Huawei Enterprise A Better Way. Huawei FusionServer X6800 Competitiveness Analysis

Transcription

1 Huawei Enterprise A Better Way Huawei FusionServer X6800 Competitiveness Analysis

2 Contents 1 Positioning and Selling Click Points to add Title 2 How to Beat Click to add Title 3 How to Defend 2

3 X6800: High-density and Energy Reservation Four 2U rack servers One X6800 high-density server Super high density: 2X storage density of a 2U rack server 2X compute density of a 1U rack server Ultra-low power consumption: Optimized architecture, reducing power consumption Shared power supply, improving power conversion efficiency Energy efficiency 8% higher than a 2U rack server Application scenario: Server SAN, SDS, big data, virtualization, and HPC, etc. 3

4 X6800 vs. Conventional Servers Product for Comparison Architecture Single-rack storage density Single-rack compute density Power consumption Management Maintenance 1U/2U Universal Rack Server 1U/2U conventional rack server, fixed form factor, no optional nodes, and rear cable routing Twenty 2U servers and two hundred and forty 3.5" hard disks at most Forty 1U servers, 80 CPUs, 960 dual in-line memory modules (DIMMs), and 160 hard disks at most Each rack server has independent PSUs and fan modules, consuming more power. Each rack server provides independent management. The rack server uses rear cable routing, which causes inconvenience for maintenance. X6800 Multi-node Server 4U rack server, up to 4 dual-width nodes, two optional nodes, centralized power supply to multiple nodes, centralized heat dissipation, front or rear cable routing Up to forty storage servers and four hundred and eighty 3.5" hard disks Up to 80 dual-sockete5-2600v3 servers, 160 CPUs, 1280 DIMMs, and 320 hard disks Four nodes share the fan modules and PSUs, saving power consumption at least 8% in contrast with conventional servers. Each node has an independent BMC chip for management and a trunk management network port, greatly simplifying cable routing. With a modular design, server nodes are maintained in front swap mode and fan modules, management modules, and PSUs support hop swap, facilitating maintenance. Deployment speed Long deployment time Four server nodes are deployed in a chassis by using the batch deployment software. Equipment room requirements TCO Customization Low requirements for weight bearing, power supply, and heat dissipation Conventional rack server deployment has similar TCOs. The rack servers are standardized products and seldom support customization. High requirements for weight bearing, power supply, and heat dissipation; deployment density decreased accordingly or using 1.2 m deep chassis Compared with rack server deployment in conventional equipment rooms, the X6800 deployment enables hardware procurement costs reduced by over 8.3% and total TCO reduced by over 8.7%. The X6800 supports different levels of customization, including customization for hardware and software. 4

5 X6800 Introduction Huawei proprietary high-density server, intended for enterprises and governments in Internet, data center, and cloud computing markets 8 slots, supporting 4 dual-slot servers; 8 single-slot/2 quad-slot/one 8-slot compute nodes in plan 4 redundant PSUs (750 W/1200 W AC Platinum power (with at least 94% energy efficiency) Or, 800 W DC Gold power (with at least 92% energy efficiency) 8 half-height halflength; PCIe 3.0 cards x 8 slots Management board working in 1+1 redundancy mode HMM+iBMC management 898 mm 175 mm 447 mm 5 fan modules, tolerating the failure of a single fan module (each fan module having two counter-rotating fans), working in N+1 redundancy mode and supporting heat dissipation capability of 3000 W 5

6 X6800 Node (Balanced Storage and Compute): XH628 v3 Hot swappable nodes and hard disks; built-in USB flash drive/sata DOM 16 DDR4 DIMM slots Two 2.5" SATA/SSD or two HHHL PCIe slots Twelve 3.5" hot swappable SAS/SATA or 2.5" hot swappable SAS/SATA/SSD Two rear HHHL PCIe slots Two E v3 processors Flexible on-board load: 2 x GE/4 x GE/2 x 10GE Applies to Server SAN, big data, and software-defined storage; batch delivery to China Telecom 6

7 X6800 GPU Node: XH622 v3 Built-in USB flash drive/sata DOM 16 DDR4 DIMM slots Four 2.5" SATA/SAS HDD or SSD Two dualwidth GPGPU cards Two rear HHHL PCIe slots Two E v3 processors Flexible on-board load: 2 x GE/4 x GE/2 x 10GE Applies to HPC, graphics processing acceleration, and gaming. 7

