Mechanical Specification

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1 6/19/2018 epcn Print: Final Product Change Notification F01 Final Product Change Notification F01 Issue Date: Effective Date: 20-Jun Sep-2018 Here's your personalized quality information concerning products Mouser Electronics purchased from NXP. For detailed information we invite you to view this notification online Management Summary LPC8N04FHI24 Boot ROM update from version 0.12 to version 0.14 to support Over The Air (OTA) firmware update and vector checksum verification. Change Category Wafer Fab Process Assembly Process Wafer Fab Assembly Materials Materials Wafer Fab Assembly Location Location Firmware Other Product Marking Test Location Design Mechanical Specification Test Process Errata Test Electrical spec./test Packing/Shipping/Labeling Equipment coverage LPC8N04 Boot ROM Update to Support Over The Air (OTA) Description of Change The LPC8N04FHI24 Boot ROM will be updated. - Boot ROM version number is changed from version 0.12 to version Boot ROM was updated to support application vector checksum verification before booting the image. - Users migrating from previous version need to ensure that the reserved Cortex-M0+ exception vector location 7 (offset 0x C in the vector table) contains the 2's complement of the check-sum of table entries 0 through 6. - Boot ROM code was updated to support OTA firmware update using Secondary Bootloader (SBL) library. See Tech Note : LPC8N04: Encrypted Over the Air (OTA) Firmware update using NFC. The following documents are updated to support this change. Data sheet: LPC8N04 v.1.4, User Manual: UM11074 v.1.2, Tech Note: : LPC8N04: Encrypted Over the Air (OTA) Firmware update using NFC, Reason for Change To support OTA firmware update and application checksum verification. Identification of Affected Products Parts with date code 824 (workweek 1824) or later have firmware version The date code can be seen on the part marking and packing labels. Product Availability Sample Information 1/2

2 6/19/2018 epcn Print: Final Product Change Notification F01 Samples are available from 25-Jun-2018 Production Planned first shipment 30-Sep-2018 Anticipated Impact on Form, Fit, Function, Reliability or Quality No physical change to die or packaging. No Quality or Reliability impact. The user needs to include checksum verification. Data Sheet Revision A new datasheet will be issued Disposition of Old Products Products with firmware version 0.12 will no longer be shipped. Additional information Self qualification: view online Additional documents: view online Timing and Logistics In compliance with JEDEC J-STD-046, your acknowledgement of this change is expected by 20-Jul Contact and Support For all inquiries regarding the epcn tool application or access issues, please contact NXP "Global Quality Support Team". For all Quality Notification content inquiries, please contact your local NXP Sales Support team. For specific questions on this notice or the products affected please contact our specialist directly: Name Tim Camenzind Position Senior Quality Engineer address tim.camenzind@nxp.com At NXP Semiconductors we are constantly striving to improve our product and processes to ensure they reach the highest possible Quality Standards. Customer Focus, Passion to Win. NXP Quality Management Team. About NXP Semiconductors NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. NXP Semiconductors High Tech Campus, 5656 AG Eindhoven, The Netherlands NXP Semiconductors. All rights reserved. 2/2

3 San Jose, October 2017 PRODUCT QUALIFICATION PACKAGE Type LPC8N04FHI24 Contents Certification of Design (including reliability data) Customer Liaison NXP Semiconductors San Jose Product Line: Micro Controllers 1/5

4 San Jose, October Supplier parts number LPC8N04FHI24 2. Location of die fabrication facility and process identifier a. Die fab. b. Die version c. Process 3. Location of assembly facility and process identifier a. Assembly b. process SSMC Singapore - CMOS Z14HFLVW_TIMD5 NXP ATKH KAOHSIUNG SOT616KA27 4. Location of final Q.C. facility NXP ATKH KAOHSIUNG 5. Die technology description a. Wafer size b. process technology c. number of mask steps d. feature metal size 8 inch, mm CMOS Z14HFLVW_TIMD m 6. Chip dimensions 2.55 x Die metallization number 6 Layers 8. Die passivation Nitride 9. Die separation methode Sawing 10. Type of package and pin count SOT616-3, HVQFN Moisture sensitivity level 260 C MSL Die attach material and method Henkel ATB-F125E, Adhesive 13. Plastic moulding compound CEL-9240HF10AN 14. Bond wire material and diameter AuPd1 wire, 20 m 15. Wire bond process Thermo sonic 16. Type of wire bond a. at die b. at lead frame 17. Lead frame a. Material b. Pre plating Ball bond Stitch bond CuNi3 NiPdAu 2/5

