Introduction to Spine-Leaf Networking Designs

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1 Front cover Introduction to - Networking Designs Last Update: 7 November 2017 Explains three-tier versus spine-leaf network architectures Details the advantages and disadvantages of three-tier and spine-leaf architectures Introduces Lenovo s recommended spine-leaf switches Details the capacities of Lenovo s recommended spine-leaf implementations William Nelson

2 Abstract The traditional three-layer network topologies are losing momentum in the modern data center and are being supplanted by spine-leaf designs (also known as Clos designs after one of the original researchers, Charles Clos). This is even despite three-layer familiarity, scalability and ease of implementation. Why is this happening? Organizations are seeking to maximize the function and utilization of their data centers leading to architecture optimized for software defined and cloud solutions. The spine-leaf architecture provides a strong base for the software defined data center optimizing the reliability and bandwidth available server communications. This document describes the following: The traditional three-layer and spine-leaf architectures The advantages and disadvantages of each architecture approach Lenovo s spine-leaf solutions This paper is for network architects and decision makers desiring to understand why spine-leaf designs are important to the modern data center and how Lenovo Networking products can be utilized in these designs. At Lenovo Press, we bring together experts to produce technical publications around topics of importance to you, providing information and best practices for using Lenovo products and solutions to solve IT challenges. See a list of our most recent publications at the Lenovo Press web site: Do you have the latest version? We update our papers from time to time, so check whether you have the latest version of this document by clicking the Check for Updates button on the front page of the PDF. Pressing this button will take you to a web page that will tell you if you are reading the latest version of the document and give you a link to the latest if needed. While you re there, you can also sign up to get notified via whenever we make an update. Contents Approaches for Network Designs Lenovo spine-leaf Conclusion Appendix: Lenovo spine-leaf capacities Acronyms Change history Author Notices Trademarks Introduction to - Networking Designs

3 Approaches for Network Designs The overall network performance is highly dependent upon the design approach that is utilized. These approaches can be optimized for either north-south or east-west traffic flows. The following three-tier and spine-leaf architectures are two classic approaches utilized to optimize designs for north-south and east-west traffic respectively. Three-tier architecture Data center technologies are driving network architecture changes from the traditional three-tier architecture, as shown in Figure 1. Layer 3 Layer 2 Routing Switch (L3/L2) Switch 1 (L2) Pod 1 Routing Switch (L3/L2) Switch n (L2) Routing Switch (L3/L2) Switch 1 (L2) Pod 2 Routing Switch (L3/L2) Switch n (L2) Routing Switch (L3/L2) Switch 1 (L2) Pod n Routing Switch (L3/L2) Switch n (L2) Aggregation Access Figure 1 Traditional three-tier architecture This architecture consists of three major layers: 1. Layer 3 routers providing separation of the pods 2. Aggregation Layer 2/3 (L2/3) switches which serve as boundaries between the pods. 3. Access Layer 2 (L2) switches providing loop free pod designs utilizing either spanning tree protocol or virtual link aggregation (VLAG) as displayed in Figure 1. The three-tier architecture has served the data center well for many years providing effective access to servers within the pod and isolation between the pods. This matches very cleanly with traditional server functions which require east-west traffic within the pod but limited North/South traffic across pods thru the core network. The difficulty that arises with this architecture is an increased latency for pod-to-pod (east-west) traffic. Advantages of the three-tier architecture The three-tier architecture has been in existence for many years and displacing this for other approaches should not be taken lightly since it is well known and proven. This architecture has distinct benefits including: Copyright Lenovo All rights reserved. 3

4 Availability if a pod is down due to equipment or some other failure, it can be easily isolated to a branch (pod) without affecting other branches (pods) Security processes and data can be isolated in pods limiting exposure risks Performance traffic within the pod is reduced so oversubscription is minimized Scalability if a pod becomes oversubscribed, it is a simple task to add another pod and load-balance traffic across them and improving application performance Simplicity network issues caused by leaf devices are simplified because the number of devices in each branch are limited Disadvantages of the three-tier architecture As previously stated, software defined infrastructures are requiring changes in the traditional network architecture demanding expanded east-west traffic flows. The major software defined applications driving this are virtualization and convergence. Virtualization requires moving workloads across multiple devices which share common backend information. Convergence requires storage traffic between devices on the same network segment. These applications also drive increased bandwidth utilization which is difficult to expand across the multiple layered network devices in the three-tier architecture. This leads to the core network devices being very expensive high speed links. -leaf architecture New data centers are now being designed for cloud architectures with larger east-west traffic domains. This drives the need for a network architectures with an expanded flat east-west domain like spine-leaf as shown in Figure 2 on page 5. Solutions like VMware NSX, OpenStack and others that distribute workloads to virtual machines running on many overlay networks running on top of a traditional underlay (physical) network require mobility across the flatter east-west domain. 4 Introduction to - Networking Designs