8 X6800 Compute Node:XH620 V3 Hot swappable nodes and hard disks; built-in USB flash drive/sata DOM 16 DDR4 DIMM slots Four 2.5 SATA/SAS/SSD or two 2.5 SATA/SAS/SSD + one HHHL PCEe slots or two 3.5 not hot swappable SATA hard disks One rear HHHL PCIe slots Two E v3 processors Flexible on-board load: 2 x GE/4 x GE/2 x 10GE Applies to Web Access,CDN,Web Cache,Cloud Computing,and virtualization etc. 8

9 X6800 Application Scenario Recommendation Yes No Multi-node server scenarios with high requirements for storage capacity such as Server SAN and SDS Internet data center applications Customers requiring more than a hundred of rack servers Customers concerned about energy reservation, easy maintenance, and overall TCO New construction and scenarios where power supply and heat dissipation are not optimal 800 mm deep and 1 m deep chassis in conventional equipment rooms Enterprise core application (mission critical) requiring at least four processors 9

10 Multiple Server Node Options Unified architecture for different service applications Different servers and architectures for different service applications X6800 server 1U rack server 2U rack server Compute application GPU application Storage application One architecture and multiple server node options, meeting requirements for various service applications and simplifying equipment room deployment 10

11 Optimized Architecture, Saving TCO 8.7% Deployment density increased, reducing chassis rental fees Management cable routing simplified, reducing costs on switches Node upgrade supported, reducing procurement costs Energy efficiency improved, reducing power consumption Easy maintenance, short service interruption, low maintenance costs The procurement costs and TCO of the X6800 are reduced by 8.3% and 8.7%, respectively, compared with a conventional rack server. 11

12 High-density Design, Saving Equipment Room Footprint Innovative room layout 6.9 mm Thinnest guide rails in the industry Ultra-thin "tank-thread" cable tray 22 mm Narrowest hard disk tray in the industry Shared space for the cable tray and guide rails Hard disk density improved by 20% 50% 6.8 mm Chassis depth decreased by 68 mm mm Width decreased by at least 3 mm Model for Comparison Huawei X6800 (4U) HP SL4540 (4.3U) DELL C8220X (4U) Maximum number of hard disks in each chassis x 3.5" + 8 x 2.5" 45 x 3.5" + 6 x 2.5" 48 x 3.5" Server node storage nodes (no compute nodes)

13 Optimized Heat Dissipation, Supporting Long-term and Stable Running at 40ºC 3D ventilation Front and rear direct ventilation channels with air exhaustion Return air for heat dissipation of the management board, rear I/O module, and PSUs Top vent for cooling rear hard disks Centralized cooling High-pressure counter-rotating fan Panel with honeycomb-like heat dissipation holes Temperature sensor Up to 3000 W heat dissipation power Air volume increased by 10% Porosity rate: 66% Full coverage of heat spots and precision wind speed adjustment 13

14 Details-oriented, Ensuring Service Reliability Passive backplane Interconnects server nodes to management modules, rear I/O modules, fan modules, and PSUs to prevent single-point failure. Shockproof design for hard disks System-level three-layered shockproof: chassis-level (enhanced strength), componentlevel (separated fan and hard disk chassis), and part-level (shockproof front panel) Durable component Adopts strict component selection and frequency decrease design to prolong the service life. Adopts polymer components to substitute for electrolyte to improve long-term reliability. Redundant key component Adopts redundancy design for the management board, fans, and PSUs to improve system reliability. 14

15 Quick Deployment, Accelerating Service Provisioning Rack Chassis Power Cable Management Network Cable X PCS 4 PCS 1 PCS 4 x 2P rack 4 PCS 8 PCS 4 PCS Model Person Time Quantity Efficiency X day 160 chassis (4 x 2P server) 160/person/day 2U rack 4 1 day /person/day 15

