Microchip 社ワイヤボンド変更のご案内

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1 文書管理番号 :RC NT236 平成 28 年 9 月 8 日 お客様各位 株式会社 PALTEK QRA グループ塩脇由華 Microchip 社ワイヤボンド変更のご案内 拝啓平素は格別のお引立てを賜り厚く御礼申し上げます さて Microchip 社よりワイヤボンド変更について案内文が届きましたので下記に要点をご報告いたします ご査収の上何卒宜しくお取り計らい下さるようお願い申し上げます 記 敬具 対象製品 LAN8700C-AEZG LAN8700C-AEZG-AR2 LAN8700C-AEZG-TR LAN8700C-AEZG-TR-A00 LAN8700C-AEZG-TR-AR1 LAN8700IC-AEZG LAN8700IC-AEZG-CAG LAN8700IC-AEZG-TR LAN8700IC-AEZG-TR-CAG USB3280-AEZG USB3280-AEZG-T 変更内容生産性向上のため ANAC (Amkor Assembly & Test (Shanghai) Co., LTD) で製造される 0.18 TSMC ウエハテクノロジ 36LVQFN パッケージ製品について金メッキパラジウム被膜銅ワイヤボンドに変更するための評価を開始します 変更前変更後 : 金ワイヤボンドまたは パラジウム被膜銅ワイヤボンド : 金メッキパラジウム被膜銅ワイヤボンド この変更は先にお知らせしました弊社文書管理番号 :RC NT064 (Microchip 文書管理番号 :JAON-13OEWI224) のご案内について 信頼性データのご提供と変更時期の変更をお知らせするものです 前回の案内文はこちらの URL をご参照ください 本件につきましてご質問などがございましたら 弊社営業担当までお問合せください 変更時期 2016 年 9 月 30 日 (Date Code: 1640) 株式会社 PALTEK 神奈川県横浜市港北区新横浜 Tel: Fax: /2

2 添付資料 - Microchip 社発行 Product Change Notification - JAON-04PFPM024 - Microchip 社発行 PCN_JAON-04PFPM024_QUALIFICATION REPORT 注意 : Microchip 社発行の英文資料が正式資料となっております. 本和文資料とMicrochip 社発行の英文資料との間に差違が生じた場合はMicrochip 社発行の英文資料を優先願います. 以上 株式会社 PALTEK 神奈川県横浜市港北区新横浜 Tel: Fax: /2

3 English Search... PRODUCTS APPLICATIONS DESIGN SUPPORT TRAINING SAMPLE AND BUY ABOUT US CONTACT US mymicrochip Login Product Change Noti 晏\ cation - JAON-04PFPM024 Date: 31 Aug 2016 Product Category: SMSC Noti 晏\ cation subject: CCB 2518 Final Notice: Quali 晏\ cation of CuPdAu bond wire in selected products of the 0.18 TSMC wafer technology available in 36L VQFN package at ANAC assembly site. Noti 晏\ cation text: PCN Status: Final notification Microchip Parts Affected: Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN. NOTE: For your convenience Microchip includes identical files in two formats (.pdf and.xls). Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.18 TSMC wafer technology available in 36L VQFN package at ANAC assembly site. Pre Change: Palladium coated copper wire (PdCu) bond wire Post Change: Palladium coated copper with gold flash (CuPdAu) bond wire Pre and Post Change Summary: Pre Change Post Change Assembly Site ANAC assembly site ANAC assembly site Wire material PdCu wire CuPdAu wire Die attach material Molding compound material G700 G700 Lead frame material C194 C194 Impacts to Data Sheet: None Change Impact: None Reason for Change: To improve productivity and qualifying Palladium coated copper with gold flash (CuPdAu) bond wire. Change Implementation Status: In Progress Estimated First Ship Date: September 30, 2016 (date code: 1640) NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.

4 NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts. Time Table Summary: March 2016 > August 2016 September 2016 WW Initial PCN Issue Date X Qual Report Availability X Final PCN Issue Date X Estimated Implementation Date X Method to Identify Change: Traceability code Qualification Report: Please open the attachments included with this PCN labeled as PCN_#_Qual Report. Revision History: March 10, 2016: Issued initial notification. August 31, 2016: Issued final notification. Attached qualification report. Revised estimated first ship date from June 30, 2016 to September 30, The change described in this PCN does not alter Microchip s current regulatory compliance regarding the material content of the applicable products. Attachment(s): PCN_JAON-04PFPM024_Qual_Report.pdf PCN_JAON-04PFPM024_A 䍘 ected CPN.pdf PCN_JAON-04PFPM024_A 䍘 ected CPN.xls Please contact your local Microchip sales o 䍓 ce with questions or concerns regarding this noti 晏\ cation. Terms and Conditions: If you wish to change your product/process change noti 晏\ cation (PCN) pro 晏\ le please log on to our website at sign into mymicrochip to open the mymicrochip home page, then select a pro 晏\ le option from the left navigation bar. To opt out of future o 䍘 er or information s (other than product change noti 晏\ cation s), click here to go to microchipdirect and login, then click on the "My account" link, click on "Update pro 晏\ le" and un-check the box that states "Future o 䍘 ers or information about Microchip's products or services." Products Applications Design Support Training Sample and Buy About Us Contact Us Legal Investors Careers Support Copyright Microchip Technology Inc. All rights reserved. Shanghai ICP Recordal No

