User Manual. Installation Manual TSC-300X. VPX Raid Controller Board for 3U VPX Systems

Transcription

1 Installation Manual User Manual TSC-300X VPX Raid Controller Board for 3U VPX Systems

2 TSC-300X TSC-300X TSC-300X TSC-300X TSC-300X TSC-300X TSC-300X TSC-300X TSC-300X TSC-300X TSC-300X TSC-300X TSC-300X TSC-300X VPX Raid Controller Board for 3U VPX Systems VPX Raid Controller Board for 3U VPX Systems VPX Raid Controller Board for 3U VPX Systems VPX Raid Controller Board for 3U VPX Systems VPX Raid Controller Board for 3U VPX Systems VPX Raid Controller Board for 3U VPX Systems VPX Raid Controller Board for 3U VPX Systems

3 TSC-300X Installation Manual Version 1.0 November 2011 Americas and Pacific Rim Bayside Parkway Fremont, CA Phone (510) Fax (510) World Wide Web Rest of World 5 Rue Irene Joliot-Curie Eybens, France Phone Fax

4 Copyright 2011, Inc. ALL RIGHTS RESERVED. No part of this publication may be reproduced in any form, by photocopy, microfilm, retrieval system, or by any other means now known or hereafter invented without the prior written permission of. The information in this publication has been carefully checked and is believed to be accurate. However, assumes no responsibility for inaccuracies. retains the right to make changes to this publication at any time without prior notice. does not assume any liability arising from the application or use of this publication or the product(s) described herein. RESTRICTED RIGHTS LEGEND: Use, duplication, or disclosure by the United States Government is subject to the restrictions set forth in DFARS (c)(1)(ii) and FAR TRADEMARKS and SERVICEMARKS Themis is a registered trademark of, Inc. All other trademarks, servicemarks, or registered trademarks used in this publication are the property of their respective owners. CE Marking This product complies with the European EMC Directive (2004/108/EC) and the European Low Voltage Safety Directive (2006/95/EC)/. Safety Precautions Instructions regarding safety precautions during installation, operation, or maintenance of the equipment are given in the section entitled Safety Instructions on page iv. WARNINGS and CAUTIONS The definitions of WARNINGS and CAUTIONS as used in this document are given in the Preface in the section entitled Notes, Cautions, Warnings, and Sidebars. Themis Customer Support North America, South America, and Pacific Rim Telephone: Fax: support@themis.com Web Site: TSC-300X Installation Manual, Version 1.0 November 2011 Part Number:

5 TSC-300X Installation Manual Version Revision History Version November 2011 iii

6 TSC-300X Installation Manual Version 1.0 Safety Instructions To maximize user safety and ensure correct device operation, all instructions contained in this section should be read carefully. Caution: It is important that the user observe all warnings and instructions that are on the device and contained in this manual. The device must be used in accordance with the instructions for use. Electrical installations in the room must correspond to the requirements of respective regulations. Take care that there are no cables, particularly mains cables, in areas where persons can trip over them. Do not use a mains connection in sockets shared by a number of other power consumers. Do not use an extension cable. Only use the mains cable supplied. The unit is completely disconnected from the power source only when the power cord is disconnected from the power source. Therefore the power cord and its connectors must always remain easily accessible. Do not set up the device in the proximity of heat sources or in a damp location. Make sure the device has adequate ventilation. All connection cables must be screwed or locked to the chassis housing. The device is designed to be used in horizontal position only. The device is no longer safe to operate when the device has visible damage or the device no longer functions. In these cases, the device must be shut down and secured against unintentional operation. Repairs may only be carried out by a person authorized by. If extensions are made to the device, the legal stipulations and the device specifications must be observed. iv

7 TSC-300X Installation Manual The device must be switched off when removing the top cover. Operation of Laser Source Devices Do not allow yourself to be exposed to any radiation emitted by fiber-optic laser sources. Optical transceivers are Class 1 Laser Products and comply with US FDA regulations. These products are certified by TÜV and CSA to meet the Class 1 eye safety requirements of EN (IEC) and the electrical safety requirements of EN (IEC) Electrostatic Discharge (ESD) A sudden discharge of electrostatic electricity can destroy static-sensitive devices or micro-circuitry. Proper packaging and grounding techniques are necessary precautions to prevent damage. Always take the following precautions: 1. Transport boards in static-safe containers such as boxes or bags. 2. Keep electrostatic-sensitive parts in their containers until they arrive at staticfree stations. 3. Always be properly grounded when touching a sensitive board, component, or assembly. 4. Store electrostatic-sensitive boards in protective packaging or on conductive foam. Grounding Methods Guard against electrostatic damage at workstations by following these steps: 1. Cover workstations with approved anti-static material. Provide a wrist strap connected to a work surface and properly grounded tools and equipment. 2. Use anti-static mats, heel straps, or air ionizers to give added protection. 3. Handle electrostatic-sensitive components, boards, and assemblies by the case or the PCB edge. 4. Avoid contact with pins, leads, or circuitry. v

8 TSC-300X Installation Manual Version Turn off power and input signals before inserting and removing connectors or test equipment. 6. Keep the work area free of non-conductive materials such as ordinary plastic assembly aids and Styrofoam. 7. Use field service tools, such as cutters, screwdrivers, and vacuums that are conductive. 8. Always place drives and boards PCB-assembly-side down on the foam. vi

9 Table of Contents Version Revision History... iii Safety Instructions... iv Preface... xi 1. Overview and Specifications Overview TSC-300X Raid Controller Board Description Key Features Specifications General Packaging and Shipping Installation, Configuration and Operation Configuring the TSC-300X Jumpers Assembling the Module Installing the TSC-300X Modules Removing the TSC-300X Modules Powering Up and Configuring the TSC-300X RAID Controller Module Configuring the RAID Controller BIOS Setting Up RAID Volumes Other Configuration Tasks Viewing IS Volume Properties Activating an Array Deleting an Array Locating a Disk Drive, or Multiple Disk Drives In a Volume Selecting a Boot Disk Appendix A. Connector Pinouts and Signals... A-1 A.1 TSC-300X Sockets and Pinouts... A-1 A.2 XMC Connector Pinouts... A-2 vii