16 Easy Management and Convenient Maintenance Trunk management network port in redundancy mode Two management modes: conventional P2P management and centralized management Management network HMM in active/standby mode, making the management system more reliable N o d e N o d e N o d e IPMI v2.0, SNMP v3, and CIM supported, facilitating interconnection with the upper-layer management platform Network controller sideband interface (NCSI) supported, X6800 chassis efficiently reducing costs Modular design for simple swap maintenance: server nodes, hard disks, PSUs, fans, HMM modules, and I/O modules 16

17 Ranked No.1 In SPEC CPU 2006 Performance Test Year of 2015 Link:

18 Contents 1 Positioning and Selling Click Points to add Title 2 How to Beat Click to add Title 3 How to Defend 18

19 HP Apollo 4500 Introduction 1 compute nodes 60 x 3.5" hard disks Chassis dimensions: 899 mm x mm x 174.8mm 5 fans in N+1 redundancy mode 4 x 800 W/1400 W in redundancy mode One ilo port for managing the whole chassis On-board load: two rear GE ports (10GE optional), one HHHL PCIe slot Compute platform: E v3, 16 DDR4 DIMMs 3 compute nodes 3 x 15 x 3.5" hard disks XH628 v3 with equivalent nodes 19

20 HP Apollo 4500 Advantage and Disadvantage Advantage Apollo 4530 single node supports more hard disks, up to 15; Single node supports up to 4 PCIe slots; Apollo 4510 single node supports up to 68 x 3.5 hard disks; Compute node is separated from storage chassis, which makes it easier to change compute node Disadvantage Chassis height 4.3U, not an integer value Just 3 nodes in 4U chassis CPU just supports to 135W, operating temperature is limited by 35 Server node has no managements network interface Fan is not convenient to change 20

21 HP Apollo 2000 System Competing product of the XH620 V3 Competing product of the XH622 V3 2 U chassis: 448 mm x 87 mm x 863 mm (W x H x D) Four or eight fans with redundancy Two 800 W/1400 W power supplies with redundancy supported Chassis centralized management through the RCM module XL170r 2U4 compute node: 2 x E v3 processor, 16 x DDR4 DIMM, 2 x GE network port, 1 x ilo management network port, 2 x PCIe 3.0 standard card slot (flexible NICs are supported), 2 x M.2 built-in storage device, and support for 24 x 2.5-inch hard disk XL190r 2U2 I/O node: 2 x E v3 processor, 16 x DDR4 DIMMs, 2 x GE network port, 1 x ilo management network port, 3 x PCIe 3.0 standard card slot (flexible NICs are supported), 2 x M.2 built-in storage device, and support for 24 x 2.5-inch hard disk 21

22 HP Apollo 2000 System Advantages and Disadvantages Advantages Disadvantages High hard disk specifications: Each node supports three 3.5-inch hard disks or six 2.5-inch hard disks. The r2800 chassis also supports flexible mapping between hard disks and nodes. Mixed use of different nodes are supported. The panel provides USB 3.0 ports. Nodes can be maintained only from the rear, not in the cold aisle. The operating temperature range is only from 10 to 35 C. RAID controller cards need to occupy standard PCIe slots. XL190r supports only one dual-width GPU. 22

23 HP Apollo 6000 System Competing product of the XH620 V3 XL230a Gen9 Competing product of the XH622 V3 XL250a Gen9 5 U chassis: 448 mm x 220 mm x 862 mm (W x H x D) Five counter-rotating fans 14.4 KW or 15.9 KW external power supply on the cabinet Chassis centralized management XL230a single-width compute node: 2 x E v3 processor, 16 x DDR4 DIMM, 2 x rear PCIe 3.0 standard card slot (flexible NICs are supported), 1 x built-in PCIe standard card slot, and support for 4 x 2.5-inch hard disk XL250a dual-width GPU node: 2 x E v3 processor, 16 x DDR4 DIMM, 2 x rear PCIe 3.0 standard card slot (flexible NICs are supported), 1 x built-in PCIe standard card slot, and support for 6 x 2.5-inch hard disk 23

24 HP Apollo 6000 System Advantages and Disadvantages Advantages Disadvantages The server uses external power supplies that supply 12 V power to the chassis. The power conversion efficiency is high. Each GPU node supports up to six 2.5-inch HDDs. Nodes support CPUs with at most 135 W and do not support 145 W CPUs. The operating temperature range is only from 10 to 35 C. RAID controller cards need to occupy standard PCIe slots. Also, the PCIe slots support only flexible NICs. The nodes do not provide independent management network ports. 24

