Huawei FusionServer RH8100 V3. Technical White Paper. Issue 04. Date HUAWEI TECHNOLOGIES CO., LTD.

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1 Huawei FusionServer RH8100 V3 Issue 04 Date HUAWEI TECHNOLOGIES CO., LTD.

2 2015. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd. Trademarks and Permissions and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd. All other trademarks and trade names mentioned in this document are the property of their respective holders. Notice The purchased products, services and features are stipulated by the contract made between Huawei and the customer. All or part of the products, services and features described in this document may not be within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information, and recommendations in this document are provided "AS IS" without warranties, guarantees or representations of any kind, either express or implied. The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied. Huawei Technologies Co., Ltd. Address: Website: Huawei Industrial Base Bantian, Longgang Shenzhen People's Republic of China i

3 Contents Contents Functions Appearance Ports Indicators and Buttons Physical Structure Compute Module Front I/O Module Logical Structure Topologies of QPI, PCIe, and Other Ports Huawei FusionPar Technology RAS Features Technical Specifications Advantages Product Features Product Specifications Component Compatibility Processor Memory Local Storage LOM Standard PCIe Card PSU OS Application Software Management Warranty Certifications Glossary ii

4 1.1 Functions 1.2 Appearance 1.3 Ports 1.4 Indicators and Buttons 1.5 Physical Structure 1.6 Logical Structure 1.7 RAS Features 1.8 Technical Specifications 1.9 Advantages 1.1 Functions This topic describes the basic functions of the Huawei RH8100 V3 server (RH8100 V3 for short). With the development of IT technologies, the performance of IT devices has been improved, and enterprises rely more and more on the IT devices. Key services are critical to enterprises and require highly reliable servers. To meet performance requirements of real-time data analysis in the Big Data era, in-memory databases need to provide large memory capacity, high computing capability, and good scalability. Some other applications, such as heavy-load virtualization applications and high-performance computing (HPC), also require high-performance, high-reliability servers. Openness is the trend of IT technologies. As the performance and reliability of Intel Xeon E7 processors have been improved continually, an increasing number of enterprise IT departments use open x86 servers to replace closed Reduced Instruction Set Computer (RISC) servers. Huawei RH8100 V3 is a high-end 8-socket rack server that adopts the latest Intel Xeon E v2 or v3 processors, and uses the latest Huawei server technologies. 1

5 The RH8100 V3 has high reliability, outstanding performance, a leading architecture, and an open and easy-to-use management platform, suited for mission-critical services, in-memory databases, virtualization, and HPC. For details about the single-system mode and dual-system mode in this topic, see Huawei FusionPar Technology. 1.2 Appearance This topic describes the appearance and panel of the RH8100 V3. Appearance Figure 1-1 shows the RH8100 V3 configured with the front I/O module of model A (FM-A). Figure 1-1 RH8100 V3 Front Panel Figure 1-2 and Figure 1-3 show the front panel of the RH8100 V3. Note: The RH8100 V3 supports three types of front I/O modules: 1. FM-A: provides performance-balanced configuration. FM-A supports up to six standard PCIe slots (working with PRMs) in addition to hard disks and RAID controller cards (PRM stands for PCIe riser module). These PCIe slots support PCIe solid-state drive (SSD) cards and graphics processing units (GPUs) but do not support standard cards that need to connect to external cables, for example, NICs, host bus adapters (HBAs), and InfiniBand (IB) cards. 2. Front I/O module of model B (FM-B): provides storage-enhanced configuration. FM-B supports up to 24 hard disks and two RAID controller cards, but not standard PCIe slots. 3. Front I/O module of model C (FM-C): provides basic configuration. FM-C supports up to eight hard disks and two RAID controller cards, but not standard PCIe slots. 2

6 Figure 1-2 Front panel of the RH8100 V3 with FM-A Table 1-1 Components on the RH8100 V3 front panel (with FM-A) 1 Compute module 2 Compute module slot indicator 3 Memory board button/status indicator 4 Memory board ATTN indicator 5 Memory backup indicator 6 Hard disk fault indicator 7 Hard disk active indicator 8 Hard disk 9 FM-A 10 Secondary power button/indicator 11 Secondary UID button/indicator 12 Secondary health indicator 13 VGA port 14 USB port 2 15 USB port 1 16 DVD-ROM drive 17 Primary UID button/indicator 18 Primary health indicator 19 Primary power button/indicator 20 LCD Table 1-2 Compute module slot layout CM-1 CM-2 CM-3 CM-4 CM-5 CM-6 CM-7 CM-8 3

7 Table 1-3 Memory board slot layout MemB-1 MemB-3 MemB-5 MemB-7 MemB-9 MemB-11 MemB-13 MemB-15 MemB-2 MemB-4 MemB-6 MemB-8 MemB-10 MemB-12 MemB-14 MemB-16 MemB stands for memory board. Table 1-4 FM-A hard disk slot layout HDD0 HDD3 HDD6 HDD9 HDD1 HDD4 HDD7 HDD10 HDD2 HDD5 HDD8 HDD11 Figure 1-3 Front panel of the RH8100 V3 with FM-B On the front panel shown in Figure 1-3, FM-B consists of two hard disk drawers, and either drawer supports twelve 2.5-inch hot-swappable hard disks. Therefore, FM-B supports up to 24 hot-swappable hard disks. For details, see Front I/O Module. 4

8 Figure 1-4 Front panel of the RH8100 V3 with FM-C Figure 1-4 shows the front panel of the RH8100 V3 with FM-C. FM-C supports up to eight hard disks. Table 1-5 shows the hard disk slot layout of FM-C. Table 1-5 FM-C hard disk slot layout HDD0 HDD2 HDD4 HDD6 HDD1 HDD3 HDD5 HDD7 Rear Panel Figure 1-5 shows the rear panel of the RH8100 V3. 5

9 Figure 1-5 Rear panel of the RH8100 V3 1 Primary UID indicator 2 USB port 3 Primary management network port 4 Serial port 5 VGA port 6 HFC-1 7 LOM 8 PCIe ATTN indicator 9 PCIe power indicator 10 PCIe card 1 (hot-swappable) 11 PCIe card hot swap button 12 PCIe card 2 (hot-swappable) 13 PCIe card 3 14 PCIe card 4 15 PCIe card 5 16 PCIe card 6 17 PCIe card 7 18 PCIe card 8 19 PCIe card 9 (hot-swappable) 20 PCIe card 10 (hot-swappable) 21 Network port connection status indicator 22 Network port data transmission status indicator 23 PSU status indicator 24 HFC-2 25 Secondary UID indicator 26 Fan status indicator 6

10 Table 1-6 PCIe slot layout on the BM (rear view, from left to right) Slot 1 Slot 2 Slot 3 Slot 4 Slot 5 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10 The back I/O module (BM) provides 10 standard PCIe slots. For details about these slots, see Table 1-7. The last two columns in Table 1-7 specify whether I/O address space is allocated to slots. Processors built on the Intel 64 or IA-32 architecture access I/O ports in the following ways: Separate I/O address space Memory-mapped I/O I/O address space in Table 1-7 is separate I/O address space. For details, see the Intel 64 and IA-32 Architectures Software Developer's Manual. For details about the single-system and dual-system modes mentioned in Table 1-7, see Huawei FusionPar Technology. For details about PCIe configuration requirements, see 4.5 Standard PCIe Card. Table 1-7 Standard PCIe slots on the BM PCIe Slot Compute Module a PCIe Standard Hot Swap I/O Address Space b Allocated to a PCIe Slot in Single-Syst em Mode I/O Address Space Allocated to a PCIe Slot in Dual-Syste m Mode Slot 1 CM-7 PCIe 3.0 x16 Supported Yes Yes Slot 2 CM-6 PCIe 3.0 x8 Supported Yes Yes Slot 3 CM-6 PCIe 3.0 x8 Not supported Slot 4 CM-6 PCIe 3.0 x8 Not supported Slot 5 CM-8 PCIe 3.0 x8 Not supported Slot 6 CM-4 PCIe 3.0 x8 Not supported Slot 7 CM-3 PCIe 3.0 x8 Not supported Slot 8 CM-3 PCIe 3.0 x8 Not supported Yes No No No No Yes Yes Yes Yes Yes Yes Yes Slot 9 CM-3 PCIe 3.0 x8 Supported Yes Yes Slot 10 CM-2 PCIe 3.0 x16 Supported Yes Yes 7

