Packaging Solutions. Advanced Packaging Solutions for High-Density PLDs

Transcription

1 Packaging Solutions Advanced Packaging Solutions for High-Density PLDs June 1998

2 package options pin compatibility design flexibility Advanced Packaging Solutions

3 FineLine BGA vertical migration space efficiency cost-effectiveness SameFrame pin-out

4 Table of Contents Advanced Packaging Solutions Altera Package Migration FineLine Ball-Grid Array 100-Pin FineLine BGA Pin FineLine BGA Pin FineLine BGA Pin FineLine BGA Ball-Grid Array 225-Pin BGA Pin BGA Pin BGA Pin BGA Thin Quad Flat Pack 32-Pin TQFP Pin TQFP Pin TQFP Pin TQFP Quad Flat Pack 100-Pin PQFP Pin PQFP Pin PQFP Pin RQFP Pin PQFP Pin RQFP Pin RQFP Plastic J-Lead Chip Carrier 20-Pin PLCC Pin PLCC Pin PLCC Plastic Dual In-Line Package 8-Pin PDIP Pin-Grid Array 403-Pin PGA Pin PGA Pin PGA for Other Altera Packages Device Package Dimension Formats Device Package Guide back cover Altera Corporation

5 Advanced Packaging Solutions With an increasing trend toward systems on a chip, programmable logic device (PLD) vendors must supply increasingly complex products that meet new levels of I/O density and performance. To address these needs, PLD technology is advancing rapidly, allowing for more complex logic to be placed in an ever smaller die area. Today, entire digital subsystems can be implemented on a single PLD. As this trend toward system integration continues to drive the need for higher I/O counts in less board area, space-saving packaging technology is becoming a more critical factor. With an offering of complex, high-performance device families based on its high-density FLEX and MAX architectures, Altera has taken a leadership role in packaging innovation for users of high-density PLDs. These packaging solutions allow designers to fully harness the power of programmable logic devices for complex system integration. Need for New Packaging Technologies As increased system integration continues to drive the trend toward higher pin counts, traditional packages such as quad flat pack (QFP) packages can no longer provide the required board area efficiency for devices requiring greater than 240 pins. As shown in Figure 1, almost 50% of designs require more than 240 pins. The trend toward higher pin count has led to The popularity of ball-grid array (BGA) packages, along with chip scale packages (CSP) and Flip Chip packages, is on the rise because they offer higher pin counts in significantly less board area than QFP packages. Also, BGA packages are robust, provide improved manufacturability, and have better thermal characteristics than most QFP packages. Figure 2. IC Package Type Usage BGA, Chip Scale Package Plastic QFP Chip On Board Pin-Grid Array Tape Automated Bonding Dual In-Line Package Surface Mount Technology Source: Anam the emergence of new packages. Figure 1. Percentage of ASIC Design Starts by Pin Count Figure 2 shows the growth and decline of various package types Number of ICs (Billions) % of Designs < > Source: Dataquest Package Pins 2 Altera Corporation

6 Emergence of BGA Packages At the forefront of packaging technologies, BGA packages have a distinct advantage in cost and ease of production (Figure 3). They are inexpensive and do not require any specialized manufacturing equipment. BGA packages are quickly becoming the most preferred packages for high-density PLD designs because they support high pin counts, easy handling, and volume manufacturing. As a result, Altera has introduced numerous devices in this package type. Figure 3. Comparison of Packaging Solutions Requires Specialized Manufacturing Equipment Altera has taken a leadership position in providing advanced BGA packaging solutions. With the FineLine BGA package, Altera offers the most space-efficient and cost-effective packaging for high-pin-count devices in the PLD industry. Figure 4 shows the various package types with respect to package area and pin count. FineLine BGA Packaging Altera s FineLine BGA strategy will provide a path for support of future PLDs with pin counts in excess of 1,000 pins. FineLine BGA packages currently are available in 1.0-mm ball pitch, and in the future will be offered in 0.8-mm and 0.5-mm ball pitch, supporting I/O count and board area requirements for system-level integration and the next generation of high-density PLDs. Expensive Altera s Commitment Number of Pins 240 QFP PGA BGA TQFP CSP Flip Chip Altera is committed to offering its customers programmable logic solutions that are at the forefront of technology. At Altera, one of our goals is to improve your time-to-market with the latest technologies and PLCC package options so that our devices can meet your needs today and in the future. Lead Density (Pins per Inch 2 ) Figure 4. FineLine BGA Package Efficiency Package Area (mm 2 ) 2,250 2,000 1,750 1,500 1,250 1, TQFP PQFP (11 mm) 256 (27 mm) 256 (17 mm) 289 (15 mm) 356 (35 mm) 400 (17 mm) 480 (35 mm) 484 (23 mm) Thermally Enhanced BGA 1.27-mm Pitch 600 (45 mm) 660 (40 mm) 672 (27 mm) 625 (21 mm) Thermally Enhanced BGA 1.0-mm Pitch FineLine BGA 1.0-mm Pitch Pin Count 729 (23 mm) 1,024 (27 mm) FineLine BGA 0.8-mm Pitch 1,225 (29 mm) Altera Corporation 3