5 18. Marking of the device line A line B line C San Jose, October 2017 Syww, S = Assembly plant, NXP Kaousiung, Taiwan, yww = assembly date code DBSN&ASID, Waferbatch code + assembly sequence ID NXP part number: LPC8N E.S.D Human Body Model Charged Device Mode Passed: >2000V Passed: >500V 20. Reliability summary See page 5 3/5

6 San Jose, October 2017 OVERALL MANUFACTURING FLOWCHART Waferfab SSMC Pre-testing ATKH Wafer store ATKH Dicing ATKH Assembly ATKH Final Testing ATKH Store Europe Far East USA Customer 4/5

7 San Jose, October 2017 RELIABILITY SUMMARY TEST/CONDITIONS Duration Sample size Rejects High Temperature Operating Life HTOL Temp=150 C, Dynamic, Rated Voltage 168h 3x h 77 0 Temp Cycling (TC) Temp = -65 C to +150 C (Air-to-Air) 250 Cycles 3x Cycles 3x77 0 Highly Accelerated Stress Test (HAST) HAST = 130 C, 85% R.H. 114h 3x h 77 0 High Temp Storage Life (HTSL)* HTSL = 175 C 250h 3x77* 0 500h 77* 0 Latch-up +/- 100mA 6 Early Failure Rate Intrinsic Failure Rate < 10 FPM < 10 FIT RELIABILITY ENGINEERING * Data from Structurally similar product 5/5

8 LPC8N04: Encrypted Over the Air (OTA) Firmware update using NFC Rev. 1 5 June 2018 Technical note Document information Info Keywords Abstract Content LPC8N04, OTA, NFC, SBL, encryption/decryption, CRC32 This technical note gives an overview of how build an application to support encrypted over the air firmware update using NFC through a Secondary Boot Loader (SBL).

9 LPC8N04: Encrypted Over the Air (OTA) Firmware update using NFC Revision history Rev Date Description Initial version. Contact information For more information, please visit: For sales office addresses, please send an to: All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Technical note Rev. 1 5 June of 11

10 LPC8N04: Encrypted Over the Air (OTA) Firmware update using NFC 1. Introduction The LPC8N04 is a family of ARM Cortex-M0+ based microcontrollers with an integrated NFC Tag. LPC8N04 Development Board is used in this technical note. Note: Only the LPC8N04 parts with Boot ROM Version greater than equal to 0.14 support the OTA firmware update using SBL and OTA does not work with energy harvesting, it needs external USB power or a battery. Details of the LPC8N04 Development board can be found in: Fig 1. LPC8N04 Development Board 2. Description The technical note is accompanied with a software package containing a demo application in the BSP folder that supports firmware update through a Secondary Boot Loader (SBL). The projects are under BSP\prj_8Nxx. It also contains a Secure Image Creator tool and the SBL binary under the folder secure_image_creator. The SBL downloads the encrypted firmware over NFC, decrypts, and updates the flash memory with the new firmware. The SBL takes the first 8 sectors of the flash and is the first image to boot up for the LPC8N04, which then validates the application image by verifying the CRC32 of the image and boots it. The Secure Image Creator tool is used to generate encryption keys, generate combined images of SBL + application, and encrypt firmware binaries. The SBL and Secure Image Creator Tool use Corrected Block Tiny Encryption Algorithm for cryptography. The Sample Binaries folder contains binaries to try out the firmware update feature. Firmware is downloaded using the LPC8N04 NFC Demo Android App. See the following link: Fig 2 shows version 2.0 of the app that supports OTA firmware update. All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Technical note Rev. 1 5 June of 11

