 8 ) x0.5 ±0.05 0.6 0.5 0.5 0. 0.5 0.95 0.5 0.75 0.55 0. R0. 0. 0.7 0.5 Pin marking 0.76 8 0006
Edition 0096 Published by Infineon Technologies AG 876 Munich, Germany 009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in lifesupport devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 9 0006