5 Figure 2 -leaf Architecture The spine-leaf architecture is also known as a Clos architecture (named after Charles Clos, a researcher at Bell Laboratories in the 1950s) where every leaf switch is connected to each of the spine switch in a full-mesh topology. The spine-leaf mesh can be implemented using either Layer 2 or 3 technologies depending on the capabilities available in the networking switches. Layer 3 spine-leafs require that each link is routed and is normally implemented using Open Shortest Path First (OSPF) or Border Gateway Protocol (BGP) dynamic routing with equal cost multi-path routing (ECMP). Layer 2 utilizes a loop-free Ethernet fabric technology such as Transparent Interconnection of Lots of Links (TRILL) or Shortest Path Bridging (SPB). The core network is also connected to the spine with Layer 3 using a dynamic routing protocol with ECMP. Redundant connections to each spine switch are not required but highly recommended, as show in Figure 2. This minimizes the risk of overloading the links on the spine-leaf fabric. This architecture provides a connection thru the spine with a single hop between leafs minimizing any latency and bottle necks. The spine can be expanded or decreased depending on the data thru-put required. Advantages of the spine-leaf architecture The spine-leaf architecture is optimized for east-west traffic that is required by most software defined solutions. The advantages of this approach are: All interconnections are used and there is no need for STP to block loops All east-west traffic is equidistant so traffic flow has deterministic latency Switch configuration is fixed so that no network changes are required for a dynamic server environment 5

6 Disadvantages of the spine-leaf architecture The spine-leaf architecture is not without concerns as listed below: The leading concern is the amount of cables and network equipment required to scale the bandwidth since each leaf must be connected to every spine device. This can lead to more expensive spine switches with high port counts. The number of hosts that can be supported can be limited due to spine port counts restricting the number of leaf switch connections. Oversubscription of the spine-leaf connections can occur due to a limited number of spine connections available on the leaf switches (typically 4 to 6). Generally, no more than a 5:1 oversubscription ratio between the leaf and spine is considered acceptable but this is highly dependent upon the amount of traffic in your particular environment. Oversubscription of the links out of the spine-leaf domain to the core should also be considered. Since this architecture is optimized for east-west traffic as opposed to north-south, oversubscriptions of 100:1 may be considered acceptable. Lenovo spine-leaf The spine-leaf architecture provides a loop free mesh between the spine and the leaf switches. This can be accomplished using either Layer 2 or 3 designs. Lenovo provides solutions for small two switch Layer 2 spines and expanded multi-switch Layer 3 spines utilizing either Cloud Network Operating System (CNOS) or Enterprise Network Operating System (ENOS). The following sections detail Lenovo s recommendation for spine-leaf switches, and Layer 2 and 3 designs. A table summarizing the scaling of Lenovo's spine-leaf solutions is also provided in Appendix: Lenovo spine-leaf capacities on page 22 as a convenient reference. Lenovo Layer 2 spine-leaf architecture Lenovo implements the Layer 2 spine-leaf network utilizing VLAG to provide a non-blocking loop free design as show in Figure 3 on page 7. Every spine-leaf switch is aggregated in pairs of switches utilizing 100 Gbps spine links providing a 400 Gbps spine with very low congestion. This solution offers the ability to connect to redundant server NICs using bonding with LAG or MAC address load balancing as well as utilizing the NICs independently. 6 Introduction to - Networking Designs

7 connection is possible using L2 with a VLAG or routing using VRRP and ECMP NE2572 Switch 1 NE2572 Switch 2 NE2572 Switch 27 NE2572 Switch 28 Four (4) 100 Gbps links from each leaf switch are utilized for an ISL (2 links) and uplink to the spine (2 links). Figure 3 Lenovo Layer 2 spine-leaf architecture with VLAG at the spine-leaf Each leaf pair has a 400 Gbps VLAG to the spine with a connection to each spine switch from each leaf switch in the pair. NE2572 An alternate Layer 2 design shown in Figure 4 utilizes VLAG only in the spine with a LAG in the leaf switches connecting back to the spine. This solution provides a 200 Gbps spine with slightly higher congestion while providing the ability to connect more servers. Server NICs can be connected as individual NICs or bonding with MAC address load balancing. connection is possible using L2 with a VLAG or routing using VRRP and ECMP Each leaf switch has an 200 Gbps VLAG to the spine with a connection to each spine switch. NE2572 Switch 1 NE2572 Switch 2 NE2572 Switch 27 NE2572 Switch 28 NE2572 Each leaf switch has two (2) 100 Gbps links in a LAG to the spine. Figure 4 Lenovo Layer 2 spine-leaf architecture with VLAG at the spine only Both Layer 2 implementation can connect to the core using Layer 3 with ECMP and VRRP active-active or with VLAG for a full Layer 2 spine implementation. 7

