Advanced Thermal Solution Dynamic Heat Conduction System (DHCS) Introduction

Transcription

1 August 31, 2015 Version 1. 0 Advanced Thermal Solution Dynamic Heat Conduction System (DHCS) Introduction Author: Irene.Wu Irene.Wu@advantech.com.tw

2 August 31, 2015 Version 1. 0 Table of Contents Introduction: Market Overview and Challenges... 1 Advantech Innovative Thermal Solution... 1 DHCS Technologies... 2 Structure of DHCS Thin and Compact Design Higher Thermal Conductivity Coefficient Material Shortened Heat Transfer Route Implementation Comparison - Traditional Thermal Module v.s. DHCS Application Stories... 6 Medical- New Thermal Solution Empowers Ultrasound Devices Test Equipment Enhance Performance Under Ruggedized Environment Advantech services... 9 Conclusion... 9 Product Offerings... 9

3 Introduction: Market Overview and Challenges In the past, most customers use thermal pad as TIM to resolve the dimension tolerance between CPU die and heat sink to prevent CPU damage or board bending, and to ensure tight contact from flatness problem. However, thermal pad is a bottleneck to heat conduction efficiency because its thermal resistance is limited by material technology, and it extends the length of heat conduction path, result in that the heat dissipation will be jammed when high performance CPU generates massive heat. There is an alternative that use spring screws to attach heat sink to Computer-On-Modules (COM) that can resolve mechanical tolerance to let the block contact CPU directly, but it will increase total height after adding spring, so it will be limited to some small dimension system. Also, spring screws tend to loosen under vibration which causes damage of board or poor heat transfer performance. In order to solve heat transfer problems and simplify assembly, Advantech innovates a new thermal solution Dynamic Heat Conduction System (DHCS) which is adopted by our COM Express series. Advantech Innovative Thermal Solution Advantech has developed a highly efficient thermal solution the Dynamic Heat Conduction System (DHCS). The advanced DHCS technology effectively improves heat transfer performance, which solves the heat dissipation problem that develops when a high performance CPU generates massive heat. With the help of the Dynamic Heat Conduction System, devices and systems can run smoothly and the chances of a breakdown or malfunction can be reduced. The key features: Connects exactly with CPU. Automatic CPU surface pressure adjustment. Use of standard screws. Benefits: Delivers a better heat transfer performance and dissipation. Keeps board staying flat and prevents damage of CPU. Keeps assembly tight, even under vibration. 1

4 DHCS Technologies Structure of DHCS DHCS consist of one base, five through holes for assembly, one thermal interface material for chipset, one heat conduction block, four through holes for assembly on carrier board, eight threaded stand-off for pre-assembly and one cooling fin (please refer to pictures below). The base accommodates all of the parts and a little portion (the bronze area) of block protrudes the base. The heat conduction block comprises a heat conduction surface for forming a connection to the CPU and accomplishes efficient heat conduction. The heat produced by the CPU is transferred through the heat conduction surface, the heat conduction block, and a side surface of the heat conduction block to the base. 2

5 Thin and Compact Design Traditional thermal module is heavy and bulky which is limited for large system use. DHCS is designed thinner and sophisticated that can be applied for smaller systems but deliver better heat transfer performance compared to traditional one. The height of DHCS is only 28.3 mm and contains advanced techniques. And there is no extra fixture equipment required. It only requires standard screws to lock DHCS on COM module which is simple and secured. Higher Thermal Conductivity Coefficient Material Traditional thermal module requires a thermal pad to transfer the heat from the CPU to the heat sink. The DHCS uses a copper block (heat conduction block) which delivers a better thermal conductivity coefficient to transfer the heat. Compared to a traditional thermal module, the new Dynamic Heat Conduction System enables a decrease of up to 20 less CPU temperature. Shortened Heat Transfer Route DHCS heat transfer route: The route of heat transfer is shorter and the heat dissipation is faster compared to a traditional thermal module using Thermal Pad (TIM). This is because of the heat conduction block, with its automatic CPU surface pressure adjustment and its thermal conductivity coefficient with is resulting in a better heat transfer performance. 3