5 QUALIFICATION REPORT RELIABILITY LABORATORY PCN #: JAON-04PFPM024 Date: August 17, 2016 Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.18 TSMC wafer technology available in 36L VQFN package at ANAC assembly site. Distribution: CORPORATE QA/RE CORPORATE PACKAGING SUPPLIER ENGINEERING

6 OBJECTIVE Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.18 TSMC wafer technology available in 36L VQFN package at ANAC assembly site. QUAL ID QAR BD # BDM A PART # TA3121RPXA0C (LAN8700C) CCB # 2518 PRODUCT INFORMATION PACKAGE TYPE QFN (PUNCH) PACKAGE LEAD COUNT 36 (6x6x0.9mm) PACKAGE CODE RPX MANUFACTUR PART # TA3121RPXA0C (LAN8700C) WAFER LOT TC WAFER MASK TA312 (66814A2) WAFER PROCESS 0.18um FAB TSMC (TSR FAB 11) CIRCUIT UNDER PAD YES Material used in the Assembly: LEADFRAME PART NUMBER LEADFRAME MATERIAL C194 (ETCHED) LEADFRAME INTERNAL PLATING DOUBLE RING LEADFRAME SURFACE Cu NO TREATMENT LEADLOCK NO DIE ATTACH EPOXY TYPE 8290 EPOXY CONDUCTIVE YES WIRE TYPE CuPdAu DOWNBOND YES MOLDING COMPOUND TYPE G700 LEAD FINISH PROCESS Matte Si MARKING LASER

7 Manufacturing Information PACKAGE QUALIFICATION REPORT Assembly Lot No. Wafer Lot No. MARKING /Date Code ANAC W3G / TC C-AEZG C1614-A2C14 614UMUA ATC-CN ANAC W3G / TC C-AEZG C1614-A2C14 614UM1A ATC-CN ANAC W3G / TC C-AEZG C1614-A2C14 614UM2A ATC-CN Result Pass Fail The 36L QFN (6x6X0.9mm) package using ALS Leadfram3 with CuPdAu wire and 0.18um TSMC Technology, assembled by ANAC Pass Reliability test per QCI This package was qualified the Moisture/Reflow Sensitivity Classification Level 3 at 260 C reflow temperature per IPC/JEDEC J-STD-020D standard. Prepared By: Peter Boudouris Date: August 17, 2016 (Corporate Reliability & FA) Approved By: Vassilios Danginis Date: : August 17, 2016 (Corporate Reliability & FA)

8 Test Number (Reference) PACKAGE QUALIFICATION REPORT Test Condition Standard/ Method Qty. (Acc.) Def/SS Result Remarks Moisture/Reflow Sensitivity Classification Test (At MSL Level 3) 30 C/ 60%RH Moisture Soak 192 hrs. ( IPC/JEDEC J-STD-020D) IPC/ JEDEC J-STD-020D 0/ 0/ 0/ Pass Pass Pass LOT 1 LOT 2 LOT 3 Precondition Prior Perform Reliability Tests (At MSL Level 3) Electrical Test: +85 C JESD22- A113 (0) Lot 1 Good Devices Bake 125 C, 24hrs 85 C/85%RH Moisture Soak 192hrs 3x Convection-Reflow 260 C Electrical Test : +85 C Precondition Prior Perform Reliability Tests (At MSL Level 3) Electrical Test: +85 C JESD22- A113 (0) Lot 2 Good Devices Bake 125 C, 24hrs 30 C/60%RH Moisture Soak 192hrs 3x Convection-Reflow 260 C Electrical Test : +85 C

9 Precondition Prior Perform Reliability Tests (At MSL Level 3) Electrical Test: +85 C JESD22- A113 (0) Lot 3 Good Devices Bake 125 C, 24hrs 30 C/60%RH Moisture Soak 192hrs 3x Convection-Reflow 260 C Electrical Test : +85 C

10 Test Number (Reference) Temp Cycle Test Condition PACKAGE QUALIFICATION REPORT Stress Condition: C to +150 C, 1000 Cycles Standard/ Method Qty. (Acc.) Def/SS. Result Remarks JESD22-A Parts had been pre-conditioned at 260 C Electrical Test: + 85 C 231 (0) 0/231 Pass 77 units / lot uhast Stress Condition: +130 C/85%RH, 96hrs, 192hrs. JESD22-A Parts had been pre-conditioned at 260 C Electrical Test: + 85 C 231 (0) 0/231 Pass 77 units / lot High Temperatur e Storage Life Stress Condition: Bake +150 C, 1008hrs Electrical Test : + 85 C JESD22-A Parts had no Pre-Condition 231 (0) 0/231 Pass 77 units / lot