8 Lenovo Layer 3 spine-leaf Architecture Figure 5 is an example of Lenovo s Layer 3 spine-leaf Architecture which utilizes a dynamic routing protocol such as BGP or OSPF to provide connection between all of the spine-leaf switches and core network. While Layer 3 has more complex configurations than Layer 2, it provides a more scalable spine with speeds ranging from 200 to 600 Gbps depending on the type of leaf switch utilized and the number of ThinkSystem spine switches. Layer 3 spine/leaf designs have become more common because L3 (routed) ports have dropped in cost to where they are no more costly than a L2 (switched) port. This is true of the Lenovo switches shown in Figure 5. Future CNOS firmware releases will provide enhanced capabilities to implement virtualized overlay networks using VXLAN and providing redundant Virtual Tunnel End-Points (VTEPs) for virtualization environments. Switch 1 Up to 6 x Switches 2 x 10/25/40/100 Gbps L3 interfaces from each spine switch to core using VRRP and ECMP Switch n NE2572 Switch 1 NE2572 Switch 2 NE2572 Switch 29 NE2572 Switch 30 Each leaf switch has a 100 Gbps L3-only link utilizing ECMP with BGP or OSPF yielding up to 600 Gbps access to the spine. Figure 5 Lenovo Layer 3 spine-leaf architecture using dynamic routing Each leaf switch has an 100 Gbps link to each spine switch. NE2572 Lenovo spine switches The spine switch is used to connect the leaf switches. Lenovo has two recommended leaf switches each with the same number of ports but with different uplink speeds. When considering the spine switch consider the following aspects: Number of leaf switches to be connected Types uplink connections (100/40 Gbps QSFP28 vs 40 Gbps QSFP+) The switch with the least number of 100 or 40 Gigabit ports will limit the cumulative spine speed. 8 Introduction to - Networking Designs

9 Lenovo ThinkSystem RackSwitch Switch The Lenovo ThinkSystem RackSwitch (Figure 6) is Lenovo s preferred spine switch which offers 100 Gbps or 40 Gbps Ethernet spine connections. The has the following features that are important for this spine switch: Layer 2/3 for both routing and switching 32 QSFP28 ports for high speed 100 or 40 Gbps Ethernet connections CNOS for enhanced BGP, OSPF and ECMP routing VLAG for Layer 2 fabric Single chip design for improved latency and buffer management Figure 6 Lenovo ThinkSystem RackSwitch Switch The can connect up to: 28 leaf switches with a L2 implementation with two spine switches and a 200 Gigabit spine without leaf switch VLAG or 14 leaf switches with a 400 Gbps spine with leaf switch VLAG 30 leaf switches with a L3 implementation and a scalable spine up to 600 Gigabit (6 switch) spine Lenovo RackSwitch G8332 Switch The Lenovo RackSwitch G8332 (Figure 7) is a 40 Gbps Ethernet spine switch. The G8332 has the following features that are important for this spine switch: Layer 2/3 for both routing and switching 32 QSFP+ ports for high speed 40 Gbps Ethernet connections CNOS for enhanced BGP, OSPF and ECMP routing VLAG for Layer 2 fabric Single chip design for improved latency and buffer management Lenovo leaf switches Figure 7 Lenovo RackSwitch G8332 Switch The G8332 can connect up to: 28 leaf switches with a L2 implementation with two spine switches and an 80 Gigabit spine without leaf switch VLAG or 14 leaf switches with a 160 Gbps spine with leaf switch VLAG 30 leaf switches with a L3 implementation and a scalable spine up to 400 Gigabit (10 switch) spine The leaf switch is used to connect server nodes. Lenovo has three recommended leaf switches each with varying number of ports and types of connections: Number of ports for connecting to servers Types of server NIC connections Number of 100 or 40 Gbps ports for connecting to the spine 9