10 TSC-300X Installation Manual Version 1.0 A.3 J11 Connector Pinouts... A-4 A.4 J12 Connector Pinouts... A-6 A.5 J13 Connector Pinouts... A-7 A.6 J14 Connector to Carrier Board P2 and Backplane J2 Pins... A-9 A.7 VPX Backplane Connectors... A-12 A.7.1 Connector P0... A-12 A.7.2 Connector P1... A-13 A.7.3 Connector P2... A-15 Appendix B. Repackaging Instructions...B-1 B.1 Repackaging for Shipment...B-1 B.2 Packaging Components...B-2 B.3 Instructions for Repackaging...B-3 Index... Index-1 Reader Comment Card viii

11 Table of Contents List of Figures Figure 1 TSC-300X Raid Controller Board... xi Figure 1-1 TSC-300X Raid Controller Board Figure 1-2 Typical 3U VPX System Figure 1-3 Module Covers Figure 1-4 Assembled Module Figure 1-5 TSC-300X Block Diagram Figure 2-1 TSC-300X jumpers Figure 2-2 Module Order of Assembly Figure 2-3 Keyed mounting pins Figure 2-4 Chassis Backplane Figure 2-5 Remove the access cover Figure 2-6 3U VPX Module Figure 2-7 Wedge-Lok Locking Devices Figure 2-8 3U VPX Module Insertion Figure 2-9 BIOS Boot Message Figure 2-10 Adapter List Screen Figure 2-11 Adapter Properties Screen Figure A-1 TSC-300X Sockets... A-1 Figure B-1 Packaging Components... B-2 Figure B-2 Order of Assembly... B-4 List of Tables Table 1-1 TSC-300X General Specifications Table 2-1 TSC-300X Jumper Descriptions Table A-1 XMC Connector Pinouts... A-2 ix

12 TSC-300X Installation Manual Version 1.0 Table A-2 J11 Connector Pinouts... A-4 Table A-3 J12 Connector Pinouts... A-6 Table A-4 J13 Connector Pinouts... A-7 Table A-5 J14 Connector to Carrier Board P2 and Backplane J2 Pins... A-9 Table A-6 Connector P0 Pinout... A-12 Table A-7 Signal Decoding... A-13 Table A-8 Connector P1 Pinout... A-13 Table A-9 Connector P2 Pinout... A-15 x

13 Preface This document, entitled TSC-300X Installation Manual, provides instructions on how to install, configure, and power up the TSC-300X (see Figure 1). The TSC-300X is a conduction cooled RAID Controller card which includes an onboard PCI-e XMC/PMC carrier port for integrating I/O cards into 3U VPX systems. An overview of TSC-300X design and specifications is given in Chapter 1, Figure 1. TSC-300X Raid Controller Board "Overview and Specifications", of this manual. xi

14 TSC-300X Installation Manual Version 1.0 Notes, Cautions, Warnings, and Sidebars The following icons and formatted text are included in this document for the reasons described: Note: A note provides additional information concerning the procedure or action being described. Caution: A caution describes a procedure or action that may result in damage to the equipment. This may involve but is not restricted to heavy equipment or sharp objects. To reduce the risk, follow the instructions accompanying this symbol. Warning: A warning describes a procedure or action that may cause injury or death to the operator as a result of hazardous voltages. To reduce the risk, follow the instructions accompanying this symbol. Sidebar: A sidebar adds detail to the section within which it is placed, but is not absolutely vital to the description or procedure of the section. Website Information corporate and product information may be accessed on the World Wide Web by browsing the website xii

15 Preface Your Comments are Welcome Your Comments are Welcome We are interested in improving our documentation and welcome your comments and suggestions. You can your comments to us at Please include the document part number in the subject line of your . xiii

16 TSC-300X Installation Manual Version 1.0 xiv

17 General Section Chapter 1TSC-300X Overview and Specifications 1.1 Overview The TSC-300X is a conduction cooled RAID Controller card which includes an onboard General Purpose PCI-e XMC/PMC carrier port for integrating I/O cards into 3U VPX systems.(see Figure 1-1). A typical 3U VPX System is pictured in Figure 1-1. TSC-300X Raid Controller Board 1-1

18 TSC-300X Installation Manual Version 1.0 Figure 1-2. This 3U VPX system comprises a family of modules packaged in an ARINC 1/2 Air Transport Rack (ATR) chassis form factor. Eight slot chassis 3U VPX modules Figure 1-2. Typical 3U VPX System These systems may include a number of different conduction-cooled VPX modules that allow for tailoring a system to fit many different missions. The TSC-300X RAID Controller/IO Carrier Board supports that flexibility by providing an 8-port RAID controller as well as connectivity and physical support for an XMC/PMC IO card with a bus path for the XMC/PMC card. All off-board connectivity is through the VPX backplane including the 8 SAS/SATA ports and an I/O path from the XMC/PMC card to the outside of the chassis through a passive backplane TSC-300X Raid Controller Board Description The TSC-300X 3U VPX RAID Controller Board is capable of supporting up to eight SAS/SATA hard drives connected through the backplane. The board features onboard storage of user defined parameters, BIOS and mirroring data. (See Figure 1-5 on page 1-4 for a block diagram.) It includes a PMC/XMC site using PCIx/PCIe. The PMC/XMC I/O Carrier site supports non-graphics cards. It comes with full conduction cooled mechanicals including REDI module covers. (See Figure 1-3 on page 1-3). 1-2

19 1 Overview and Specifications Overview Figure 1-3. Module Covers Figure 1-4. Assembled Module The backplane interface includes PCIe as well as SAS/SATA lane and return lines for an I/O card mounted to this carrier. PMC and XMC connectors with supporting 1-3

20 TSC-300X Installation Manual Version 1.0 logic are provided. VPX P0, P1 and P2 Connectors SMBus 64-BIT PMC I/O FRU EEPROM PCIe x8 PCIe x4 PEX 8114 PCIe to PCI-X Bridge PCIe x8 PEX Port PCIe GEN2 Switch PCI-X PCIe x8 (8) SAS or SATA GEN 2 (3Gb/s) Ports w/ RAID capability I/O PMC (64 bit) XMC (GEN2) EXPANSION SITE LSI SAS1068E PCIE-Based RAID Controller FLASH EEPROM NVSRAM Key Features Figure 1-5. TSC-300X Block Diagram Conduction cooled 3U VPX module with REDI covers. Up to eight SAS/SATA drives supported. Up to 3 Gb/s SAS and SATA data transfer rates per port, full duplex. Utilizes the LSI 1068e RAID controller and MegaRAID Software Utility. On-board user storage setup. Supports RAID 0, 1 and 10 in hardware. Features a Secure Erase interface output to a XVPX-9750 drive carrier board. PMC PCIx 133MHz, 32/64 bit, XMC with PCIe x8, GEN 2.0 PMC/XMC ports. Supports Microsoft Windows, Linux and Solaris 10. SMI bus FRU with module part number, module temperature and health of the module accessible via a Themis chassis management card. 1-4