25 IBM NeXtScale M5 Introduction 6U chassis, dimensions: 263 mm x 447 mm x 915 mm 10 x 80 counter-rotating fans in redundancy mode 6 PSUs in redundancy mode One management port for managing the whole chassis Up to twelve 2P compute nodes (E v3, 16 DDR4 DIMMs, 1 PCIe x 16 slots/2 x 2.5" hard disks+1 x 3.5" hard disk/2 x 2.5" hard disks/4 x 1.8' SSDs, 2 GE on-board load) Storage tray: 7 x non-hot-swappable 3.5" hard disks (small capacity) GPU tray: 2 x GPUs, 1 x PCIe standard card slot n x 360 M5 servers Storage chassis PCIe chassis n x 360 M5 watercooled servers 25

26 IBM NeXtScale M5 Advantage and Disadvantage Advantage Multiple nodes sharing the same chassis, facilitating maintenance Water cooling with high heat dissipation efficiency Optional IMM management module, supporting flexible configuration Disadvantage Chassis height 6U, chassis depth 915 mm, incompliant with the customers' environments Storage node: low storage density, supporting only seven 3.5" hard disks Storage node: non-hot-swappable hard disk, maintenance accompanied by device power-off and service interruption; when the OS runs on two 2.5" hard disks, the hard disks are not hot swappable. Poor PCIe extension, only one PCIe standard card slot Only front cable routing supported 26

27 Dell PowerEdge FX2 2U4 FC630 node 2U8 FC430 node 2 U chassis: mm x mm x 86.8 mm Eight fans: two 80 mm counter-rotating fans and six 60 mm fans Two 1600 W or 1100 W PSUs in redundancy The entire chassis provides a CMC management board and supports cascaded chassis management Four FC630 node, each with the E v3 platform, 24 x DDR4 DIMM, 2 x 2.5-inch disk or 8 x 1.8-inch disk, 2 x PCIe mezzanine card) Eight FC430 nodes, each with the E v3 platform, 8 x DDR4 DIMM, 2 x 1.8-inch disk (or 1 x 1.8-inch disk and 1 x IB mezzanine card), and 1 x PCIe mezzanine card Support for GE or 10GE pass-through modules, and three types of switch modules within the chassis FN410s 4 x SFP + 10GE FN410t 4 x 10BASE-T FN2210s 4 x 10GE or 2 x FC + 2 x 10GE 27

28 Dell PowerEdge FX2 Advantages and Disadvantages Advantages Disadvantages Various nodes are supported and can be used in the same chassis. High computing density: Eight Xeon or 16 Atom compute nodes fit into 2 U space. Flexible switch module configuration: Chassis switches are supported. Flexible configuration: Nodes can be changed to storage modules. Excellent performance: NVMe SSDs are supported. The chassis needs to be pulled out before hotswapping fan modules, which is inconvenient. The nodes do not have independent management ports or VGA ports. This contradicts customer operation habits. The FD332 storage module supports only 2.5- inch disks. The storage expandability is poor. The FX2 does not support front cabling and therefore does not suit some scenarios. 28

29 Fujitsu CX2550 M1 2U4 CX400 M1 chassis 2 U chassis: 860 mm x 446 mm x 87.8 mm Four fans that do not support hot swap Two 1600 W PSUs with redundancy supported 2U4 E v3 platform, 16 x DDR4 DIMM, 6 x 2.5-inch disk, 2 x GE port, and 2 x PCIe slot CX2550 M1 node 29

30 Fujitsu CX2550 M1 Advantages and Disadvantages Advantages Disadvantages The mainboard applies to 2U4 and 2U2 nodes and supports two GPGPUs. Each node supports up to six 2.5-inch hard disks. The node supports NVMe SSDs, which offer high performance. The fans do not support hot swap. The chassis does not provide an aggregated management network port. Only two GE network ports are provided. Other service network adapters need to occupy standard PCIe slots. The node does not support front cabling and therefore does not suit some scenarios. 30