6 Implementation 1. In compliance with the chip vendor specification, the heat conduction block provides adequate down pressure to reduce heat resistance and accelerate heat conduction efficiency. 2. Design with precise "coefficient of elasticity" to push the block up and down to a steady state, suitable for various platforms with different chip height. Comparison - Traditional Thermal Module v.s. DHCS Thermal Solution: Case 1: Traditional Thermal Module (Two-piece heat sink) Case 2: Dynamic Heat Conduction System (DHCS) Thermal Simulation COM Module: SOM-5893 with AMD RX-427BB Environmental: Tambient= 60. ; Air flow= 0 m/s. Simulation result: 4

7 Temperature distribution on the components: DHCS technology effectively improves heat transfer performance, which solves the heat dissipation problem that develops when a high performance CPU generates massive heat. Actual Test Test Equipment: COM Module: SOM-5893 with AMD RX-427BB Carrier Board: SOM-AB5810 OS: Win7 64bit Test Program: AMD Thermal Now Test Result: Unit Traditional Thermal Module (fan out of heatsink) DHCS (fan out of heatsink) Environment Temp CPU TDP W CPU Tj The demo shows the effectiveness of DHCS. The whole operation used SOM-5893 to conduct the experiment. Compared to traditional thermal module, DHCS creates a over 20 temperature difference. 5

8 Application Stories Thermal solution performance is always a hot issue, especially for high performance COM Express solutions and in harsh application conditions, such as in the traffic, medical and defense industry. When a CPU offers extreme computing performance, it generates extreme heat as well and the situation is getting even more challenging when a SOC is used, which includes the I/O connectivity as well. Thus, the efficiency of heat dissipation will be an important factor that leads to perfect CPU performance. Medical- New Thermal Solution Empowers Ultrasound Devices Introduction In the medical field, Ultrasound requires high-speed board design based on multi-bus signal acquisition channels, signal acquisition and has to comply with many rules in medical field. Especially device must work at a normal temperature to provide a stable operation. Application Requirements and Challenges Medical device requires high-performance boards which causes the heat dissipation problem easily. This problem develops when a high performance CPU generates massive heat. Also, in order to support high definition image output, an integrated GPU design while consuming low power is required. Because of various requirements, there are some challenges that customers suffer from: 1. Constraints in airflow of the medical device enclosure that requires complicated design. 2. Using max graphic performance of the CPU/GPU results in max TDP is used and needs to be dissipated 3. Difficult to achieve cost effective and reliable solution 4. Scalability of performance and easy maintenance are key issues. Advantech Solution and Benefits Based on Intel the third-generation Core i series CPU, Advantech SOM-5892 module based on a COM Express Basic, Type 6 form factor can provide high-performance signal processing power and fully meets the design requirements of Ultrasound devices SOM-5892 has high processing performance and rich expansion interface features which help designers to achieve flexible Ultrasound devices design requirements. 6

9 1. Platform-leading performance: SOM-5892 module is based on Intel Ivy Bridge platform, significant performance boost over the previous generation of processing speed. 2. Dynamic Heat Conduction System: Dynamic heat conduction system is built-in SOM % mates CPU delivers better heat transfer performance. Delivers better thermal conductivity coefficient 3. Powerful graphics engine: Support hardware encoding / decoding, HD video acceleration, covers a variety of display interface --HDMI / DVI / Display Port, support ultra-high-resolution image B output, even small lesions graphics can easily be discovered, thus greatly improving the accuracy of diagnosis; also support three independent displays. Test Equipment New Thermal Solution Enhances Performance Under Ruggedized Environment Introduction Test equipment requires high reliability and precision, which widely applied in demanding industries such as medical, aerospace or transportation. Usually these delicate systems are designed with high-end processor to trigger the extreme performance and get exact test data. Since it requires high computing ability in ruggedized environment, the thermal solution efficiency is actually an important factor that leads to extreme performance. Application Requirements and Challenges Test equipment can be a simple computer like a tablet or portable device, and either a complicated system built in a bundle of test instruments. It requests a flexible configuration to meet the wide application in testing devices of different industries, to real-time measure the signal and send the data back to system for analysis soon, durable and without any hardware unstable situation to result in incorrect test result. SOM-5894 with i7-4700eq is a 47W CPU module which provides perfect computing performance; it s very suitable to this high-end test device. 7

