Mission Critical Facilities & Technology Conference November 3, 2011 Cooling 101 Nick Gangemi Regional Sales Manager Data Aire
Agenda Exactly what are we talking about ASHRAE TC 9.9 Design best practices Cooling systems overview CRAC/CRAH and accessories
16 The Holistic Approach Industry Boundaries INTERFACE POINT INTERFACE POINT IT Industry Facilities Industry Utilities Chip / CPU / Board Server / Packaging Rack / Cabinet Row / Server Floor Central Plant / Equipment Yard Utility Plant / Substation
IT Basics IT Equipment Types There are several types of IT equipment, each with different purposes and different cooling / power requirements. Compute Servers used for computing Typically fit in standard racks Blade servers offer reduced packaging Storage Used to store data Vary in size and configuration Network Used to connect network segments
IT Basics Server Racks A variety of configurations are available to house servers. Types of racks can differ based on: Telecom Industry 2 post, 4 post IT Industry 2 post, 4 post, custom Usage Storage Compute
TC 9.9 Website www.tc99.ashraetcs.org
ASHRAE Technical Committee TC 9.9 Overview Title: Mission Critical Facilities, Technology Spaces, & Electronic Equipment Objective: To be recognized by ALL areas of the datacom industry as the UNBIASED engineering leader in HVAC & an effective provider of technical datacom information. Scope: All datacom facilities: datacom stands for data processing & communication facilities. It includes rooms or closets used for communication, computers, or electronic equipment.
12 TC 9.9 Datacom Book Series 1. Thermal Guidelines for Data Processing Environments 2 nd Edition (2008) 2. Datacom Equipment Power Trends & Cooling Applications (2005) 3. Design Considerations for Datacom Equipment Centers (2006) 4. Liquid Cooling Guidelines for Datacom Equipment Centers (2006) 5. Structural & Vibration Guidelines for Datacom Equipment Centers (2008) 6. Best Practices for Datacom Facility Energy Efficiency (2008) 7. High Density Data Centers Case Studies & Best Practices (2008) 8. Particulate & Gaseous Contamination in Datacom Environments (2009) 9. Real Time Energy Consumption Measurements in Data Centers (2009) 10. Green Tips for Data Centers (2011)
Air Flow IT Equipment Air Flow ASHRAE s Thermal Guidelines for Data Processing Environments standardizes nomenclature for defining the cooling airflow paths for server equipment. Bridge the gap between the equipment manufacturer s data and the requirements of the facility cooling system.
Server & Component Power Usage Trends kw/rack
Updated Slide IT Equipment Environment ASHRAE Psychrometric Chart *Envelopes Represent Conditions at IT Equipment Inlet ASHRAE Allowable ASHRAE 2004 Recommended ASHRAE 2008 Recommended
IT Equipment Environment Powered ON Specifications Class Dry Bulb Temperature ( F) % Relative Humidity Allowable Recommended Allowable Recommended 1 59 to 89.6 64.4 to 80.6 20 to 80 41.9 F DP to 60% RH and 59 F Max. Dew Point ( F) Max Rate of Change ( F / hr) 62.6 9 / 36 * 2 50 to 95 64.4 to 80.6 20 to 80 41.9 F DP to 60% RH and 59 F 69.8 9 / 36 * 3 41 to 95 N/A 8 to 80 N/A 82.4 N/A 4 41 to 104 N/A 8 to 80 N/A 82.4 N/A * 9 F for data centers employing tape drives, 36 F for data centers employing disk drives. Notes: Environment specifications based on a max. elevation of 10,000 ft. Dry Bulb Temperatures derated over 3,000 ft by ~2 F / 1,000ft.
42 IT Equipment Environment ASHRAE The envelopes for new Classes A1 and A2 are EXACTLY the SAME as previous Classes 1 and 2 The recommended envelope is EXACTLY the SAME. Psychrometric Chart Two NEW data center classes have now been defined (A3, A4) with expanded allowable envelopes.