21 1 Overview and Specifications 1.2 Specifications General Table 1-1. TSC-300X General Specifications Parameter Dimensions, assembled w/mechanicals (nominal) Weight, assembled w/mechanicals (nominal) Temperature Operating: Non-Operating: Relative Humidity Shock Vibration 6.81 (17.3 cm) high 3.94 (10 cm) wide 1 (2,54 cm) deep Description.90 lbs (410 g) The empty shipping container weighs approximately 2 lbs (906 g) 40 up to 85 C ( 40 up to 185 F) 50 to 100 C ( 58 to 212 F) 0% to 95% (non-condensing) msec Random, 0.1g2/Hz Hz per MIL-STD-810E ~12g RMS 1.3 Packaging and Shipping The TSC-300X is packaged in a reusable shipping container. Approximate weight of an empty container, with packing material, is 2 pounds (906 g). The approximate weight of a TSC-300X with included hardware is.90 pound (410 g). Therefore, both the shipping container and a fully installed TSC-300X, including manual and associated paperwork, weigh approximately 3 pounds (1.36 kg). If it becomes necessary for any reason to return your TSC-300X unit back to Themis, it is very important that the original packaging materials be used according to the repackaging instructions found in Appendix B. 1-5

22 TSC-300X Installation Manual Version

23 2RES-31XR3 Installation Section Chapter 2 Installation, Configuration and Operation This chapter describes how to install and configure the TSC-300X RAID controller/carrier board in a system and make it operational. This process involves a number of steps. This chapter will lead the user through the following: Configuring for a PMC/XMC card by setting jumpers Installing the PMC/XMC card Assembling the card with the module covers Installing the module into the system. Powering up the module and configuring the RAID controller. Caution: Use industry-standard ESD grounding techniques when handling all components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. Handle all IC cards by the front panel or edges only. 2.1 Configuring the TSC-300X Jumpers The TIOC-300X Carrier Board may be configured using the jumpers provided. Leg- 2-1

24 TSC-300X Installation Manual Version 1.0 ends for the jumpers are depicted in Figure 2-1. Jumpers and Legends Figure 2-1. TSC-300X jumpers Table 2-1 lists the Jumper descriptions. Table 2-1. TSC-300X Jumper Descriptions Jumper CLKSEL FRUSEL ORB PEXSPD Description Selects Common (REFCLK) or non-common (Onboard) clock (default). Selects 3.3V (default) or 3.3V AUX to power FRU & Temp. Stitches Chassis Ground (ORB ) to Digital (default). Selects PCIE Switch Speed - GEN1 or GEN2 (default) or GEN1 Only. 2-2

25 2 Installation, Configuration and Operation 2.2 Assembling the Module The TSC-300X is furnished with REDI covers which provide protection, Top PMC Mezzanine Card Frame TSC-300X RAID Board Bottom Tray Figure 2-2. Module Order of Assembly 2-3

26 TSC-300X Installation Manual Version 1.0 rigidity, and aid in conduction cooling. They are assembled to the board as depicted in Figure 2-2. To assemble the module, follow these steps, referring to Figure 2-2 on page 2-3: 1. Before starting the assembly, check the bottom tray for cleanliness, free from metal flakes and other foreign debris. 1. Mate the TSC-300X carrier board to the bottom tray. Insert 4 #2 socket-head mounting screws using Loctite 242, and tighten. 2. Install the center frame to the bottom tray and board assembly. Insert 4 #4 flathead mounting screws, using Loctite 242, and tighten. 3. If installing a PMC/XMC mezzanine card, mate the PMC/XMC card to the TSC-300X board. Insert 16 #2 socket-head mounting screws, using Loctite 242, and tighten. 4. Fit the top cover to the assembly. Insert 4 flat head Phillips screws, using Loctite 242, and tighten. 2.3 Installing the TSC-300X Modules The TSC-300X is a special purpose module, and may make the module slot-dependent in a given chassis. This module supports keyed guide pins on a backplane to inhibit cards from being plugged into the wrong slot. See Figure 2-4. Contact the factory to purchase different key receptacles if the ones on this card do not match the 2-4

27 2 Installation, Configuration and Operation Installing the TSC-300X Modules slot for your intended purpose. Figure 2-3 shows the module mounting holes and Match the pin to the hole Figure 2-3. Keyed mounting pins backplane mounting pins. Figure 2-4. Chassis Backplane To install modules in the 3U VPX system, follow the steps below: 2-5

28 TSC-300X Installation Manual Version Remove the access cover of the chassis. See Figure 2-5 for one example. Figure 2-5. Remove the access cover 2. In this example, orient the module so that the solder side of the circuit board faces to the rear (fan side) of the chassis.. Locking Screws Indicates solder side of circuit board Wedge-Lok locking devices Figure U VPX Module 2-6

29 2 Installation, Configuration and Operation Installing the TSC-300X Modules 3. Determine the slot in which to install the module. Check that the mounting pins in the backplane match the keying in the mounting holes of the module. (See Figure 2-3). Locking Screw Keying Slots Wedge-Lok locking devices Figure 2-7. Wedge-Lok Locking Devices 4. Open the locking levers. (See Figure 2-8 on page 2-8). Each module has Wedge-Lok locking devices, (See Figure 2-7), which are designed to expand to prevent any slight movement of the module. These Wedge- Lok locking devices serve to lock the module into position to both contribute to its shock worthiness, and to aid in the conduction cooling process. It s therefore important to expand the Wedge-Lok locking devices after module insertion. 5. It will be necessary to hold the Wedge-Lok locking devices flush in order to insert the board. (See Figure 2-7). Use fingertip pressure to hold the Wedge- Lok locking devices flush while inserting the module. (See Figure 2-8). 2-7