10 When considering mixed types of leaf switches, the switch with the least number of 100 or 40 Gigabit ports will limit the cumulative spine speed. switches described in this section: Lenovo ThinkSystem NE2572 RackSwitch Switch Lenovo RackSwitch G8272 Switch on page 12 Lenovo RackSwitch G8296 Switch on page 15 Lenovo EN4093R Switch for Flex System on page 18 Lenovo ThinkSystem NE2572 RackSwitch Switch The Lenovo ThinkSystem NE2572 RackSwitch (Figure 8) is Lenovo s preferred leaf switch which offers 100 Gbps or 40 Gbps Ethernet spine connections and 25 or 10 Gbps server connections. The NE2572 has the following features that are important for this leaf switch: Layer 2/3 for both routing and switching 48 SFP28 ports for 25 or 10 Gbps Ethernet connections to servers 6 QSFP28 ports for high speed 100 or 40 Gbps Ethernet connections to the spine CNOS for enhanced BGP, OSPF and ECMP routing VLAG for Layer 2 fabric Single chip design for improved latency and buffer management Figure 8 Lenovo ThinkSystem NE2572 RackSwitch Switch Solutions utilizing the NE2572 are characterized as follows: Layer 2 solution with VLAG with 28 leaf switches connected to a 400 (2 switch spine) Gbps spine can connect up to 1,568 (28 x (48+8)) server ports with an oversubscription of 4:1 ((25Gx56 servers):400g); if only 25G SFP28 ports are used the oversubscription is 3:1 (25Gx48 servers:400g). This solution is shown in Figure Introduction to - Networking Designs

11 2 x 100/40/25/10 Gbps L3 interfaces from each spine switch to core using VRRP and ECMP NE2572 Switch 1 NE2572 Switch 2 NE2572 Switch 27 NE2572 Switch 28 Four (4) 100 Gbps links from each leaf switch are utilized for an ISL (2 links) and uplink to the spine (2 links). Figure 9 ThinkSystem NE2572 RackSwitch Layer 2 solution with VLAG Each leaf pair has a 400 Gbps VLAG to the spine with a connection to each spine switch from each leaf switch in the pair. NE2572 Layer 2 solution with no leaf VLAG with 28 leaf switches connected to an 80 Gbps spine can up to 1,792 (28 x (48+16)) server ports with an oversubscription of 8:1 ((25Gx64 servers):200g); if only 25G SFP28 ports are used the oversubscription is 6:1 ((25Gx48 servers):200g); at a cost to some redundancy and connections options to the server. This solution is shown in Figure x 100/40/25/10 Gbps L3 interfaces from each spine switch to core using VRRP and ECMP Each leaf switch has an 200 Gbps VLAG to the spine with a connection to each spine switch. NE2572 Switch 1 NE2572 Switch 2 NE2572 Switch 27 NE2572 Switch 28 NE2572 Each leaf switch has two (2) 100 Gbps links in a LAG to the spine. Figure 10 ThinkSystem NE2572 RackSwitch Layer 2 solution with no leaf VLAG 11

12 Layer 3 solution with 30 leaf switches The Layer 3 solutions are all based off of the following architecture diagram and only vary by then number of spine switches that are connected or reserved ports. This solution is shown in Figure 11 on page 12. Switch 1 Up to 6 x Switches 2 x 100/40/25/10 Gbps L3 interfaces from each spine switch to core using VRRP and ECMP Switch n NE2572 Switch 1 NE2572 Switch 2 NE2572 Switch 29 NE2572 Switch 30 There are up to 30 x NE2572 leaf switches in this solution, the available server connections are dependent upon the number of spine switches. Figure 11 ThinkSystem NE2572 RackSwitch Layer 3 solution with 30 leaf switches Table 1 lists the capacities of Lenovo's Layer 3 solution using NE2572 leaf switches. Table 1 Lenovo ThinkSystem NE2572 RackSwitch L3 leaf switch capacities Each leaf switch has an 100 Gbps link to each spine switch. NE2572 Server ports per leaf switch switch quantity speed (Gbps) switch quantity Server quantity Oversubscription ratio Rounded oversubscription ratio :1 2: :5 3: :2 4: :1 5: :1 8:1 Lenovo RackSwitch G8272 Switch The Lenovo RackSwitch G8272 is Lenovo s 1U 10 Gbps Ethernet solution for the leaf switch. The G8272 has the following features that are important for this leaf switch: Layer 2/3 for both routing and switching CNOS for enhanced BGP, OSPF and ECMP routing VLAG for Layer 2 fabric Single chip design for improved latency and buffer management 12 Introduction to - Networking Designs

