Memory Configuration Guide. X11 UP/DP/MP Motherboards. for. Revision 1.0a

Transcription

1 Memory Configuration Guide for X11 UP/DP/MP Motherboards (For Intel 81xx/61xx/51xx/41xx/31xx-based Platfroms) Revision 1.0a 1

2 Acknowledgement All memory tables contained in this document are extracted from Section 7.5 and Section 7.6 of Intel's Purley Design Guide Rev. 1.17, 12/2016. Intel is the rightful owner of these memory tables and the copyright thereof. SMCI incorporated the memory tables into this document under a general licensing provision between the two companies. The information provided in this document is for general reference only. Disclaimer The information in this user s manual has been carefully reviewed and is believed to be accurate. The vendor assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note: For the most up-to-date version of this manual, please see our website at Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual at any time and without notice. This product, including software and documentation, is the property of Supermicro and/ or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except as expressly permitted by the terms of said license. IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA. Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product. Manual Revision 1.0a Release Date: August 23, 2017 Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this document. Information in this document is subject to change without notice. Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders. Copyright 2017 by Super Micro Computer, Inc. All rights reserved. Printed in the United States of America 2

3 Memory Support for the X11 UP/DP/MP Motherboards This document provides the user with an easy-to-use guide for proper memory configuration and installation for the X11 UP/DP/MP (Socket P/Socket P0) Motherboards utilizing /3DS /L/3DS L memory modules. To ensure proper memory installation, please follow the information and instructions listed below. 1 A Memory Module is a Static-Sensitive Component Electrostatic Discharge (ESD) can damage electronic com ponents including memory modules. To avoid damaging your DIMM modules, it is important to handle it very carefully. The following measures are generally sufficient to protect your equipment from ESD. Precautions Use a grounded wrist strap designed to prevent static discharge. Handle the memory module by its edges only. Put the memory modules into the antistatic bags when not in use. Check the Supermicro website for recommended memory modules 2 Memory Support The X11 UP/DP/MP motherboard supports 3DS L (3DS Load Reduced DIMM)/ L (Load Reduced DIMM)/3DS (3DS Registered DIMM)/ (Registered DIMM), DDR4 (288-pin) ECC 2133/2400/2666 MHz memory modules. Refer to the following tables for detailed information on memory support for the X11 UP/DP/MP motherboards. 3

4 Type DDR4 Memory Support (for 2-Slot Per-Channel Configuration) Ranks Per DIMM and Data Width DIMM Capacity (GB) Speed (MT/s); Voltage (V); Slots per Channel (SPC) and DIMMs per Channel (DPC) 1DPC (1-DIMM per Channel) 2 Slots per Channel 2DPC (2-DIMM per Channel) 4 Gb 8 Gb 1.2 V 1.2 V SRx4 8 GB 16 GB SRx8 4 GB 8 GB DRx8 8 GB 16 GB DRx4 16 GB 32 GB QRX4 N/A 2H-64GB RX4 N/A 4H-128GB L QRx4 32 GB 64 GB L QRX4 N/A 2H-64GB Rx4 N/A 4H-128 GB Type DDR4 Memory Support (for 1-Slot Per-Channel Configuration) Ranks Per DIMM and Data Width DIMM Capacity (GB) Speed (MT/s); Voltage (V); Slots per Channel (SPC) and DIMMs per Channel (DPC) 1 Slot per Channel 1DPC (1-DIMM per Channel) 4 Gb 8 Gb 1.2 V SRx4 8 GB 16 GB 2666 SRx8 4 GB 8 GB 2666 DRx8 8 GB 16 GB 2666 DRx4 16 GB 32 GB 2666 QRX4 N/A 2H-64GB RX4 N/A 4H-128GB 2666 L QRx4 32 GB 64 GB 2666 L QRX4 N/A 2H-64GB Rx4 N/A 4H-128 GB Memory Installation Sequence Memory modules for the X11 UP/DP/MP motherboards are populated using the "Fill First" method. The blue memory slot of each channel is considered the "first DIMM module." When installing memory modules, be sure to populate your first DIMM module on the blue memory slot of a memory channel, and then populate the remaining DIMM modules on the black memory slots. 4 General Memory Population Requirements 1. Be sure to use the memory modules of the same type and speed on the motherboard. Mixing of memory modules of different types and speeds is not allowed. 2. Using unbalanced memory topology such as populating two DIMMs in one channel while populating one DIMM in another channel on the same motherboard will result in reduced memory performance. 3. Populating memory slots with a pair of DIMM modules of the same type and size will result in interleaved memory, which will improve memory performance. 4

5 5 DIMM Population Guidelines for Optimal Performance For optimal memory performance, follow the instructions listed in the tables below when populating memory modules. 5.1 Key Parameters for DIMM Configuration Key Parameters for DIMM Configurations Parameters Possible Values Number of Channels 1, 2, 3, 4, 5, or 6 Number of DIMMs per Channel DIMM Type DIMM Construction 1DPC (1 DIMM Per Channel) or 2DPC (2 DIMMs Per Channel) (w/ecc), 3DS, L, 3DS L non-3ds Raw Cards: A/B (2RX4), C (1RX4), D (1RX8), E (2RX8) 3DS Raw Cards: A/B (4RX4) non-3ds L Raw Cards: D/E (4RX4) 3DS L Raw Cards: A/B (8RX4) 5.2 DIMM Mixing Guidelines General DIMM Mixing Guidelines DIMM Mixing Rules All DIMMs must be all DDR4 DIMMs. X4 and X8 DIMMs can be mixed in the same channel. Mixing of Ls and s is not allowed in the same channel, across different channels, and across different sockets. Mixing of non-3ds and 3DS L is not allowed in the same channel, across different channels, and across different sockets. Mixing of DIMM Types within a Channel DIMM Types L 3DS L Allowed Not Allowed Not Allowed L Not Allowed Allowed Not Allowed 3DS L Not Allowed Not Allowed Allowed 5

6 6 DIMM Installation 1. Insert DIMM modules in the following order: P1-DIMMA1, P1-DIMMD1, P1- DIMMB1, DIMME1. For the system to work properly, please use memory modules of the same type and speed on the motherboard. (See the Note below.) X11DAi-N REV: Push the release tabs outwards on both ends of the DIMM slot to unlock it. BIOS LICENSE BAR CODE MAC CODE 3. Align the key of the DIMM module with the receptive point on the memory slot. 4. Align the notches on both ends of the module against the receptive points on the ends of the slot. 5. Use two thumbs together to press the notches on both ends of the module straight down into the slot until the module snaps into place. Notches 6. Press the release tabs to the lock positions to secure the DIMM module into the slot. 7 DIMM Removal Reverse the steps above to remove the DIMM modules from the motherboard. Release Tabs Press both notches straight down into the memory slot. Note: All graphics including the layout drawing above are for reference only. Your system components may look or may not look the same as graphics shown in this guide. 6