11 PCIe Slot Compute Module a PCIe Standard Hot Swap I/O Address Space b Allocated to a PCIe Slot in Single-Syst em Mode I/O Address Space Allocated to a PCIe Slot in Dual-Syste m Mode a: The PCIe slots mapping to a vacant compute module slot cannot be used. b: Some standard PCIe cards require I/O address space. A PCIe slot to which no I/O address space is allocated cannot hold a standard PCIe card that requires I/O address space. For details, see the RH8100 V3 Compatibility List. 1.3 Ports This topic describes the ports on the RH8100 V3. Table 1-8, Table 1-9, and Table 1-10 describe the external ports on the RH8100 V3. Table 1-8 Ports on the front panel Port Connecto r Type Qu anti ty Valid in Singl e-sys tem Mod e Valid in Dual- Syste m Mod e Description VGA port DB15 1 Valid Valid The port is connected to a terminal, such as a monitor or keyboard, video, and mouse (KVM). In dual-system mode, the port can be switched between partition A and partition B on the ibmc WebUI or LCD. USB port USB2.0 - A Male 2 Valid Valid The USB port is connected to a USB device. In dual-system mode, the port can be switched between partition A and partition B on the ibmc WebUI or LCD. The ports on the RH8100 V3 rear panel are located on two High-performance Fusion Consoles (HFCs): HFC-1 and HFC-2. When you face the rear panel, HFC-1 is on the left side, and HFC-2 is on the right side. 8

12 Table 1-9 Ports on HFC-1 of the rear panel Port Connecto r Type Qu anti ty Valid in Singl e-sys tem Mod e Valid in Dual- Syste m Mod e Description VGA port DB15 1 Invali d Valid The port is connected to a terminal, such as a monitor or KVM. USB port USB2.0 - A Male 2 Invali d Valid The USB port is connected to a USB device. Manageme nt network port RJ45 1 Invali d Invali d This management network port is invalid. Serial port RJ45 1 Invali d Valid This port is used as the system serial port by default. You can set it as the ibmc serial port using the CLI. Onboard network port - - Valid Valid The port type and quantity vary according to the configured LOM type. Table 1-10 Ports on HFC-2 of the rear panel Port Connecto r Type Qu anti ty Valid in Singl e-sys tem Mod e Valid in Dual- Syste m Mod e Description VGA port DB15 1 Valid Valid The port is connected to a terminal, such as a monitor or KVM. USB port USB2.0 - A Male 2 Valid Valid The USB port is connected to a USB device. Manageme nt network port RJ45 1 Valid Valid The GE port is used to manage devices. Serial port RJ45 1 Valid Valid This port is used as the system serial port by default. You can set it as the ibmc serial port using the CLI. Onboard network port - - Valid Valid The port type and quantity vary according to the configured LOM type. 9

13 Port Connecto r Type Qu anti ty Valid in Singl e-sys tem Mod e Valid in Dual- Syste m Mod e Description For details, see 4.4 LOM. If the server is in single-system mode, only the LOM on HFC-2 supports NC-SI. A management network cable can connect only to ports on HFC Indicators and Buttons This topic describes the indicators and buttons on the RH8100 V3. You can observe the indicators to determine the status of the RH8100 V3. Table 1-11 describes the indicators and buttons on the RH8100 V3 front panel. Table 1-11 Indicators and buttons on the front panel Silk Screen Meaning Color Server Status in Single-System Mode Server Status in Dual-System Mode Primary power button/indi cator Yellow and green Off: The server is on standby. Blinking yellow: ibmc is starting. Steady yellow: The primary service system of the server is on standby. Steady green: The primary service system of the server is powered on properly. NOTE If you press the power button for less than 3 seconds, the primary service system of the server starts to power on. If you hold down the power button for 6 seconds, the primary service system of the server is forcibly powered off, but ibmc Off: Partition A is not powered on. Blinking yellow: ibmc of partition A is starting. Steady yellow: The primary service system of partition A is on standby. Steady green: The primary service system of partition A is powered on properly. NOTE If you press the power button for less than 3 seconds, the primary service system of partition A starts to power on. If you hold down the power button for 6 seconds, the primary service system of partition A is forcibly 10

14 Silk Screen Meaning Color Server Status in Single-System Mode is still operating. Server Status in Dual-System Mode powered off, but ibmc is still operating. Secondary power button/indi cator Yellow and green This button and indicator are invalid. That is, the indicator is off and the button is unavailable. Off: Partition B is not powered on. Blinking yellow: ibmc of partition B is starting. Steady yellow: The secondary service system of partition B is on standby. Steady green: The secondary service system of partition B is powered on properly. NOTE If you press the power button for less than 3 seconds, the secondary service system of partition B starts to power on. If you hold down the power button for 6 seconds, the secondary service system of partition B is forcibly powered off, but ibmc is still operating. Primary UID button/indi cator Blue Steady on: The UID button is triggered. Off: The UID button is not triggered. NOTE You can hold down the UID button for 6 seconds to reset ibmc. Off: Partition A is not located. On: Partition A is located. NOTE You can hold down the UID button for 6 seconds to reset ibmc in partition A. Secondary UID button/indi cator Blue This button and indicator are invalid. That is, the indicator is off and the button is unavailable. Off: Partition B is not located. On: Partition B is located. NOTE You can hold down the UID button for 6 seconds to reset ibmc in partition B. Primary health indicator Red and green Steady green: The server is operating properly. Blinking red at 1 Hz: Steady green: Partition A is operating properly. Blinking red at 1 Hz: A major alarm is 11

15 Silk Screen Meaning Color Server Status in Single-System Mode A major alarm is generated. Blinking red at 2 Hz: A critical alarm is generated. Server Status in Dual-System Mode generated for partition A. Blinking red at 2 Hz: A critical alarm is generated for partition A. Secondary health indicator Red and green This indicator is invalid. That is, the indicator is off. Steady green: Partition B is operating properly. Blinking red at 1 Hz: A major alarm is generated for partition B. Blinking red at 2 Hz: A critical alarm is generated for partition B. - Hard disk active indicator - Hard disk fault indicator Green Off: The hard disk is not detected or is faulty. Blinking green: Data is being read from or written to the hard disk, or synchronized between hard disks. Steady green: The hard disk is inactive. Yellow Off: The hard disk is operating properly or cannot be detected in the RAID group. Blinking yellow: The hard disk is located, or RAID is being reconstructed. Steady yellow: The hard disk is faulty or not detected. Off: The hard disk is faulty or not detected. Blinking green: Data is being read from or written to the hard disk, or synchronized between hard disks. Steady green: The hard disk is inactive. Off: The hard disk is operating properly or cannot be detected in the RAID group. Blinking yellow: The hard disk is located, or RAID is being reconstructed. Steady yellow: The hard disk is faulty or not detected. Table 1-12 describes the indicators and buttons on the RH8100 V3 rear panel. Table 1-12 Indicators and buttons on the rear panel Silk Screen Meaning Color Server Status in Single-System Mode Server Status in Dual-System Mode 12

