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17 POWER4+ Multi-Chip Module (MCM) * -&,#. L3 Cache L2 Cache POWER4 1.1GHz 1.3GHz 0,18 micron 115W 414 mm 2 32 MB 1.4 MB 174 POWER4+ 1.2GHz 1.45GHz 70W 265 mm 2 32 MB 1.5 MB GHz - 1.9GHz 0,13 micron Shared L2 Distributed switch Distributed switch Shared L2 Shared L2 Distributed switch Distributed switch Shared L2 POWER GHz Shared L2 Distributed switch 2-way POWER4+ SMP 8-way (4 chip) POWER4+ SMP %% + p690, p670p655

18 ! Peak /O Bandwidth 2 drawers x 6GB/s = 12GB/s 0 1 MCM 2 MCM 3 MCM 4 MCM L3 L3 L3 L , , ,2 102,4 Peak Memory Bandwidth 50 4 path x 12,8GB/s=51,2GB/s 1 MCM 2 MCM 3 MCM 4 MCM 400 L3 L3 L3 L ,4 ~ ,2 144,8 Peak CPU/Cache Bandwidth 4 chips x 18,1GB/s=72,4GB/s 1 MCM 2 MCM 3 MCM 4 MCM

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20 ! System (64 cabinets, 64x32x32) Cabinet (32 Node boards, 8x8x16) TeraFlops Node Board (32 chips, 4x4x2) 16 Compute Cards Compute Card (2 chips, 2x1x1) Chip (2 processors) 90/180 GF/s 8 GB DDR 5.6/11.2 GF/s 2.8/5.6 GF/s 0.5 GB DDR 4 MB 180/360 TF/s 16 TB DDR 2.9/5.7 TF/s 256 GB DDR BM BlueGene/L * BM BlueGene/P 10 1 BM Deep Blue * ASC White

21 Blue Gene # /! /! Processor Chip 48 processors 1 GF/s 1-2 GOP/s -)#! 48 GF/s 12 MB Board 24 chips 1.15TF/s 288 MB Rack 5 boards 5.75 TF/s 1.44 GB System 196 racks 1.1 PF/s 282 GB

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26 Special Notices This document was developed for BM offerings as of the date of publication. BM may not make these offerings available in other countries, and the information is subject to change without notice. Consult your local BM business contact for information on the BM offerings available in your area. nformation in this document concerning non-bm products was obtained from the suppliers of these products or other public sources. Questions on the capabilities of non-bm products should be addressed to the suppliers of those products. BM may have patents or pending patent applications covering subject matter in this document. The furnishing of this document does not give you any license to these patents. Send license inquires, in writing, to BM Director of Licensing, BM Corporation, New Castle Drive, Armonk, NY USA. All statements regarding BM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only. The information contained in this document has not been submitted to any formal BM test and is provided "AS S" with no warranties or guarantees either expressed or implied. All examples cited or described in this document are presented as illustrations of the manner in which some BM products can be used and the results that may be achieved. Actual environmental costs and performance characteristics will vary depending on individual customer configurations and conditions. BM Global Financing offerings are provided through BM Credit Corporation in the United States and other BM subsidiaries and divisions worldwide to qualified commercial and government customers. Rates are based on a customer's credit rating, financing terms, offering type, equipment type and options, and may vary by country. Other restrictions may apply. Rates and offerings are subject to change, extension or withdrawal without notice. BM is not responsible for printing errors in this document that result in pricing or information inaccuracies. All prices shown are BM's United States suggested list prices and are subject to change without notice; reseller prices may vary. BM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply. Many of the pseries features described in this document are operating system dependent and may not be available on Linux. For more information, please check: Any performance data contained in this document was determined in a controlled environment. Actual results may vary significantly and are dependent on many factors including system hardware configuration and software design and configuration. Some measurements quoted in this document may have been made on development-level systems. There is no guarantee these measurements will be the same on generally-available systems. Some measurements quoted in this document may have been estimated through extrapolation. Users of this document should verify the applicable data for their specific environment.

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