30 TSC-300X Installation Manual Version 1.0 Note that there are two sets of Wedge-Lok locking devices which need to be held flush. Locking Levers 6. Once both sets of Wedge-Lok locking devices are inserted, gently seat the module fully in its slot, and close the Locking Levers. 7. Tighten the Locking Screws to expand the Wedge-Lok locking devices, locking the module into place. Suggested torque setting is 6 in-lbs Removing the TSC-300X Modules 1. Loosen the Locking Screws to free the Wedge-Lok locking devices. (Use caution not to over loosen the screws to avoid dropping Wedge-Lok pieces off the module when it is removed.) 2. Open the Locking Levers. Figure U VPX Module Insertion 3. Pull the module straight out from its slot. 2.4 Powering Up and Configuring the TSC-300X RAID Controller Module Apply power to the 3U VPX system in accordance with the power up procedures provided for the system in which the module is installed. Observe the power up indications to verify a normal powering up process. During the system boot process, the 2-8

31 2 Installation, Configuration and Operation boot messages will include the RAID controller BIOS boot message. The TSC-300X RAID Controller Board employs the LSISAS1068E RAID Controller, which uses Fusion-MPT architecture. There are a number of options for configuring the RAID Controller. The LSI web site lists its MegaRAID Storage Manager (MSM) software at the following URL, where it is available for download: MSM software and drivers are available for Linux and Windows platforms. The RAID Controller may also be configured using the SAS Configuration Utility, (CU), which is part of the BIOS installed on the card Configuring the RAID Controller BIOS The BIOS SAS Configuration Utility offers three components of Integrated RAID; Integrated Mirroring (IM), (RAID1), which supports two-disk mirrored arrays and hot spare disks. Integrated Mirroring Enhanced (IME), (RAID1E), which supports mirrored arrays with three to eight disks, plus hot spares. Integrated Striping (IS), (RAID0), which supports striped arrays with two to eight disks. You can configure as many as two volumes, either two IM/IME volumes, two IS volumes, or one IM/IME volume and one IS volume, using a maximum of eight drives for the two volumes. In addition, you can create one or two hot spares for the IM/IME array(s). The following guidelines also apply when creating an IM or IME volume: All physical disks in a volume must be either SATA, (with extended command set support), or SAS, (with SMART support). SAS and SATA disks cannot be combined in the same volume. However, you can create one volume with SAS disks and a second volume with SATA disks on the same controller. Disks must have 512-byte blocks and must not have removable media. An IM volume must have two drives. An IME volume can have three to eight drives. In addition, one or two hot spares can be created for the IM/IME volume(s). Note: If a disk in an IM/IME volume fails, it is rebuilt on the global hot spare if one is available. We recommend that you always use hot spares with IM/IME volumes. Although you can use disks of different size, the smallest disk in the volume 2-9

32 TSC-300X Installation Manual Version 1.0 will determine the logical size of all disks in the volume. Only the space on a drive equal to the space on the smallest drive will be used Setting Up RAID Volumes The SAS Configuration Utility is invoked during the boot process. When the LSI Configuration Utility message appears during boot, press <Ctrl-C> to start the CU. (See Figure 2-9). Figure 2-9. BIOS Boot Message After pressing <Ctrl-C>, the message changes to: Please wait, invoking SAS Configuration Utility... After a brief pause, the following message appears: LSI Configuration Utility will load following initialization! The SAS BIOS CU will load after the system has completed its POST. When the 2-10

33 2 Installation, Configuration and Operation Powering Up and Configuring the TSC-300X RAID Controller Module SAS BIOS CU boots, it will present the Adapter List. (See Figure 2-10). Figure Adapter List Screen 1. Highlight with the <Arrow> keys the adapter listed and press <Enter>. The Adapter Properties screen will appear. Highlight with the <Arrow> keys RAID Properties and press <Enter>. (See Figure 2-11). Figure Adapter Properties Screen 2. The CU will present volume types to select. Select Create IS Volume, Create IM Volume, or Create IME Volume, and press <Enter>. 2-11

34 TSC-300X Installation Manual Version The CU presents The Create New Array screen which lists all the drives which have been discovered. Move the cursor to the RAID Disk column. To add a disk to the volume, change the NO to YES by pressing the + key, - key, or space bar. IM/IME Volume Only: When the first disk is added, the SAS BIOS CU prompts you to either keep existing data or overwrite existing data. Press M to keep the existing data on the first disk or press D to overwrite it. If you keep the existing data, this is called a data migration. The first disk will be mirrored onto the second disk, so any data you want to keep must be on the first disk selected for the volume. Data on the second disk is overwritten. The first disk must have 512-KB available for meta data after the last partition. Optional: Add one or two global hot spares by moving the cursor to the hot spare column and pressing the + key, - key, or space bar. As disks are added the Array Size field changes to reflect the size of the new volume. 4. When the volume has been fully configured, press C and then select Save changes then exit this menu to commit the changes Other Configuration Tasks Additional tasks may be performed with the BIOS SAS CU, such as: Viewing IS Volume Properties Activating an Array Deleting an Array Locating a Disk Drive, or Multiple Disk Drives in a Volume Selecting a Boot Disk Viewing IS Volume Properties Follow these steps to view the properties of IS volumes: 1. In the CU, select an adapter from the Adapter List. Select the RAID Properties Option 2. If more than one volume is configured, press <ALT-N> to view the next array 3. To manage the current array, press <Enter> when the Manage Array item is selected. 2-12

35 2 Installation, Configuration and Operation Powering Up and Configuring the TSC-300X RAID Controller Module Activating an Array An array can become inactive if, for example, it is removed from one controller or computer and moved to another one. The Activate Array option allows you to reactivate an inactive array that has been added to a system. this option is only available when the selected array is currently inactive. Follow these steps to activate a selected array. 1. Select Activate Array on the Manage Array screen. 2. Press Y to proceed with the activation, or press N to abandon it. After a pause, the array will become active Deleting an Array Caution: Before deleting an array, be sure to back up all data on the array that you want to keep. Follow these steps to delete a selected array: 1. Select Delete Array on the Manage Array screen. 2. Press Y to delete the array, or press N to abandon the deletion. After a pause, the firmware deletes the array. Note: Once a volume has been deleted, it cannot be recovered. The master boot records of all disks are deleted Locating a Disk Drive, or Multiple Disk Drives In a Volume You can use the SAS BIOS CU to locate and identify a specific physical disk drive by flashing the drive s LED, or all the disk drives in a RAID volume, however in normal use the drive LEDs will not be visible to the user if the drives are installed in a closed system. There are several ways to do this: When you are creating an IS volume, and a disk drive is set to YES as part of the volume, the LED on the disk drive is flashing, (but may not be visible to the user). The LED is turned off when you have finished creating the volume. You can locate individual disk drives from the SAS Topology screen. To do 2-13

