Intel 946 Express Chipset Family

Transcription

1 1 Intel 946 Express Chipset Family Thermal and Mechanical Design Guidelines For the Intel 82946GZ Graphics and Memory Controller Hub (GMCH) and Intel 82946PL Memory Controller Hub (MCH) June 2006 Document Number:

2 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel 82946GZ GMCH and Intel 82946PL MCH may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Pentium, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright 2006 Intel Corporation 2 Thermal and Mechanical Design Guidelines

3 Contents 1 Introduction Terminology Reference Documents Product Specifications Package Description Non-Grid Array Package Ball Placement Package Loading Specifications Thermal Specifications Thermal Design Power (TDP) Definition Methodology Specifications Thermal Metrology Case Temperature Measurements Thermocouple Attach Methodology Airflow Characterization Thermal Mechanical Test Vehicle Reference Thermal Solution Operating Environment ATX Form Factor Operating Environment Balanced Technology Extended (BTX) Form Factor Operating Environment Reference Design Mechanical Envelope Thermal Solution Assembly Environmental Reliability Requirements...23 Appendix A: Currently Enabled Suppliers...25 Appendix B: Mechanical Drawings...27 Thermal and Mechanical Design Guidelines 3

4 Figures Figure 1. (G)MCH Non-Grid Array...12 Figure 2. 0 Angle Attach Methodology (top view, not to scale)...16 Figure 3. 0 Angle Attach Heatsink Modifications (generic heatsink side and bottom view shown, not to scale)...16 Figure 4. Airflow &Temperature Measurement Locations...17 Figure 5. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on an ATX Platform...20 Figure 6. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a Balanced Technology Extended (BTX) Platform...21 Figure 7. ATX MCH Heatsink Installed on Board...22 Figure 8. Balanced Technology Extended (BTX) MCH Heatsink Design Installed on Board...22 Figure 9. (G)MCH Package Drawing...28 Figure 10. (G)MCH Component Keep-Out Restrictions for ATX Platforms...29 Figure 11. (G)MCH Component Keep-Out Restrictions for Balanced Technology Extended (BTX) Platforms...30 Figure 12. (G)MCH Reference Heatsink for ATX Platforms Sheet Figure 13. (G)MCH Reference Heatsink for ATX Platforms Sheet Figure 14. (G)MCH Reference Heatsink for ATX Platforms Anchor...33 Figure 15. (G)MCH Reference Heatsink for ATX Platforms Ramp Retainer Sheet Figure 16. (G)MCH Reference Heatsink for ATX Platforms Ramp Retainer Sheet Figure 17. (G)MCH Reference Heatsink for ATX Platforms Wire Preload Clip...36 Figure 18. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms...37 Figure 19. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms Clip...38 Tables Table 1. Package Loading Specifications...12 Table 2. Thermal Specification...14 Table 3. ATX Reference Thermal Solution Environmental Reliability Requirements (Board Level)...23 Table 4. Balanced Technology Extended (BTX) Reference Thermal Solution Environmental Reliability Requirements (System Level)...24 Table 5. ATX Intel Reference Heatsink Enabled Suppliers for Intel 946 Express Chipset Family...25 Table 6. Balanced Technology Extended (BTX) Intel Reference Heatsink Enabled Suppliers for Intel 946 Express Chipset Family...25 Table 7. Supplier Contacts Thermal and Mechanical Design Guidelines

5 Revision History Revision Number Description Revision Date -001 Initial release June 2006 Thermal and Mechanical Design Guidelines 5

6 6 Thermal and Mechanical Design Guidelines

7 Introduction 1 Introduction As the complexity of computer systems increases, so do power dissipation requirements. The additional power of next generation systems must be properly dissipated. Heat can be dissipated using improved system cooling, selective use of ducting, and/or passive heatsinks. The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within functional limits. The functional temperature limit is the range within which the electrical circuits can be expected to meet specified performance requirements. Operation outside the functional limit can degrade system performance, cause logic errors, or cause component and/or system damage. Temperatures exceeding the maximum operating limits may result in irreversible changes in the operating characteristics of the component. Note: Unless otherwise specified the information in this document applies to Intel 946 Express Chipset Family. The Intel 946 Express chipsets will be available with integrated graphics and associated SDVO and analog display ports. In this document the integrated graphics component may be referred to as the GMCH. In addition a version will be offered using discrete graphics and may be referred to as the MCH. The term (G)MCH will be used in this document to refer to both components. The devices covered by this document are: Intel 82946GZ Graphics and Memory Controller Hub (GMCH) Intel 82946PL Memory Controller Hub (MCH) Note: In this document the use of the term chipset refers to the combination of the (G)MCH and the Intel ICH7. This document presents the conditions and requirements to properly design a cooling solution for systems that implement the (G)MCH. Properly designed solutions provide adequate cooling to maintain the (G)MCH case temperature at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the (G)MCH case temperature at or below those recommended in this document, a system designer can ensure the proper functionality, performance, and reliability of this component. Thermal and Mechanical Design Guidelines 7

8 Introduction 1.1 Terminology Term FC-BGA Intel ICH7 GMCH MCH T A T C Description Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a die is mounted using an underfill C4 (Controlled Collapse Chip Connection) attach style. The primary electrical interface is an array of solder balls attached to the substrate opposite the die. Note that the device arrives at the customer with solder balls attached. Intel I/O Controller Hub 7. The chipset component that contains the primary PCI interface, LPC interface, USB, ATA, and/or other legacy functions. Graphic Memory Controller Hub. The chipset component that contains the processor and memory interface and integrated graphics core. Memory Controller Hub. The chipset component that contains the processor and memory interface. This component is used with a discrete graphics card in the system. The local ambient air temperature at the component of interest. The ambient temperature should be measured just upstream of airflow for a passive heatsink or at the fan inlet for an active heatsink. The case temperature of the (G)MCH component. The measurement is made at the geometric center of the die. T C-MAX The maximum value of T C. T C-MIN The minimum valued of T C. TDP TIM Thermal Design Power is specified as the maximum sustainable power to be dissipated by the (G)MCH. This is based on extrapolations in both hardware and software technology. Thermal solutions should be designed to TDP. Thermal Interface Material: thermally conductive material installed between two surfaces to improve heat transfer and reduce interface contact resistance. Ψ CA Case-to-ambient thermal solution characterization parameter (Psi). A measure of thermal solution performance using total package power. Defined as (T C T A ) / Total Package Power. Heat source size should always be specified for Ψ measurements. 8 Thermal and Mechanical Design Guidelines