Understanding the Power Impact 40% Energy Savings going from PUE = 2.0 to 1.2
Best Practices at a Minimum Hot aisle/cold aisle Perforated tile location and CRAC/CRAH unit location Blanking panels, sealing between racks Ceiling height, dropped ceilings and sensor location
Return Air Inlet Location Data Room Cold Aisle T H T H Datacom Rack Datacom Rack Under floor supply air plenum
Best Practices at a Minimum Air bypass
Cooling Unit Incapacity From Bypass Airflow Cold air escaping from cable cutouts is on the discharge side of the heat load The air does not cool the heat load Mixes and precools cabinet hot air exhaust Reduces air temperature returning to cooling units Reduces cooling unit sensible capacity Reduces delta T across cooling coil Reduces sensible cooling (wastes energy) Increases latent cooling (wastes energy)
Best Practices at a Minimum Raised floor height
The Cause of Flow Maldistribution
Raised Floor Height Raised floor plenum Velocity Rules Tip! Plug fans CRAC
Cooling Systems Overview Heat Rejection Chiller (Air-Cooled) Mechanical Cooling Equipment Terminal Equipment CRAH (Chilled Water) Cooling Tower Chiller (Water-Cooled) CRAH (Chilled Water) Condenser Drycooler CRAC (DX) CRAC (Water / Glycol) Condensing Unit Air Handler (DX)
Cooling Equipment Overview There are energy saving opportunities in each piece to the Cooling System Critical to select efficient equipment (24/7 operation often at partial load).
Chilled Water 11/9/2011 25
Chilled Water (AH) Units Water Water Water Water 11/9/2011 26
Water Side Economizers Air Flow Cooling Tower Or Dry cooler Economizer coil DX Condenser DX Cooling coil 11/9/2011 27
Dual Source (Glycol Primary/DX Backup) DX Coils Glycol Coils 11/9/2011 28
Water Side Economizers Air Flow Cooling Tower Or Dry cooler Economizer coil DX Condenser DX Cooling coil 11/9/2011 29
89 Economizer Cycles Water Side (Indirect) In an Indirect system, a heat exchanger is added to separate the condenser water and chilled water loops. Commonly used in conjunction with water cooled chillers Chiller use can be decreased or eliminated
Typical Air Cooled CRAC Unit Higher Temperature Air Warmer Low Pressure Vapor Refrigerant Compressor Return Air Filter CRAC Unit Air-Cooled Refrigerant Condenser Ambient Air Hot High Pressure Vapor Cooler High Pressure Liquid Liquid Receiver Evaporative Cooling Coil Cold Low Pressure Vapo Supply Plenum Thermal Expansion Valve Supply Air Fan 11/9/2011 31
84 Economizer Cycles Air Side Economizer Exhaust Air 2 Intake Air 1 Return Air 3 Cooling Coil 4 Location Economizer None Full Partial Winter 1 Intake Airflow 0 % 100 % 100 % 10 % 2 Exhaust / Relief Airflow 0 % 100 % 100 % 10 % 3 Return Airflow 100 % 0% 0 % 90 % 4 Cooling Coil Load 100 % 0 % 50 % 0 %
114 Liquid Cooling Systems / Loops Liquid Cooling Systems / Loops within a Data Center
Liquid Cooling Systems / Loops 112
The mission critical cooling system of the future! Energy Efficient Enhanced Reliability Environmentally Responsible
Energy Efficient
Energy Efficient gforce standard features include: Backward curved plenum fans Rifled tubing Improve airflow design
Backward Curved Plenum Fans EC motors DC maximum efficiency in 90% versus 70% for AC motors eliminates losses from brushes and polarity integrated motor and fan eliminate belt, pulley, shaft and external bearing loss
Plug Fans
Improved Air Flow gforce s internal area largest of Data Aire products Less resistance Improved airflow More cooling Allows for more options
Enhanced Reliability
Traditional Drive Train AC Motor Bearings Belts Pulleys Periodic Maintenance!
gforce Drive Train Air Flow Air Flow
gforce Drive Train Benefits Integrated fan and motor Eliminates periodic maintenance Eliminates belt dust Improved air dispersion Less velocity Increased static pressure Omni directional dispersion
Environmentally Responsible
Environmentally Repsonsible gforce is available in either of two environmentally friendly refrigerants. R-410 A R-407C
Air Flow Isolation on DX Hinged Electrical Panel Steam Generator Humidifier Easy access to all major components from front of unit Compressors Seal air flow compartment
gforce Available in DX and Chilled Water Systems DX Single Circuit 7 46 kw Dual Circuit 21 106 kw Chilled Water 7 146 kw
gforce
THE BEST SOLUTION UNITY COOLING 51
Gain Control: Stability, Efficiency and IT Flexibility Facility can be designed from day one, knowing you can fully utilize cooling and with no need to worry about IT load changes or additions Cooling Distribution Points A: All IT exhaust heat has a direct return path B: Supply air temperature is raised toward ASHRAE limit A B 105 ºF 75 ºF C: All cool air that is delivered is available for the IT load D: IT load is divorced from cooling source locations E: Cool supply air delivery method is flexible C E D
Automated and Managed Data Center Cooling
UNITY COOLING BY DATA AIRE EC Systems: Efficient High Density Computing Utilizing Standard Precision Cooling Patents Pending
Questions Nick Gangemi Regional Sales Manager Data Aire ngangemi@dataaire.com