16 Silk Screen Meaning Color Server Status in Single-System Mode Server Status in Dual-System Mode Primary UID indicator Blue Steady on: The UID button is triggered. Off: The UID button is not triggered. Off: Partition A is not located. On: Partition A is located. Secondary UID indicator Blue This indicator is invalid. That is, the indicator is off. Off: Partition B is not located. On: Partition B is located. - Data transmissio n status indicator for the manageme nt network port - Connectivit y status indicator for the manageme nt network port - Network port data transmissio n status indicator - Network port connection status indicator Orange Off: No data is being transmitted. Blinking: Data is being transmitted. Green Steady on: The network port is properly connected. Off: The network port is not connected. Orange Off: No data is being transmitted. Blinking: Data is being transmitted. Green Steady on: The network port is properly connected. Off: The network port is not connected. Off: No data is being transmitted. Blinking: Data is being transmitted. Steady on: The network port is properly connected. Off: The network port is not connected. Off: No data is being transmitted. Blinking: Data is being transmitted. Steady on: The network port is properly connected. Off: The network port is not connected. Fan status indicator Red or green Off: The device is not powered on. Blinking red at 0.5 Hz: An alarm is generated for the device, but whether to repair the server is uncertain. Off: The device is not powered on. Blinking red at 0.5 Hz: An alarm is generated for the device, but whether to repair the server is uncertain. Steady red: A fan module or the board to which a fan module is connected is faulty and needs to be repaired. Steady green: The fan Steady red: A fan module or the board to which a fan module is connected is faulty and needs to be repaired. Steady green: The fan 13

17 Silk Screen Meaning Color Server Status in Single-System Mode module is faulty or is in the online upgrade state. (An online upgrade takes about 3 minutes.) Blinking green at 0.5 Hz: The device is properly communicating with ibmc. Blinking green at 4 Hz: The device fails to communicate with ibmc. Server Status in Dual-System Mode module is faulty or is in the online upgrade state. (An online upgrade takes about 3 minutes.) Blinking green at 0.5 Hz: The device is properly communicating with ibmc. Blinking green at 4 Hz: The device fails to communicate with ibmc. - PSU status indicator Red or green Steady green: The PSU is operating properly. Blinking green at 0.5 Hz: The PSU is in the hibernation state (there is no 12 V output). Steady red: A fault alarm is generated for the PSU. Steady green: The PSU is operating properly. Blinking green at 0.5 Hz: The PSU is in the hibernation state (there is no 12 V output). Steady red: A fault alarm is generated for the PSU. PCIe card status indicator PCIe card power indicator PCIe card hot swap button Yellow On: The PCIe card is abnormal, or the server is in the POST phase. Off: The PCIe card is operating properly. Blinking: The PCIe card is waiting to cancel the hot swap operation. Green Steady green: The power supply to the PCIe card is normal. Blinking green: The PCIe card is being powered on or powered off. Off: The PCIe card is powered off. - You can hot-swap the PCIe card when the system is operating properly. Press this button when On: The PCIe card is abnormal, or the server is in the POST phase. Off: The PCIe card is operating properly. Blinking: The PCIe card is waiting to cancel the hot swap operation. Steady green: The power supply to the PCIe card is normal. Blinking green: The PCIe card is being powered on or powered off. Off: The PCIe card is powered off. You can hot-swap the PCIe card when the system is operating properly. Press this button when the PCIe card is 14

18 Silk Screen Meaning Color Server Status in Single-System Mode the PCIe card is operating properly. If the PWR indicator is off 10 seconds later, remove the PCIe card. Press this button after installing the PCIe card. If the PWR indicator is steady green 10 seconds later, the PCIe card is operating properly. Server Status in Dual-System Mode operating properly. If the PWR indicator is off 10 seconds later, remove the PCIe card. Press this button after installing the PCIe card. If the PWR indicator is steady green 10 seconds later, the PCIe card is operating properly. Figure 1-6 shows the indicators and button on a compute module. Table 1-13 describes the indicators and button. Figure 1-6 Compute module status indicators and button 1 Memory board power button/status indicator 2 Memory board ATTN indicator 3 Memory board backup indicator 4 Processor board status indicator 15

19 Table 1-13 Description of the compute module panel indicators and button Silk Screen Meaning Color State Description Memory board power button/indicat or Red and green Button: hot swaps the memory board. Off: The memory board is on standby. Steady green: The memory board is operating properly. Blinking green at 1 Hz: The memory board is in the intermediate state of hot swap. Blinking red at 1 Hz: The memory board is faulty. Blinking red at 5 Hz: The memory board is not securely inserted. Memory board ATTN indicator Yellow On: The hot insertion or removal operation has failed. Off: The hot insertion or removal operation is normal. Blinking: The memory board is waiting to cancel the hot swap operation. To cancel the operation, press the memory board button again within 5 seconds. Memory board backup indicator Processor board status indicator Green Red and green Observe the status of this indicator during the hot swap of a memory board. On: The memory board is in the backup state. Off: The memory board is not in the backup state. Blinking red at 1 Hz: The processor board is faulty. Steady green: The processor board is operating properly. The RH8100 V3 provides offline indication for a faulty DIMM. Figure 1-7 shows the indicator and button on the memory board. Table 1-14 describes the indicator and button on the memory board. 16

20 Figure 1-7 Indicator and button on the PCB of a memory board 1 DIMM fault locating button 2 DIMM fault indicator Table 1-14 Indicator and button on the PCB of a memory board Name Color State Description DIMM fault indicator DIMM fault locating button Red On: The DIMM is faulty. Off: The DIMM is operating properly. - This button helps locate a faulty DIMM. When a fault occurs in the memory board in the power-on state, the memory board turns on the corresponding fault indicator. After you power off and remove the memory board, hold down this button, and the indicator for the faulty DIMM turns on. You can easily locate the faulty DIMM and replace or repair the DIMM. 1.5 Physical Structure This topic describes the RH8100 V3 components. Figure 1-8 and Figure 1-9 show the components of the RH8100 V3 with 12 hard disks. 17

21 Figure 1-8 RH8100 V3 components (front view) 1 Chassis 2 DVD-ROM drive+lcd module 3 PCIe card 4 ibbu (optional) 5 Supercapacitor (optional) 6 PRM 7 RAID controller card 8 FM-A inch hard disk 10 Memory board 11 Compute module 12 Heat sink 13 Processor 14 DIMM 18

22 Figure 1-9 RH8100 V3 components (rear view) 1 Fan module 2 PSU 3 HFC 4 LOM 5 TPM 6 USB flash drive 7 Hot-swappable PCIe card 8 Non-hot-swappable PCIe card 9 BM Table 1-15 and Table 1-16 describe the RH8100 V3 components. Table 1-15 Components (front view) No. Name Description 1 Chassis A chassis houses and protects all components. 2 DVD-ROM drive+lcd module This module consists of a DVD-ROM drive for installing an operating system (OS) and a touch LCD. 3 PCIe card This card is installed on a PRM. The front I/O module supports PCIe 3.0 x8 and PCIe 3.0 x16 cards, for example, ES3000 PCIe SSD cards and 19

