INGEPAC DA-CU. Control Unit. Data Sheet ZY8932IMA01E 31/03/2016

Transcription

1 ZY8932IMA01E 31/03/2016 INGEPAC DA-CU Control Unit Data Sheet

2 Total or partial reproduction of this publication by any means or procedure is prohibited without previous express written authorisation by Ingeteam Power Technology. One of the primary goals of Ingeteam Power Technology is the continuous improvement of its equipment; consequently, the information contained in this catalogue may be modified without previous notice. For further information, please refer to the manual or contact us. Parque Tecnológico de Bizkaia Edificio Zamudio (Bizkaia) Tel Fax

3 Contents Table 1 Introduction Technical Features Housing /3 19 Housing Front View Rear View DA2505-2/3 19 Housing Front View Rear View DA Compact Housing Front View Rear View Communication Protocols Configuration points Time Synchronization Logic Programming Configuration Software Standards and Tests Ingeteam Power Technology, S.A. All rights reserved. ZY8932IMA01D

4 1 Introduction INGEPAC DA-CU consists of a high-performing modular system designed for electrical environments. Its main functions are as follows: Acts as a Remote Terminal Unit and collects information (alarms, statuses, measurements, counters etc.) from different local devices using several communication protocols, and sends it to different control centers, following telecontrol standards. Receives commands and set points from different telecontrol centers and sends them to the corresponding IEDs. Performs general logic operations, receiving the necessary information from the IEDs at position level. These logic operations are developed using IEC compliant tools. Acts as a synchronization pattern for all the devices connected to the communications network via the SNTP protocol. Offer both data concentrator and protocol converter features. Data acquisition: Several combinations of digital and analogue values modules that allow to acquire all the substation general purposes signalization not supplied by the bay units. Digital Inputs are dated with 3 ms accuracy Ingeteam Power Technology, S.A. All rights reserved. ZY8932IMA01D

5 INGEPAC DA-CU 1/3 19 Housing INGEPAC DA - C U 0 A H C X F A X X X X - MODEL Control Unit RTU 8 DIGITAL INPUT 5 DIGITAL OUTPUT Generic CU0 EXTENDED FEATURES Basic A HOUSING 1/3 19" H POWER SUPPLY 24/48 Vdc DI 24/48 Vdc A 12 Vdc DI 12 Vdc D CPU INTEGRATED SERIAL PORT SP0 RS232 C SERIAL PORT SP1 None RS232/RS485 X C CPU INTEGRATED ETHERNET PORT ETH1 RJ45 F ETHERNET PORT ETH2 None RJ45 X F TERMINALS Pin Type A BOARD SELECTION None XX 15 DI / 8 DO, 24/48 Vdc XC 24 DI / 16 DO (13 NO / 3NC), 24/48 Vdc XM BOARD1 8 DC (ma) 15 DI, 24/48 Vdc XN BOARD2 15 DI / 8 DO, 12 Vdc CC 24 DI / 16 DO (13 NO / 3NC), 12 Vdc CM 8 DC (ma) 15 DI, 12 Vdc CN RESERVED RESERVED -

6 INGEPAC DA-CU 2/3 19 Housing INGEPAC DA - C U 0 A I C X F A - MODEL Control Unit RTU 8 DIGITAL INPUT 5 DIGITAL OUTPUT Generic CU0 EXTENDED FEATURES Basic A HOUSING 2/3 19" I POWER SUPPLY 24/48 Vdc DI 24/48 Vdc A 12 Vdc DI 12 Vdc D CPU INTEGRATED SERIAL PORT SP0 RS232 C SERIAL PORT SP1 None RS232/RS485 X C CPU INTEGRATED ETHERNET PORT ETH1 RJ45 F ETHERNET PORT ETH2 None RJ45 X F TERMINALS Pin Type A BOARD SELECTION None XX 15 DI / 8 DO 24 / 48 Vdc XC BOARD1 24 DI / 16 DO (13 NO / 3NC), 24/48 Vdc XM BOARD2 8 DC (ma) 15 DI, 24/48 Vdc XN BOARD3 15 DI / 8 DO, 12 Vdc CC BOARD4 24 DI / 16 DO (13 NO / 3NC), 12 Vdc CM 8 DC (ma) 15 DI, 12 Vdc CN RESERVED RESERVED -

7 INGEPAC DA-CU Compact Housing INGEPAC DA - C U 0 A G C X F A X X X X X X - MODEL Control Unit RTU 8 DIGITAL INPUT 5 DIGITAL OUTPUT Generic CU0 EXTENDED FEATURES Basic A HOUSING Compact G POWER SUPPLY 24/48 Vdc DI 24/48 Vdc A 12 Vdc DI 12 Vdc D CPU INTEGRATED SERIAL PORT SP0 RS232 C SERIAL PORT SP1 None RS232/RS485 X C CPU INTEGRATED ETHERNET PORT ETH1 RJ45 F ETHERNET PORT ETH2 None RJ45 X F TERMINALS Pin Type A BOARD SELECTION None XX 15 DI / 16 DO, 24/48 Vdc XT 8 DC (ma) 15 DI, 24/48 Vdc XN BOARD1 15 DI / 16 DO, 12 Vdc CT 8 DC (ma) 15 DI, 12 Vdc CN RESERVED RESERVED -

