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Crystalfontz America, Inc. CUSTOMER : MODULE NO.: CFAH22A-NGG-JP SALES BY APPROVED BY CHECKED BY PREPARED BY Crystalfontz America, Inc. 12412 East Saltese Avenue Spokane Valley, WA 99216-357 Phone: (888) 26-972 Fax: (59) 892-123 Email: techinfo@crystalfontz.com URL: www.crystalfontz.com

Contents 1.Module Classification Information 2.Precautions in use of LCD Modules 3.General Specification 4.Absolute Maximum Ratings 5.Electrical Characteristics 6.Optical Characteristics 7.Interface Pin Function 8.Contour Drawing & Block Diagram 9.Function Description 1.Character Generator ROM Pattern 11.Instruction Table 12.Timing Characteristics 13.Initializing of LCM 14.Reliability

1. Module Classification Information CFA H 22 A - N G G - JP Brand:Crystalfontz America, Inc. Display Type:H Character Type, G Graphic Type Display Font:Character 2 words, 2 Lines. Model no. A Backlight Type: N Without backlight T LED, White B EL, Blue green D EL, Green W EL, White F CCFL, White A LED, Amber R LED, Red O LED, Orange G LED, Green Y LED, Yellow Green LCD Mode: B TN Positive, Gray T FSTN Negative LCD Polarize Type/ Temperature range/ View direction Special Code N TN Negative, G STN Positive, Gray Y STN Positive, Yellow Green M STN Negative, Blue F FSTN Positive A Reflective, N.T, 6: H Transflective, W.T,6: D Reflective, N.T, 12: K Transflective, W.T,12: G Reflective, W. T, 6: C Transmissive, N.T,6: J Reflective, W. T, 12: F Transmissive, N.T,12: B Transflective, N.T,6: I Transmissive, W. T, 6: E Transflective, N.T.12: L Transmissive, W.T,12: JP : English and Japanese standard fonts

2. Precautions in use of LCD Modules (1)Avoid applying excessive shocks to the module or making any alterations or modifications to it. (2)Don t make extra holes on the printed circuit board, modify its shape or change the components of LCD module. (3)Don t disassemble the LCM. (4)Don t operate it above the absolute maximum rating. (5)Don t drop, bend or twist LCM. (6)Soldering: only to the I/O terminals. (7)Storage: please storage in anti-static electricity container and clean environment. 3. General Specification Item Dimension Unit Number of Characters 2 characters x 2Lines - Module dimension 116. x 37. x 9.5(MAX) mm View area 85. x 18.6 mm Active area 73.5x 11.5 mm Dot size.6 x.65 mm Dot pitch.65 x.7 mm Character size 3.2 x 5.55 mm Character pitch 3.7 x 5.95 mm LCD type STN Positive, Reflective,Gray Duty 1/16 View direction 6 o clock Backlight Type N/A

4. Absolute Maximum Ratings Item Symbol Min Typ Max Unit Operating Temperature T OP -2 - +7 Storage Temperature T ST -3 - +8 Input Voltage V I V SS - V DD V Supply Voltage For Logic VDD-V SS -.3-7 V Supply Voltage For LCD V DD -V -.3-13 V 5. Electrical Characteristics Item Symbol Condition Min Typ Max Unit Supply Voltage For Logic V DD -V SS - 4.5 5. 5.5 V Supply Voltage For LCD V DD -V Ta=-2 - - 5.7 V Ta=25 Ta=7 3.8 - Input High Volt. V IH - 3.5 - V DD V Input Low Volt. V IL - -.6 V Output High Volt. V OH - 2.4 - V DD V Output Low Volt. V OL - -.4 V Supply Current I DD V DD =5.V 1. 1.2 1.5 ma - 4.5 - - V V