23 No. Name Description GPUs. 4 Integrated battery backup unit (ibbu) The ibbu provides power-off protection for the RAID controller card with the LSISAS2208 chip. NOTE You can use either an ibbu or a supercapacitor to provide power-off protection for a RAID controller card. 5 Supercapacitor The supercapacitor provides power-off protection for the RAID controller card with the LSISAS2208 or LSISAS3108 chip. 6 PRM FM-A provides two PRMs. Each PRM provides two standard PCIe 3.0 x8 slots and one standard PCIe 3.0 x16 slot for installing PCIe SSD cards or GPUs that do not need to connect to external cables. 7 RAID controller card The RAID controller card model varies according to the type of the front I/O module. For details, see Front I/O Module. 8 FM-A This module consists of hard disks, RAID controller cards, standard PRMs, PCIe cards, and an ibbu or a supercapacitor. NOTE The standard PCIe cards on FM-A support PCIe SSD cards and GPUs but do not support standard cards (for example, NICs, FC cards, and IB cards) that need to connect to external cables. 9 Hard disk The server supports 2.5-inch hot-swappable hard disks. 10 Memory board A compute module supports a maximum of two memory boards. Each memory board provides 12 or 8 DIMM slots, and the entire server supports a maximum of 192 DDR3 or DDR4 DIMMs. 11 Compute module A compute module is used for installing two memory boards and one processor. The compute modules are numbered 1 to 8 from left to right. In dual-system mode, compute modules 1 to 4 belong to system A and compute modules 5 to 8 belong to system B. 12 Heat sink A heat sink adopts fool-proofing design and cools a processor. One heat sink is configured for one processor on each compute module. 13 Processor Each compute module on the RH8100 V3 supports one Intel Xeon E v2 or v3 series processor. 14 DIMM When the server is configured with E7 v2 processors, you can configure only DDR3 20

24 No. Name Description DIMMs with 1066, 1333 or 1600 MT/s bandwidth. Each DDR3 DIMM provides a maximum of 64 GB memory capacity, and the server provides a maximum of 12 TB memory capacity. When the server is configured with E7 v3 processors, you can configure only DDR4 DIMMs with 1333, 1600, or 1866 MT/s bandwidth. Table 1-16 Components (rear view) No. Name Description 1 Fan module Fan modules dissipate heat for the entire server and support hot swap. Each fan module consists of two fans. If one fan module is faulty, the adjacent fan modules run at full speed to ensure optimal heat dissipation for the server. 2 PSU The RH8100 V3 provides four DC or AC PSUs in 2+2 redundancy mode. AC PSU: converts AC power into 12 V DC power for the RH8100 V3. DC PSU: converts DC power into 12 V DC power for the RH8100 V3. 3 HFC The console provides an Intel Platform Controller Hub (PCH), out-of-band management system, USB port, management network port, serial port, and VGA port, and consists of the trusted platform module (TPM), LOM, and USB flash drive. 4 LOM The RH8100 V3 supports one GE NIC to provide two or four GE ports or one 10GE NIC to provide two 10GE ports. Both types of NICs support the Network Controller Sideband Interface (NC-SI). 5 TPM A TPM is optional. It is a security solution that complies with the Trusted Computing Group (TCG) standards. It prevents viruses or unauthorized operations, enhancing the platform security. 6 USB flash drive A USB flash driver is optional. It provides a maximum capacity of 8 GB. 7 Hot-swappable PCIe card This card is installed on the BM. The BM supports two hot-swappable PCIe 3.0 x8 and two hot-swappable PCIe 3.0 x16 cards. 8 Non-hot-swappable PCIe This card is installed on the BM. The BM supports 21

25 No. Name Description card six non-hot-swappable PCIe 3.0 x8 cards. 9 BM The BM supports four hot-swappable PCIe cards and six non-hot-swappable PCIe cards Compute Module Figure 1-10 shows the physical structure of a compute module that supports an E7 v2 processor. Each compute module consists of one processor board and two memory boards. The RH8100 V3 has two types of processor boards, which support E7 v2 and E7 v3 processors respectively. A processor board consists of the following components: Only one E v2 or v3 processor One dedicated heat sink (mandatory) for cooling a processor with a maximum thermal design power (TDP) of 165 W The RH8100 V3 provides four types of memory boards: DDR3-12-DIMM, DDR3-8-DIMM, DDR4-8-DIMM, and DDR4-12-DIMM. E7 v3 processors support only DDR3 DIMMs and memory boards, and E7 v2 processors support only DDR4 DIMMs and memory boards. Each memory board provides two scalable memory buffers, that is, Jordan Creek. A DDR3-12-DIMM memory board: Each memory board provides 12 DIMM slots and a maximum capacity of 768 GB (12 x 64 GB). A DDR3-8-DIMM memory board: Each memory board provides eight DIMM slots and a maximum capacity of 512 GB (8 x 64 GB). A DDR3-12-DIMM memory board and a DDR3-8-DIMM memory board cannot be installed on one compute module. Memory boards support hot swap. A memory board supports hot swap only when the memory board and DIMM configuration meet the requirements. For details, see the Huawei RH8100 V3 Server RAS White Paper and Huawei RH8100 V3 Server Troubleshooting Guide. E7 v2 and E7 v3 processors require different processor boards, and cannot be installed on one server. DDR3 and DDR4 DIMMs cannot be installed on one server. 22

26 Figure 1-10 Compute module components (DDR3-12-DIMM memory board) Front I/O Module FM-A The RH8100 V3 supports three types of front I/O modules. You can choose one of them based on actual requirements. FM-A, performance-balanced configuration One or two RAID controller cards A maximum of 12 hard disks A maximum of two PRMs Each PRM supports three standard PCIe 3.0 slots. FM-B, storage-enhanced configuration One or two RAID controller cards A maximum of 24 hard disks FM-C, basic configuration One or two RAID controller cards A maximum of eight hard disks FM-A consists of the following components (see Figure 1-11): Front I/O board - A (FIO-A) Hard disk backplane - A One or two RAID controller cards that support an ibbu or supercapacitor for power-off protection The two RAID controller cards on the I/O module must be of the same model. PRM: Each I/O module supports a maximum of two PRMs. 23

27 Each PRM provides three standard PCIe 3.0 slots. If you install PCIe SSD cards, each PRM supports up to three PCIe SSD cards. If you install GPUs, each PRM supports only one dual-slot GPU. The PRMs do not support standard PCIe cards that need to connect to external cables, for example, NICs, FC cards, and IB cards. The server supports no, one, or two PRMs. Figure 1-11 FM-A components Table 1-17 Standard PCIe slots provided by FM-A with the PRMs PCIe Slot Compute Module a PCIe Standard Hot Swap I/O Address Space b Allocated to a PCIe Slot in Single-Syst em Mode I/O Address Space Allocated to a PCIe Slot in Dual-Syste m Mode Slot 11 CM-4 PCIe 3.0 x8 Not supported No Yes Slot 12 CM-4 PCIe 3.0 x8 Not supported No Yes Slot 13 CM-1 PCIe 3.0 x16 Not supported Yes Yes 24

28 PCIe Slot Compute Module a PCIe Standard Hot Swap I/O Address Space b Allocated to a PCIe Slot in Single-Syst em Mode I/O Address Space Allocated to a PCIe Slot in Dual-Syste m Mode Slot 14 CM-8 PCIe 3.0 x8 Not supported No Yes Slot 15 CM-8 PCIe 3.0 x8 Not supported No Yes Slot 16 CM-5 PCIe 3.0 x16 Not supported Yes Yes a: The PCIe slots mapping to a vacant compute module slot cannot be used. b: Some standard PCIe cards require I/O address space. A PCIe slot to which no I/O address space is allocated cannot hold a standard PCIe card that requires I/O address space. For details, see the RH8100 V3 Compatibility List. FM-B FM-B consists of the following components (see Figure 1-12): Front I/O board - B (FIO-B) The I/O module supports one or two RAID controller cards that support an ibbu or supercapacitor for power-off protection. The two RAID controller cards on the I/O module must be of the same model. Two hard disk drawers (mandatory). Each hard disk drawer consists of the following (see Figure 1-13): Hard disk indicator board Hard disk backplane Cables: Two groups of cables are connected to FIO-B and two hard disk drawers. 25

29 Figure 1-12 FM-B components 26

30 Figure 1-13 FM-B hard disk drawer (left) FM-C Figure 1-14 shows the physical structure of FM-C. Table 1-18 describes the FM-C components. 27