8 2 Technical Features ENVIRONMENTAL CONDITIONS Operating temperature -40 to +65 ºC Storage temperature -40 to +85 ºC Relative humidity Up to 95% without condensation POWER SUPPLY 24/48 Vdc 12 Vdc DC operating range Vdc Vdc Output power 5 W W per active relay 5 W W per active relay Max Output power 20 W 20 W CPU FEATURES Number of CPU modules 1 Microprocessor ARM-Cortex A-8 RAM memory 256 MB Storage memory 128 MB NVRAM memory 512 KB Number of USB 2.0 port 1 Logic programming IEC with10 ms cycle time Time synchronization SNTP CPU ETHERNET COMMUNICATIONS Number of Ethernet controllers 2 Connectors 2 RJ45 Connector type RJ45 female Cable type UTP Cat 5 Maximum cable length 100 m Insulation 1 kv Speed 10/100 Mbps CPU SERIAL COMMUNICATIONS Number of serial ports 2 Serial Port type SP0 RS-232 and SP1 RS-232/RS-485 (software selectable) Connector type Female RJ45 Cable type UTP Cat 5 Insulation 1 kv Cable length 100 m max Speed Up to bps

9 Table 1. DA-CU serial ports pinout Pin SP0 SP1 RS232 RS232 RS485 1 CD 2 RX RX D- 3 TX TX D+ 4 DTR 5 GND GND GND 6 DSR- 7 RTS RTS 8 CTS CTS 9 CPU INTEGRATED DIGITAL INPUT 24/48 Vdc 12 Vdc Number of inputs 8 8 Voltage levels Vdc TBT Inactive below: 13 Vdc TBT Burden <3 ma TBT CPU INTEGRATED DIGITAL OUTPUT 24/48 Vdc 12 Vdc Number of outputs 5 5 Carry (Permanent) 5 A at 25 ºC TBT Make (1 s.) 30 A TBT Operating time 8 ms TBT Trip or close capacity (L/R = 40 ms) 1,5 A TBT With resistive load 2 A TBT

10 Fig. 2.1 INGEPAC DA-CU connection diagram MODULE: 15 DI AND 8 DO XC 24/48 Vdc CC 12 Vdc Output power TBT TBT Digital inputs Number of inputs 15 TBT Voltage levels Vdc TBR TBT Inactive below: 13 Vdc TBR TBT Burden <3 ma TBT Digital output Number of outputs 8 TBT Carry (Permanent) 5 A at 25 ºC TBT Make (1 s.) 30 A TBT Operating time 8 ms TBT Trip or close capacity (L/R = 40 ms) 1,5 A TBT With resistive load 2 A TBT

11 Fig DI AND 8 DO MODULE connection diagram MODULE: 24 DI AND 16 DO (3NC) XM 24/48 Vdc CM 12 Vdc Output power TBT TBT Digital inputs Number of inputs Voltage levels Vdc TBR TBT Inactive below: 13 Vdc TBR TBT Burden <3 ma TBT Digital outputs Number of outputs 16 (3NC) 16 (3NC) Carry (Permanent) 5 A at 25 ºC TBT Make (1 s.) 30 A TBT Operating time 8 ms TBT Trip or close capacity (L/R = 40 ms) 1,5 A TBT With resistive load 2 A TBT

12 Fig DI AND 16 DO MODULE connection diagram MODULE: 15 DI AND16 DO XT 24/48 Vdc CT 12 Vdc Output power TBT TBT Digital inputs Number of inputs 15 TBT Voltage levels VdcTBT TBT Inactive below: 13 VdcTBT TBT Burden <3 ma TBT Digital output Number of outputs 16 TBT Carry (Permanent) 5 A at 25 ºC TBT Make (1 s.) 30 A TBT Operating time 8 ms TBT Trip or close capacity (L/R = 40 ms) 1,5 A TBT With resistive load 2 A TBT

13 Fig DI AND 16 DO MODULE connection diagram MODULE: 8 DC / 13 DI XN 24/48 Vdc CN 12 Vdc Output power Digital inputs Number of inputs Voltage levels Vdc TBT TBT Inactive below: 13 VdcTBT TBT Burden <3 ma TBT Analog Number of inputs 8 Resolution 15 bits + 1 sign bit Input impedance 50 kω (tensión) / 66,5Ω (corriente) Isolation (for 1 minute) 2000 Vrms Precisión (25⁰C) 0.05% Measurement range (±10%) Voltage: Current: ±10 V ±25 ma ±5 ±1 V ±20 ma ±10 ma ±5 ma Continuous load without destruction Voltage: Current: 40 V / 0.5 ma 40 ma

