Product Change Notification - JAON-14ZGDV728 (Printer Friendly)

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1 Product Change Notification - JAON-14ZGDV Oct CCB 2701 Final Noti... Page 1 of 4 10/11/2016 English Search... PRODUCTS APPLICATIONS DESIGN SUPPORT TRAINING SAMPLE AND BUY ABOUT US CONTACT US mymicrochip Login Product Change Notification - JAON-14ZGDV728 (Printer Friendly) Date: 09 Oct 2016 Product Category: Notification subject: Notification text: Memory; Analog (Linear & Mixed Signal) AND Interface CCB 2701 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 160K wafer technology available in 8L PDIP package at MMT assembly site. PCN Status: Final notification Microchip Parts Affected: Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN. NOTE: For your convenience Microchip includes identical files in two formats (.pdf and.xls). Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 160K wafer technology available in 8L PDIP package at MMT assembly site. Pre Change: Using gold (Au) bond wire Post Change: Using palladium coated copper with gold flash (CuPdAu) bond wire Pre and Post Change Summary: Pre Change Post Change Assembly Site

2 Product Change Notification - JAON-14ZGDV Oct CCB 2701 Final Noti... Page 2 of 4 10/11/2016 MMT assembly site MMT assembly site Wire material Au wire CuPdAu wire Die attach material CRM-1064L CRM-1064L Molding compound material GE800 GE800 Lead frame material CDA194 CDA194 Impacts to Data Sheet: None Change Impact: None Reason for Change: To improve manufacturability and qualify Palladium coated copper with gold flash (CuPdAu) bond wire Change Implementation Status: In Progress Estimated First Ship Date: November 25, 2016 (date code: 1647) NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts. Time Table Summary: July > October 2016 November 2016 Workweek Initial PCN Issue Date X Qual Report Availability X

3 Product Change Notification - JAON-14ZGDV Oct CCB 2701 Final Noti... Page 3 of 4 10/11/2016 Final PCN Issue Date X Estimated Implementation Date X Method to Identify Change: Traceability code Qualification Report: Please open the attachments included with this PCN labeled as PCN_#_Qual Report. Revision History: July 19, 2016: Issued initial notification. October 9, 2016: Issued final notification. Attached the qualification report. Provided estimated first ship date on November 25, The change described in this PCN does not alter Microchip s current regulatory compliance regarding the material content of the applicable products. Attachment(s): PCN_JAON-14ZGDV728_Qual Report.pdf PCN_JAON-14ZGDV728_Affected_CPN.pdf PCN_JAON-14ZGDV728_Affected_CPN.xls Please contact your local Microchip sales office with questions or concerns regarding this notification. Terms and Conditions: If you wish to change your product/process change notification (PCN) profile please log on to our website at sign into mymicrochip to open the mymicrochip home page, then select a profile option from the left navigation bar. To opt out of future offer or information s (other than product change notification s), click here to go to microchipdirect and login, then click on the "My account" link, click on "Update profile" and un-check the box that states "Future offers or information about Microchip's products or services."

4 Product Change Notification - JAON-14ZGDV Oct CCB 2701 Final Noti... Page 4 of 4 10/11/2016 Products Applications Design Support Training Sample and Buy About Us Contact Us Legal Investors Careers Support Copyright Microchip Technology Inc. All rights reserved. Shanghai ICP Recordal No

5 JAON-14ZGDV728 - CCB 2701 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 160K wafer technology available in 8L PDIP package at MMT assembly site. Affected Catalog Part Numbers (CPN) PCN_JAON-14ZGDV728 CATALOG_PART_NBR 11AA010-I/P 11AA020-I/P 11AA040-I/P 11AA080-I/P 11AA160-I/P 11AA161-I/P 11LC010-E/P 11LC010-I/P 11LC020-E/P 11LC020-I/P 11LC040-E/P 11LC040-I/P 11LC080-E/P 11LC080-I/P 11LC160-E/P 11LC160-I/P 11LC161-E/P 11LC161-I/P 24AA014H-I/P 24AA014-I/P 24AA01H-I/P 24AA01-I/P 24AA02/P 24AA024H-I/P 24AA024-I/P 24AA025-I/P 24AA025UID-I/P 24AA02H-I/P 24AA02-I/P 24AA02UID-I/P 24AA52-I/P 24C01C/P 24C01C-E/P 24C01C-I/P 24C02C/P 24C02C-E/P 24C02C-I/P 24LC014-E/P 24LC014H-E/P 24LC014H-I/P 24LC014-I/P 24LC01B/P 24LC01B-E/P Page 1 of 2