36 TSC-300X Installation Manual Version 1.0 this, move the cursor to the name of the disk in the Device identifier column and press <Enter>. The LED on the disk flashes until the next key is pressed, (but may not be visible to the user). You can locate all the disk drives in a volume by selecting the volume on the SAS Topology screen. The LEDs flash on all the disk drives in the volume, (but may not be visible to the user) Selecting a Boot Disk You can select a boot disk in the SAS topology screen. This disk is then moved to scan ID0 on the next boot, and remains at this position. This makes it easier to set BIOS boot device options and to keep the boot device constant during device additions and removals. There can be only one boot disk. Follow these steps to select a boot disk: 1. In the SAS BIOS CU, select an adapter from the Adapter List. 2. Select the SAS Topology option. The current topology is displayed. If the selection of a boot device is supported, the bottom of the screen lists the Alt+B option. this is the key for toggling the boot device. If a device is currently configured as the boot device, the Device Info column on the SAS topology screen will show the word Boot. 3. To select a boot disk, move the cursor to the disk and press Alt+B. 4. To remove the boot designator, move the cursor down to the current boot disk and press Alt+B. This controller will no longer have a disk designated as boot. 5. To change the boot disk, move the cursor to the new boot disk and press Alt+B. The boot designator will move to this disk. Note: The firmware must be configured correctly in order for the Alt+B feature to work. 2-14

37 A Appendix Connector Pinouts and Signals This appendix provides connector pinouts and signal definitions for the TSC-300X. A.1 TSC-300X Sockets and Pinouts Figure A-1 shows I/O sockets on the TSC-300X Carrier Board J13 J14 19 A XMC J11 J12 1 A 1 63 F F P2 P1 P0 Figure A-1. TSC-300X Sockets A-1

38 TSC-300X Installation Manual Version 1.0 A.2 XMC Connector Pinouts XM C connector pinouts are shown in Table A-1. Table A-1. XMC Connector Pinouts Pin No. Signal Definition Pin No. Signal Definition A1 PET0p0 D1 PET0p1 A2 D2 A3 PET0p2 D3 PET0p3 A4 D4 A5 PET0p4 D5 PET0p5 A6 D6 A7 PET0p6 D7 PET0p7 A8 D8 A9 NC D9 NC A10 D10 A11 PER0p0 D11 PER0p1 A12 D12 A13 PER0p2 D13 PER0p3 A14 D14 A15 PER0p4 D15 PER0p5 A16 D16 A17 PER0p6 D17 PER0p7 A18 D18 A19 REFCLK+ D19 WAKE# B1 PET0n0 E1 PET0n1 B2 E2 A-2

39 A Connector Pinouts and Signals XMC Connector Pinouts Table A-1. XMC Connector Pinouts (Continued) Pin No. Signal Definition Pin No. Signal Definition B3 PET0n2 E3 PET0n3 B4 E4 B5 PET0n4 E5 PET0n5 B6 E6 B7 PET0n6 E7 PET0n7 B8 E8 B9 NC E9 NC B10 E10 B11 PER0n0 E11 PER0n1 B12 E12 B13 PER0n2 E13 PER0n3 B14 E14 B15 PER0n4 E15 PER0n5 B16 E16 B17 PER0n6 E17 PER0n7 B18 E18 B19 REFCLK- E19 NC C1 +3.3V F1 +5V C2 TRST# F2 MRST# C3 +3.3V F3 +5V C4 TCK F4 MRSTO# C5 +3.3V F5 +5V C6 TMS F6 +12V C7 +3.3V F7 +5V C8 TDI F8-12V C9 RPS F9 +5V A-3

40 TSC-300X Installation Manual Version 1.0 Table A-1. XMC Connector Pinouts (Continued) Pin No. Signal Definition Pin No. Signal Definition C10 TDO F10 GA0 C11 MBIST# F11 +5V C12 GA1 F12 MPRESENT# C13 3.3V AUX F13 +5V C14 GA2 F14 MSDA C15 RPS F15 +5V C16 MVMRO F16 MSCL C17 RFU F17 RFU C18 RPS F18 RPS C19 RPS F19 RPS A.3 J11 Connector Pinouts Table A-2. J11 Connector Pinouts Pin No. Signal Definition Pin No. Signal Definition 1 TCK 64 REQ64* 2-12V V6 4 INTA* 61 AD[0] 5 INTB* 60 AD[1] 6 INTC* 59 AD[2] 7 BUSMODE1* 58 AD[3] 8 +5V1 57 V_I/O4 9 INTD* A-4

41 A Connector Pinouts and Signals J11 Connector Pinouts Table A-2. J11 Connector Pinouts (Continued) Pin No. Signal Definition Pin No. Signal Definition 10 PCI-RSVD14B 55 AD[4] AD[5] 12 PCI-RSVD14A 53 AD[6] 13 PCICLK 52 C_BE*[0] V5 16 GNT* 49 AD[9] 17 REQ* 48 AD[11] 18 +5V2 47 AD[12] 19 V_I/O1 46 AD[15] 20 AD[31] 45 V_I/O3 21 AD[28] AD[27] 43 PAR 23 AD[25] 42 SB0* SDONE PLOCK* 26 C_BE*[3] AD[22] 38 +5V4 28 AD[21] 37 DEVSEL* 29 AD[19] 36 IRDY* 30 +5V V_I/O AD[17] 33 FRAME* A-5

42 TSC-300X Installation Manual Version 1.0 A.4 J12 Connector Pinouts Table A-3. J12 Connector Pinouts Pin No. Signal Definition Pin No. Signal Definition 1 +12V 64 PMC-RSVD_PN TRST* TMS V9 4 TDO 61 ACK64* 5 TDI 60 PMC-RSVD_PN PMC-RSVD_PN PCI-RSVD9A 57 PMC-RSVD_PN PCI-RSVD10B PCI-RSVD11A 55 PMC-RSVD_PN BUSMODE2* 54 PMC-RSVD_PN V V8 13 RST* 52 PMC-RSVD_PN BUSMODE3* 51 AD[7] V V7 16 BUSMODE4* 49 AD[8] 17 PCI-RSVD19A 48 AD[10] M66EN 19 AD[30] 46 AD[13] 20 AD[29] 45 AD[14] AD[26] 43 C_BE*[1] A-6