10 But in this case, the system space is very limited; it can only transfer the heat through a short heat sink by system air flow. That s why customer focuses on the heat conduction efficiency that is the crucial factor to lead to high CPU performance. Besides, they also expect to adopt this thermal solution into different system and easily migrate to new generation. Because of this multi-purpose application, there are some challenges that customers suffer from: 1. Require to dissipate heat effectively to bring the best computing performance. 2. Traditional thermal module is simple and stable, but the path of heat conduction in traditional thermal module is too long to resolve heat issue. 3. They require a reliable thermal solution, easy assembly and flexible to different system space, even a portable test device. Advantech Solution and Benefits The new thermal module - Dynamic Heat Conduction System (DHCS) is suitable for this high end test equipment, especially to which powered by the high TDP CPU. After applying this new concept, it resolved customer's problem without design change, and do not require extra assembly process. They are benefiting for this new accessory. 1. Lead to high CPU performance: Because we shorten the path of the heat flow, the DHCS can conduct the heat quickly from CPU to heat sink and then to air. Thus, CPU can run in the best status without throttling. 2. No vibration issue to portable device: The DHCS follows the advantage of the traditional thermal module; use the normal screw for assembly to prevent loose issue if the device is moved about in most application scenario. 3. Easy applying: It is compatible to traditional thermal solutions, so customer uses it easily, and doesn t make extra fixture to attach it into their products. Besides, It is efficient and thin to comply with customer s chassis, and also suitable to wide dimension of test equipment. Customer can use the DHCS in most of their product in the future. 4. Value-added service: Because they will adopt the same thermal module in common use, it means that there will be different assembly requirement. If they need, we can also provide the COM and thermal module pre-assembly service without design change. It will reduce customer s working time to apply SOM-5894 and heat spreader into their products. 8

11 Advantech services Advantech is not only a COM Express provider, but also a problem solver. Dynamic heat conduction system can be applied into variety application no matter in harsh environment or space limited chassis. Advantech can offer feasibility study, thermal simulation, heat sink design, thermal performance verification based on customer s requirement. And pre-assembly heat sink to COM products that helps customer to reduce production process in customer s manufacturing site. Conclusion Dynamic heat conduction system is an innovative technology benefit to high-computing power SOM series product and is now available; it resolved the tolerance issue and make CPU contact to heat sink tightly to prevent board bending and CPU damage. Bring significant heat dissipation efficiency for high-power CPU. SOM-5893 is the first model that implements the Dynamic heat conduction system thermal solution. This technology will also be adopted to the coming COM new models. Product Offerings Photo Model Description SOM rd Gen. Intel Core Processor COM Express Basic Module Supports Dual Channel DDR3-1600, DDR3L-1333 SODIMM sockets up to 16 GB Supports PCIe x16, 7 PCIe x1, 2 SATAIII, 2 SATAII, 8 USB 2.0, 4 USB 3.0, GbE SOM nd Gen. AMD embedded R-Series APU COM Express Basic Module Supports Dual DDR3L-1600 SODIMM sockets up to 16 GB Four Independent Displays with outstanding graphics performance SOM th Gen. Intel Core Processor COM Express Basic Module Supports Dual DDR3L-1333/1600 SODIMM sockets up to 16 GB Triple displays with outstanding graphics performance SOM th Gen Intel Core / Celeron Processors COM Express Basic Module Supports Dual Chanel DDR4 2133, 1.2V, up to 32GB Supports 8 PCIex1 Gen 3 (8GT/s) up to 3 controllers 9