7 Altera Package Migration Vertical Migration Capability Altera devices have been developed to offer maximum design flexibility and ease of use. Package migration, available in Altera s MAX and FLEX product families, allows users to move freely from one device to another without the need to change board layout. This flexibility enhances both ease of use and time-to-market. Vertical migration allows you to move your design from one density device to another density device in the same package and pin count, enabling you to maintain the same pin assignments while adding or removing logic requirements. The following pages contain actual-size photographs with dimensions for each package, as well as information on vertical migration. Table 1 below shows sample information on vertical migration; all devices that support vertical migration are highlighted in a common color. Cross-Package Migration with SameFrame Pin-out Figure 5 illustrates a cross-package migration example in which you start your design in a 100-pin FineLine BGA and want the flexibility to move to a 256-pin FineLine BGA for a higher I/O count in the future. Similarly, you could start your design in the 256-pin FineLine BGA for maximum prototyping flexibility and then choose to migrate to the 100-pin FineLine BGA for lower cost. Either way, the SameFrame pin-out provides a new level of package migration flexibility. Figure 5. SameFrame Pin-out Example Printed Circuit Board Designed for 256-Pin BGA Package In addition to vertical migration, Altera s FineLine BGA packages offer migration capability between packages with different ball counts. Altera s innovative SameFrame pin-out makes this flexibility possible. With SameFrame pin-out, the layout of balls is such that the smaller ball-count packages form a footprint-compatible subset of the larger packages. This layout of balls gives you the benefit of migrating from one FineLine BGA package to another without having to re-layout your board. By laying out the board for the worst case FineLine BGA ball count, the designer maintains the flexibility to choose from any density or FineLine BGA ball count before the design is finalized. 100-Pin FineLine BGA 100-Pin FineLine BGA Package (Reduced I/O Count or Logic Requirements) 256-Pin FineLine BGA 256-Pin FineLine BGA Package (Increased I/O Count or Logic Requirements) Table 1. Sample Vertical Migration Table Package Type MAX 7000A FLEX 6000 FLEX 10KA FLEX 10KE 256-Pin FineLine BGA EPM7128A EPM7256A EPM7384AE EPM7512AE EPF6010A EPF6016A EPF6024A EPF10K10A EPF10K30A EPF10K30E EPF10K50E EPF10K100B EPF10K100E Vertical Migration Vertical Migration Vertical Migration 4 Altera Corporation

8 Figure 6. Cross-Package Migration Example Power & Ground Pins (256-Pin BGA Package) I/O & Configuration Pins (256-Pin BGA Package) Common I/O & Configuration Pins (100-Pin & 256-Pin BGA Packages) Common Power & Ground Pins (All FineLine BGA Packages) Figure 6 illustrates how the innovative concentric ball layout is achieved with the new packaging. The power and ground pins in yellow are common to all FineLine BGA packages. With higher ball-count packages, more power and ground pins are present, these pins are located in each corner and are shown in green. Faster Time-to-Market Because the SameFrame pin-out allows a single PCB layout to support multiple device density/package combinations, you can now layout your board prior to final device selection. This increased flexibility allows you to concentrate on your design functionality rather than focus on fitting your design in a particular device or package. Dual Cost Savings SameFrame pin-out allows you to start with a larger device for prototyping flexibility and migrate to a lowerdensity, lower-cost device for volume production. You also have the option to migrate from a higher pin-count package to a lower pin-count package to save even more. Table 2 shows devices offered in FineLine BGA packages. Devices in the same color support cross-package migration. Design Migration Flexibility Table 2. Altera Devices with SameFrame Pin-out You can increase device density and/or I/O count without re-laying out your board. This density and I/O pin migration capability gives you additional design flexibility beyond what you can achieve with vertical migration. Devices EPF10K10A EPF10K30A EPF10K50A EPF10K100A EPF10K30E EPF10K50E EPF10K100B 100-Pin FineLine BGA 256-Pin FineLine BGA 484-Pin FineLine BGA 672-Pin FineLine BGA EPF10K100E EPF10K130E EPF10K200E EPF10K250E EPF6010A EPF6016A EPF6024A EPM7064A EPM7128A EPM7256A EPM7384A EPM7512A Altera Corporation 5