43 A Connector Pinouts and Signals J13 Connector Pinouts Table A-3. J12 Connector Pinouts (Continued) Pin No. Signal Definition Pin No. Signal Definition 23 AD[24] 42 SERR* V V6 25 IDSEL* AD[23] 39 PERR* V4 38 STOP* 28 AD[20] AD[18] V TRDY* 31 AD[16] 34 PMC-RSVD_PN C_BE*[2] 33 6 A.5 J13 Connector Pinouts Table A-4. J13 Connector Pinouts Pin No. Signal Definition Pin No. Signal Definition 1 PCI-RSVD1 64 PCI-RSVD C_BE[7]# 61 PCI-RSVD4 5 C_BE[6]# 60 PCI-RSVD3 6 C_BE[5]# 59 PCI-RSVD2 7 C_BE[4]# 58 AD[32] V_I/O4 9 V_I/O A-7

44 TSC-300X Installation Manual Version 1.0 Table A-4. J13 Connector Pinouts (Continued) Pin No. Signal Definition Pin No. Signal Definition 10 PAR64 55 AD[33] 11 AD[63] 54 AD[34] 12 AD[62] 53 AD[35] 13 AD[61] 52 AD[36] AD[60] 49 AD[37] 17 AD[59] 48 AD[38] 18 AD[58] 47 AD[39] 19 AD[57] 46 AD[40] ] 21 V_I/O AD[56] 43 AD[41] 23 AD[55] 42 AD[42] 24 AD[54] 41 AD[43] 25 AD[53] 40 AD[44] V_I/O AD[52] 37 AD[45] 29 AD[51] 36 AD[46] 30 AD[50] 35 AD[47] 31 AD[49] 34 AD[48] A-8

45 A Connector Pinouts and Signals J14 Connector to Carrier Board P2 and Backplane J2 Pins A.6 J14 Connector to Carrier Board P2 and Backplane J2 Pins Table A-5. J14 Connector to Carrier Board P2 and Backplane J2 Pins J14 Connector Pin No. J14 Signal Name Signal Description Carrier Board Connector P2 Pin No. Backplane Connector J2 Pin No. 1 IO1 PMC_IO1_DN E01 F01 2 IO2 PMC_IO2_DN B01 B01 3 IO3 PMC_IO1_DP D01 E01 4 IO4 PMC_IO2_DP A01 A01 5 IO5 PMC_IO3_DN F02 H02 6 IO6 PMC_IO4_DN C02 D02 7 IO7 PMC_IO3_DP E02 G02 8 IO8 PMC_IO4_DP B02 C02 9 IO9 PMC_IO5_DN E03 F03 10 IO10 PMC_IO6_DN B03 B03 11 IO11 PMC_IO5_DP D03 E03 12 IO12 PMC_IO6_DP A03 A03 13 IO13 PMC_IO7_DN F04 H04 14 IO14 PMC_IO8_DN C04 D04 15 IO15 PMC_IO7_DP E04 G04 16 IO16 PMC_IO8_DP B04 C04 17 IO17 PMC_IO9_DN E05 F05 18 IO18 PMC_IO10_DN B05 B05 19 IO19 PMC_IO9_DP D05 E05 20 IO20 PMC_IO10_DP A05 A05 A-9

46 TSC-300X Installation Manual Version 1.0 Table A-5. J14 Connector to Carrier Board P2 and Backplane J2 Pins (Continued) J14 Connector Pin No. J14 Signal Name Signal Description Carrier Board Connector P2 Pin No. Backplane Connector J2 Pin No. 21 IO21 PMC_IO11_DN F06 H06 22 IO22 PMC_IO12_DN C06 D06 23 IO23 PMC_IO11_DP E06 G06 24 IO24 PMC_IO12_DP B06 C06 25 IO25 PMC_IO13_DN E07 F07 26 IO26 PMC_IO14_DN B07 B07 27 IO27 PMC_IO13_DP D07 E07 28 IO28 PMC_IO14_DP A07 A07 29 IO29 PMC_IO15_DN F08 H08 30 IO30 PMC_IO16_DN C08 D08 31 IO31 PMC_IO15_DP E08 G08 32 IO32 PMC_IO16_DP B08 C08 33 IO33 PMC_IO17_DN D09 F09 34 IO34 PMC_IO18_DN B09 B09 35 IO35 PMC_IO17_DP D09 E09 36 IO36 PMC_IO18_DP A09 A09 37 IO37 PMC_IO19_DN F10 H10 38 IO38 PMC_IO20_DN C10 D10 39 IO39 PMC_IO19_DP E10 G10 40 IO40 PMC_IO20_DP B10 C10 41 IO41 PMC_IO21_DN E11 F11 42 IO42 PMC_IO22_DN B11 B11 43 IO43 PMC_IO21_DP D11 E11 44 IO44 PMC_IO22_DP A11 A11 45 IO45 PMC_IO23_DN F12 H12 A-10

47 A Connector Pinouts and Signals J14 Connector to Carrier Board P2 and Backplane J2 Pins Table A-5. J14 Connector to Carrier Board P2 and Backplane J2 Pins (Continued) J14 Connector Pin No. J14 Signal Name Signal Description Carrier Board Connector P2 Pin No. Backplane Connector J2 Pin No. 46 IO46 PMC_IO24_DN C12 D12 47 IO47 PMC_IO23_DP E12 G12 48 IO48 PMC_IO24_DP B12 C12 49 IO49 PMC_IO25_DN E13 F13 50 IO50 PMC_IO26_DN B13 B13 51 IO15 PMC_IO25_DP D13 E13 52 IO52 PMC_IO26_DP A13 A13 53 IO53 PMC_IO27_DN F14 H14 54 IO54 PMC_IO28_DN C14 D14 55 IO55 PMC_IO27_DP E14 G14 56 IO56 PMC_IO28_DP B14 C14 57 IO57 PMC_IO29_DN E15 F15 58 IO58 PMC_IO30_DN B15 B15 59 IO59 PMC_IO29_DP D15 E15 60 IO60 PMC_IO30_DP A15 A15 61 IO61 PMC_IO31_DN F16 H16 62 IO62 PMC_IO32_DN C16 D16 63 IO63 PMC_IO31_DP E16 G16 64 IO64 PMC_IO32_DP B16 C16 A-11