31 Comparison Between Huawei XH628 V3 and Competitors' Storage Nodes Item Huawei XH628 V3 HP Apollo 4530 Gen9 IBM NX360 M5 CPU 2 x E v3 2 x E v3 2 x E v3 DIMM 16 x DDR4 16 x DDR4 DIMM 16 x DDR4 DIMM 7 x 3.5-inch (non-hotswappable) + 2 x 2.5-inch Hard disk 12 x 3.5-inch + 2 x 2.5-inch 15 x 3.5-inch + 2 x (non-hot-swappable) + 2 x (optional) 2.5-inch 2.5-inch (optional, when the PCIe 3.0 x16 slot is not configured) PCIe slot LOM 2 x PCIe 3.0 x8 + 2 x PCIe 3.0 x8 (optional) + 1 x PCIe 3.0 x8 mezzanine slot 2 x GE/4 x GE/2 x 10GE 4 x PCIe3.0 x8 slots 2 x GE + 2 x 10GE (optional) 1 x PCIe 3.0 x x PCIe 3.0 x8 RAID slot 2 x GE + 2 x 10GE/2 x IB Comments 4 nodes in 4U 3 nodes in 4U 6 nodes in 6U Huawei XH628 V3: higher density and better I/O expandability compared with other servers. 31

32 Comparison Between Huawei XH622 V3 and Competitors' GPU Nodes Item Huawei XH622 V3 HP XL190r Gen9 HP XL250r Gen9 IBM NX360 M5 CPU 2 x E v3 2 x E v3 2 x E v3 2 x E v3 DIMM 16 x DDR4 16 x DDR4 16 x DDR4 16 x DDR4 Hard disk 4 x 2.5-inch GPGPU 2 PCIe slot LOM 2 x PCIe 3.0 x8 + 1 x PCIe 3.0 x8 mezzanine slot 2 x GE/4 x GE/2 x 10GE 6 x 2.5-inch (up to 24 x 2.5-inch) 2 x single-width or 1 x dual-width 1 x PCIe 3.0 x8 + 1 x PCIe 3.0 x16 mezzanine slot 2 x GE 6 x 2.5-inch 2 x 2.5-inch (non-hotswappable) + 2 x 2.5- inch (optional, when the PCIe 3.0 x16 slot is not configured) x PCIe 3.0 x8 flexible NIC + 1 x PCIe 3.0 x16 flexible NIC + 1 x PCIe 3.0 x16 built-in slot Flexible NICs required 1 x PCIe 3.0 x x PCIe 3.0 x8 RAID slot 2 x GE + 2 x 10GE/2 x IB Huawei XH622 V3: better I/O expandability and flexible LOM compared with other servers. 32

33 Comparison Between Huawei XH620 V3 and Competitors' Compute Nodes Item Huawei XH620 V3 HP XL170r Gen9 HP XL230r Gen9 Dell FC630 IBM NX360 M5 Huawei XH620 V3: Better storage capacity and flexible LOM compared with other servers. 33 Fujitsu CX2550 M1 CPU 2 x E v3 2 x E v3 2 x E v3 2 x E v3 2 x E v3 2 x E v3 DIMM 16 x DDR4 16 x DDR4 16 x DDR4 24 x DDR4 16 x DDR4 16 x DDR4 Hard disk PCIe slot LOM 4 x 2.5-inch/2 x 2.5-inch/2 x 3.5- inch SATA non-hotswappable 1 x rear PCIe 3.0 x8 + 1 x front PCIe 3.0 x8 (when only 2 x 2.5-inch HDDs are supported) + 1 x PCIe 3.0 x8 mezzanine slot 2 x GE/4 x GE/2 x 10GE 6 x 2.5-inch (up to 24 x 2.5-inch) 1 x PCIe 3.0 x8 + 1 x PCIe 3.0 x16 mezzanine slot 2 x GE 4 x 2.5-inch 1 x PCIe 3.0 x8 flexible NIC + 1 x PCIe 3.0 x16 flexible NIC + 1 x PCIe 3.0 x16 builtin slot Flexible NICs required 2 x 2.5-inch/8 x 1.8-inch 2 x rear PCIe 3.0 x8 + 1 x PCIe 3.0 x8 mezzanine slot 4 x GE or 4 x 10GE (mezzanine) 2 x 2.5-inch (nonhot-swappable) + 2 x 2.5-inch (optional, 6 x 2.5inch when the PCIe 3.0 SATA/SAS/SSD/P x16 slot is not CIe SSD configured) 1 x PCIe 3.0 x x PCIe 3.0 x8 RAID slot 2 x GE + 2 x 10GE/2 x IB 2 x PCIe + 1 x PCIe mezzanine slot for RAID controller card 2 x GE