13 6 QSFP+ ports for 40 Gbps spine connections allowing for a maximum cumulative spine speed of 240 Gbps. The QSFP+ ports not utilized for spine connections can be broken out into 4 x 10 Gigabit Ethernet ports for additional server connections. 48 SFP+ ports for 1/10 Gigabit Ethernet server connections per leaf switch The Lenovo RackSwitch G8272 is shown in Figure 12. Figure 12 Lenovo RackSwitch G8272 Switch Solutions utilizing the G8272 are characterized as follows: Layer 2 solution with VLAG with 28 leaf switches connected to a 160 (2 switch spine) Gbps spine can connect up to 1,568 (28 x (48+8)) server ports with an oversubscription of 4:1 ((10Gx56 servers):160g); if only 10G SFP+ ports are used the oversubscription is 3:1 (10Gx48 servers:160g). This solution is shown in Figure 13 on page x 10/40 Gbps L3 interfaces from each spine switch to core using VRRP and ECMP or G8332 G8272 Switch 1 G8272 Switch 2 G8272 Switch 27 G8272 Switch 28 Four (4) 40 Gbps links from each leaf switch are utilized for an ISL (2 links) and uplink to the spine (2 links). Figure 13 RackSwitch G8272 Layer 2 solution with VLAG Each leaf pair has a 160 Gbps VLAG to the spine with a connection to each spine switch from each leaf switch in the pair. G8272 Layer 2 solution with no leaf VLAG with 28 leaf switches connected to an 80 Gbps spine can up to 1,792 (28 x (48+16)) server ports with an oversubscription of 8:1 ((10Gx64 servers):80g); if only 10G SFP+ ports are used the oversubscription is 6:1 ((10Gx48 servers):80g); at a cost to some redundancy and connections options to the server. This solution is shown in Figure

14 2 x 10/40 Gbps L3 interfaces from each spine switch to core using VRRP and ECMP or G8332 Each leaf switch has an 80 Gbps VLAG to the spine with a connection to each spine switch. G8272 Switch 1 G8272 Switch 2 G8272 Switch 27 G8272 Switch 28 G8272 Each leaf switch has two (2) 40 Gbps links in a LAG to the spine. Figure 14 RackSwitch G8272 Layer 2 solution with no leaf VLAG Layer 3 solution with 30 leaf switches The Layer 3 solutions are all based off of the following architecture diagram and only vary by then number of spine switches that are connected or reserved ports. This solution is shown in Figure 15. Switch 1 Up to 6 x Switches 2 x 10/40 Gbps L3 interfaces from each spine switch to core using VRRP and ECMP Switch n or G8332 G8272 Switch 1 G8272 Switch 2 G8272 Switch 29 G8272 Switch 30 There are up to 30 x G8272 leaf switches in this solution, the available server connections are dependent upon the number of spine switches. Figure 15 RackSwitch G8272 Layer 3 solution with 30 leaf switches Each leaf switch has an 40 Gbps link to each spine switch. Table 2 lists the capacities of Lenovo's Layer 3 solution utilizing G8272 leaf switches. G Introduction to - Networking Designs

15 Table 2 Lenovo RackSwitch G8272 leaf switch capacities Server ports per leaf switch switch quantity speed (Gbps) switch quantity Server quantity Oversubscription ratio Rounded oversubscription ratio :1 2: :5 3: :2 4: :1 5: :1 8:1 Lenovo RackSwitch G8296 Switch The Lenovo RackSwitch G8296 is Lenovo s 2U solution for the leaf switch. The G8296 has the following features that are important for this leaf switch: Layer 2/3 for both routing and switching CNOS for enhanced BGP, OSPF and ECMP routing VLAG for Layer 2 fabric Single chip design for improved latency and buffer management 10 QSFP+ ports for 40 Gbps spine connections allowing for a maximum cumulative spine speed of 400 Gbps. Two of the QSFP+ ports not utilized for spine connections can be broken out into 4 x 10 Gigabit Ethernet ports for eight additional server connections. The remaining QSFP+ ports can be utilized as a single server connection. 86 SFP+ ports for 1/10 Gigabit Ethernet server connections per leaf switch The Lenovo RackSwitch G8296 is shown in Figure 16. Figure 16 Lenovo RackSwitch G8296 Switch Solutions utilizing the G8296 are characterized as follows: Layer 2 solution with VLAG with 28 leaf switches connected to a 160 Gbps spine can connect up to 2,744 (28 x (86+8+4)) server ports with an oversubscription of 6:1 ((10Gx98 servers:160g). This solution is shown in Figure