9 Introduction 1.2 Reference Documents Document Intel 946 Express Chipset Family Datasheet Intel I/O Controller Hub 7 (ICH7) Thermal Design Guidelines Intel Pentium D Processor, Intel Pentium Processor Extreme Edition, and Intel Pentium 4 Processor Thermal and Mechanical Design Guidelines Balanced Technology Extended (BTX) System Design Guide Intel Pentium D Processor 840,830 and 820 Datasheet Various System Thermal Design Suggestions Location /design/chipsets/datashts/ htm chipsets/ designex/ htm / pentiumxe/designex/ htm esign/pentiumd//datashts/ htm Thermal and Mechanical Design Guidelines 9

10 Introduction 10 Thermal and Mechanical Design Guidelines

11 Product Specifications 2 Product Specifications 2.1 Package Description The (G)MCH is available in a 34 mm [1.34 in] x 34 mm [1.34 in] Flip Chip Ball Grid Array (FC-BGA) package with 1226 solder balls. The die size is currently 11.9 mm [0.469in] x 10.9 mm [0.429in]. A mechanical drawing of the package is shown in Figure 9, Non-Grid Array Package Ball Placement The (G)MCH package uses a balls anywhere concept. Minimum ball pitch is 0.8 mm [0.031 in], but ball ordering does not follow a 0.8-mm grid. Board designers should ensure correct ball placement when designing for the non-grid array pattern. For exact ball locations relative to the package, refer to the Intel 946 Express Chipset Family Datasheet. Thermal and Mechanical Design Guidelines 11