6. Optical Characteristics Item Symbol Condition Min Typ Max Unit View Angle (V)θ CR 2 2-4 deg (H)φ CR 2-3 - 3 deg Contrast Ratio CR - - 3 - - Response Time T rise - - 15 2 ms T fall - - 15 2 ms Definition of Operation Voltage (Vop) Definition of Response Time ( Tr, Tf ) Intensity 1% Selected Wave Non-selected Wave Non-selected Conition Intensity Selected Conition Non-selected Conition 1% Cr Max Cr = Lon / Loff 1% 9% Vop [positive type] Driving Voltage(V) Tr [positive type] Tf Conditions : Operating Voltage : Vop Viewing Angle(θ,φ) :, Frame Frequency : 64 HZ Driving Waveform : 1/N duty, 1/a bias Definition of viewing angle(cr 2 θb θf φ= 18 θl θr φ= 27 φ= 9 φ=

7. Interface Pin Function Pin No. Symbol Level Description 1 V SS V Ground 2 V DD 5.V Supply Voltage for logic 3 VO (Variable) Operating voltage for LCD 4 RS H/L H: DATA, L: Instruction code 5 R/W H/L H: Read(MPU Module) L: Write(MPU Module) 6 E H,H L Chip enable signal 7 DB H/L Data bus line 8 DB1 H/L Data bus line 9 DB2 H/L Data bus line 1 DB3 H/L Data bus line 11 DB4 H/L Data bus line 12 DB5 H/L Data bus line 13 DB6 H/L Data bus line 14 DB7 H/L Data bus line 15 A - LED + 16 K - LED-

8. Contour Drawing & Block Diagram

9. Function Description The LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an instruction register (IR) and a data register (DR). The IR stores instruction codes, such as display clear and cursor shift, and address information for display data RAM (DDRAM) and character generator (CGRAM). The IR can only be written from the MPU. The DR temporarily stores data to be written or read from DDRAM or CGRAM. When address information is written into the IR, then data is stored into the DR from DDRAM or CGRAM. By the register selector (RS) signal, these two registers can be selected. RS R/W Operation IR write as an internal operation (display clear, etc.) 1 Read busy flag (DB7) and address counter (DB to DB7) 1 Write data to DDRAM or CGRAM (DR to DDRAM or CGRAM) 1 1 Read data from DDRAM or CGRAM (DDRAM or CGRAM to DR) Busy Flag (BF) When the busy flag is 1, the controller LSI is in the internal operation mode, and the next instruction will not be accepted. When RS= and R/W=1, the busy flag is output to DB7. The next instruction must be written after ensuring that the busy flag is. Address Counter (AC) The address counter (AC) assigns addresses to both DDRAM and CGRAM Display Data RAM (DDRAM) This DDRAM is used to store the display data represented in 8-bit character codes. Its extended capacity is 8 8 bits or 8 characters. Below figure is the relationships between DDRAM addresses and positions on the liquid crystal display. High bits Low bits Example: DDRAM addresses 4E AC (hexadecimal) A C 6 A C 5 A C 4 A C 3 A C 2 A C 1 A C 1 1 1 1

Display position DDRAM address 1 2 3 4 5 6 7 8 9 1 11 12 13 14 15 16 17 18 19 2 1 2 3 4 5 6 7 8 9 A B C D E F 1 11 12 13 4 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 5 51 52 53 2-Line by 2-Character Display Character Generator ROM (CGROM) The CGROM generate 5 8 dot or 5 1 dot character patterns from 8-bit character codes. See Table 2. Character Generator RAM (CGRAM) In CGRAM, the user can rewrite character by program. For 5 8 dots, eight character patterns can be written, and for 5 1 dots, four character patterns can be written. Write into DDRAM the character code at the addresses shown as the left column of table 1. To show the character patterns stored in CGRAM.

Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns Table 1. For 5 * 8 dot character patterns Character Codes ( DDRAM data ) CGRAM Address Character Patterns ( CGRAM data ) 7 6 5 4 3 2 1 5 4 3 2 1 7 6 5 4 3 2 1 High Low High Low High Low 1 1 1 1 * 1 1 1 1 1 1 1 1 1 1 1 1 * 1 1 1 1 1 1 1 1 1 1 1 Character pattern( 1 ) Cursor pattern Character pattern( 2 ) Cursor pattern * 1 1 1 For 5 * 1 dot character patterns Character Codes ( DDRAM data ) 1 1 1 1 1 1 1 1 1 1 1 CGRAM Address Character Patterns ( CGRAM data ) 7 6 5 4 3 2 1 High Low * 5 4 3 2 1 High Low 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 7 6 5 4 3 2 1 High Low Character pattern Cursor pattern : " High " 1 1 1 1 * *

1. Character Generator ROM Pattern Table.2 Upper 4 bit Lower 4 bit LLLL LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL HHHH CG RAM ( 1 ) LLLH ( 2 ) LLHL ( 3 ) LLHH ( 4 ) LHLL ( 5 ) LHLH ( 6 ) LHHL ( 7 ) LHHH ( 8 ) HLLL ( 1 ) HLLH ( 2 ) HLHL ( 3 ) HLHH ( 4 ) HHLL ( 5 ) HHLH ( 6 ) HHHL ( 7 ) HHHH ( 8 )

11. Instruction Table Instruction Instruction Code Description Execution time RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB (fosc=27khz) Clear Display 1 Write H to DDRAM and set 1.53ms DDRAM address to H from AC Return Home 1 - Set DDRAM address to H from AC 1.53ms and return cursor to its original position if shifted. The contents of DDRAM are not changed. Entry Mode 1 I/D SH Assign cursor moving direction and 39μs Set enable the shift of entire display. Display 1 D C B Set display (D), cursor (C), and blinking 39μs ON/OFF Control of cursor (B) on/off control bit. Cursor or 1 S/C R/L - - Set cursor moving and display shift 39μs Display Shift control bit, and the direction, without changing of DDRAM data. Function Set 1 DL N F - - Set interface data length (DL:8-bit/4- bit), numbers of display line (N:2-line/1- line)and, display font type (F:5 11 dots/5 8 dots) 39μs Set CGRAM Address 1 AC5 AC4 AC3 AC2 AC1 AC Set CGRAM address in address counter. 39μs Set DDRAM 1 AC6 AC5 AC4 AC3 AC2 AC1 AC Set DDRAM address in address counter. 39μs Address Read Busy Flag and Address 1 BF AC6 AC5 AC4 AC3 AC2 AC1 AC Whether during internal operation or not can be known by reading BF. The contents of address counter can also be read. μs Write Data to 1 D7 D6 D5 D4 D3 D2 D1 D Write data into internal RAM 43μs RAM (DDRAM/CGRAM). Read Data from RAM 1 1 D7 D6 D5 D4 D3 D2 D1 D Read data from internal RAM (DDRAM/CGRAM). 43μs * "-":don t care

12. Timing Characteristics 12.1 Write Operation RS t AS t AH R/W E t Er PW EH t DSW t AH t Ef t H DB to DB7 Valid data t cyce Ta=25, VDD=5.±.5V Item Symbol Min Typ Max Unit Enable cycle time t cyce 4 - - ns Enable pulse width (high level) PW EH 15 - - ns Enable rise/fall time t Er,t Ef - - 25 ns Address set-up time (RS, R/W to E) t AS 3 - - ns Address hold time t AH 1 - - ns Data set-up time t DSW 4 - - ns Data hold time t H 1 - - ns