31 Figure 1-14 FM-C components Table 1-18 FM-C components No. Name Description 1 Hard disk FM-C supports a maximum of eight 2.5-inch hot-swappable Serial Attached SCSI (SAS) disks or Serial Advanced Technology Attachment (SATA) disks. 2 FM-C FM-C consists of hard disks, RAID controller cards, and supercapacitors. 3 Hard Disk Backplane The hard disk backplane connects hard disks to RAID controller cards. 4 Supercapacitor The supercapacitor provides power-off protection for the RAID controller card with the LSISAS3108 chip. 5 Front I/O board-c This board supports one or two RAID controller cards. 6 RAID controller card FM-C supports two types of RAID controller cards: SR130 (LSISAS3008) Supports RAID 0, 1, 1E, and 10. Does not provide an integrated backup battery unit (ibbu) for power-off protection. SR430C (LSISAS3108) Supports RAID 0, 1, 5, 6, 10, 50, and

32 No. Name Description Provides a supercapacitor for power-off protection. The RAID controller cards support RAID level migration and RAID configuration memory. FM-C supports two RAID controller cards, which map to different compute modules: RAID controller card 1 maps to compute module 1. RAID controller card 2 maps to compute module 5. NOTE The RAID controller card mapping to a vacant compute module slot cannot be used. 1.6 Logical Structure This topic describes the logical structure of the RH8100 V3, including the logical modules, QuickPath Interconnect (QPI) and PCIe topologies, and Huawei FusionPar technology. The RH8100 V3 logically consists of the following modules: System chassis module: This module consists of the backplane, indicator board, fan modules, and chassis. As the basic component of the RH8100 V3, this module houses and interconnects various components, and provides power supply and cooling channels for the system. Compute module: As the core computing unit of the RH8100 V3, each compute module consists of one processor board and two memory boards to provide one processor and a maximum of 24 DIMMs respectively. Front I/O module: consists of hard disks, RAID controller cards, and PRMs (available only for FM-A). The front I/O module supports three types of configuration: FM-A, FM-B, and FM-C. BM: provides 10 standard full-height PCIe slots at the rear, including four hot-swappable ones. High-performance Fusion Console (HFC) module: The RH8100 V3 requires two HFC modules to work together. As the core control unit of the RH8100 V3, the HFC modules implement power control and system configuration and management, and provide flexible LAN on motherboard (LOM) options. PSU: Four Huawei-developed PSUs with the 94% conversion efficiency implement redundant power supply. Fan module: Eight dual-motor fan modules are configured, supporting single-fan failures Topologies of QPI, PCIe, and Other Ports Figure 1-15 and Figure 1-16 show the logical architecture of the RH8100 V3. (In the two figures, the left part shows the topology of two DDR3-12-DIMM memory boards, and the right part shows the topology of two DDR3-8-DIMM memory boards.) Figure 1-17 and Figure 1-18 show the PCIe topology. 29

33 The DDR4 memory subsystem topology is the same as the DDR3 memory subsystem topology. Figure 1-19 shows the topology of other ports, such as USB, DVD-ROM drive, and LCD. The key terms in these figures are defined as follows: QPI: QuickPath Interconnect developed by Intel, used to interconnect and transmit data between processors. DMI2: Direct Media Interface generation 2, used to interconnect processors and platform controllers. SMI2: Scalable Memory Interface generation 2, used as the interface between a processor and a memory buffer. HA 0 and HA 1: The home agent (HA) processes all the DRAM requests. An HA contains the integrated memory controller (imc) that controls memory. JC-0, JC-1, JC-2, and JC-3: JC stands for Jordan Creek, which refers to the scalable memory buffers on E7 v2 processors. Different types of memory boards use different models of Jordan Creeks. Figure 1-15 QPI topology 30

34 Figure 1-16 DDR3 memory subsystem topology 31

35 Figure 1-17 PCIe topology (FM-A) 32

36 Figure 1-18 RH8100 V3 PCIe topology (FM-B and FM-C) Figure 1-19 Topology of other ports 33

37 1. When the RH8100 V3 is operating in dual-system mode, all internal and external ports are available. 2. When the RH8100 V3 is operating in single-system module, the ports marked with are unavailable Huawei FusionPar Technology The RH8100 V3 employs the Huawei FusionPar technology to implement the hard partitioning function. The RH8100 V3 can operate in single-system or dual-system mode. FusionPar changes the interconnection topology between processors based on the collaboration between the ibmc and BIOS. In single-system mode (Figure 1-20), eight processors are in the same QPI topology. In dual-system mode (Figure 1-21), eight processors are in two groups, and each group is in a QPI topology. That is, the processors interconnected through QPIs are in one partition. The RH8100 V3 operates in single-system mode by default. The RH8100 V3 in this mode operates as a single system. The dual-system mode is also called dual-partition mode. The RH8100 V3 in this mode operates as two 4-socket systems: systems A and B, which are also called partitions A and B. The hard partitioning function improves service loading flexibility. You can configure the operating mode of the RH8100 V3 based on service requirements, which helps maximize return on investment (ROI). The FusionPar technology has the following features: Easy switching: You can implement one-click switching between the system operating modes using the LCD or ibmc WebUI, without altering hardware components or upgrading any software. Unified UI: When the RH8100 V3 operates in single-system mode, ibmc provides a unified UI for management. Symmetrical distribution of service resources: When the RH8100 V3 is operating in dual-system mode, service resources are symmetrically distributed on the two partitions. Internal integrated GE ports: When the RH8100 V3 is operating in dual-system mode, you can use the internal integrated GE ports for communication between the two partitions. Joint control of platform resources: When the RH8100 V3 is operating in dual-system mode, fan modules and PSUs can be shared between and jointly controlled by the two partitions to achieve optimal overall performance. DVD-ROM drive and LCD sharing: When the RH8100 V3 is operating in dual-system mode, the two partitions share the DVD-ROM drive and LCD, which facilitates local maintenance and one-click switching between the system operating modes using the LCD or ibmc WebUI. 34

38 Figure 1-20 QPI topology in single-system mode 35

39 Figure 1-21 QPI topology in dual-system mode The RH8100 V3 can switch to the dual-system mode using the FusionPar technology. In-band resources, including processors, DIMMs, PCIe cards, hard disks, and NICs, are symmetrically distributed in the two partitions. Table 1-19 Resources in dual-system mode Item Partition A Partition B Processor Four processors: CM-1 to CM-4 Four processors: CM-5 to CM-8 Memory board Eight memory boards: support a maximum of 96 DIMMs in total. MemB-1 to MemB-8 Eight memory boards: support a maximum of 96 DIMMs in total. MemB-9 to MemB-16 PCIe Slots 6 to 10 Slots 11 to 13 if FM-A is configured and PRMs are used Hard disk Six hard disks (HDD0 to HDD5) for FM-A Twelve hard disks (HDD0 to HDD11) for FM-B Four hard disks (HDD0 to HDD3) for FM-C Slots 1 to 5 Slots 14 to 16 if FM-A is configured and PRMs are used Six hard disks (HDD6 to HDD11) for FM-A Twelve hard disks (HDD12 to HDD23) for FM-B Four hard disks (HDD4 to HDD7) for FM-C 36

40 Item Partition A Partition B RAID RAID 1 RAID 2 HFC HFC-2 HFC-1 LOM HFC-2 LOM HFC-1 LOM DVD-ROM drive LCD Shared mode. The DVD-ROM drive is shared by partitions A and B. You can switch between partitions A and B using the LCD or ibmc WebUI. Shared mode. The LCD is shared by partitions A and B. You can switch between partitions A and B using the LCD or ibmc WebUI. PSU Shared mode. PSUs are shared by partitions A and B. Fan module Shared mode. Fan modules shared by partitions A and B. Backplane Shared mode. The backplane is shared by partitions A and B. 1.7 RAS Features This topic describes the Reliability, Availability, and Serviceability (RAS) features supported by the RH8100 V3. The RH8100 V3 supports various RAS features, greatly improving server system availability. RAS is a key indicator throughout the entire design process of the RH8100 V3, from its top-layer architecture design to its underlying hardware design. Strict process assurance covers each activity, such as development, test, and component selection. For details about the RAS features, see the HUAWEI RH8100 V3 Server RAS White Paper. 1.8 Technical Specifications This topic describes the technical specifications for the RH8100 V3. Table 1-20 describes the technical specifications for the RH8100 V3. Table 1-20 Technical Specifications Category Item Specifications Physical specifications Chassis dimensions (H x W x D) Weight 352 mm x 447 mm x 855 mm (13.86 in. x in. x in.) Maximum weight: 160 kg ( lb) Packaging materials: 20 kg (44.10 lb) Environmental Temperature Operating temperature: 5 C to 40 C (41 F to 37