12 Product Specifications Figure 1. (G)MCH Non-Grid Array 34 x 34mm Substrate [1.34 x 1.34 in] BC BB BA AY AW AV AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U R T P N M L K J H G F E D C B A BC1 BC2 BC3 BC5 BC7 BC10 BC12 BC14 BC16 BC18 BC20 BC22 BC24 BC26 BC28 BC30 BC32 BC34 BC37 BC39 BC42 FIDSAF1 BC41 BC43 BB4 BB6 BB9 BB11 BB13 BB15 BB17 BB19 BB21 BB23 BB25 BB27 BB29 BB31 BB33 BB35 BB38 BB40 BB1 BB2 BB3 BB5 BB7 BB10 BB12 BB14 BB16 BB18 BB20 BB22 BB24 BB26 BB28 BB30 BB32 BB34 BB37 BB39 BB42 BB41 BB43 BA4 BA6 BA9 BA11 BA13 BA15 BA17 BA19 BA21 BA23 BA25 BA27 BA29 BA31 BA33 BA35 BA38 BA40 BA1 BA2 BA5 BA10 BA14 BA18 BA22 BA26 BA30 BA34 BA39 BA42 BA43 AY6 AY9 AY11 AY13 AY15 AY17 AY19 AY21 AY23 AY25 AY27 AY29 AY31 AY33 AY35 AY38 AY2 AY3 AY4 AY7 AY12 AY20 AY24 AY32 AY37 AY40 AY41 AY42 AW1 AW2 AW5 AW7 AW9 AW11 AW12 AW13 AW15 AW17 AW18 AW20 AW21 AW23 AW24 AW26 AW27 AW29 AW31 AW32 AW33 AW35 AW37 AW39 AW43 AW3 AW41 AW42 AV6 AV38 AV2 AV3 AV7 AV9 AV11 AV12 AV13 AV15 AV17 AV18 AV20 AV21 AV23 AV24 AV26 AV27 AV29 AV31 AV32 AV33 AV35 AV37 AV40 AV42 AV4 AV41 AU1 AU2 AU4 AU5 AU6 AU7 AU9 AU11 AU12 AU13 AU15 AU17 AU18 AU20 AU21 AU23 AU24 AU26 AU27 AU29 AU31 AU32 AU33 AU35 AU39 AU37 AU38 AU43 AU40 AU42 AT11 AT12 AT13 AT15 AT17 AT18 AT20 AT21 AT23 AT24 AT26 AT27 AT29 AT31 AT32 AT33 AR41 AR2 AR3 AR4 AR40 AR42 AR5 AR6 AR7 AR9 AR35 AR37 AR39 AR38 AR11 AR12 AR13 AR15 AR17 AR18 AR20 AR21 AR23 AR24 AR26 AR27 AR29 AR31 AR32 AR33 AP1 AP2 AP3 AP42 AP41 AP43 AN5 AN6 AN7 AN8 AN9 AP12 AP13 AP15 AP17 AP18 AP20 AP21 AP23 AP24 AP26 AP27 AP29 AP31 AP32 AN35 AN37 AN39 AN2 AN3 AN4 AN11 AN36 AN41 AN33 AN38 AN40 AN42 AN12 AN13 AN15 AN17 AN18 AN20 AN21 AN23 AN24 AN26 AN27 AN29 AN31 AN32 AM1 AM2 AM4 AM40 AM42 AM43 AM5 AM6 AM7 AM8 AM9 AM10 AM11 AM34 AM36 AM38 AM13 AM15 AM17 AM18 AM20 AM21 AM23 AM24 AM26 AM27 AM29 AM31 AM33 AM35 AM37 AM39 AL41 AL2 AL3 AL4 AL40 AL42 AL15 AL17 AL18 AL20 AL21 AL23 AL24 AL26 AL27 AL29 AL5 AL6 AL7 AL8 AL9 AL11 AL13 AL31 AL33 AL35 AL37 AL39 AK42 AK1 AK2 AK3 AL10 AL12 AL32 AL34 AL36 AL38 AK41 AK43 AK14 AK15 AK17 AK18 AK20 AK21 AK23 AK24 AK26 AK27 AK29 AK30 AJ41 AJ2 AJ3 AJ4 AJ40 AJ42 AJ5 AJ6 AJ7 AJ8 AJ9 AJ11 AJ13 AJ31 AJ33 AJ35 AJ37 AJ39 AJ10 AJ12 AJ14 AJ15 AJ17 AJ18 AJ20 AJ21 AJ23 AJ24 AJ26 AJ27 AJ29 AJ30 AJ32 AJ34 AJ36 AJ38 AH42 AH1 AH2 AH4 AH43 AG17 AG18 AG19 AG20 AG21 AG22 AG23 AG24 AG25 AG26 AG27 AG5 AG6 AG7 AG8 AG9 AG10 AG12 AG14 AG29 AG31 AG33 AG35 AG37 AG39 AG2 AG3 AG4 AG11 AG15 AG13 AG32 AG41 AG30 AG34 AG36 AG38 AG40 AG42 AF17 AF18 AF19 AF20 AF21 AF22 AF23 AF24 AF25 AF26 AF27 AF42 AF1 AF2 AF3 AF5 AF6 AF7 AF8 AF9 AF11 AF13 AF15 AF29 AF30 AF32 AF34 AF36 AF38 AF41 AF43 AF10 AF12 AF14 AE17 AE18 AE19 AE20 AE21 AE22 AE23 AE24 AE25 AE26 AE27 AF31 AF33 AF35 AF37 AF39 AE41 AE2 AE3 AE4 AE40 AE42 AD5 AD6 AD7 AD8 AD9 AD11 AD13 AD15 AD18 AD20 AD21 AD22 AD23 AD24 AD25 AD26 AD29 AD31 AD33 AD35 AD37 AD39 AD1 AD2 AD4 AD10 AD12 AD14 AD17 AD19 AD27 AD30 AD32 AD34 AD36 AD38 AD40 AD43 AD42 AC17 AC19 AC20 AC21 AC22 AC23 AC24 AC25 AC26 AC27 AC41 AC2 AC3 AC4 AC5 AC6 AC7 AC8 AC9 AC10 AC11 AC18 AC13 AC15 AC30 AC32 AC34 AC36 AC38 AC40 AC42 AC12 AC14 AC29 AC31 AC33 AC35 AC37 AC39 AB1 AB2 AB3 AB17 AB18 AB19 AB20 AB21 AB22 AB23 AB24 AB25 AB26 AB27 AB42 AB41 AB43 AA5 AA6 AA7 AA8 AA9 AA10 AA12 AA13 AA15 AA29 AA31 AA33 AA35 AA2 AA3 AA4 AA11 AA14 AA36 AA37 AA39 AA17 AA18 AA19 AA20 AA21 AA22 AA23 AA24 AA25 AA26 AA27 AA30 AA32 AA34 AA38 AA41 AA40 AA42 Y1 Y2 Y4 Y40 Y5 Y6 Y7 Y8 Y9 Y10 Y11 Y12 Y13 Y14 Y15 Y17 Y18 Y19 Y20 Y21 Y22 Y23 Y24 Y25 Y26 Y27 Y29 Y30 Y31 Y32 Y33 Y34 Y35 Y36 Y37 Y38 Y39 Y42 Y43 W2 W3 W4 W40 W41 W42 W17 W18 W19 W20 W21 W22 W23 W24 W25 W26 W27 V5 V6 V7 V8 V9 V10 V11 V12 V13 V14 V15 V29 V30 V31 V32 V33 V34 V35 V36 V37 V38 V39 V1 V2 V3 V41 V42 V43 V17 V18 V19 V20 V21 V22 V23 V24 V25 V26 V27 U2 U3 U4 U5 U6 U7 U8 U9 U10 U11 U12 U13 U14 U15 U29 U30 U31 U32 U33 U34 U35 U36 U37 U38 U39 U40 U41 U42 U17 U18 U19 U20 U21 U22 U23 U24 U25 U26 U27 T1 T2 T4 T42 T43 R14 R15 R17 R18 R20 R21 R23 R24 R26 R27 R29 R30 R5 R6 R7 R8 R9 R10 R11 R12 R13 R31 R32 R33 R34 R35 R36 R37 R38 R39 R2 R3 R4 R40 R41 R42 P14 P15 P17 P18 P20 P21 P23 P24 P26 P27 P29 P30 P1 P2 P3 N5 N6 N7 N8 N9 N10 N11 N12 N13 N31 N32 N33 N34 N35 N36 N37 N38 N39 P41 P42 P43 N15 N17 N18 N20 N21 N23 N24 N26 N27 N29 N2 N3 N4 N40 N41 N42 M13 M15 M17 M18 M20 M21 M23 M24 M26 M27 M29 M31 M5 M6 M7 M8 M9 M10 M11 M33 M34 M35 M36 M37 M38 M39 M1 M2 M4 M40 M42 M43 L12 L13 L15 L17 L18 L20 L21 L23 L24 L26 L27 L29 L31 L32 L11 L33 L2 L3 L4 L5 L6 L7 L8 L9 K12 K13 K15 K17 K18 K20 K21 K23 K24 K26 K27 K29 K31 K32 L35 L36 L37 L38 L39 L40 L41 L42 K1 K2 K3 J11 J12 J13 J15 J17 J18 J20 J21 J23 J24 J26 J27 J29 J31 J32 J33 K41 K42 K43 J5 J6 J7 J9 J35 J37 J38 J39 J2 J3 J4 H11 H12 H13 H15 H17 H18 H20 H21 H23 H24 H26 H27 H29 H31 H32 H33 J40 J41 J42 G1 G2 G4 G5 G6 G7 G9 G11 G12 G13 G15 G17 G18 G20 G21 G23 G24 G26 G27 G29 G31 G32 G33 G35 G37 G38 G39 G40 G42 G43 F2 F3 F4 F7 F9 F11 F12 F13 F15 F17 F18 F20 F21 F23 F24 F26 F27 F29 F31 F32 F33 F35 F37 F40 F41 F42 F6 F38 E1 E2 E3 E7 E9 E11 E12 E13 E15 E17 E18 E20 E21 E23 E24 E26 E27 E29 E31 E32 E33 E35 E37 E41 E42 E43 E5 E39 D2 D3 D4 D6 D7 D9 D11 D12 D13 D15 D16 D17 D19 D20 D21 D23 D24 D25 D27 D29 D31 D33 D35 D28 D32 D37 D38 D41 D40 D42 C1 C2 C5 C10 C14 C18 C22 C26 C30 C34 C39 C42 C43 C4 C6 C9 C11 C13 C15 C17 C19 C21 C23 C25 C27 C29 C31 C33 C35 C38 C40 B2 B3 B5 B7 B10 B12 B14 B16 B18 B20 B22 B24 B26 B28 B30 B32 B34 B37 B39 B41 B42 B43 B4 B6 B9 B11 B13 B15 B17 B19 B21 B23 B25 B27 B29 B31 B33 B35 B38 B40 A3 A5 A7 A10 A12 A14 A16 A18 A20 A22 A24 A26 A28 A30 A32 A34 A37 A39 A41 A42 A BC BB BA AY AW AV AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A Non-standard grid ball pattern. Minimum Pitch 0.8mm [0.31 in] 2.2 Package Loading Specifications Table 1 provides static load specifications for the (G)MCH package. This mechanical maximum load limit should not be exceeded during heatsink assembly, shipping conditions, or regular use conditions. Also, any mechanical system or component testing should not exceed the maximum limit. The package substrate should not be used as a mechanical reference or load-bearing surface for the thermal and mechanical solution. Table 1. Package Loading Specifications Parameter Maximum Notes Static 15 lbf 1,2,3 NOTES: 1. These specifications apply to uniform compressive loading in a direction normal to the package. 2. This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide the minimum specified load on the package. 3. These specifications are based on limited testing for design characterization. Loading limits are for the package only. 12 Thermal and Mechanical Design Guidelines