48 TSC-300X Installation Manual Version 1.0 A.7 VPX Backplane Connectors VPX Connectors are P0, P1, and P2 A.7.1 Connector P0 Table A-6. Connector P0 Pinout Pin No. Signal Definitions A +3.3V +3.3V +5V NVRAM_LOCK B +3.3V +3.3V +5V VPX_SYSRST# C +3.3V +3.3V +5V D nc nc nc -12V E +12V +12V +5V F +12V +12V +5V nc G +12V +12V +5V nc Pin No. Signal Definitions A B SMB_DATA SMBD_DATA/R1 SMBD_CLK/R2 SMB_CLK VPX_GA0# nc VPX_GA1# nc nc C nc D +3.3V_AUX nc nc E nc CK_100M_REF_DP F VPX_GA4# VPX_GA2# CK_100M_REF_DN G VPX_GAP# VPX_GA3# nc A-12

49 A Connector Pinouts and Signals VPX Backplane Connectors A.7.2 Connector P1 The following table explains the signal nomenclature. Table A-7. Signal Decoding Signal PCIE_VPX_8632_P0_DP PCIE_VPX_8632_P0_DN SATA_VPX_SAS_P0_DP SATA_VPX_SAS_P0_DN PCIE_8632_VPX_P0_DP PCIE_8632_VPX_P0_DN SATA_SAS_VPX_P0_DP SATA_SAS_VPX_P0_DN Meaning +PCIe data from backplane to GBe Switch -PCIe data from backplane to GBe Switch +SATA data from backplane to RAID SAS -SATA data from backplane to RAID SAS +PCIe data from GBe Switch to backplane -PCIe data from GBe Switch to backplane +SATA data from RAID SAS to backplane -SATA data from RAID SAS to backplane Table A-8. Connector P1 Pinout Signal Definition Pin No A PCIE_VPX_8632 _P0_DP PCIE_VPX_8632 _P2_DP B PCIE_VPX_8632 _P0_DN PCIE_VPX_8632 _P1_DP PCIE_VPX_8632 _P2_DN PCIE_VPX_8632 _P3_DP C PCIE_VPX_8632 _P1_DN PCIE_VPX_8632 _P3_DN D PCIE_8632_VPX _P0_DP PCIE_8632_VPX _P2_DP E PCIE_8632_VPX _P0_DN PCIE_8632_VPX _P1_DP PCIE_8632_VPX _P2_DN PCIE_8632_VPX _P3_DP A-13

50 TSC-300X Installation Manual Version 1.0 Table A-8. Connector P1 Pinout (Continued) Signal Definition F PCIE_8632_VPX _P1_DN PCIE_8632_VPX _P3_DN G unused unused Pin No A PCIE_VPX_8632 _P4_DP PCIE_VPX_8632 _P6_DP B PCIE_VPX_8632 _P4_DN PCIE_VPX_8632 _P5_DP PCIE_VPX_8632 _P6_DN PCIE_VPX_8632 _P7_DP C PCIE_VPX_8632 _P5_DN PCIE_VPX_8632 _P7_DN D PCIE_8632_VPX _P4_DP PCIE_8632_VPX _P6_DP E PCIE_8632_VPX _P4_DN PCIE_8632_VPX _P5_DP PCIE_8632_VPX _P6_DN PCIE_8632_VPX _P7_DP F PCIE_8632_VPX _P5_DN PCIE_8632_VPX _P7_DN G unused unused Pin No A SATA_VPX_SAS _P0_DP SATA_VPX_SAS _P2_DP B SATA_VPX_SAS _P0_DN SATA_VPX_SAS _P1_DP SATA_VPX_SAS _P2_DN SATA_VPX_SAS _P3_DP C SATA_VPX_SAS _P1_DN SATA_VPX_SAS _P3_DN D SATA_SAS_VPX _P0_DP SATA_SAS_VPX _P2_DP E SATA_SAS_VPX _P0_DN SATA_SAS_VPX _P1_DP SATA_SAS_VPX _P2_DN SATA_SAS_VPX _P3_DP F SATA_SAS_VPX _P1_DN SATA_SAS_VPX _P3_DN A-14

51 A Connector Pinouts and Signals VPX Backplane Connectors Table A-8. Connector P1 Pinout (Continued) Signal Definition G ZEROIZE_LED PURGE# Pin No A SATA_VPX_SAS _P4_DP SATA_VPX_SAS _P6_DP B SATA_VPX_SAS _P4_DN SATA_VPX_SAS _P5_DP SATA_VPX_SAS _P6_DN SATA_VPX_SAS _P7_DP C SATA_VPX_SAS _P4_DN SATA_VPX_SAS _P7_DN D SATA_SAS_VPX _P4_DP SATA_SAS_VPX _P6_DP E SATA_SAS_VPX _P4_DN SATA_SAS_VPX _P5_DP SATA_SAS_VPX _P6_DN SATA_SAS_VPX _P7_DP F SATA_SAS_VPX _P5_DN SATA_SAS_VPX _P7_DN G ZEROIZE# unused A.7.3 Connector P2 Table A-5 on page A-9 correlates P2 signals to J14. Table A-9. Connector P2 Pinout Signal Definition Pin No A PMC_IO2_DP PMC_IO6_DP B PMC_IO2_DN PMC_IO4_DP PMC_IO6_DN PMC_IO8_DP C PMC_IO4_DN PMC_IO8_DN D PMC_IO1_DP PMC_IO5_DP E PMC_IO1_DN PMC_IO3_DP PMC_IO5_DN PMC_IO7_DP A-15

52 TSC-300X Installation Manual Version 1.0 Table A-9. Connector P2 Pinout (Continued) Signal Definition F PMC_IO3_DN PMC_IO7_DN G SATA_ACT_LED0 SATA_ACT_LED1 Pin No A PMC_IO10_DP PMC_IO14_DP B PMC_IO10_DN PMC_IO12_DP PMC_IO14_DN PMC_IO16_DP C PMC_IO12_DN PMC_IO16_DN D PMC_IO9_DP PMC_IO13_DP E PMC_IO9_DN PMC_IO11_DP PMC_IO13_DN PMC_IO15_DP F PMC_IO11_DN PMC_IO15_DN G SATA_ACT_LED2 SATA_ACT_LED3 Pin No A PMC_IO18_DP PMC_IO22_DP B PMC_IO10_DN PMC_IO20_DP PMC_IO22_DN PMC_IO24_DP C PMC_IO20_DN PMC_IO24_DN D PMC_IO17_DP PMC_IO21_DP E PMC_IO17_DN PMC_IO19_DP PMC_IO21_DN PMC_IO23_DP F PMC_IO19_DN PMC_IO23_DN G SATA_ACT_LED4 SATA_ACT_LED5 Pin No A PMC_IO26_DP PMC_IO30_DP B PMC_IO26_DN PMC_IO28_DP PMC_IO30_DP PMC_IO32_DP C PMC_IO28_DN PMC_IO32_DN D PMC_IO25_DP PMC_IO29_DP E PMC_IO25_DN PMC_IO27_DP PMC_IO29_DN PMC_IO31_DP A-16