41 Category Item Specifications specifications 104 F) NOTE When 64 GB DIMMs or GPUs with high power consumption are equipped, the maximum operating temperature is 35 C. Storage temperature: 40 C to +65 C ( 40ºF to +149ºF) Humidity Operating humidity: 10% RH to 90% RH (non-condensing) Storage humidity: 5% RH to 95% RH (non-condensing) Altitude 3000 m ( ft). The temperature decreases by 1 C (1.8 F) per an increase of 300 m ( ft). PSU input specifications Input voltage 2500 W PSU: -38 V DC to -72 V DC 2000 W PSU: 90 V AC to 264 V AC at 50 Hz or 60 Hz 192 V DC to 288 V DC 3000 W PSU: 90 V AC to 264 V AC at 50 Hz or 60 Hz 192 V DC to 288 V DC PSU output specifications Power specifications Maximum input current PDU selection Rated input voltage PSU power rating 2500 W PSU: 63 A 3000 W PSU: 16 A 2000 W PSU: 15 A C32 circuit breakers or those with higher current are recommended. 12 V DC The RH8100 V3 supports four PSUs. The following lists the power rating for each type of PSU: 2500 W DC PSU: 2500 W (input voltage: 48 V DC to 72 V DC) 2000 W PSU: 800 W (input voltage: 90 V AC to 179 V AC) 1800 W (input voltage: 180 V AC to 197 V AC) 2000 W (input voltage: 198 V AC to 264 V AC) 3000 W PSU: 1200 W (input voltage: 90 V AC to 175 V AC) 38

42 Category Item Specifications 2500 W (input voltage: 176 V AC to 199 V AC or 192 V DC to 204 V DC) 3000 W (input voltage: 200 V AC to 264 V AC or 205 V DC to 288 V DC) 1.9 Advantages Stability and Reliability Excellent Performance Leading Architecture Simple Maintenance The RH8100 V3 provides the following advantages: Has 60 RAS features, which maximizes server availability. Supports memory migration, combined with memory board hot swap, to implement DIMM replacement without shutdown. Complies with component selection criteria for carrier-grade component reliability and derating, and meets carrier-grade reliability test requirements. Implements redundancy for key components, such as the basic input/output system (BIOS) flash memory, ibmc image, PSUs, and fan modules. Supports a maximum of eight E v2 or v3 processors. Each processor supports up to 18 cores and 36 threads, and the server supports 144 cores and 288 threads. Supports a maximum of 192 DDR3 or DDR4 DIMMs. Uses the Huawei FusionPar technology, and supports hard partitioning and one-click switchover. Supports flexible configurations based on customer requirements, including LOMs, one or two RAID controller cards, front I/O modules, and four or eight processors. Adopts modular design for easy upgrades and expansion. Stably operates at 40 C (104 F) for a long time. For details, see Table Adopts modular design for easy maintenance. Supports tool-free installation and maintenance. Supports online parts replacement to facilitate maintenance. The parts include the DIMM, PCIe card, hard disk, fan module, and PSU. Uses the latest Huawei ibmc with a Huawei-developed Hi1710 chip to provide overall, one-stop device management, configuration, and fault management. Provides a 3.5-inch LCD for onsite maintenance. 39

43 2 Product Features 2 Product Features Performance and Scalability The RH8100 V3 supports the following features to improve performance and scalability while reducing the total cost of ownership (TCO): Supports a maximum of eight processors (four processors can also be configured.) Each Intel Xeon E v2 processor ensures high processing performance by providing up to 15 cores, one L3 cache of 37.5 MB, and three 8.0 GT/s QPI links between processors. Each Intel Xeon E v3 processor ensures high processing performance by providing up to 18 cores, one L3 cache of 45 MB, and three 9.6 GT/s QPI links between processors. Uses Intel Turbo Boost Technology, which allows processor cores to run faster than the frequency specified in the TDP configuration if they are operating below power, current, and temperature specification limits. Uses Intel Hyper-Threading Technology, which enables each processor core to run up to two threads, improving parallel computation performance. Uses the hardware-assisted Intel Virtualization Technology (Intel VT), which allows OS vendors to better use hardware to address virtualization workloads. Large memory capacity and high memory bandwidth Supports a maximum of 192 DDR3 DIMMs with up to 1600 MT/s bandwidth when the server is configured with E7 v2 processors. Supports a maximum of 192 DDR4 DIMMs with up to 1866 MT/s bandwidth when the server is configured with E7 v3 processors. Provides 18 PCIe slots. Ten PCIe slots are on the back I/O module (BM), used for installing standard cards that need to connect to external cables, for example, NICs, HBAs, and IB cards. Six PCIe slots are on FM-A, used for installing standard PCIe SSD cards (Huawei ES3000) or GPUs that do not need to connect to external cables. Up to two compatible GPUs or six standard PCIe SSD cards are supported. Two PCIe slots are dedicated for RAID controller cards. Provides two LOMs with GE or 10GE ports. The two LOMs do not occupy standard PCIe slots. Supports PCIe 3.0, which increases the maximum theoretical I/O bandwidth by 60% compared with PCIe

44 2 Product Features Availability and Serviceability Manageability and Security Energy Efficiency The RH8100 V3 provides 60 RAS features to improve availability and serviceability: Supports memory migration, combined memory board hot swap, to implement DIMM replacement without shutdown, which is leading in the industry. Complies with component selection criteria for carrier-grade component reliability and derating, and meets carrier-grade reliability test requirements. Implements redundancy for key components, such as the BIOS flash memory, ibmc image, PSUs, and fan modules. Supports faulty DIMM indication on an offline memory board, which allows faulty DIMMs to be indicated on a removed memory board. Supports redundancy and hot swap without opening the chassis cover for key components such as PSUs, fan modules, and hard disks. These features enable quick replacement of faulty components without interrupting system operation. Supports hot swap of PCIe cards in some PCIe slots without opening the chassis cover, which implements PCIe upgrades and replacement without interrupting system operation. Supports hot swap of hard disks and uses RAID to protect data on hard disks and maximize system uptime. Uses the Huawei ibmc to monitor system parameters in real time, trigger alarms, and perform recovery actions in case of failures, minimizing system downtime. Integrates fault management and predictive failure analysis (PFA) to greatly improve fault locating efficiency and reduce unexpected downtime. Provides a 3.5-inch touch-screen LCD diagnosis panel to facilitate fault locating and shorten the fault recovery time. Provides a three-year warranty for parts replacement and onsite limited repair for the server, and provides 9 x 5 (a 9-hour-a-day, 5-day-a-week) next business day (NBD) support. Optional service upgrades are available. The RH8100 V3 provides the following features to simplify local and remote server management: Provides ibmc, which monitors server operating status and implements remote management in compliance with Intelligent Platform Management Interface (IPMI) 2.0. Integrates the Unified Extensible Firmware Interface (UEFI)to improve setup, configuration, and update efficiency and simplify fault handling. Supports the Intel Advanced Encryption Standard New Instructions (AES NI), which allows faster and stronger encryption. Provides the Intel Execute Disable Bit (EDB) function, which works with the supported OS to prevent certain types of malicious buffer overflow attacks. Adopts strict security test criteria and the chip-level Huawei ibmc, ensuring secure system operating. The RH8100 V3 provides the following features to reduce energy consumption and operating expense (OPEX) and increase energy efficiency: 41