34 How to Beat the HP Apollo 4500 The server supports CPUs of only up to 135 W. The maximum operating temperature is only 35 C. A 4 U chassis allows only three nodes. The node density is lower than that of XH628 V3. It is not convenient to replace fans because they cannot be replaced without pulling out the chassis. SL4500 nodes do not provide independent management network ports. The cable layout on the management plane is different from that of most servers. 34

35 How to Beat the Dell FC630 The nodes do not provide independent management network ports or independent VGA ports. This contradicts customer operation habits. Hot swap of fans requires use of guide rails and cable supports. The operation is not convenient. The server does not support front cabling and therefore does not suit some scenarios. 35

36 How to Beat the HP XL170r The operating temperature range is only from 10 to 35 C. RAID controller cards need to occupy standard PCIe slots. The server does not support front cabling and therefore does not suit some scenarios. 36

37 How to Beat the HP XL190r The operating temperature range is only from 10 to 35 C. RAID controller cards need to occupy standard PCIe slots. Only one dual-width GPU is supported. 37

38 How to Beat the HP XL230r The operating temperature range is only from 10 to 35 C. The server supports CPUs of up to only 135 W. RAID controller cards need to occupy standard PCIe slots. The nodes do not provide independent management network ports. 38

39 How to Beat the HP XL250r The operating temperature range is only from 10 to 35 C. The server supports CPUs of up to only 135 W. RAID controller cards need to occupy standard PCIe slots. The rear PCIe slots support only flexible NICs. The nodes do not provide independent management network ports. 39

40 Contents 1 Positioning and Selling Click Points to add Title 2 How to Beat Click to add Title 3 How to Defend 40

41 FAQ 1. Q: Do E v3 and DDR4 have high initial investment? A: Compared with the last generation products, E v3 and DDR4 have the performance improved by 30%. Therefore, fewer servers are required for meeting equivalent requirements. Considering the OPEX (electricity cost) in the next three years, the TCO of the Grantley platform is largely less than that of the Romley platform. 2. Q: Does the power consumption of a chassis fully configured with high-density servers exceed the power supply capacity to the whole chassis? A: The maximum power consumption of a chassis is calculated based on the maximum power consumption of per single node. However, in practice, the actual power consumption of a chassis is far lower than the maximum power consumption depending on the customer configuration, node selection, and service running situation. It is recommended that 4 5 chassis be configured for a 7 kw 4U 4-node X6800 chassis. 3. Q: Since up to six hard disks are installed vertically, will the service lives of hard disk batteries decrease with the temperature rise? A: The temperature rise of each hard disk is about 2 C and the temperature of the last hard disk will be about 12 C. Considering that the equipment room temperature is controlled at C and the hard disk temperature is controlled below 40 C, the temperature has mere impact on the service lives of batteries unless the temperature reaches 50 C. 4. Q: Since the current architecture is squeezed to support power supply and heat dissipation of the next generation servers with improved specifications, how to protect current chassis investment? A: In terms of heat dissipation, the next generation Intel servers have same requirements as those of the current servers. In addition, the width of each node in the 4U 4-node X6800 chassis is 1.2U. Compared with the 1U space provided by competitors' products, the heat dissipation margin is larger, better supporting the next generation nodes. Therefore, the X6800 chassis has no problem to support the next generation nodes. 5. Q: How to beat competitors' compute nodes? A: Huawei has 4U 8-node X6800 servers in plan, which will be provided in

42 HUAWEI ENTERPRISE ICT SOLUTIONS A BETTER WAY Copyright 2012 Huawei Technologies Co., Ltd. All Rights Reserved. The information in this document may contain predictive statements including, without limitation, statements regarding the future financial and operating results, future product portfolio, new technology, etc. There are a number of factors that could cause actual results and developments to differ materially from those expressed or implied in the predictive statements. Therefore, such information is provided for reference purpose only and constitutes neither an offer nor an acceptance. Huawei may change the information at any time without notice.