13 Product Specifications 2.3 Thermal Specifications To ensure proper operation and reliability of the (G)MCH, the temperature must be at or below the maximum case temperature specified in Table 2 when operating at the Thermal Design Power (TDP). System and component level thermal enhancements are required to dissipate the heat generated and maintain the (G)MCH within specifications. Section 3 provides the thermal metrology guidelines for case temperature measurements. The (G)MCH should also operate above the minimum case temperature specification listed in Table Thermal Design Power (TDP) Definition Thermal design power (TDP) is the estimated power dissipation of the (G)MCH based on normal operating conditions including V CC and T C-MAX while executing real worstcase power intensive applications. This value is based on expected worst-case data traffic patterns and usage of the chipset and does not represent a specific software application. TDP attempts to account for expected increases in power caused by variations in (G)MCH current consumption due to silicon process variation, processor speed, DRAM capacitive bus loading and temperature. However, since these variations are subject to change, the TDP cannot ensure that all applications will not exceed the TDP value. The system designer must design a thermal solution for the (G)MCH such that it maintains T C below T C-MAX for a sustained power level equal to TDP. Note that the T C-MAX specification is a requirement for a sustained power level equal to TDP, and that the case temperature must be maintained at temperatures less than T C-MAX when operating at power levels less than TDP. This temperature compliance is to ensure component reliability over its useful life. The TDP value can be used for thermal design if the thermal protection mechanisms are enabled. The (G)MCH incorporates a hardware-based fail-safe mechanism to keep the product temperature within specification in the event of unusually strenuous usage above the TDP power Methodology Pre-Silicon In order to determine TDP for pre-silicon products in development, it is necessary to make estimates based on analytical models. These models rely on knowledge of the past (G)MCH power dissipation behavior along with knowledge of planned architectural and process changes that may affect TDP. Knowledge of applications available today and their ability to stress various aspects of the (G)MCH is also included in the model. The projection for TDP assumes (G)MCH operation at T C-MAX. The TDP estimate also accounts for normal manufacturing process variation Post-Silicon Once the product silicon is available, post-silicon validation is performed to assess the validity of pre-silicon projections. Testing is performed on both commercially available and synthetic high power applications and power data is compared to pre-silicon estimates. Post-silicon validation may result in a small adjustment to pre-silicon TDP estimates. Thermal and Mechanical Design Guidelines 13

14 Product Specifications Specifications The data in Table 2 is based on post-silicon power measurements of initial (G)MCH silicon. The system configuration is two (2) DIMMs per channel, DDR2, FSB operating at the top speed allowed by the chipset with an 800 MHz processor system bus speed. FC-BGA packages have poor heat transfer capability into the board and have minimal thermal capability without thermal solutions. Intel requires that system designers plan for an attached heatsink when using the (G)MCH. Table 2. Thermal Specification Component System Bus Speed Memory Frequenc y T C-MIN T C-MAX Idle Power TDP Value Intel 946GZ GMCH 800 MT/s 667 MT/s 0 C 98 C 9.1 W 26 W Intel 946PL MCH 800 MT/s 667 MT/s 0 C 103 C 7.8 W 16 W NOTES: 1. Thermal specifications assume an attached heatsink is present. 2. Idle Power is based on a typical part in system booted to Windows* with no background applications running. 14 Thermal and Mechanical Design Guidelines

15 Thermal Metrology 3 Thermal Metrology The system designer must measure temperatures in order to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques of measuring (G)MCH component case temperatures. 3.1 Case Temperature Measurements To ensure functionality and reliability of the (G)MCH the T C must be maintained at or below the maximum temperature listed in Table 2. The surface temperature measured at the geometric center of the die corresponds to T C. Measuring T C requires special care to ensure an accurate temperature reading. Temperature differences between the temperature of a surface and the surrounding local ambient air can introduce error in the measurements. The measurement errors could be due to a poor thermal contact between the thermocouple bead and the surface of the package, heat loss by radiation and/or convection, conduction through thermocouple leads, or contact between the thermocouple cement and the heatsink base (if a heatsink is used). To minimize these measurement errors a thermocouple attach with a zero-degree methodology is recommended Thermocouple Attach Methodology 1. Mill a 3.3 mm [0.13 in] diameter hole centered on bottom of the heatsink base. The milled hole should be approximately 1.5 mm [0.06 in] deep. 2. Mill a 1.3 mm [0.05 in] wide slot, 0.5 mm [0.02 in] deep, from the centered hole to one edge of the heatsink. The slot should be in the direction parallel to the heatsink fins (see Figure 3). 3. Attach thermal interface material (TIM) to the bottom of the heatsink base. 4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts should match the slot and hole milled into the heatsink base. 5. Attach a 36 gauge or smaller K-type thermocouple bead to the center of the top surface of the die using a cement with high thermal conductivity. During this step, make sure no contact is present between the thermocouple cement and the heatsink base because any contact will affect the thermocouple reading. It is critical that the thermocouple bead makes contact with the die (see Figure 2). 6. Attach heatsink assembly to the (G)MCH, and route thermocouple wires out through the milled slot. Thermal and Mechanical Design Guidelines 15