11 LPC8N04: Encrypted Over the Air (OTA) Firmware update using NFC Fig 2. OTA firmware update tab in the Android app 2.1 Executing the sample binaries with the Android App The sample binaries folder consists of three binaries: firmware.bin This is the combined binary of SBL + application and you flash it through the SWD using MCUXpresso Flash Programmer tool. Choose the binary and set the start address as 0x0 in MCUXpresso. See Fig 3. After flashing, power off and power on the board. The application version is App_1.bin This is an encrypted firmware binary that can be downloaded from the phone using the Android App. The version is App_2.bin This is another encrypted version of firmware. The version is All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Technical note Rev. 1 5 June of 11

12 LPC8N04: Encrypted Over the Air (OTA) Firmware update using NFC Fig 3. Downloading SBL + application image using MCUXpresso IDE When the SBL + application image is flashed through the MCUXpresso, the LPC8N04 NFC Demo App can be used to read the application version by clicking on Read Version from Device on the OTA tab of the app. See Fig 4. Fig 4. Reading application firmware version from LPC8N04 NFC demo app All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Technical note Rev. 1 5 June of 11

13 LPC8N04: Encrypted Over the Air (OTA) Firmware update using NFC To download app_1.bin over NFC, transfer the app_1.bin to the phone/tablet device running the LPC8N04 NFC Demo App and select the file using the button Select from Storage and click Flash. Fig 5 shows the firmware download in progress. Fig 5. Firmware download in progress Fig 6 shows the completed firmware download. Fig 6. Firmware download completed All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Technical note Rev. 1 5 June of 11

14 LPC8N04: Encrypted Over the Air (OTA) Firmware update using NFC After download is completed, the SBL resets and boots the application image following successful verification. The application version can be read again from the LPC8N04 NFC Demo app shown in Fig 7. Tap the NFC again (that is, move the phone away and tap it back) to make the app fully functional. Fig 7. Read updated application version The update procedure can be repeated for app_2.bin to upgrade to version By default, the SBL only allows for upgrading the firmware version and rejects downgrading the firmware version. Therefore, to revert to 1.0.0, use the MCUXpresso IDE to program. 2.2 Steps to build the binaries from the demo application The demo application project is located under the folder BSP\prj_8Nxx. The demo application project is available in three tool chains: MCUXpresso IDE v Keil MDK v IAR Workbench v Note: The MCUXpresso project and source is provided as a zip file and it can be imported into your workspace. Use the following steps for generating the encryption keys, generating encrypted firmware binaries, generating combined SBL and application image for development or factory use: 1. Open the project using one of the tools mentioned and build the project. 2. Copy the app_demo.bin from output folder and copy it into the secure_image_creator folder. The SBL binary is already provided in the secure_image_creator folder as sbl_nfc.bin. Do not change the name of the SBL binary. 3. To generate new keys, run secure_image_creator.exe -g keys in the command prompt. Use the same keys or the combined image and the follow-on encrypted images for firmware updates. All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Technical note Rev. 1 5 June of 11