45 2 Product Features Uses E v2 series processors to deliver nearly double performance with only 20% higher TDP, compared with the previous-generation product. Uses Huawei Platinum PSUs with a maximum power conversion efficiency of 94%. Supports power capping when it operates in single-system mode. Provides Intel Intelligent Power Capability, which allows a processor to be powered on or off based on site requirements. Uses low-voltage, low-power E v2 processors, suited for data centers and telecommunication environments that have power and thermal limitations. 42

46 3 Product Specifications 3 Product Specifications Table 3-1 describes the RH8100 V3 product specifications. Table 3-1 Product specifications Item Form factor Specifications 8U rack server without holding rails Processor A maximum of eight Intel Xeon E v2 (IvyBridge-EX) processors. Each processor supports up to 37.5 MB L3 cache capacity and 15 cores. (Four processors can also be configured.) A maximum of eight Intel Xeon E v3 (Haswell-EX) processors. Each processor supports up to 45 MB L3 cache capacity and 18 cores. (Four processors can also be configured.) Chipset Number of DIMM slots Intel Patsburg PCH-J (C602-J) Up to 192 DIMM slots in 16 memory boards(each processor supports two memory boards.) E7 v2: supports only DDR3 DIMMs and memory boards. E7 v3: supports only DDR4 DIMMs and memory boards. NOTE 192 DIMM slots are supported only when you use the 12-DIMM memory boards. Maximum memory capacity Number of hard disks RAID support 12 TB (using 64 GB DIMMs) Twelve (FM-A), twenty-four (FM-B), or eight (FM-C) 2.5-inch hot-swappable SAS/SATA HDDs or SSDs A RAID controller card supports either of the following: RAID 0, 1, 10, and 1E RAID 0, 1, 10, 5, 50, 6, and 60, a maximum cache capacity of 2 GB, and a supercapacitor for power-off protection One or two RAID controller cards of the same model 43

47 3 Product Specifications Item Network port PCIe slot External ports and buttons DVD-ROM drive Specifications The LOM can be flexibly configured to provide either of the following ports: Up to two LOMs 2-port GE-RJ45/4-port GE-RJ45/2-port 10GE SFP+/2-port 10GE RJ45 Supports a maximum of 18 PCIe slots if the server is configured with FM-A. Two PCIe 3.0 x16 and eight PCIe 3.0 x8 slots are on the BM, used for installing standard cards that need to connect to external cables, for example, NICs, HBAs, and IB cards. Two PCIe 3.0 x16 and four PCIe 3.0 x8 slots are on FM-A by using two PRMs, used for installing standard cards that do not need to connect to external cables, for example: Six Huawei ES3000 PCIe SSD cards Two Huawei-certified GPUs Three Huawei ES3000s and one GPU Two PCIe slots are dedicated for RAID controller cards. Front panel: two USB 2.0 ports, one Power button, one UID button, one VGA port, and one touchable LCD diagnosis panel Rear panel: Two consoles. Each provides two USB 2.0 ports, one VGA port, one serial port, one GE management network port, one UID indicator, and one LOM slot. NOTE Some ports on the two management modules on the rear are unavailable. For details, see 1.3 Ports. DVD-RW drive with one SATA port Graphics card The graphics card is integrated into an HFC, and supports 32 MB display memory and a maximum resolution of 1280 x PSU System management Security Supported OSs Warranty Dimensions (H x W x D) You can choose 3000 W AC, 2000 W AC, or 2500 W DC PSUs. The PSUs can be configured in 2+2 or 1+1 redundancy mode. Supports remote management, WebUIs, virtual KVM, and standard protocols such as IPMI 2.0 and SNMP. Power-on password and administrator password Windows Server 2012 R2, RHEL 6.5, SLES 11.3, and so on Huawei provides a three-year warranty for parts replacement and onsite limited repair for the server. Huawei provides 9 x 5 (a 9-hour-a-day, 5-day-a-week) next business day (NBD) support. Optional service upgrades are available. 352 mm x 447 mm x 855 mm (13.86 in. x in. x in.) 44

48 3 Product Specifications Item Weight Physical environment Acoustic noise Specifications Maximum weight: 160 kg ( lb) Operating environment Ambient temperature: 5 C to 40 C (41 F to 104 F) The operating temperature decreases by 1 C (1.8 F) as the altitude increases by 300 m ( ft). Maximum altitude: 3000 m ( ft) Ambient humidity: 10% RH to 90% RH (twmax = 29 C) Storage environment Ambient temperature: 40 C to +65 C ( 40 F to +149 F) Ambient humidity: 5% RH to 95% RH (twmax = 38 C) The data listed in the following is the declared A-weighted sound power levels (LWAd) and declared average bystander position A-weighted sound pressure levels (LpAm) when the server is operating in a 23 C (73.4 F) ambient environment. Noise emissions are measured in accordance with ISO 7999 (ECMA 74) and declared in accordance with ISO 9296 (ECMA 109). Idle: LWAd: 6.6 Bels LpAm: 50.3 dba Operating: LWAd: 6.9 Bels LpAm: 52.7 dba NOTE The actual sound levels generated during server operating vary depending on the server configuration, loads, and ambient temperature. 45

49 4 Component Compatibility 4 Component Compatibility 4.1 Processor 4.2 Memory 4.3 Local Storage 4.4 LOM 4.5 Standard PCIe Card 4.6 PSU 4.7 OS 4.8 Application Software 4.1 Processor The RH8100 V3 supports four or eight Intel Xeon E v2 or v3 series processors. Table 4-1 lists the compatible processors. For the latest compatibility information, see the RH8100 V3 Compatibility List. Table 4-1 is for reference only. For details about the processors available, contact your sales representatives. A server must use the same model of processors. Table 4-1 Compatible processors BOM Number Model Numb er of Cores Frequenc y (GHz) L3 Cache (MB) TDP (W) Maximu m QPI bandwid th (MT/s) E v2 processors (working with DDR3 DIMMs only) E v E v

50 4 Component Compatibility BOM Number Model Numb er of Cores Frequenc y (GHz) L3 Cache (MB) TDP (W) Maximu m QPI bandwid th (MT/s) E v E7-8880L v E v E v E v E v E v3 processors (working with DDR4 DIMMs only) E v E v E v E7-8880L v E v E v E v E v Memory Memory Capacity Configuration Rules The RH8100 V3 supports DDR3 and DDR4 DIMMs. If the server is configured with E7 v2 processors, you can configure DDR3 DIMMs with up to 1600 MT/s bandwidth. Each processor supports up to two DDR3 memory boards and 24 DDR3 DIMMs. If the server is configured with E7 v3 processors, you can configure DDR4 DIMMs with up to 1866 MT/s bandwidth. Each processor supports up to two DDR4 memory boards and 24 DDR4 DIMMs. The RH8100 V3 memory subsystem provides two types of channels: SMI2: is the channel between a processor and the memory buffer. Each processor supports up to four SMI2 channels. 47