16 Thermal Metrology Figure 2. 0 Angle Attach Methodology (top view, not to scale) Figure 3. 0 Angle Attach Heatsink Modifications (generic heatsink side and bottom view shown, not to scale) 3.2 Airflow Characterization Figure 4 describes the recommended location for air temperature measurements measured relative to the component. For a more accurate measurement of the average approach air temperature, Intel recommends averaging temperatures recorded from two thermocouples spaced about 25 mm [1.0 in] apart. Locations for both a single thermocouple and a pair of thermocouples are presented. 16 Thermal and Mechanical Design Guidelines

17 Thermal Metrology Figure 4. Airflow &Temperature Measurement Locations Airflow velocity can be measured using sensors that combine air velocity and temperature measurements. Typical airflow sensor technology may include hot wire anemometers. Figure 4 provides guidance for airflow velocity measurement locations which should be the same as used for temperature measurement. These locations are for a typical JEDEC test setup and may not be compatible with chassis layouts due to the proximity of the processor to the (G)MCH. The user may have to adjust the locations for a specific chassis. Be aware that sensors may need to be aligned perpendicular to the airflow velocity vector or an inaccurate measurement may result. Measurements should be taken with the chassis fully sealed in its operational configuration to achieve a representative airflow profile within the chassis. 3.3 Thermal Mechanical Test Vehicle A Thermal Mechanical Test Vehicle (TMTV) is available for early thermal testing prior to the availability of actual silicon. The TMTV contains a heater die and can be powered up to a desired power level to simulate the heating of a (G)MCH package. The TMTV also contains daisy chain functionality and can be used for mechanical testing. The TMTV needs to be surface mounted to a custom board designed to provide connectivity to the die heater and/or daisy chain depending on the needs of the user. The package ball connections are provided so the user may design and build a board to interface with the TMTV. Note that although the TMTV is designed to closely match the (G)MCH package mechanical form and fit, it is recommended that final validation be performed with actual production silicon. The TMTV mechanical features, including die size, ball count, etc., may not reflect those of the final production package. Please contact your Intel Field Sales Representative on the availability of the TMTV for your development needs. Thermal and Mechanical Design Guidelines 17

18 Thermal Metrology 18 Thermal and Mechanical Design Guidelines

19 Reference Thermal Solution 4 Reference Thermal Solution The design strategy for the reference component thermal solution for the (G)MCH for ATX platforms reuses the ramp retainer, extrusion design and MB anchors from the Intel 945G Express chipset thermal solution. The thermal interface material and a wire preload clip are being redesigned to meet the Intel 946 Express chipset family thermal requirements. The Balanced Technology Extended (BTX) reference design for the Intel 946 Express chipset family will include a new extrusion, clip with higher preload, and a new thermal interface material. A slightly larger motherboard keep out zone than used by the Intel 945G Express chipset thermal solution has been defined, see Figure 11. This chapter provides detailed information on operating environment assumptions, heatsink manufacturing, and mechanical reliability requirements for the (G)MCH. 4.1 Operating Environment The operating environment of the (G)MCH will differ depending on system configuration and motherboard layout. This section defines operating environment boundary conditions that are typical for ATX and BTX form factors. The system designer should perform analysis on platform operating environment to assess impact to thermal solution selection ATX Form Factor Operating Environment In ATX platforms, an airflow speed of 0.76 m/s [150 lfm] is assumed to be present 25 mm [1 in] in front of the heatsink air inlet side of the attached reference thermal solution. The local ambient air temperature, T A, at the (G)MCH heatsink in an ATX platform is assumed to be 47 C. The system integrator should note that board layout may be such that there will not be 25 mm [1 in] between the processor heatsink and the (G)MCH. The potential for increased airflow speeds may be realized by ensuring that airflow from the processor heatsink fan exhausts in the direction of the (G)MCH heatsink. This can be achieved by using a heatsink providing multi-directional airflow, such as a radial fin or X pattern heatsink. Such heatsink can deliver airflow to both the (G)MCH and other areas like the voltage regulator, as shown in Figure 5. In addition, (G)MCH board placement should ensure that the (G)MCH heatsink is within the air exhaust area of the processor heatsink. Note that heatsink orientation alone does not ensure that 0.76 m/s [150 lfm] airflow speed will be achieved. The system integrator should use analytical or experimental means to determine whether a system design provides adequate airflow speed for a particular (G)MCH heatsink. The thermal designer must carefully select the location to measure airflow to get a representative sampling. These environmental assumptions are based on a 35 C system external temperature measured at sea level. Thermal and Mechanical Design Guidelines 19

20 Reference Thermal Solution Figure 5. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on an ATX Platform Airflow Direction Airflow Direction Airflow Direction GMCH Heatsink Airflow Direction Omni Directional Flow Processor Heatsink (Fan not Shown) TOP VIEW Other methods exist for providing airflow to the (G)MCH heatsink, including the use of system fans and/or ducting, or the use of an attached fan (active heatsink) Balanced Technology Extended (BTX) Form Factor Operating Environment This section provides operating environment conditions based on what has been exhibited on the Intel micro-btx reference design. On a BTX platform, the (G)MCH obtains in-line airflow directly from the processor thermal module. Since the processor thermal module provides lower inlet temperature airflow to the processor, reduced inlet ambient temperatures are also often seen at the (G)MCH as compared to ATX. An example of how airflow is delivered to the (G)MCH on a BTX platform is shown in Figure 6. The local ambient air temperature, T A, at the (G)MCH heatsink in the Intel micro-btx reference design is predicted to be ~45 C. The thermal designer must carefully select the location to measure airflow to get a representative sampling. These environmental assumptions are based on a 35 C system external temperature measured at sea level. Note that the local ambient air temperature is a projection based on the power for a 2005 platform with processor TDP up to 130 W. 20 Thermal and Mechanical Design Guidelines

21 Reference Thermal Solution Figure 6. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a Balanced Technology Extended (BTX) Platform GMCH Airflow Direction BTX Thermal Module Assembly over processor Top View 4.2 Reference Design Mechanical Envelope The motherboard component keep-out restrictions for the (G)MCH on an ATX platform are included in Figure 10. The motherboard component keep-out restrictions for the (G)MCH on a BTX platform are included in Appendix B, Figure Thermal Solution Assembly The reference thermal solution for the (G)MCH for an ATX chassis is shown in Figure 7 and is an aluminum extruded heatsink that utilizes two ramp retainers, a wire preload clip, and four motherboard anchors. Refer to Appendix B for the mechanical drawings. The heatsink is attached to the motherboard by assembling the anchors into the board, placing the heatsink over the (G)MCH and anchors at each of the corners, and securing the plastic ramp retainers through the anchor loops before snapping each retainer into the fin gap. The assembly is then sent through the wave process. Post wave, the wire preload clip is assembled using the hooks on each of the ramp retainers. The clip provides the mechanical preload to the package. A thermal interface material (Honeywell* PCM45F) is pre-applied to the heatsink bottom over an area which contacts the package die. Note: The ATX design is similar in appearance to the Intel 945G Express Chipset thermal solution, but two critical items have been changed. A higher performance TIM A clip with a higher preload to meet the TIM preload requirements. The combination of the two new items provides the performance increase to meet the Intel 946 Express chipset family thermal requirements. The reference thermal solution for the (G)MCH in a BTX chassis is shown in Figure 8. The heatsink is aluminum extruded and utilizes a Z-clip for attach. The clip is secured to the system motherboard via two solder down anchors around the (G)MCH. The clip helps to provide a mechanical preload to the package via the heatsink. A thermal Thermal and Mechanical Design Guidelines 21

22 Reference Thermal Solution interface material (Honeywell* PCM45F) is pre-applied to the heatsink bottom over an area in contact with the package die. Figure 7. ATX MCH Heatsink Installed on Board Figure 8. Balanced Technology Extended (BTX) MCH Heatsink Design Installed on Board 22 Thermal and Mechanical Design Guidelines

23 Reference Thermal Solution 4.4 Environmental Reliability Requirements The environmental reliability requirements for the reference thermal solution are shown in Table 3 and Table 4. These should be considered as general guidelines. Validation test plans should be defined by the user based on anticipated use conditions and resulting reliability requirements. The ATX testing will be performed with the sample board mounted on a test fixture and includes a processor heatsink with a maximum mass of 550 g. The test profiles are unpackaged board level limits. Table 3. ATX Reference Thermal Solution Environmental Reliability Requirements (Board Level) Test 1 Requirement Pass/Fail Criteria 2 Mechanical Shock Random Vibration Unbiased Humidity 3 drops for + and - directions in each of 3 perpendicular axes (i.e., total 18 drops). Profile: 50 G, Trapezoidal waveform, 4.3 m/s [170 in/s] minimum velocity change Duration: 10 min/axis, 3 axes Frequency Range: 5 Hz to 500 Hz Power Spectral Density (PSD) Profile: 3.13 g RMS 85 % relative humidity / 85 C, 576 hours Visual\Electrical Check \ Thermal Performance Visual/Electrical Check \ Thermal Performance Visual Check NOTES: 1. The above tests should be performed on a sample size of at least 12 assemblies from 3 different lots of material. 2. Additional Pass/Fail Criteria may be added at the discretion of the user. The current plan for BTX reference solution testing is to mount the sample board mounted in a BTX chassis with a thermal module assembly having a maximum mass of 900 g. The test profiles are unpackaged system level limits. Thermal and Mechanical Design Guidelines 23

24 Reference Thermal Solution Table 4. Balanced Technology Extended (BTX) Reference Thermal Solution Environmental Reliability Requirements (System Level) Test 1 Requirement Pass/Fail Criteria 2 Mechanical 2 drops for + and - directions in each of 3 Shock 5 perpendicular axes (i.e., total 12 drops). Profile: 25g, Trapezoidal waveform, 5.7 m/s [225 in/sec] minimum velocity change. Visual\Electrical Check \ Thermal Performance Random Vibration 5 Power Cycling Unbiased Humidity Duration: 10 min/axis, 3 axes Frequency Range:.001 5Hz, ramping to.01 Hz, Hz to 500 Hz Power Spectral Density (PSD) Profile: 2.20 g RMS 7500 cycles (on/off) of minimum temperature min 27 / max cycles (on/standby) min 35 / max 96. A 15 second dwell at high / low temperature for both cycles. 85 % relative humidity / 85 C, 576 hours Visual/Electrical Check \ Thermal Performance Thermal Performance - TIM degradation Visual Check NOTES: 1. The above tests should be performed on a sample size of at least 12 assemblies from 3 different lots of material. 2. Additional Pass/Fail Criteria may be added at the discretion of the user. 3. Mechanical Shock minimum velocity change is based on a system weight of 20 lbs to 29 lbs [9.08 kg to kg]. 4. For the chassis level testing, the system will include: 1 HD, 1 ODD, 1 PSU, 2 DIMMs and the I/O shield. 5. BTX reference solution testing for shock and vibration is to mount the sample board mounted in a BTX chassis with a thermal module assembly having a maximum mass of 900 g. The test profiles are unpackaged system level limits. 24 Thermal and Mechanical Design Guidelines

25 Appendix A: Currently Enabled Suppliers Appendix A: Currently Enabled Suppliers Currently enabled suppliers for the MCH reference thermal solution are listed in Table 5 through Table 7. Table 5. ATX Intel Reference Heatsink Enabled Suppliers for Intel 946 Express Chipset Family ATX items Intel Part Number AVC CCI Foxconn Wieson heatsink & TIM D S902Y I833301A 2Z plastic clip C P C863501A 3EE wire clip D A I833301A 3KS anchor C Z G2100C Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice. Table 6. Balanced Technology Extended (BTX) Intel Reference Heatsink Enabled Suppliers for Intel 946 Express Chipset Family BTX items Intel PN AVC CCI Foxconn Wieson heatsink assembly (HS, wire clip & TIM) D S905Y I833201A 2ZQ anchor, LF A HB9703E- DW G2100C H Thermal and Mechanical Design Guidelines 25

26 Appendix A: Currently Enabled Suppliers Table 7. Supplier Contacts Supplier Contacts Phone AVC (Asia Vital Components) David Chao Raichel Hsu ext ext CCI (Chaun Monica Chih Choung Technology) Harry Lin (714) Foxconn Jack Chen (714) Wanchi Chen (714) Wieson Technologies Andrea Lai Edwina Chu ext ext Thermal and Mechanical Design Guidelines

27 Appendix B: Mechanical Drawings Appendix B: Mechanical Drawings The following table lists the mechanical drawings available in this document: Drawing Name Page Number (G)MCH Package Drawing 28 (G)MCH Component Keep-Out Restrictions for ATX Platforms 29 (G)MCH Component Keep-Out Restrictions for Balanced Technology Extended (BTX) Platforms 30 (G)MCH Reference Heatsink for ATX Platforms Sheet 1 31 (G)MCH Reference Heatsink for ATX Platforms Sheet 2 32 (G)MCH Reference Heatsink for ATX Platforms Anchor 33 (G)MCH Reference Heatsink for ATX Platforms Ramp Retainer Sheet 1 34 (G)MCH Reference Heatsink for ATX Platforms Ramp Retainer Sheet 2 35 (G)MCH Reference Heatsink for ATX Platforms Wire Preload Clip 36 (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms 37 (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms Clip 38 NOTE: Unless otherwise specified, all figures in this appendix are dimensioned in millimeters. Dimensions shown in brackets are in inches. Thermal and Mechanical Design Guidelines 27

28 Appendix B: Mechanical Drawings Figure 9. (G)MCH Package Drawing 28 Thermal and Mechanical Design Guidelines

29 Appendix B: Mechanical Drawings Figure 10. (G)MCH Component Keep-Out Restrictions for ATX Platforms NORTH 60.6 [ ] 48 [ ] [ ] DETAIL A NO COMPONENTS THIS AREA 4X 5.08 [.200 ] 81 [ ] 67 [ ] [ ] [ ] 74 [ ] EAST 4X 1.84 [.072 ] COMPONENT CENTER MAX 1.27 [.050] COMPONENT HEIGHT (NON-MCH COMPONENTS) MAX 25 [1.000] COMPONENT HEIGHT [ 1.85 ] 4 [.1575 ] Thermal and Mechanical Design Guidelines 4X 8.76 [.345 ] 4X 8.76 [.345 ] DETAIL A SCALE 8 8X 0.97 [.038 ] PLATED THRU HOLE 8X 1.42[.056] TRACE KEEPOUT NOTES: 1 HOLE PLACEMENT FABRICATION TOLERANCE PER INTEL , CLASS 1,2,3 2. HEATSINK COMPONENT HEIGHT NOT TO EXCEED 38.1MM ABOVE MOTHERBOARD SURFACE. 29

30 Appendix B: Mechanical Drawings Figure 11. (G)MCH Component Keep-Out Restrictions for Balanced Technology Extended (BTX) Platforms 30 Thermal and Mechanical Design Guidelines

31 Appendix B: Mechanical Drawings Figure 12. (G)MCH Reference Heatsink for ATX Platforms Sheet 1 Thermal and Mechanical Design Guidelines 31

32 Appendix B: Mechanical Drawings Figure 13. (G)MCH Reference Heatsink for ATX Platforms Sheet 2 16 [.630 ] 2X [ ] TYP [.003] R0. 5 [.020 ] 66 [ ] 2X 15 [.591 ] [ ] 25.5 CH OMER ICS: [ ] T 710 TYP R1 [.039 ] [ ] NO BURR ALL ARO UND 4X 45 X 1 [.039] TYP 4 [.1575 ] BOTTOM VIEW TYP DETAIL A SCALE 5 TYP. TYP [ ] DETAIL B SCALE 5 32 Thermal and Mechanical Design Guidelines 5 6 6

33 Appendix B: Mechanical Drawings Figure 14. (G)MCH Reference Heatsink for ATX Platforms Anchor [ ] 2X [ ] [ ] [ ] 2X X 4 [.157 ] 45 X 0.2 M IN 2X 0.75 [.030 ] 2X [ ] 2X [ ] [ ] X 6 [ ] 2X [ ] [ ] [ ] Thermal and Mechanical Design Guidelines 2X CHAMFER ALL ARO UND CO NTACT TO INSULATO R INTERFACE AT SUPPLIERS OPTIO N NOTES: 1. THIS DRAW ING TO BE USED IN CO NJUNCTIO N W ITH SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAW ING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE APPLICABLE AT PART FREE, UNCO NSTRAINED STATE UNLESS INDICATED O THERW ISE. 2. TO LERANCES O N DIMENSIO NED AND UNDIM ENSIO NED FEATURES UNLESS OTHERW ISE SPECIFIED: DIM ENSIO NS ARE IN MILLIMETERS. FOR FEATURE SIZES < 10MM: LINEAR.07 FOR FEATURE SIZES > 10MM: LINEAR.08 ANGLES: MATERIALS: INSULAT O R: PO LYCARBO NAT E T HERM O PLAST IC, UL 94V-0, BLACK (739) (REF. GE LEXAN 3412R-739) CONTACT: BRASS OR EQUIVALENT UPON INTEL APPROVAL CO NTACT FINISH: u" MIN. NICKEL UNDER PLATING ; SO LDER T AILS, " M IN T IN O NLY SO LDER (LEAD F REE). 5. MARK W ITH INTEL P/N AND REVISION PER INTEL MARKING STANDARD ; PER SEC 3.8 (PO LYETHYLENE BAG) 6 CRITICAL TO FUNCTIO N DIMENSIO N 7. ALL DIMENSIONS SHOW N SHALL BE MEASURED FO R FAI 8. NO TE REMO VED 9. DEG ATE: FLUSH TO 0.35 BELO W STRUCTURAL THICKNESS (GATE W ELL OR G ATE RECESS ACCEPTABLE) 10. F LA SH: 0.15 M AX. 11. SINK: 0.25 M AX. 12. EJECTO R MARKS: FLUSH TO PARTING LINE MISMATCH NOT TO EXCEED EJECTION PIN BOSSES, GATING, AND TOOLING INSERTS REQUIRE INTEL'S APPROVAL PRIO R TO TO OL CONSTRUCTIO N. ALL EJECTION PIN BOSSES AND GATE FEATURES SHO W N ARE FO R REFERENCE O NLY. 15. EDGES SHOW N AS SHARP R 0.1 MAX. 16. TOOLING REQUIRED TO MAKE THIS PART SHALL BE THE PRO PERTY OF INTEL, AND SHALL BE PERMANENTLY MARKED W ITH INTEL'S NAME AND APPROPRIATE PART NUMBER. 17. ALL SECO NDARY UNIT DIMENSIO NS ARE FO R REFERENCE O NLY

34 Appendix B: Mechanical Drawings Figure 15. (G)MCH Reference Heatsink for ATX Platforms Ramp Retainer Sheet 1 NO TES: 2X 31.1 [ ] [.118 ] 2X [ ] SEE DETAIL C [ ] [ ] 1. THIS DRAW ING TO BE USED IN CO NJUNCT IO N W ITH SUPPLIED 3D DAT ABASE F ILE. ALL DIMENSIO NS AND T O LERANCES O N T HIS DRAW ING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE APPLICABLE AT PART FREE, UNCONSTRAINED STATE UNLESS INDICATED O T HERW ISE. 2. TO LERANCES O N DIMENSIO NED AND UNDIMENSIO NED F EATURES UNLESS O THERW ISE SPECIFIED: DIMENSIONS ARE IN MILLIMETERS. FOR FEATURE SIZES < 10MM: LINEAR.07 FOR FEATURE SIZES BETW EEN 10 AND 25 MM: LINEAR.08 FOR FEATURE SIZES BETW EEN 25 AND 50 MM: LINEAR.10 FOR FEATURE SIZES > 50MM: LINEAR.18 ANGLES: M AT ERIAL: A) TYPE: ENVIRONMENTALLY CO MPLIANT THERMOPLASTIC O R EQ UIVALENT UPO N INT EL APPRO VAL (REF. G E LEXAN 500ECR-739) B) CRITICAL M ECHANICAL MATERIAL PRO PERT IES F O R EQ UIVALENT MATERIAL SELECTIO N: T ENSILE YIELD ST RENG T H (ASTM D638) > 57 M Pa T ENSILE ELO NG AT IO N AT BREAK (AST M D638) > = 46% F LEXURAL M O DULUS (AST M D638) 3116 M Pa 10% SO FT ENING TEMP (VICAT, RAT E B): 154 C C) COLOR: APPROXIMATING BLACK, (REF GE 739) D) REG RIND: 25% PERMISSIBLE. E) VO LUM E e+ 03 CUBIC-M M (REF ) W EIG HT G RAMS (REF ) 5 MARK PART W IT H INT EL P/N, REVISIO N, CAVITY NUMBER AND DATE CODE APPROX W HERE SHOW N PER INTEL MARKING ST ANDARD CRITICAL TO F UNCT IO N DIMENSIO N 7. ALL DIMENSIONS SHOW N SHALL BE MEASURED FOR FAI 8. NO T E REM O VED 9. DEG AT E: FLUSH TO 0.35 BELO W STRUCTURAL THICKNESS (G ATE W ELL O R G AT E RECESS ACCEPTABLE) 10. F LASH: 0.15 M AX. 11. SINK: 0.25 M AX. 12. EJECTOR MARKS: FLUSH TO PART ING LINE MISMAT CH NO T T O EXCEED EJECTION PIN BOSSES, GATING, AND TOOLING INSERTS REQUIRE INTEL'S APPROVAL PRIOR TO TOOL CONSTRUCTION. ALL EJECTION PIN BO SSES AND GATE FEATURES SHOW N ARE FOR REFERENCE ONLY. 15. EDGES SHOW N AS SHARP R 0.1 MAX. 16. TO O LING REQ UIRED TO MAKE T HIS PART SHALL BE THE PROPERTY OF INTEL, AND SHALL BE PERMANENTLY MARKED W ITH INTEL'S NAME AND APPROPRIATE PART NUMBER. 17. ALL SECO NDARY UNIT DIMENSIO NS ARE F O R REFERENCE O NLY [ ] SEE DETAIL A 34 Thermal and Mechanical Design Guidelines

35 Appendix B: Mechanical Drawings Figure 16. (G)MCH Reference Heatsink for ATX Platforms Ramp Retainer Sheet [.219 ] [.157 ] [.187 ] 3.15 [.124 ] 2.75 [.108 ] 2X [.227 ] 1.75 [.069 ] [.020 ] [.205 ] 1.19 [.047 ] [.118 ] SECTION B-B 2X DETAIL A SCALE [.258 ] Thermal and Mechanical Design Guidelines 6.4 [.252 ] DETAIL C SCALE 10 2X [.114 ] B B

36 Appendix B: Mechanical Drawings Figure 17. (G)MCH Reference Heatsink for ATX Platforms Wire Preload Clip 36 Thermal and Mechanical Design Guidelines

37 Appendix B: Mechanical Drawings Figure 18. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms Thermal and Mechanical Design Guidelines 37

38 Appendix B: Mechanical Drawings Figure 19. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms Clip 38 Thermal and Mechanical Design Guidelines