6 JAON-14ZGDV728 - CCB 2701 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 160K wafer technology available in 8L PDIP package at MMT assembly site. Affected Catalog Part Numbers (CPN) PCN_JAON-14ZGDV728 CATALOG_PART_NBR 24LC01BH-E/P 24LC01BH-I/P 24LC01B-I/P 24LC024/P 24LC024-E/P 24LC024H-E/P 24LC024H-I/P 24LC024-I/P 24LC025/P 24LC025-E/P 24LC025-I/P 24LC02B/P 24LC02B-E/P 24LC02BH-E/P 24LC02BH-I/P 24LC02B-I/P 24LCS52-I/P 24VL014/P 24VL014H/P 24VL024/P 24VL024H/P 24VL025/P 34AA02-E/P 34AA02-I/P 34LC02-E/P 34LC02-I/P 34VL02/P MCP4726-E/P MCP7940M-I/P MCP7940N-I/P Page 2 of 2

7 QUALIFICATION REPORT RELIABILITY LABORATORY PCN #: JAON-14ZGDV728 Date October 7, 2016 Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 160K wafer technology available in 8L PDIP package at MMT assembly site. Distribution Somnuek T. Fernando C. V.Danginis A. Navarro Wichai K. J. Fernandez Arnel M. Alex K. Chaweng W. Hazel C. Microchip Technology (Thailand) Co., Ltd. 14 Moo 1 T.Wangtakien A. Muangchacherngsao, Chacherngsao, Thailand, Tel. (+66 38) , ext Fax (+66 38)

8 Purpose CN QUAL ID MP CODE Part No. Bonding No. PACKAGE QUALIFICATION REPORT Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 160K wafer technology available in 8L PDIP package at MMT assembly site. ES Q16149 CCB No DFAX17C4XA00 24LCS52-I/P BDM Rev. A Package Type 8L PDIP Package size 300 mils Die thickness 15 mils Die size x mils Lead Frame Paddle size 100 x 140 mils Material CDA194 Surface Ag Spot Plated Process Stamped Lead Lock No Part Number Treatment None Die attach material Epoxy CRM-1064L Wire CuPdAu wire Mold Compound GE800 Plating Composition Matte Tin

9 PACKAGE QUALIFICATION REPORT Manufacturing Information Assembly Lot No. Wafer Lot No. Date Code MMT GRSM B K4 MMT GRSM B DQ MMT GRSM B DU Result Pass Fail assembled by MMT pass reliability test per QCI Prepared By: Date: October 7, 2016 (Reliability Engineer) (Mr.Wittawat Premniwat) Approved By: Date: October 7, 2016 (Reliability Manager) (Mr. Somnuek Thongprasert)

10 PACKAGE QUALIFICATION REPORT Test Number (Reference) Test Condition Standard/ Method Qty. (Acc.) Def/SS. Result Remarks Electrical Test Electrical Test:+25 C and 85 C System: NEXTEST_PT A (0) 693 Good Devices Temp Cycle Stress Condition: -65 C to +150 C, 500 Cycles System : TABAI ESPEC TSA-70H Inspection: External crack inspection all units under 40X Optical magnification Electrical Test: + 85 C A (0) 0/231 Pass System: NEXTEST_PT Bond Strength: Wire Pull (> 2.50 grams) Bond Shear (>15.00 grams) 15 (0) 15 (0) 0/15 0/15 Pass Pass UNBIASED-HAST Stress Condition: +130 C/85%RH, 96 hrs. System: HAST 6000X Electrical Test: +25 C System NEXTEST_PT A (0) 0/231 Pass

11 PACKAGE QUALIFICATION REPORT Test Number (Reference) Test Condition Standard/ Method Qty. (Acc.) Def/SS. Result Remarks HAST Stress Condition: +130 C/85%RH, 96 hrs. Bias Volt: 5.0 Volts System: HAST 6000X Electrical Test: +25 C and 85 C System: NEXTEST_PT A (0) 0/231 Pass High Temperature Storage Life Stress Condition: Bake 175 C, 504 hrs System: SHEL LAB Electrical Test: +25 C and 85 C System: NEXTEST_PT A units 45(0) 0/45 Pass Bond Strength Data Assembly Wire Pull (> 2.50 grams) Bond Shear (>15.00 grams) M2011 B (0) Wires 30 (0) bonds 0/30 Pass 0/30 Pass