15 LPC8N04: Encrypted Over the Air (OTA) Firmware update using NFC 4. To generate a combined image, run secure_image_creator.exe -d keys app_demo.bin firmware.bin. The firmware.bin is downloaded using MCUXpresso IDE. Note: The secure_image_creator.exe -f keys app_demo.bin firmware.bin command option is only used for the factory images with CRP enabled. Do not use this for development. 5. To generate a newer version of the application firmware, open app_version.h and increase the version. The versioning scheme is 2 bytes of Major version, 2 bytes of Minor version and 2 bytes of Revision. 6. Build the project and copy the app_demo.bin to secure_image_creator folder. 7. To encrypt application image, run secure_image_creator.exe -e keys app_demo.bin app_1.bin. 8. Repeat steps 5 through 7 for each firmware update. 3. Configuring your example to support SBL for OTA firmware update To support OTA firmware update using SBL, your application must have and support some NFC records to read application version and switch to SBL mode. Note: The OTA firmware update using SBL is only supported on parts with Boot ROM version greater than equal to 0.14 and OTA does not work with just energy harvesting, it needs a battery or external USB power. The following are the requirements on the application side to support OTA firmware update using SBL: The application must be built for flash address starting from 0x2000 because the first 8 sectors are taken by the SBL. The RAM address should start from 0x See the demo application projects provided with this technical note for more details. You must add a app_version.h into your project. The post build steps in your project should generate a binary with the vector checksum. The application should have an image header starting at address 0x20C0, that is, soon after the Interrupt Vector Table is implemented in the startup files provided with this technical note. Each element in the image header structure is a 32-bit word: o Fixed pattern 0xFEEDA5A5. o Image Type always 0x0. o o o o Length for CRC32 should be left as 0x0 by application. It is updated by secure image creator tool. CRC32 value should be left as 0x0 by application. It is updated by secure image creator tool. App Major and Minor version most significant 16 bits is major version and the least significant 16 bits is minor version. The major and minor version is extracted from app_version.h. App Revision most significant 16 bits is 0 and the least significant 16 bits is the Revision. The Revision is extracted from app_version.h. The application should always provide a NDEF MIME record of type application/octetstream in its NFC memory for the Android App to read. The payload structure is as All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Technical note Rev. 1 5 June of 11

16 LPC8N04: Encrypted Over the Air (OTA) Firmware update using NFC follows: 0xB0, A, P, P, 2 bytes of Major version in little endian format, 2 bytes of Minor version in little endian format and 2 bytes of Revision in little endian format. This is used by Android App to read the version and know that it is compatible with OTA scheme. Please note that there can be other NDEF records pertaining to the application in the NFC memory. The application should also support a NFC write from host of NDEF MIME record of type application/octet-stream with payload of one-byte (0x34). This is the command to enter SBL mode for firmware update. After the command 0x34 is received by the application it should process it and the NFC memory should read a NDEF MIME record of type application/octet-stream in the NFC memory with payload of 0xB4, 0x00. The host can read this and it acknowledges the Android App that the command to enter SBL mode was successfully received. The previous version NDEF record is not required anymore. Note: There can be other NDEF records pertaining to the application in the NFC memory. After the response, the application should jump into SBL after 100 ms by calling function address present in 0x1F00 location. The function pointer in the location 0x1F00 is of type void (*)(uint32_t) and the argument passed allows SBL to decide whether to allow firmware downgrading. The SBL allows firmware downgrading only when parameter passed is 0x5A5A5A5A. For any other value, firmware downgrading is disabled. This feature allows for releasing test versions in the field that can be downgraded if bugs or errors are found. All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Technical note Rev. 1 5 June of 11

17 LPC8N04: Encrypted Over the Air (OTA) Firmware update using NFC 4. Legal information 4.1 Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 4.2 Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer s applications and products planned, as well as for the planned application and use of customer s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer s applications or products, or the application or use by customer s third party customer(s). Customer is responsible for doing all necessary testing for the customer s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer(s). NXP does not accept any liability in this respect. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 4.3 Trademarks Notice: All referenced brands, product names, service names and trademarks are property of their respective owners. All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Technical note Rev. 1 5 June of 11

18 LPC54608 ADC Sequence A and B conversions with DMA 5. Contents 1. Introduction Description Executing the sample binaries with the Android App Steps to build the binaries from the demo application Configuring your example to support SBL for OTA firmware update Legal information Definitions Disclaimers Trademarks Contents Please be aware that important notices concerning this document and the product(s) described herein, have been included in the section 'Legal information'. NXP B.V All rights reserved. For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com Date of release: 5 June 2018 Document identifier:

19 Changed Orderable Part# Customer Part# Changed Part 12NC Changed Part Number Changed Part Description Package Outline Package Name Status Product Line LPC8N04FHI24E LPC8N04FHI24E LPC8N04FHI24 32 bit ARM Cortex M0+ SOT616 3 HVQFN24 RFS BL Microcontrollers LPC8N04FHI24Z LPC8N04FHI24Z LPC8N04FHI24 32 bit ARM Cortex M0+ SOT616 3 HVQFN24 RFS BL Microcontrollers