9 100-Pin FineLine BGA, 1.0-mm Ball Pitch (Preliminary) Indicates location of Ball A (10.80) (11.20) A B C D (1.00) (1.00) A1 Ball Pad Corner (1.00) (1.00) (0.785) (0.48) E F G H J K (1.1) Package Type 100-Pin FineLine BGA MAX 7000A EPM7064AE EPM7128A EPM7256A FLEX 6000 EPF6010A EPF6016A Within a given architecture, package migration across different FineLine BGA pin counts is also available. 6 Altera Corporation

10 256-Pin FineLine BGA, 1.0-mm Ball Pitch (Preliminary) (16.80) (17.20) (1.00) (1.00) A1 Ball Pad Corner (1.00) (0.785) Indicates location of Ball A1 A B C D (0.48) E F G H J K (1.00) L M N P R T (1.1) Package Type MAX 7000A FLEX 6000 FLEX 10KA FLEX 10KE 256-Pin FineLine BGA EPM7128A EPM7256A EPM7384AE EPM7512AE EPF6010A EPF6016A EPF6024A EPF10K10A EPF10K30A EPF10K30E EPF10K50E EPF10K100B EPF10K100E Within a given architecture, package migration across different FineLine BGA pin counts is also available. Altera Corporation 7

11 484-Pin FineLine BGA, 1.0-mm Ball Pitch (Preliminary) (22.80) (23.20) (1.00) (1.00) A1 Ball Pad Corner (1.00) (0.785) Indicates location of Ball A1 A B C D E F G H J K L M N P R T U V W Y AA AB (1.00) (0.48) (1.86) Package Type FLEX 10KA FLEX 10KE 484-Pin FineLine BGA EPF10K30A EPF10K50V EPF10K100A EPF10K30E EPF10K50E EPF10K100E EPF10K130E Within a given architecture, package migration across different FineLine BGA pin counts is also available. 8 Altera Corporation

12 672-Pin FineLine BGA, 1.0-mm Ball Pitch (Preliminary) (26.80) (27.20) (1.00) A1 Ball (2.00) Pad Corner (2.00) (1.50) Indicates location of Ball A1 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF (1.00) (0.48) (1.86) Package Type 672-Pin FineLine BGA FLEX 10KE EPF10K130E EPF10K200E EPF10K250E Within a given architecture, package migration across different FineLine BGA pin counts is also available. Altera Corporation 9

13 225-Pin BGA, 1.5-mm Ball Pitch (26.80) (27.20) 0.94 (24.00) 0.97 (24.70) (3.00) Ref (1.50) Indicates location of Pin A1 A B C D E F G H J K L M N P R (0.60) (0.90) 0.32 Ref. 45 Chamfer (8.05) (4 Places) Ref. (1.0) (0.50) (0.70) (1.15) (1.25) (2.00) (2.30) (0.31) (0.41) Package Type FLEX Pin BGA EPF8820A 10 Altera Corporation

14 256-Pin BGA, 1.27-mm Ball Pitch A1 Ball Pad Corner Indicates location of Pin A1 45º Chamfer (all 4 corners) (26.80) (27.20) 0.94 (24.00) 0.97 (24.70) (8.05) Ref (0.60) (0.90) 0.05 (1.27) (1.44) Ref. A1 Ball Pad Corner A B C D E F G H J K L M N P R T U V W Y (1.44) Ref (0.50) R. (for 3 corners) (2.00) (0.50) (2.30) (0.70) (0.31) (0.41) (1.15) (1.25) Package Type FLEX Pin BGA EPF6016 EPF6024A Altera Corporation 11

15 356-Pin BGA, 1.27-mm Ball Pitch 1.38 ± (35.00 ± 0.10) 1.25 ± (31.75 ± 0.10) Indicates location of pin A ± (0.75 ± 0.15) A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF ± (0.87 ± 0.06) ± (1.50 ± 0.13) (1.27) ± (0.63 ± 0.07) Package Type MAX 9000 FLEX 10K FLEX 10KA FLEX 10KE 356-Pin BGA EPM9320 EPM9320A EPM9560 EPM9560A EPF10K30 EPF10K50 EPF10K30A EPF10K50V EPF10K100A EPF10K100E 12 Altera Corporation

