NeXLev Product Specification TB2144

NeXLev Product Specification TB2144 Revision B Specification Revision Status Revision SCR No. Description Initial Date - S0161 New Release DM 4/5/2006 A S1357 Update copper material callout, DM 8/31/09 TP spec. B S4222 Added Min/Max Operating Temp JP 1/21/16 Ratings

REVISION B NEXLEV PRODUCT SPECIFICATION PAGE NO. 2 OF 10 1.0 SCOPE 1.1 Content This preliminary specification covers performance, test and quality requirements for the NeXLev parallel interconnect system. These connectors are two-piece devices that connect two printed circuit boards in parallel. Receptacle connectors and plug connectors are surface mount devices employing a ball grid-array style interface to the PCB. The NexLev connector family consists of 10-row module configurations with standard signal wafers 1.2 Qualification Testing will be performed on subject product line, using procedures specified in EIA-364-B, per the test sequences outlined in this product specification. All inspections shall be performed using applicable inspection plan and product drawings. 2.0 REFERENCE DOCUMENTS 2.1 Amphenol Documents 2.1.1 TB-2073 NeXLev Signal Integrity Characterization Report 2.1.2 NeXLev Parallel Interconnect System:Telcordia GR-1217-CORE Compliance Report 2.1.3 NeXLev Solder Joint Reliability Thermal Cycling Report:CR200315 & CR200730 2.2 Commercial Standards 2.2.1 EIA-364-B Electrical Connector Test Procedure Including Environmental Classifications 2.2.2 GR-1217-CORE Generic Requirements for Separable Electrical Connectors Used in Telecommunications Hardware 2.2.3 IEC-512 Electromechanical Components for Electronic Equipment - Basic Testing Procedures and Measuring Methods. 3.0 REQUIREMENTS 3.1 Design and Construction 3.1.1 Product shall be of the design, construction and physical dimensions specified in the applicable product drawings. 3.2 Materials 3.2.1 Contacts 3.2.1.1 All signal and ground contacts shall be 0.15 mm thick, high performance copper alloy, per ATCS specification MTS- 506.Finish shall be 0.00127mm thick nickel minimum all over per QQ-N-290, 0.00076mm thick gold minimum, selective in mating area, per MIL-G-45204, Type II, Grade C, 0.000076mm to 0.000305mm thick gold flash, selective on bottom of ball attach foot. Copyright Amphenol Corporation 2016 All rights reserved Page 2 of 10

REVISION B NEXLEV PRODUCT SPECIFICATION PAGE NO. 3 OF 10 3.2.3 Insulators 3.2.3.1 Glass reinforced polyester (Liquid Crystal Polymer). UL 94V-0 rating; color black. 3.3 Ratings Electrical Height, Value, Mated Signal Contact Bulk Resistance, mated, See Figure 1. 10mm 10 m initial max. (at mated height indicated) 12 mm 11 m 13 mm 12 m 14 mm 12 m 15 mm 12 m 17 mm 12 m 18 mm 13 m 20 mm 15 m 22 mm 15 m 26 mm 18 m 28 mm 20 m 30 mm 20 m Shield contact bulk resistance, mated Initial max.(all heights) All heights 4 m Contact to Surface Mount Pad Resistance Dielectric Withstanding Voltage Insulation Resistance Signal Contact Current Rating(per IO) Shield Contact Current Rating(per IO) Signal Integrity 1 m Maximum 600 Volts RMS 600 Megohms duty 1.0 Amp continuous duty derated (see Current vs. Trise report) 1.0 Amp continuous duty derated (see Current vs. Trise report) NexLev Interconnection System Electrical Characterization Report TB-2073 Temperature Maximum Operating Temperature Rating Minimum Operating Temperature Rating 105 degrees C -40 degrees C Copyright Amphenol Corporation 2016 All rights reserved Page 3 of 10

REVISION B NEXLEV PRODUCT SPECIFICATION PAGE NO. 4 OF 10 Mechanical Contact Normal Signal and Ground Contact Engagement Contact Separation Contact Life () Signal Contact Wipe Length Air Creepage Distance Solder Ball Parameters Ball Diameter, Initial Ball Height (from base) Ball Coplanarity (entire field) Ball True Position, Radial 0.35N (35 Grams) minimum per beam, end of life (EOL) 0.45N (45 Grams) maximum per signal contact 0.15N (15 Grams) minimum per signal contact (non-lubricated) 1.1mm nominal 0.4mm minimum 0.71 mm (0.028 inch) 0.05 mm. minimum, 0.25 maximum 0.125 mm. maximum 0.175 mm maximum 3.5 Performance and Test Description 3.5.1 The product is designed to meet the electrical, mechanical and environmental performance criteria specified in Table 1, as tested per the test sequence in Figure 1. All tests are performed at ambient environmental conditions per EIA-364B and GR-1217-CORE, unless otherwise specified. Copyright Amphenol Corporation 2016 All rights reserved Page 4 of 10