16 2 x 10/40 Gbps L3 interfaces from each spine switch to core using VRRP and ECMP or G8332 G8296 Switch 1 G8296 Switch 2 G8296 Switch 27 G8296 Switch 28 Four (4) 40 Gbps links from each leaf switch are utilized for an ISL (2 links) and uplink to the spine (2 links). Figure 17 RackSwitch G8296 Layer 2 solution with VLAG (28 leaf switches) Each leaf pair has a 160 Gbps VLAG to the spine with a connection to each spine switch from each leaf switch in the pair. G8296 Layer 2 solution VLAG with 14 leaf switches connected to a 320 Gbps spine by aggregating two QSFP+ ports on each leaf switch can connect up to 1,316 (14 x (86+8)) server ports with an oversubscription of 3:1 ((10Gx94 servers:320g). This solution, shown in Figure 18 on page 16, doubles the spine connections to reduce oversubscription but will also reduce the maximum number of server conneciton possible for the solution. 2 x 10/40 Gbps L3 interfaces from each spine switch to core using VRRP and ECMP or G8332 Each leaf pair has a 320 Gbps VLAG to the spine with a connection to each spine switch from each leaf switch in the pair. G8296 Switch 1 G8296 Switch 2 G8296 Switch 13 G8296 Switch 14 G8296 Four (8) 40 Gbps links from each leaf switch are utilized for an ISL (4 links) and uplink to the spine (4 links). Figure 18 RackSwitch G8296 Layer 2 solution with VLAG (14 leaf switches) 16 Introduction to - Networking Designs

17 Layer 2 solution no leaf VLAG with 30 leaf switches connected to an 80 Gbps spine can up to 2,856 (28 x (86+8+8)) server ports with an oversubscription of 13:1 ((10Gx102 servers:80g) at a cost to redundancy. This solution is shown in Figure x 10/40 Gbps L3 interfaces from each spine switch to core using VRRP and ECMP or G8332 Each leaf switch has an 80 Gbps VLAG to the spine with a connection to each spine switch. G8296 Switch 1 G8296 Switch 2 G8296 Switch 27 G8296 Switch 28 Each leaf switch has two (2) 40 Gbps links in a LAG to the spine. G8296 Figure 19 RackSwitch G8296 Layer 2 solution no leaf VLAG Layer 3 solution with 30 leaf switches The Layer 3 solutions are all based off of the following architecture diagram and only vary by then number of spine switches that are connected or reserved ports. The G8296 supports up to 10 spine switches. This solution is shown in Figure

18 Switch 1 Up to 10 x Switches 2 x 10/40 Gbps L3 interfaces from each spine switch to core using VRRP and ECMP Switch n or G8332 Each leaf switch has an 40 Gbps link to each spine switch. G8296 Switch 1 G8296 Switch 2 G8296 Switch 27 G8296 Switch 28 There are up to 30 x G8296 leaf switches in this solution, the available server connections are dependent upon the number of spine switches. G8296 Figure 20 RackSwitch G8296 Layer 3 solution Table 3 lists the capacities of Lenovo's layer 3 solution utilizing G8296 leaf switches. Table 3 Lenovo RackSwitch G8296 leaf switch capacities Server ports per leaf switch switch quantity speed (Gbps) switch quantity Server quantity Oversubscription ratio Rounded oversubscription ratio :20 2: :2 3: :16 3: :28 3: :1 4: :20 5: :8 6: :4 8: :2 13:1 Lenovo EN4093R Switch for Flex System The Lenovo Flex System Fabric EN4093R 10Gb Scalable Switch is Lenovo s Flex System solution for the leaf switch. The EN4093R has the following features that are important for this leaf switch: Layer 2/3 for both routing and switching 18 Introduction to - Networking Designs

19 ENOS with BGP, OSPF and ECMP routing VLAG for Layer 2 fabric Single chip design for improved latency and buffer management 2 QSFP+ ports for 40 Gbps spine connections allowing for a maximum cumulative spine speed of 80 Gbps. 14 dedicated server facing ports 14 SFP+ ports for 1/10 Gigabit external Ethernet server connections and an Inter-Switch Link (ISL) for use with VLAG The Lenovo Flex System Fabric EN4093R 10Gb Scalable Switch is shown in Figure 21. Figure 21 Lenovo Flex System Fabric EN4093R 10Gb Scalable Switch Solutions utilizing the Flex System Chassis and the EN4093R have some limitations as compared to TOR based solutions. The main limitation is the limited number of 40 Gbps ports restricting this solution to two spine switches. There is also a limited number of servers that can be connected due to the hard wired connections to the Flex System server nodes. Solutions utilizing the EN4093R are characterized as follows: Layer 2 solution with VLAG with 28 leaf switches connected to a 160 (2 switch spine) Gbps spine can connect up to 672 (28 x (14 INT + 10 EXT)) server ports with an oversubscription of 2:1 ((10Gx24 servers:160g). The solution is shown in Figure x 10/40 Gbps L3 interfaces from each spine switch to core using VRRP and ECMP EN4093R Chassis 1/Switch 1 EN4093R Chassis 1/Switch 2 Figure 22 Flex System EN4093R Layer 2 solution with VLAG Each leaf pair has a 160 Gbps VLAG to the spine with a connection to each spine switch from each leaf switch in the pair. EN4093R Chassis 14/Switch 1 EN4093R Chassis 14/Switch 2 The 2 x 40 Gbps links from each EN4093R switch are utilized for uplinks to the spine and 4 to 8 x 10 Gbps EXT links are used for the ISL (2 links). or G8332 EN4093R Layer 2 solution with no leaf VLAG with 30 leaf switches connected to an 80 Gbps spine can up to 784 (28 x (14 INT + 14 EXT)) server ports with an oversubscription of 4:1 19