51 4 Component Compatibility DDR memory channel: is between the memory buffer and a DIMM. The RH8100 V3 supports DDR3 or DDR4 memory channels. Each processor supports a maximum of four SMI2 channels. Each SMI2 channel uses a memory buffer, each memory buffer supports two memory channels, and each memory channel supports up to three DIMM slots. Each E7 v2 or v3 processor has four SMI2 channels (four memory buffers), eight memory channels (4 x 2), and 24 DIMM slots. The RH8100 V3 supports four types of memory boards. Any two types of memory boards cannot be installed on one server. For the latest compatibility information, see the RH8100 V3 Compatibility List. Table 4-2 Compatible memory boards BOM Number Description Compa tible Process or Maximu m Number of Memory Boards Maximu m Number of DIMMs 03022LAR DDR3-12-DIMM memory board E7 v VQR DDR3-8-DIMM memory board E7 v WJD DDR4-12-DIMM memory board E7 v WJE DDR4-8-DIMM memory board E7 v For details, see Figure Table 4-3 Compatible DIMMs BOM Number Type Description Maximum Number of DIMMs DDR3 Memory Module,DDR3 RDIMM,8GB,240PIN,1.25ns, KHz,1.3 5V,ECC,2 Rank(512M*8bit),Height 30mm DDR3 Memory Module,DDR3 RDIMM,8GB, 240pin,1.1ns, KHz,1.5V,ECC,2Rank (512M*8bit), height 30mmMemory Module,DDR3 RDIMM,8GB,240pin,1.1ns, KHz,1.5V,ECC,2Rank(512M*8bit),Height 30mm DDR3 Memory Module,DDR3 RDIMM,16GB,240 PIN,1.5ns, KHz,1.35V,ECC,only for upper product using,2 Rank(1Gx4bit),Height 30mm, IT dedicated DDR3 Memory Module,DDR3 LRDIMM,32GB,240pin,1.5ns, KHz, (24 DIMMs per processor) 192 (24 DIMMs per processor) 192 (24 DIMMs per processor) 192 (24 DIMMs per processor) 48

52 4 Component Compatibility BOM Number Type Description Maximum Number of DIMMs 35V,ECC,4Rank(1G*4bit),height 30mm, Server dedicated DDR3 Memory Module,DDR3 LRDIMM,32GB,240pin,1.1ns, KHz,1. 5V,ECC,4Rank DDP(1G*4bit),IT dedicated DDR4 Memory Module,DDR4 RDIMM,8GB,288pin,0.9ns, KHz,1.2V,ECC,2Rank(512M*8bit) DDR4 Memory Module,DDR4 RDIMM,16GB,288pin,0.9ns, KHz,1.2 V,ECC,2Rank(1G*4bit) DDR4 Memory Module,DDR4 RDIMM,32GB,288pin,0.9ns, KHz,1.2 V,ECC,2Rank(2G*4bit) 192 (24 DIMMs per processor) 192 (24 DIMMs per processor) 192 (24 DIMMs per processor) 192 (24 DIMMs per processor) Table 4-3 is for reference only. For details about the DIMMs available, contact your sales representatives. The RH8100 V3 supports the following DIMM and memory board configuration rules: 1. E7 v2 processors support only DDR3 DIMMs and memory boards, and E7 v3 processors support only DDR4 DIMMs and memory boards. 2. RDIMMs and LRDIMMs are supported, but they cannot be installed on one server. 3. If the server is equipped with RDIMMs, each DDR3 memory channel supports up to eight ranks in theory but up to six ranks in actual configuration. For details, see Table If the server is equipped with LRDIMMs, each DDR3 memory channel supports up to 24 ranks. In the latest RH8100 V3 compatible list, the number of ranks for 32 GB LRDIMMs is four. If you want to use the LRDIMM with eight ranks, for example, 64 GB LRDIMMs, the maximum number of ranks is The maximum memory bandwidth depends on the actual DIMM configuration. For details, see Table DIMMs with different BOM numbers cannot be installed on one server. The maximum memory operating speed depends on the memory operating mode. There are two memory operating modes: Performance mode (default): Each memory channel operates independently, and the speed of an SMI2 channel doubles the speed of a memory channel. The memory system in this mode delivers high performance. RAS (lockstep) mode: Two memory channels on the same SMI2 channel work synchronously, and an SMI2 channel operates at the same speed as a memory channel. The memory system in this mode delivers high reliability. 49

53 4 Component Compatibility Table 4-4 Maximum memory speed DIMM Properties RH8100 V3 Voltage/Speed (V/MT/s) BOM Numb er Key Parameters: DDRx-Type-Rated Speed (MT/s)-Rated Voltage (V)-Number of Ranks-Chip Capac ity (GB) Performance Mode 1 2 DPC DPC 3 DPC RAS Mode 1 2 DPC DPC 3 DPC DDR3-RDIMM V-2 Rank / / / / / / DDR3-RDIMM V-2 Rank 8 1.5/ / / / / / DDR3-RDIMM V-2 Rank / / / / / / DDR3-LRDIMM V- 4 Rank / / / / / / DDR3-LRDIMM V-4 Rank / / / / / / DDR4-RDIMM V-2 Rank 8 1.2/ / / / / / DDR4-RDIMM V-2 Rank / / / / / / DDR4-RDIMM V-2 Rank / / / / / /133 3 DDR3 DIMM Slot Configuration Rules The RH8100 V3 supports a maximum of 192 DDR3 DIMMs on 16 memory boards. Table 4-5 describes the memory channels on each memory board. Figure 4-1 shows the DIMM slots. Table 4-5 DDR3 memory channels Channel Slot Primary Memory Channel Channel 0 DIMM 01 DIMM 01 DIMM 02 DIMM 03 Channel 1 DIMM 11 DIMM 11 DIMM 12 DIMM 13 Channel 2 DIMM 21 DIMM 21 50

54 4 Component Compatibility Channel Slot Primary Memory Channel DIMM 22 DIMM 23 Channel 3 DIMM 31 DIMM 31 DIMM 32 DIMM 33 Figure 4-1 DIMM slots (DDR3-12-DIMM memory board) Table 4-5 shows the DIMM slots on a DDR3-12-DIMM memory board. If you use a DDR3-8-DIMM memory board, slots DIMM03, DIMM13, DIMM23, and DIMM33 are unavailable. Table 4-6 describes the DDR3 DIMM configuration rules. Table 4-6 DDR3 DIMM configuration rules Memory Board 03022LAR: DDR3-12-DIMM memory board 03022VQR: DDR3-8-DIMM memory board DIMM Installation Sequence DIMM 01, DIMM 11, DIMM 21, DIMM 31, DIMM 02, DIMM 12, DIMM 22, DIMM 32, DIMM 03, DIMM 13, DIMM 23, and then DIMM 33 Slot DIMM 01 cannot be vacant. DIMM 01, DIMM 11, DIMM 21, DIMM 31, DIMM 02, DIMM 12, DIMM 22, and then DIMM 32 Slot DIMM 01 cannot be vacant. DDR4 DIMM Slot Configuration Rules The RH8100 V3 supports a maximum of 192 DDR4 DIMMs on 16 memory boards. Table 4-7 describes the memory channels on each memory board. Figure 4-2 shows the DIMM slots. 51

55 4 Component Compatibility Table 4-7 DDR4 memory channels Channel Slot Primary Memory Channel Channel 0 DIMM 00 DIMM 00 DIMM 01 DIMM 02 Channel 1 DIMM 10 DIMM 10 DIMM 11 DIMM 12 Channel 2 DIMM 20 DIMM 20 DIMM 21 DIMM 22 Channel 3 DIMM 30 DIMM 30 DIMM 31 DIMM 32 Figure 4-2 DIMM slots on a DDR4-12-DIMM memory board Figure 4-2 shows the DIMM slots on a DDR4-12-DIMM memory board. If you use a DDR4-8-DIMM memory board, slots DIMM02, DIMM12, DIMM22, and DIMM32 are unavailable. Table 4-8 describes the DDR4 DIMM configuration rules. Table 4-8 DDR4 DIMM configuration rules Memory Board 03022WJD: DDR4-12-DIMM memory board DIMM Installation Sequence DIMM 00, DIMM 10, DIMM 20, DIMM 30, DIMM 01, DIMM 11, DIMM 21, DIMM 31, DIMM 02, DIMM 12, DIMM 22, and then DIMM 32 Slot DIMM 00 cannot be vacant. 52