16 600-Pin BGA, 1.27-mm Ball Pitch Ball Corner Indicates location of Pin A (44.90) (45.10) (0.60) (0.90) A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL AM AN AP AR A1 Ball Pad Corner (43.08) (43.28) (1.65) (1.93) (1.09) (1.23) 0.05 (1.27) (0.56) (0.70) Seating Plane Package Type 600-Pin BGA FLEX 10KA EPF10K100A EPF10K130V EPF10K250A FLEX 10KE EPF10K200E Altera Corporation 13

17 32-Pin TQFP Pin (0.30) (0.45) (0.05) (0.15) 0.05 Max. (1.2) Detail A See Detail A (0.135) (0.180) (7.00) (0.80) (1.00) Ref (0.45) (0.75) (9.00) Package Type 32-Pin TQFP Configuration EPROM EPC1064 EPC1064V EPC1441 EPC2 14 Altera Corporation

18 44-Pin TQFP Pin Min (0.30) (0.05) (0.40) 0.05 Max. (1.2) Detail A See Detail A (0.09) (0.20) (0.80) (1.00) Ref (0.45) (0.75) (9.90) (10.10) (11.75) (12.25) Package Type MAX 7000 MAX 7000S MAX 7000A 44-Pin TQFP EPM7032 EPM7032V EPM7064 EPM7032S EPM7064S EPM7032AE EPM7064AE Altera Corporation 15

19 100-Pin TQFP Indicates location of Pin 1 Pin (0.17) (0.27) (0.05) (0.15) Max. (1.2) Detail A See Detail A (0.09) (0.20) (0.50) (1.00) Ref (0.45) (0.75) (13.50) (14.50) (15.80) (16.20) Package Type MAX 7000S MAX 7000A FLEX 6000 FLEX 8000 FLEX 10KA 100-Pin TQFP EPM7064S EPM7128S EPM7160S EPM7064AE EPM7128A EPM7256A EPF6010A EPF6016A EPF8282A* EPF8282AV* EPF8452A* EPF10K10A * No vertical migration. 16 Altera Corporation

20 144-Pin TQFP Indicates location of Pin 1 Pin (0.05) (0.15) (0.17) (0.27) (1.60) Max. Detail A See Detail A (0.09) (0.20) (0.50) (1.00) Ref (0.45) (0.75) (20.00) (22.00) Package Type MAX 7000A FLEX 6000 FLEX 8000 FLEX 10K FLEX 10KA FLEX 10KE 144-Pin TQFP EPM7128A EPM7256A EPM7384AE EPM7512AE EPF6010A EPF6016 EPF6016A EPF6024A EPF8820A EPF10K10 EPF10K20 EPF10K10A EPF10K30A EPF10K30E EPF10K50E Altera Corporation 17

21 100-Pin PQFP Pin (16.95) (17.44) Max. (3.40) Min. (0.25) See Detail A Indicates location of Pin (0.22) (0.38) (22.95) (23.45) (0.65) Detail A (19.90) (20.10) (0.65) (0.95) (13.90) (14.10) Package Type MAX 7000 MAX 7000S 100-Pin PQFP EPM7064 EPM7096 EPM7128E EPM7160E EPM7128S EPM7160S 18 Altera Corporation

22 160-Pin PQFP (1.52) Indicates location of Pin (0.38) 45 Chamfer (3 Places) Max. (4.07) Min. (0.25) Pin 1 See Detail A (0.22) (0.38) (0.65) Ref. (25.35) Detail A (0.1143) (0.635) Min (0.508) (0.762) (27.90) (28.10) (30.95) (31.45) (3.17) (3.67) Package Type MAX 7000 MAX 7000S FLEX Pin PQFP EPM7128E EPM7160E EPM7192E EPM7256E EPM7128S EPM7160S EPM7192S EPF8452A* EPF8636A* EPF8820A* * No pin migration. Altera Corporation 19

23 208-Pin PQFP (1.52) (30.35) (30.85) (27.90) (28.10) (4.10) Max (3.20) (3.60) (0.25) Min. Pin 1 Indicates location of Pin 1 See Detail A (0.17) (0.27) Detail A (0.1143) (0.50) (0.40) Min (0.50) (0.75) Chamfer (0.38) (3 Places) Package Type MAX 7000S MAX 7000A FLEX 6000 FLEX 8000 FLEX 10K FLEX 10KA FLEX 10KE 208-Pin PQFP** EPM7256S EPM7256A EPM7384AE EPM7512AE EPF6016 EPF6016A EPF6024A EPF8636A* EPF8820A* EPF81188A* EPF10K10 EPF10K10A EPF10K30A EPF10K30E EPF10K50E EPF10K100B EPF10K100E * No pin migration. ** Pin migration available with 208-Pin RQFP package. See page Altera Corporation