12.2 Read Operation RS t AS t AH R/W E PW EH t Er t DDR t AH t Ef t DHR DB to DB7 VOH1 VOL1* Valid data t cyce VOH1 *VOL1 NOTE: *VOL1 is assumed to be.8v at 2 MHZ operation. Ta=25, VDD=5.±.5V Item Symbol Min Typ Max Unit Enable cycle time t cyce 4 - - ns Enable pulse width (high level) PW EH 15 - - ns Enable rise/fall time t Er,t Ef - - 25 ns Address set-up time (RS, R/W to E) t AS 3 - - ns Address hold time t AH 1 - - ns Data delay time t DDR - - 1 ns Data hold time t DHR 2 - - ns

13. Initializing of LCM Power on Wait for more than 15 ms after VCC rises to 4.5 V RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB 1 1 * BF can not be checked before this instruction. Function set ( Interface is 8 bits long. ) Wait for more than 4.1 ms RS R/W DB7 DB6 DB5 1 DB4 1 DB3 DB2 DB1 DB * BF can not be checked before this instruction. Function set ( Interface is 8 bits long. ) Wait for more than 1 μs RS R/W DB7 DB6 DB5 1 DB4 1 DB3 DB2 DB1 DB * BF can not be checked before this instruction. Function set ( Interface is 8 bits long. ) RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB 1 1 N F * * 1 1 1 I/D S BF can be checked after the following instructions. When BF is not checked, the waiting time between instructions is longer than execution instruction time. Function set ( Interface is 8 bits long. Specify the number of display lines and font. ) The number of display lines and character font can not be changed after this point. Display off Display clear Entry mode set Initialization ends 8-Bit Ineterface

Power on Wait for more than 15 ms after VCC rises to 4.5 V RS R/W DB7 DB6 DB5 DB4 1 1 BF can not be checked before this instruction. Function set ( Interface is 8 bits long. ) Wait for more than 4.1 ms RS R/W DB7 DB6 DB5 DB4 1 1 BF can not be checked before this instruction. Function set ( Interface is 8 bits long. ) Wait for more than 1 μs RS R/W DB7 DB6 DB5 DB4 1 1 BF can not be checked before this instruction. Function set ( Interface is 8 bits long. ) RS R/W DB7 DB6 DB5 1 1 N F * * DB4 1 1 1 I/D S BF can be checked after the following instructions. When BF is not checked, the waiting time between instructions is longer than execution instruction time. Function set ( Set interface to be 4 bits long. ) Interface is 8 bits in length. Function set ( Interface is 4 bits long. Specify the number of display lines and character font. ) The number of display lines and character font can not be changed after this point. Display off Display clear Entry mode set Initialization ends 4-Bit Ineterface

14. Reliability Content of Reliability Test (wide temperature, -2 ~7 ) Environmental Test Test Item Content of Test Test Condition Note High Temperature Endurance test applying the high storage 8 2 storage temperature for a long time. 2hrs Low Temperature Endurance test applying the high storage -3 1,2 storage temperature for a long time. 2hrs High Temperature Endurance test applying the electric stress 7 Operation (Voltage & Current) and the thermal stress to the element for a long time. 2hrs Low Temperature Endurance test applying the electric stress under -2 1 Operation High Temperature/ Humidity Operation Thermal shock resistance low temperature for a long time. The module should be allowed to stand at 6,9%RH max For 96hrs under no-load condition excluding the polarizer, Then taking it out and drying it at normal temperature. The sample should be allowed stand the following 1 cycles of operation -2 25 7 2hrs 6,9%RH 96hrs -2 /7 1 cycles 1,2 Vibration test Static electricity test 3min 5min 3min 1 cycle Endurance test applying the vibration during transportation and using. Endurance test applying the electric stress to the terminal. Total fixed amplitude : 1.5mm Vibration Frequency : 1~55Hz One cycle 6 seconds to 3 directions of X,Y,Z for Each 15 minutes VS=8V,RS=1.5k Ω CS=1pF 1 time 3

Note 1: No dew condensation to be observed. Note 2: The function test shall be conducted after 4 hours storage at the normal Temperature and humidity after remove from the test chamber. Note 3: Vibration test will be conducted to the product itself without putting it in a container.