REVISION B NEXLEV PRODUCT SPECIFICATION PAGE NO. 5 OF 10 4.0 QUALITY ASSURANCE PROVISIONS 4.1 Qualification Testing 4.1.1 Sample Selection: Connector housing and contacts shall be prepared in accordance with applicable Raw Stock Inspection Report (RSIR) instructions. Samples to be selected at random from current production. 4.1.2 Sample Selection Cont.: Refer to Figure 1 for minimum recommended sample connector size. 4.1.3 Test Sequence: Qualification testing shall be performed per the sequences shown in Figure 1 of this document. 4.2 Requalification Testing: 4.2.1 If changes affecting form, fit or function are made to the product or to the manufacturing process, product engineering shall coordinate requalification testing, consisting of all or part of the original testing sequence. 4.3 Acceptance: 4.3.1 Acceptance is based on verification that the product meets the requirements of Table 1. Failures attributed to equipment, test set-up, or operator deficiencies shall not disqualify the product. If product failure occurs, corrective action shall be taken and samples resubmitted for qualification. Verification of corrective action is required before resubmittal. 4.4 Quality Conformance Inspection: 4.4.1 The applicable RSIR and Plating Quality Inspection Plan shall specify the acceptable stamping and molding quality levels to be applied. Dimensional and functional requirements shall be in accordance with the applicable product drawings and this product specification. Copyright Amphenol Corporation 2016 All rights reserved Page 5 of 10

REVISION B NEXLEV PRODUCT SPECIFICATION PAGE NO. 6 OF 10 Parameter Specification Value NexLev Value Reference Materials: Plating Integrity Acceptable porosity 3 pores per cm 2 EIA-364-TP-60 Contact Metallization Same or similar on both Gold on gold N/A members No wear through to Ni EIA-364-TP-09 underplate or Cu base alloy Base Metallization surface finish = 16 RMS 16 RMS max. on all mating surfaces GR-1217-CORE Flammability Rating V-0 Must pass UL-94 Mechanical: Contact Normal 35 grams minimum, end of 40 grams minimum, end of EIA-364-TP-04 life life Engagement 45 Grams per signal contact 42 Grams maximum EIA-364-TP-05 Contact Wipe Distance 1.1mm nominal 1.0mm min. GR-1217-CORE Tribology: Dimensions (General) Per customer drawings Dimensions to print N/A Contact Geometry Minimum one curved surface NexLev is a crossed rod N/A in mating area design 2 curved surfaces Hertz Stress 250 Kpsi minimum(single beam) 300 Kpsi minimum N/A Table 1 Copyright Amphenol Corporation 2016 All rights reserved Page 6 of 10

REVISION B NEXLEV PRODUCT SPECIFICATION PAGE NO. 7 OF 10 Parameter Specification Value NeXLev Value Reference Electrical: Contact Resistance (Bulk) Per Product Specification Refer to this specification EIA-364-TP-06 Contact Resistance Change < 10 milliohm from initial See environmental below EIA-364-TP-23A Signal Continuity < 10 nanoseconds interrupt None detected EIA-364-TP-87 Current Rating, per I/O 30 C cut-off value 1.0 A Signal; 1.0 A Ground EIA-364-TP-70A Crosstalk, Voltage reflection < 5% 5% maximum Amphenol TB- 2034 Insulation Resistance 600 megohms, minimum. >1000 megohms EIA-364-21B Dielectric Withstanding Voltage 600 volts AC, minimum 950 volts AC EIA-364-TP-20B Environmental: Temperature Life No Change in > 10 1.7 milliohm change EIA-364-TP-17 Milliohms maximum Thermal Shock Same as Above 3.9 milliohm max. increase EIA-364-TP-32B Moisture Resistance Same as Above 2.3 milliohm max. increase EIA-364-TP-31 Vibration Same as Above 2.6 milliohm max. increase EIA-364-TP-28B Mechanical Shock Same as Above 3.6 milliohm max. increase EIA-364-TP-27B Industrial Manufacturing (MFG) Same as Above 3.9 milliohm max. increase EIA-364-TP-65 Table 1 (Continued) Copyright Amphenol Corporation 2016 All rights reserved Page 7 of 10

REVISION B NEXLEV PRODUCT SPECIFICATION PAGE NO. 8 OF 10 Figure 3. Pad PC P.S. NeXLev Connector Module M.V. Mated Contact Copyright Amphenol Corporation 2016 All rights reserved Page 8 of 10

REVISION B NEXLEV PRODUCT SPECIFICATION PAGE NO. 9 OF 10 Test Daughter Card Tektronix 11801-B Oscilloscope Instrument Controller GPIB VHDM 50ž Cables Test Backplane Figure 4 Crosstalk Test Set-Up Test Daughter Card Tektronix 11801-B Oscilloscope Instrument Controller GPIB VHDM Test Backplane 50ž Cables Figure 5 Reflection Test Set-Up Copyright Amphenol Corporation 2016 All rights reserved Page 9 of 10

REVISION B NEXLEV PRODUCT SPECIFICATION PAGE NO. 10 OF 10 NeXLev Bellcore GR-1217-CORE Test Plan NOTE: Sample Preparation Each Test Group will require 5 Samples Mated to Test Boards to obtain a minimum of 300 monitoring sites per group. Group 1 Mating/ Unmating Dust Vibration,Sinusoidal : X Axis Y Axis X Axis Mechanical Shock : X Axis Y Axis Z Axis Group 2 Group 2 Group 4 Group 6 (cont.) Thermal Shock Dust Humidity Temperature Life 500 hrs @ 85 C Mixed Flowing Gas (Unmated) : 5th Day 10th Day Mixed Flowing Gas (Mated) : 15th Day 20th Day Disturbance Normal Plating Thickness Corrosive Gas Nitric Acid Vapor Surface Roughness Figure 1 Copyright Amphenol Corporation 2016 All rights reserved Page 10 of 10