24 208-Pin RQFP (1.52) (30.35) (30.85) (27.90) (28.10) (4.10) Max (3.20) (3.60) Min. (0.25) Pin 1 Indicates location of Pin 1 See Detail A (0.17) (0.27) Metal Heat Sink Detail A (0.1143) (0.50) Min. (0.635) (0.46) (0.66) Chamfer (0.38) (3 Places) Package Type MAX 7000E MAX 7000S MAX 9000 FLEX 8000 FLEX 10K 208-Pin RQFP** EPM7256E EPM7256S EPM9320 EPM9320A EPM9400 EPM9480 EPM9480A EPM9560 EPM9560A EPF8820A EPF10K20 EPF10K30 EPF10K40 ** Pin migration available with 208-Pin PQFP package. See page 20. Altera Corporation 21

25 240-Pin PQFP (1.52) (34.35) (34.85) (31.90) (32.10) (4.10) Max (3.30) (3.50) Min. (0.25) Pin 1 See Detail A Indicates location of Pin (0.17) (0.27) Detail A (0.1143) (0.50) (0.46) (0.66) Min. (0.40) Chamber (0.38) (3 Places) Package Type FLEX 6000 FLEX 8000 FLEX 10KA FLEX 10KE 240-Pin PQFP** EPF6016 EPF81188A EPF10K30A EPF10K50E EPF6024A EPF81500A EPF10K100B EPF10K100E EPF10K130E ** Pin migration available with 240-Pin RQFP package. See page Altera Corporation

26 240-Pin RQFP (1.52) (34.35) (34.85) (31.90) (32.10) (4.10) Max (3.30) (3.50) (0.25) Min. Pin 1 Indicates location of Pin 1 See Detail A (0.17) (0.27) Metal Heat Sink (0.1143) Detail A (0.50) Min. (0.40) (0.46) (0.66) Chamfer (0.38) (3 Places) Package Type MAX 9000 FLEX 8000 FLEX 10K FLEX 10KA FLEX 10KE 240-Pin RQFP** EPM9400 EPM9480 EPM9480A EPM9560 EPM9560A EPF81188A EPF81500A EPF10K20 EPF10K30 EPF10K40 EPF10K50 EPF10K70 EPF10K50V EPF10K100A EPF10K200E EPF10K250E ** Pin migration available with 240-Pin PQFP package. See page 22. Altera Corporation 23

27 304-Pin RQFP (42.35) (42.85) (39.90) (40.10) (4.50) Max (3.70) (3.90) Min. (0.25) Pin 1 Indicates location of Pin 1 See Detail A (0.17) (0.27) (0.50) Metal Heat Sink (0.09) (0.20) Detail A Ref. (1.30) (0.40) Min (0.40) (0.60) Package Type MAX 9000 FLEX Pin RQFP EPM9560 EPF81500A 24 Altera Corporation

28 20-Pin PLCC Pin (1.14) (8.89) (9.04) (9.78) (10.03) (1.27) (1.07) (1.22) (0.66) (0.81) See Detail A (0.33) (0.53) (2.29) (3.04) (4.19) (4.57) (7.37) (8.13) Max. (0.254) Detail A Min. (0.508) (0.64) R (1.14) Note: Controlling measurement is in inches. Millimeter measurements (shown in parentheses) are for reference only. Package Type 20-Pin PLCC Configuration EPROM EPC1064 EPC1064V EPC1213 EPC1441 EPC1 EPC2 Altera Corporation 25

29 44-Pin PLCC (1.14) Pin Ref. (12.7) See Detail A Detail A (1.07) (1.22) (0.33) (0.53) (14.99) (16.00) Max. (0.254) Min. (0.508) (0.64) R (1.14) (16.51) (16.66) (17.39) (17.65) (1.27) (0.66) (0.81) Min. (0.508) (2.29) (3.05) (4.19) (4.57) Note: Controlling measurement is in inches. Millimeter measurements (shown in parentheses) are for reference only. Package Type MAX 7000 MAX 7000S MAX 7000A 44-Pin PLCC EPM7032 EPM7032S EPM7032AE EPM7032V EPM7064S EPM7064AE EPM Altera Corporation

30 84-Pin PLCC (1.07) (1.42) (1.143) 45 Pin (1.07) (1.22) See Detail A Indicates relative location of Pin 1 Detail A (27.69) (28.70) (0.254) Max (0.508) Min (0.64) (1.14) R (0.33) (0.53) (29.20) (29.41) (1.27) (30.09) (30.35) (25.4) Ref (0.660) (0.813) Min. (0.508) (2.29) (3.30) (4.19) (5.08) Note: Controlling measurement is in inches. Millimeter measurements (shown in parentheses) are for reference only. Package Type MAX 7000 MAX 7000S MAX 7000A MAX 9000 FLEX 8000 FLEX 10K 84-Pin PLCC EPM7064 EPM7096 EPM7128E EPM7160E EPM7064S EPM7128S EPM7160S EPM7064AE EPM7128A EPM9320 EPM9320A EPM9400* EPF8282A EPF8452A EPF8636A EPF10K10 * No vertical migration. Altera Corporation 27