14 Fig. 2.5 MODULE: 8 DC / 15 DI Connection diagram (TBR)

15 3 Housing 3.1 1/3 19 Housing Front View Fig /3 19 Front View

16 Element 1 USB 2 SP 0 3 Status LED 4 Status and configurable LEDs 5 I / O Leds Fig. 3.2 Status and confgiurable LEDs

17 3.1.2 Rear View Fig /3 19 Rear View Element 1 ETH 1 2 ETH 2 3 SP 1 4 Status LED 5 Power LED

18 3.2 DA2505-2/3 19 Housing Front View Fig /3 19 Front View

19 Element 1 USB 2 SP 0 3 Status LED 4 Status and configurable LEDs 5 I / O LEDs Fig. 3.5 Status and confgiurable LEDs

20 3.2.2 Rear View Fig /3 19 Rear View Element 1 ETH 1 2 ETH 2 3 SP 1 4 Status LED 5 Power LED

21 3.1 DA Compact Housing Front View. Fig. 3.7 Compact Front View Element 1 ETH 1 2 ETH 2 3 Status and configurable LEDs 4 SP 0 5 SP 1 6 USB 7 Power LED 8 Status LED 9 I / O LEDs

22 Fig. 3.8 Status and confgiurable LEDs Rear View. Fig. 3.9 Compact Rear View

23 4 Communication Protocols INGEPAC DA-CU can work with the following communication standards and protocols: Protocol Master (or Client) Slave (or Server) IEC X X IEC X X IEC X X DNP3 TCP and Serial X X MODBUS TCP and RTU X X Procome X 4.1 Configuration points INGEPAC DA-CU have been proven with the following maximum recommended configurations. Function Points Measures Commnads IEC Client IEC IEC DNP MODBUS Procome 5 Time Synchronization The equipment can be synchronised using the following methods: Protocol Master Slave Precision SNTP X X TBT IEC X X TBT IEC X X TBT DNP3 X X TBT 6 Logic Programming Logic editing in the INGEPAC DA-CU equipment complies with the directives defined by the IEC standard. It is possible to program in the following languages: Structured text (ST). Function Block Diagram (FBD).

24 7 Configuration Software INGEPAC DA-CU is fully configurated with the engineering software INGESYS efs. INGESYS efs is a powerful, native IEC61850 framework, specifically developed by INGETEAM to support the IEC61850 standards and derived standards simply and intuitively. INGESYS efs facilitates engineering tasks in automation systems, covering all the concepts associated with the following: Protection functions. Control functions. Telecontrol functions. Measurements. Architectural design and electrical diagrams. Definition of operational concepts. Transfer of information and configurations. Integration of other communication protocols. Regulatory configuration files. Etc. INGEPAC DA-CU stores information about system events and commands. This information can be audited with INGESYS efs.

25 8 Standards and Tests Electromagnetic Emissions Conducted radio-electric emissions IEC (2000) Class B measurement in DC power supply terminals. EN (2006) IEC (2000) Class A Radiated radio-electric emissions EN (2006) measurements. EN (2007) Insulation Dielectric strength measurement IEC (2000) 2 kvac Insulation resistance measurement IEC (2000) 500 Vdc, >100 Mohm Isolation measurement with voltage +5 kv IEC (2000) pulses. Immunity Electrostatic discharges IEC (2001) Level 4, +8 kv/+15 kv Radiofrequency electromagnetic field IEC (2006) Level V/m Fast transient bursts IEC (2004) Level 4, +4 kv, 5KHz CM: +4 kv Surges or shockwaves IEC (2006) PS: +2 kv I/O DM: +2 kv Radiofrequency-induced signals Level 3, 10 Vrms IEC (2007) (conducted disturbance) Electromagnetic field at industrial Level 5, 100 A/m 1000 A/m 1s IEC (2001) frequency (50 Hz) Pulsed magnetic fields IEC (2001) 1000 A/m Dampened magnetic field IEC (2001) Level 5, 100 A/m Damped wave IEC (2001) Level 3, +2.5 kv / +1 kv Ripple IEC (2001) 15% Dips, variations and no-voltages IEC (2000) 560 ms IEC (1979) Low frequency signals immunity IEC (2003) MC: 300 Vrms MD: 150 Vrms Climatic Cold test IEC (1994) -40 C, 16 h Dry heat test IEC (1994) 85 C, 16 h Temperature variation test IEC (1994) -25ºC / 70ºC Continuous humidity heat test IEC (1994) 40ºC+2ºC, 93% 4 days Mechanical Vibration test (sinusoidal) IEC (1998) Class I Vibration random EN (2008) Hz ASD 1 m2/s3 Shock and bump IEC (1998) Class I

26 Seismic Seismic tests IEC (1993) Class 1 Drop ETSI EN (1999) IP protection grade: UNE EN (1993) IP30 Frontal IP32

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