20 ((10Gx28 servers:80g) at a cost to some redundancy and connections options to the server. The solution is shown in Figure x 10/40 Gbps L3 interfaces from each spine switch to core using VRRP and ECMP or G8332 EN4093R Chassis 1/Switch 1 EN4093R Chassis 1/Switch 2 Each leaf switch has an 80 Gbps VLAG to the spine with a connection to each spine switch. EN4093R Chassis 14/Switch 1 EN4093R Chassis 14/Switch 2 EN4093R The 2 x 40 Gbps links from each EN4093R switch are utilized for uplinks to the spine. Figure 23 Flex System EN4093R Layer 2 solution with no leaf VLAG Layer 3 solution with 30 leaf switches The spine size for Flex System solution is limited to two (2) switches no matter if it is Layer 3 or 3. With this in mind, it is probably best to not involve the complexity of configuring routing for the Flex System spine-leaf. This may only be advantages if a lot of inter VLAN routing is utilized in the solution. The EN40993R L3 architecture is shown in Figure x 10/40 Gbps L3 interfaces from each spine switch to core using VRRP and ECMP Switch 1 Switch 2 or G8332 EN4093R Chassis 1/Switch 1 EN4093R Chassis 1/Switch 2 Each leaf switch has an 80 Gbps VLAG to the spine with a connection to each spine switch. EN4093R Chassis 14/Switch 1 EN4093R Chassis 14/Switch 2 EN4093R The 2 x 40 Gbps links from each EN4093R switch are utilized for uplinks to the spine. Figure 24 Flex System EN4093R Layer 3 solution 20 Introduction to - Networking Designs

21 The connected ports are as follows: 80 Gbps spine (2 switch spine) can connect up to 784 (28 x (14 INT + 14 EXT)) server ports with an oversubscription of 4:1 ((10Gx28 servers:80g) Conclusion Lenovo s Layer 3 spine-leaf architecture provides the best oversubscription ratios with the highest number of server ports. This architecture also provides the ability to connect thousands of servers with low latency single hop connections between the leaf switches. These connections are made over a high speed spine with low congestion as indicated by the low oversubscription numbers. Lenovo s Cloud Network Operating System (CNOS) also targets Layer 3 routing with BGP and OSPF routing protocols tuned for optimal performance. With lower numbers of servers, Lenovo s simple Layer 2 spine-leaf architecture provides good capacities without the complexity of Layer 3 configurations. The Layer 2 solution can also be greatly simplified using Q-in-Q tunneling so that no VLAN configuration is required. In conclusion, Lenovo s spine-leaf Architectures provide both Layer 2 and Layer 3 solutions with high capacities and low congestion. 21

22 Appendix: Lenovo spine-leaf capacities Table 4 provides a convenient reference summarizing the scalability of Lenovo's spine-leaf solutions. With this table you can determine at a glance the number of servers and oversubscription ratios that are possible with each architecture and leaf switch utilized. Table 4 Lenovo spine-leaf architecture capacities switch switch Server ports per leaf switch Server port speed (Gbps) switch quantity speed (Gbps) switch quantity Server quantity Oversubscription ratio Rounded oversubscription ratio & Architecture - L2 with VLAG NE :2 4:1 G8272 /G :2 4:1 G8296 /G :8 6:1 G8296 /G :16 3:1 EN4093R /G :2 2:1 & Architecture - L2 without VLAG NE :1 8:1 G8272 /G :1 8:1 G8296 /G :4 13:1 EN4093R /G :2 4:1 & Architecture - L3 NE :1 2:1 NE :2 4:1 NE :1 8:1 G8272 /G :1 2:1 G8272 /G :2 4:1 G8272 /G :1 8:1 G8296 /G :20 2:1 G8296 /G :16 3:1 G8296 /G :1 4:1 G8296 /G :8 6:1 G8296 /G :2 13:1 EN4093R /G :2 4:1 22 Introduction to - Networking Designs