31 8-Pin PDIP (7.62) (8.26) (9.14) (9.65) (2.54) (3.30) (4.32) Max (0.686) (0.940) Pin (6.10) (6.60) (0.381) Min (1.40) (1.65) (0.406) (0.508) (3.18) (3.43) (0.20) (0.30) (7.62) Note: Controlling measurement is in inches. Millimeter measurements (shown in parentheses) are for reference only. Package Type 8-Pin PDIP Configuration EPROM EPC1064 EPC1064V EPC1213 EPC1441 EPC1 28 Altera Corporation

32 403-Pin PGA Indicates location of Pin A ± (49.78 ± 0.48) AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A (45.72) (2.54) (1.27) Standoff (4 Places) ± (1.27 ± 0.127) (0.20) Dia. (1.27) ± (0.46 ± 0.05) Dia. Indicates location of Pin A1 (not a pin) Rad. (0.51) (4 Places) ± (2.29 ± 0.229) ± (4.572 ± 0.254) Note: Controlling measurement is in inches. Millimeter measurements (shown in parentheses) are for reference only. Package Type 403-Pin PGA FLEX 10K EPF10K50 Altera Corporation 29

33 503-Pin PGA ± (57.40 ± 0.381) Indicates location of Pin A ± (40.64 ± 0.304) ± (38.10 ± 0.254) BC BB BA AY AW AV AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A (53.34) ± (27.81 ± 0.279) (2.54) (1.27) Standoff (4 Places) ± (33.88 ± 3.56) (3.68) Max ± (4.572 ± 0.254) (1.27) Dia ± Dia. (0.46 ± 0.051) Indicates location of Pin A1 (not a pin) Rad. (0.51) (4 Places) (0.966) (1.22) ± (1.27 ± 0.127) ± (0.20 ± 0.127) Note: Controlling measurement is in inches. Millimeter measurements (shown in parentheses) are for reference only. Package Type 503-Pin PGA FLEX 10K EPF10K70 EPF10K Altera Corporation

34 599-Pin PGA Indicates location of A1 (not a pin) 2.46 ± ( ± 0.381) 1.6 ± (40.64 ± ) 1.5 ± 0.01 (38.1 ± 0.254) BG BF BE BD BC BB BA AY AW AV AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A 2.30 (58.42) ± 0.01 ( ± 0.254) 0.1 (2.54) 0.05 (1.27) 1.45 ± (36.83 ± 0.381) Standoff (4 Places) (3.683) Max ± 0.01 (4.572 ± 0.254) 0.05 (1.27) Dia ± Dia. ( ± ) Indicates quadrant containing location A (1.016) 0.05 ± (1.27 ± 0.127) ± ( ± 0.127) Note: Controlling measurement is in inches. Millimeter measurements (shown in parentheses) are for reference only. Package Type 599-Pin PGA FLEX 10KA EPF10K130V EPF10K250A FLEX 10KE EPF10K200E EPF10K250E Altera Corporation 31

35 for Other Altera Packages PQFP PGA Package Type MAX 7000A Package Type MAX 7000E FLEX Pin PQFP EPM7032AE 160-Pin PGA EPM7192E EPF8452A PLCC Package Type MAX 7000E FLEX 8000 Package Type MAX Pin PLCC EPM7096 MAX 7000A EPM7064AE 192-Pin PGA EPM7256E EPF8636A EPF8820A Package Type FLEX Pin PGA EPF81188A Package Type MAX 9000 FLEX Pin PGA EPM9320 EPM9560 EPF81500A Device Package Dimension Formats Formats Used for Package Outline Dimensions Abbreviations Used for Package Outline Dimensions min. inches (min. millimeters) max. inches (max. millimeters) or nominal inches ± tolerance (nominal millimeters ± tolerance) or inches, Min., Max., Ref.,, R, Dia., (millimeters) Device Package Type P: Plastic dual in-line (PDIP) L: Plastic J-lead chip carrier (PLCC) T: Thin plastic quad flat pack (TQFP) Q: Plastic quad flat pack (PQFP) R: Power quad flat pack (RQFP) G: Ceramic pin-grid array (PGA) B: Ball-grid array (BGA) F: FineLine ball-grid array (FineLine BGA) Min. Max. Ref. R Dia. Basic. Represents theoretical exact dimensions or dimension target. Minimum dimension specified. Maximum dimension specified. Reference. Represents dimension for reference use only. This value is not a device specification. Typical. Provided as a general value. This value is not a device specification. Radius. Represents curve dimension. Diameter. Represents curve dimension. Square. Indicates a square feature for a package with equal length and width dimensions. 32 Altera Corporation