53 A Connector Pinouts and Signals VPX Backplane Connectors Table A-9. Connector P2 Pinout (Continued) Signal Definition F PMC_IO27_DN PMC_IO31_DN G SATA_ACT_LED6 SATA_ACT_LED7 A-17

54 TSC-300X Installation Manual Version 1.0 A-18

55 B Appendix Repackaging Instructions B.1 Repackaging for Shipment If it becomes necessary for any reason to return your TSC-300X unit back to Themis, it is very important that the original packaging materials be used according to the repackaging instructions found in this appendix. Themis has qualified all of its shipping materials to meet the highest of standards and the rigors of today s shipping methods, thus insuring total protection of the product during delivery. Failure to use original packaging materials, exactly as described in this appendix may invalidate the warranty. If the original packaging is no longer serviceable, or no longer available, please contact Themis Customer Support for a new shipping box to send back your XV1. When using the original packaging, please remember to place your TSC- 300X back into the static protection bag. Caution: Failure to use the original Themis packaging materials, and failure to follow the instructions of this Appendix C, may invalidate the warranty. The following instructions assume the original packaging components are still available, and in serviceable condition. If not, please contact Themis for a new shipping box and packaging components for your TSC-300X. B-1

56 TSC-300X Installation Manual Version 1.0 B.2 Packaging Components The original packaging components are shown in Figure B-1. They comprise a packaging box, perimeter crush resistant foam, and upper (perimeter) crush-resistant removable foam pieces to accommodate all TSC-300X variations. The top and bottom crush-resistant foam layers are identical components, placed so that the flat side is always facing up (opening of box). Removable Foam Blocks For Customization Perimeter Foam Bottom and Top Inserts Figure B-1. Packaging Components B-2

57 B Repackaging Instructions Instructions for Repackaging B.3 Instructions for Repackaging Re-assemble the packaging material about the equipment in accordance with the following instructions (see Figure B-2): 1. Inspect the original packaging materials for serviceability. 2. Place perimeter crush-resistant layer into the shipping box, making sure the corners of the foam fit snugly into the corners of the box. 3. Place the first top/bottom layer into the box, centered into the perimeter foam cutout. Make sure the flat side of the foam is facing up (opening of box). 4. Place the wrapped (static protection bag) TSC-300X on top of the layer (top/bottom layer) that was just inserted into the middle of the shipping box. 5. Place the remaining top/bottom layer directly on top of the wrapped TSC- 300X unit. Make sure the flat side of the foam is facing up (opening of box). 6. Make sure all components of the box are firmly in place, pressing down on the surface area of the foam to insure proper seating of the material. 7. Seal the top of the box with strong packaging tape, wrapping the tape completely around the box, both lengthwise, and crosswise. 8. Prepare for shipment in accordance with the instructions received from Themis Computer. Note: Please contact Themis if new packaging material, or shipping instructions are required. You can reach Themis at 1 (510) Mon Fri, 8am 5pm PST, or by to support@themis.com. B-3

58 TSC-300X Installation Manual Version 1.0 The order of assembly when repackaging the TSC-300X for shipment as shown in Figure B-2. Figure B-2. Order of Assembly B-4

59 Index A Activating an Array 2-13 antistatic bags 2-1 antistatic wrist strap 2-1 Assembling the Module 2-3 C Cautions xii Class 1 eye safety requirements v Class 1 Laser Products v Comments xiii Configuring the RAID Controller 2-9 Configuring the TSC-300X Jumpers 2-1 Connector P0 A-12 Connector P1 A-13 connector pinouts A-1 D Deleting an Array 2-13 E electrical safety requirements v ESD grounding techniques 2-1 protected mat 2-1 F FDA regulations. v G General Specifications 1-5 I Installing the TSC-300X Modules 2-4 Instructions for Repackaging B-3 J J11 Connector Pinouts A-4 J12 Connector Pinouts A-6 J13 Connector Pinouts A-7 J14 Connector to Carrier Board P2 and Backplane J2 Pins A-9 L Locating a Disk Drive, or Multiple disk Drives In a Volume 2-13 N Notes xii O Other Configuration Tasks 2-12 Overview 1-1 P Packaging and Shipping 1-5 Packaging Components B-2 Powering Up and Configuring the TSC-300X Raid Controller Module 2-8 R Removing the TSC-300X Modules 2-8 Repackaging for Shipment B-1 Repackaging Instructions B-1 S Safety Instructions iv Electrostatic Discharge (ESD) v Operation of Laser Source Devices v Selecting a Boot Disk 2-14 Setting Up RAID Volumes 2-10 Sidebars xii Index-1

60 TSC-300X Installation Manual Version 1.0 signal definitions A-1 Specifications 1-5 Dimensions 1-5 Relative Humidity 1-5 Shock 1-5 Temperature 1-5 Vibration 1-5 Weight 1-5 T TSC-300X Raid Controller Board 1-1 TSC-300X Raid Controller Board Description 1-2 TSC-300X Sockets and Pinouts A-1 V Viewing IS Volume Properties 2-12 VPX Connectors A-12 W Warnings xii Website Information xii X XMC Connector Pinouts A-2 Index-2

61 Place Stamp Here Bayside Parkway Fremont, CA Attn: Publications Department Fold here; tape at top to seal

62 Reader Comment Card We welcome your comments and suggestions to help improve the TSC-300X Installation Manual. Please take time to let us know what you think about this manual. Information provided in the manual was complete. Agree Disagree Not Applicable Information was well documented and easy to follow. Agree Disagree Not Applicable Information was easily accessible. Agree Disagree Not Applicable The manual was useful. Agree Disagree Not Applicable Please write down any comments you may have about this manual, including how it can be improved: Name: Title: Company: Address: