LM931 Bluetooth low energy Module

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Bluetooth low energy Module Revised 24/JAN/2017 2.50mm 1m 10.1 m m 22m Features Bluetooth v4.1 specification I2C and UART 14 ma (at 0 dbm) Current Consumption (Tx Mode) 9 digital and 3 analogue (10-bit ADC) IC Antenna Onboard (Peak Gain = 0.5dBi) Wake-up interrupt and Watchdog timer 9 dbm Tx Output Power (Max) and -92 dbm Rx Sensitivity 4 PWM channels Over-the-Air Upgrade (OTAU) available 22mm x 10.11mm x 2.50mm Application Firmware Support SMT Side and Bottom Pads for easy production GATT Server Applications available (Including Serial over GATT, ibeacon and Key Fob with an RGB LED) IC, FCC, CE / RED Directive and SIG Certified Solution Fully integrated module with no additional components required CE, RoHS, REACH and WEEE Compliant Solution Overview The Bluetooth low energy module is designed for use within new and existing embedded systems. It is implemented as a peripheral device within products such as monitors, meters and printers, while saving the developer valuable PCB space. The enables you to wirelessly communicate with other nearby Bluetooth v4.1 devices (e.g. ios and Android) using a highly power efficient Bluetooth low energy connection. The transmission output power ranges from 0 dbm to 9 dbm and can be configured to provide an extended battery life or a longer range. This single core standalone module combines a Bluetooth low energy radio using a Bluetooth v4.1 stack, plus a microcontroller with 512 kb EEPROM for running the applications. The incorporates 27 pin outs including UART and I2C for interfacing with a wide range of peripheral devices like sensors. It s SMT side and bottom pads allow for easy manufacture and placement into your product. Application firmware and configuration settings can be preloaded to the module before supply. LM offer bespoke integration into your product by supporting your developer. We can also assist in the development of new applications for the module. Demo applications such as ibeacon and Key Fob are available with the module s LM53X development kits. The application firmware is customisable to meet your requirements. Page 1 of 14

Bluetooth low energy Module General Specification Wireless Bluetooth Standard v4.1 Module Type Standalone (Embedded Bluetooth Stack) Profiles GATT-Based Hardware Chipset CSR Antenna IC Antenna Onboard Microcontroller (MCU) 16-bit RISC EEPROM Memory 512 kb RAM 64 kb Program Interface SPI Interfaces I2C, UART, AIO and PIO Power Supply 3V3 (3V6 Max) Crystal Oscillators 32 khz and 16MHz Development Kit LM53X RF Characteristics Tx Output Power 0 dbm to 9 dbm Rx Sensitivity -92 dbm (Typical) Current Consumption (Continuous Tx) 14 ma (at 0 dbm), 15.9mA (at 3dBm) and <25 ma (at 9dBm) Current Consumption (Continuous Rx) 22 ma (Typical) Range (in open space) Up to 55m Data Rate Up to 1Mbps Frequency 2.4 GHz to 2.485 GHz Physical Characteristics Operating Temperature -30 C to +85 C Dimensions (L x W x H) 22mm x 10.11mm x 2.50mm Weight 0.83g Certifications IC, FCC, CE/ RED Directive and SIG Certified Solution Compliance RoHS, REACH and WEEE Compliant Solution Page 2 of 14

Bluetooth low energy Module Applications The is a standalone module capable of running your Bluetooth v4.1 application. Requiring no external MCU and supports a wide range of Bluetooth low energy applications such as: Alert Tag Automotive Keyfob Beacon Blood Pressure Sensor Cycling Speed and Cadence Sensor Environment Sensor Glucose Sensor Health Thermometer Heart Rate Sensor Keyboard Multifunction Steering Wheel Mouse Running Speed and Cadence Sensor Security Tag Serial Communication Time Client Temperature and Pressure Weight Scale User Application GAP GATT SMP ATT L2CAP Link Layer LE PHY LM Technologies offer Bluetooth v4.1 application support, including assisting the developer and creating new applications. LM provide demo applications that can be customised to your specification. Demo Applications available: ibeacon Key fob RGB LED Controller Serial Communication over GATT GPIO (for testing module capabilities) Page 3 of 14

Bluetooth low energy Module Radio Frequency Characteristics Transmit Power Measurements Crystal Trim Specification Measurement Unit Frequency Offset ±1KHz 0.75KHz KHz Trim Value 12 - Output Power Low Energy Specification Measurement Ppk Ppk <Pav +3 dbm -20 dbm<pave<10dbm Unit 2402MHz (CH0*) 2442MHz (CH20*) 2480MHz (CH39*) Pav Ppk Pav Ppk Pav Ppk 8.1 8.4 8.4 8.6 9 9.2 dbm Receive Measurements Limitation Sensitivity Specification Measurement Low Energy 2402MHz (CH0*) BER 30.8% for receiving power is -70 dbm or better. Unit 2442MHz (CH20*) -93-92 2480MHz (CH39*) -93 dbm Maximum Input Level Low Energy Specification Measurement 2402MHz (CH0*) PER 30.8% for receiving power is -10 dbm or better. Unit 2442MHz (CH20*) 0 Current Consumption Test 0 2480MHz (CH39*) 0 % Figure: Test Condition (BLE PRBS9 Channel 2442MHz Package Length 37) Continuous TX: 14 ma (at 0 dbm), 15.9mA (at 3dBm) and <25 ma (at 9dBm) Continuous Rx: 22 ma (typ.) Power Boot Up: Page 4 of 14 3 ma (typ.)

Bluetooth low energy Module Powering The Pads (Pin 16) must be supplied with the same voltage as the Lithium ion battery (Pin 17). Pin Out 1 27 2 26 WAKE 3 25 SPIPION AIO2 4 24 IO11 / I2C AIO1 5 23 IO10 / I2C AIO0 6 22 IO9 7 21 IO0 8 20 IO8 / SPI IO1 9 19 IO7 / SPI IO3 10 18 IO6 / SPI IO4 11 17 VBATT IO5 / SPI 12 16 PADS 13 15 14 Page 5 of 14

Bluetooth low energy Module Pin Assignments Pin Name Type Description 1 2 3 4 AIO2 Input Analogue Input Output 5 AIO1 Input Analogue Input Output 6 AIO0 Input Analogue Input Output 7 8 IO0 UART TX 9 IO1 UART RX 10 IO3 Programmable Input Output (PIO) 11 IO4 Programmable Input Output (PIO) 12* IO5 / SPI Programmable Input Output (PIO) / DEBUG_CLK 13 14 15 16 PADS Power Positive supply for all digital and analogue Pins 1V2 3V3 3V6 17 VBATT Power Module battery power supply DC 1V8 3V3 3V6 18* IO6 / SPI Programmable Input Output (PIO) / DEBUG_CS# 19* IO7 / SPI Programmable Input Output (PIO) / DEBUG_MOSI 20* IO8 / SPI Programmable Input Output (PIO) / DEBUG_MISO 21 22 IO9 Programmable Input Output (PIO) 23 IO10 / I2C Programmable Input Output (PIO) / SDA 24 IO11 / I2C Programmable Input Output (PIO) / SCL 25 SPIPION Input High to enable the SPI debug interface, Low to enable PIO 26 WAKE Input Toggle to wake from Dormant Mode _BAT 27 Min Typical Max * for SPI at P12, P18, P19 and P20 set P25 to High. * for PIO at P12, P18, P19 and P20 set P25 to Low. Page 6 of 14

Bluetooth low energy Module Module Block Diagram VBAT / PADS ANT PWM Filter AIO BT_RF CSR Chipset SPI_Debug UART/PIO E² PROM I2 C 512 KB Page 7 of 14 XTAL XTAL 32 khz 16MHz

Bluetooth low energy Module Physical Dimensions Top View 15 27 1.27 1.08 0.8 x 0.6mm 9.375mm 10.11mm 14 0.8 Pin 1 13 Pin Spacing 0.825 6.2mm 21.65mm 22mm Front View 2.50mm 6.2mm 21.65mm 22mm Side View 2.50mm 0.825mm 9.375mm 10.11mm Page 8 of 14

Bluetooth low energy Module PCB Footprint 15 27 EDGE OF HOST PCB ( Optimal ) Optimal Placement Position 14 13 Placement Note If the optimal placement position cannot be achieved, ensure there is no metal beneath the highlighted part of module. NB Aim to place the module away from interference. (i.e: place the module at the edge of the board.) NO METAL Pin 1 15 27 14 13 Pin 1 15 27 1.27 1.08 9.375mm 10.11mm 14 0.8 Pin 1 13 0.825 Pin Spacing 6.2mm 21.65mm 22mm Page 9 of 14

Bluetooth low energy Module Soldering Reflow Chart Page 10 of 14

Bluetooth low energy Module Tape and Reel Packaging Tape Dimensions 16mm 0.15mm 4mm LM930/931 23mm 48mm 0.32mm 11mm 3.25mm Reel Dimensions 330mm Notes Carton Dimensions (L x W x H): 360mm x 290mm x 370mm Quantities 1250 modules per Tape 4 Boxes per Carton 5000 modules per Carton 48mm 92mm Page 11 of 14

Bluetooth low energy Module Tray Packaging Tray Dimensions 8mm LM930 9.1mm 4 X 15 4.6m 7.1mm 143mm 312mm 23.5mm 10.8mm Notes Quantities Anti-Static PS Tray, Black. 60 modules per Tray Electrical Resistance: 1 MΩ< R< 100MΩ. 600 modules per Box Thickness: T= 0.8 mm 4 Boxes per Carton Carton Dimensions (L x W x H): 2400 modules per Carton 360mm x 325mm x 160mm Page 12 of 14

Bluetooth low energy Module Packaging for Tape & Reel / Tray The trays/reels are stacked and inserted into an anti-static vacuum bag and the Anti-Static Label, Model Name Label and Moisture Sensitive Labels stuck on. drying agent Humidity Indicator Card Reels are place within a vacuum bag. Anti-static aluminium vacuum bag. Trays are stacked up with an empty tray on the top. The vacuum bag is placed inside the box and a Model Name Label stuck on the front-side of each box. Model name label Anti-static aluminium vacuum bag. box ) b ox carton carton label Each carton contains 4 boxes. Page 13 of 14

Bluetooth low energy Module Packaging Options Page 14 of 14 Module 1 x SMT Plug & Play IC Antenna Module Tray Module 1 x SMT Plug & Play IC Antenna Module Tape & Reel