36 Device Package Guide MAX 7000 Family Page FLEX 6000 Family Page Page EPM7032/V/S/AE 44-Pin PLCC 26 EPM7032/V/S/AE 44-Pin TQFP 15 EPM7032AE 44-Pin PQFP 32 EPM7064/S/AE 44-Pin PLCC 26 EPM7064/S/AE 44-Pin TQFP 15 EPM7064AE 68-Pin PLCC 32 EPM7064/S/AE 84-Pin PLCC 27 EPM Pin PQFP 18 EPM7064S/AE 100-Pin TQFP 16 EPM7064AE 100-Pin FineLine BGA 6 EPM Pin PLCC 32 EPM Pin PLCC 27 EPM Pin PQFP 18 EPM7128E/S/A 84-Pin PLCC 27 EPM7128E/S 100-Pin PQFP 18 EPM7128S/A 100-Pin TQFP 16 EPM7128A 100-Pin FineLine BGA 6 EPM7128A 144-Pin TQFP 17 EPM7128E/S 160-Pin PQFP 19 EPM7128A 256-Pin FineLine BGA 7 EPM7160E/S 84-Pin PLCC 27 EPM7160E/S 100-Pin PQFP 18 EPM7160S 100-Pin TQFP 16 EPM7160E/S 160-Pin PQFP 19 EPM7192E/S 160-Pin PQFP 19 EPM7192E 160-Pin PGA 32 EPM7256A 100-Pin TQFP 16 EPM7256A 144-Pin TQFP 17 EPM7256E 160-Pin PQFP 19 EPM7256E 192-Pin PGA 32 EPM7256S/A 208-Pin PQFP 20 EPM7256E/S 208-Pin RQFP 21 EPM7256A 100-Pin FineLine BGA 6 EPM7256A 256-Pin FineLine BGA 7 EPM7384AE 144-Pin TQFP 17 EPM7384AE 208-Pin PQFP 20 EPM7384AE 256-Pin FineLine BGA 7 EPM7512AE 144-Pin TQFP 17 EPM7512AE 208-Pin PQFP 20 EPM7512AE 256-Pin FineLine BGA 7 MAX 9000 Family EPM9320/A 84-Pin PLCC 27 EPM9320/A 208-Pin RQFP 21 EPM Pin PGA 32 EPM9320/A 356-Pin BGA 12 EPM Pin PLCC 27 EPM Pin RQFP 21 EPM Pin RQFP 23 EPM9480/A 208-Pin RQFP 21 EPM9480/A 240-Pin RQFP 23 EPM9560/A 208-Pin RQFP 21 EPM9560/A 240-Pin RQFP 23 EPM Pin PGA 32 EPM Pin RQFP 24 EPM9560/A 356-Pin BGA 12 EPF6010A 100-Pin TQFP 16 EPF6010A 144-Pin TQFP 17 EPF6010A 100-Pin FineLine BGA 6 EPF6010A 256-Pin FineLine BGA 7 EPF6016A 100-Pin TQFP 16 EPF6016A 100-Pin FineLine BGA 6 EPF6016/A 144-Pin TQFP 17 EPF6016/A 208-Pin PQFP 20 EPF Pin PQFP 22 EPF Pin BGA 11 EPF6016A 256-Pin FineLine BGA 7 EPF6024A 144-Pin TQFP 17 EPF6024A 208-Pin PQFP 20 EPF6024A 240-Pin PQFP 22 EPF6024A 256-Pin BGA 11 EPF6024A 256-Pin FineLine BGA 7 FLEX 8000 Family EPF8282A 84-Pin PLCC 27 EPF8282A/AV 100-Pin TQFP 16 EPF8452A 84-Pin PLCC 27 EPF8452A 100-Pin TQFP 16 EPF8452A 160-Pin PQFP 19 EPF8452A 160-Pin PGA 32 EPF8636A 84-Pin PLCC 27 EPF8636A 160-Pin PQFP 19 EPF8636A 192-Pin PGA 32 EPF8636A 208-Pin PQFP 20 EPF8820A 144-Pin TQFP 17 EPF8820A 160-Pin PQFP 19 EPF8820A 192-Pin PGA 32 EPF8820A 208-Pin PQFP 20 EPF8820A 208-Pin RQFP 21 EPF8820A 225-Pin BGA 10 EPF81188A 208-Pin PQFP 20 EPF81188A 232-Pin PGA 32 EPF81188A 240-Pin PQFP 22 EPF81188A 240-Pin RQFP 23 EPF81500A 240-Pin PQFP 22 EPF81500A 240-Pin RQFP 23 EPF81500A 280-Pin PGA 32 EPF81500A 304-Pin RQFP 24 FLEX10K Family