23 Acronyms BGP Boarder Gateway Protocol CNOS Cloud Network Operating System ECMP Equal Cost Multi-Path Routing ENOS Enterprise Network Operating System Gbps Gigabits per second ISL Inter-Switch Link L2 Layer 2 L2/3 Layer 2 and 3 L3 Layer 3 MAC Media Access Control OSPF Open Shortest Path First RU Rack Unit SPB Shortest Path Bridging TRILL Transparent Interconnection of Lots of Links TOR Top Of Rack VLAG Virtual Link Aggregation VRRP Virtual Redundancy Protocol Change history November 7 update: Added the ThinkSystem 100 GbE spine switch Added the ThinkSystem NE GbE leaf switch Author William Nelson is a Worldwide Technical Sales Leader for Lenovo Networking. He joined Lenovo from IBM and BNT and has over 30 years of networking experience. He was one of the four founders of BNT and an early member of Centillion Networks and Alteon Web Systems. He is an evangelist for Lenovo's Networking products to the sales and customer communities and is the key voice of the customer to the networking product and engineering teams. Bill graduated from Virginia Tech with a BS in Biochemistry and University of Maryland with a BS in Computer Science. Thanks to the following people for their contributions to this project: Jim Whitten, WW Product Marketing Manager for Lenovo Networking David Watts, Lenovo Press 23

24 Notices Lenovo may not offer the products, services, or features discussed in this document in all countries. Consult your local Lenovo representative for information on the products and services currently available in your area. Any reference to a Lenovo product, program, or service is not intended to state or imply that only that Lenovo product, program, or service may be used. Any functionally equivalent product, program, or service that does not infringe any Lenovo intellectual property right may be used instead. However, it is the user's responsibility to evaluate and verify the operation of any other product, program, or service. Lenovo may have patents or pending patent applications covering subject matter described in this document. The furnishing of this document does not give you any license to these patents. You can send license inquiries, in writing, to: Lenovo (United States), Inc Think Place - Building One Morrisville, NC U.S.A. Attention: Lenovo Director of Licensing LENOVO PROVIDES THIS PUBLICATION AS IS WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some jurisdictions do not allow disclaimer of express or implied warranties in certain transactions, therefore, this statement may not apply to you. This information could include technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes will be incorporated in new editions of the publication. Lenovo may make improvements and/or changes in the product(s) and/or the program(s) described in this publication at any time without notice. The products described in this document are not intended for use in implantation or other life support applications where malfunction may result in injury or death to persons. The information contained in this document does not affect or change Lenovo product specifications or warranties. Nothing in this document shall operate as an express or implied license or indemnity under the intellectual property rights of Lenovo or third parties. All information contained in this document was obtained in specific environments and is presented as an illustration. The result obtained in other operating environments may vary. Lenovo may use or distribute any of the information you supply in any way it believes appropriate without incurring any obligation to you. Any references in this publication to non-lenovo Web sites are provided for convenience only and do not in any manner serve as an endorsement of those Web sites. The materials at those Web sites are not part of the materials for this Lenovo product, and use of those Web sites is at your own risk. Any performance data contained herein was determined in a controlled environment. Therefore, the result obtained in other operating environments may vary significantly. Some measurements may have been made on development-level systems and there is no guarantee that these measurements will be the same on generally available systems. Furthermore, some measurements may have been estimated through extrapolation. Actual results may vary. Users of this document should verify the applicable data for their specific environment. Copyright Lenovo All rights reserved. Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted by Global Services Administration (GSA) ADP Schedule Contract 24

25 This document was created or updated on November 10, Send us your comments via the Rate & Provide Feedback form found at Trademarks Lenovo, the Lenovo logo, and For Those Who Do are trademarks or registered trademarks of Lenovo in the United States, other countries, or both. These and other Lenovo trademarked terms are marked on their first occurrence in this information with the appropriate symbol ( or ), indicating US registered or common law trademarks owned by Lenovo at the time this information was published. Such trademarks may also be registered or common law trademarks in other countries. A current list of Lenovo trademarks is available on the Web at The following terms are trademarks of Lenovo in the United States, other countries, or both: BNT Flex System Lenovo RackSwitch Lenovo(logo) ThinkSystem The following terms are trademarks of other companies: Other company, product, or service names may be trademarks or service marks of others. 25

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