EPF10K10 84-Pin PLCC 27 EPF10K10A 100-Pin TQFP 16 EPF10K10/A 144-Pin TQFP 17 EPF10K10/A 208-Pin PQFP 20 EPF10K10A 256-Pin FineLine BGA 7 EPF10K Pin TQFP 17 EPF10K Pin RQFP 21 EPF10K Pin RQFP 23 EPF10K30A/E 144-Pin TQFP 17 EPF10K Pin RQFP 21 EPF10K30A/E 208-Pin PQFP 20 EPF10K Pin RQFP 23 EPF10K30A 240-Pin PQFP 22 EPF10K30A/E 256-Pin FineLine BGA 7 EPF10K30/A 356-Pin BGA 12 EPF10K30A/E 484-Pin FineLine BGA 8 EPF10K Pin RQFP 21 EPF10K Pin RQFP 23 EPF10K50E 144-Pin TQFP 17 EPF10K50E 208-Pin PQFP 20 EPF10K50E 240-Pin PQFP 22 EPF10K50/V 240-Pin RQFP 23 EPF10K50E 256-Pin FineLine BGA 7 EPF10K50/V 356-Pin BGA 12 EPF10K Pin PGA 29 EPF10K50V/E 484-Pin FineLine BGA 8 EPF10K Pin RQFP 23 EPF10K Pin PGA 30 EPF10K100B/E 208-Pin PQFP 20 EPF10K100B/E 240-Pin PQFP 22 EPF10K100A 240-Pin RQFP 23 EPF10K100B/E 256-Pin FineLine BGA 7 EPF10K100A/E 356-Pin BGA 12 EPF10K100A/E 484-Pin FineLine BGA 8 EPF10K Pin PGA 30 EPF10K100A 600-Pin BGA 13 EPF10K130E 240-Pin PQFP 22 EPF10K130E 484-Pin FineLine BGA 8 EPF10K130V 599-Pin PGA 31 EPF10K130V 600-Pin BGA 13 EPF10K130E 672-Pin FineLine BGA 9 EPF10K200E 240-Pin RQFP 23 EPF10K200E 599-Pin PGA 31 EPF10K200E 600-Pin BGA 13 EPF10K200E 672-Pin FineLine BGA 9 EPF10K250E 240-Pin RQFP 23 EPF10K250A/E 599-Pin PGA 31 EPF10K250A 600-Pin BGA 13 EPF10K250E 672-Pin FineLine BGA 9 Configuration EPROM Family EPC1064/V 8-Pin PDIP 28 EPC1064/V 20-Pin PLCC 25 EPC1064/V 32-Pin TQFP 14 EPC Pin PDIP 28 EPC Pin PLCC 25 EPC Pin PDIP 28 EPC Pin PLCC 25 EPC Pin TQFP 14 EPC1 8-Pin PDIP 28 EPC1 20-Pin PLCC 25 EPC2 20-Pin PLCC 25 EPC2 32-Pin TQFP 14 Altera Offices Altera Corporation Altera European Headquarters Altera Japan Ltd. Altera International Ltd. 101 Innovation Drive Holmers Farm Way Shinjuku Mitsui Bldg. 36F Suites , Tower 1 San Jose, CA High Wycombe 1-1, Nishi-Shinjuku, 2 Chome MetroPlaza Telephone: (408) Buckinghamshire Shinjuku-ku, Tokyo Hing Fong Road HP12 4XF Japan Kwai Fong, New Territories United Kingdom Telephone: (81) Hong Kong Telephone: (44) Telephone: (852) Copyright 1998 Altera Corporation. Altera, FLEX, FLEX 10K, FLEX 10KA, FLEX 10KE, FLEX 8000, FLEX 6000, MAX, MAX 9000, MAX 9000A, MAX 7000, MAX 7000A, MAX 7000S, FineLine BGA, SameFrame, and specific device designations are trademarks and/or service marks of Altera Corporation in the United States and other countries. Other brands or products are trademarks of their respective holders. The specifications contained herein are subject to change without notice. All rights reserved. M-GB-ALTERAPKG-01