EMIF06-HMC02F2. 6-line IPAD, EMI filter including ESD protection. Description. Features. Applications. Complies with the following standards

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1 6-line IPAD, EMI filter including ESD protection Description Datasheet - production data Features 6 lines low-pass-filter High efficiency in EMI filtering Very low PCB space consuming: < 4 mm² Lead-free package Very thin package: 0.65 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reducing of parasitic elements through integration and wafer level packaging Complies with the following standards IEC level 4 on external pins 15 kv (air discharge) 8 kv (contact discharge) MIL STD 883E - Method Class 3 Applications High Speed MultiMediaCard The is a highly integrated array designed to suppress EMI / RFI noise for High Speed MultiMediaCard port filtering. The Flip-Chip packaging means the package size is equal to the die size. Additionally, this filter includes an ESD protection circuitry which prevents the protected device from destruction when subjected to ESD surges up to 15 kv. Compared to EMIF06-HMC01F2, the has its ground balls connected together internally. Figure 1. Pin configuration (ball side) Figure 2. Basic cell configuration Table 1. Ball configuration A1 cmd C1 dat2 A2 clk C2 gnd A3 Vmmc/Vdd C3 MMCdat1 A4 MMCclk C4 MMCdat0 B1 dat1 D1 dat3 B2 dat0 D2 gnd B3 gnd D3 MMCdat3 B4 MMCcmd D4 MMCdat2 TM: IPAD is a trademark of STMicroelectronics. March 2016 DocID Rev 1 1/7 This is information on a product in full production.

2 Electrical characteristics 1 Electrical characteristics Table 2. Absolute maximum ratings (T amb = 25 C) Symbol Parameter and test conditions Value Unit V PP Internal pins (A4, B4, C3, C4, D3, D4): ESD discharge IEC , air discharge ESD discharge IEC , contact discharge External pins (A1, A2, A3, B1, B2, C1, D1): ESD discharge IEC , air discharge ESD discharge IEC , contact discharge kv T j Maximum junction temperature 125 C T op Operating temperature range - 40 to + 85 C T stg Storage temperature range - 55 to C Figure 3. Electrical characteristics (definitions) Table 3. Electrical characteristics (T amb = 25 C) Symbol Test conditions Tolerance Min. Typ. Max. Unit V BR I R = 1 ma 6 V I RM V RM = 3 V 0.1 µa C line V BIAS = 0 V, V OSC = 30 mv, f = 1 MHz 20 pf R 2, R 3, R 4, R 5, R 6, R 7 I = 50 ma ±20% 50 Ω R 10, R 11, R 12, R 13 I = 50 µa ±30% 75 kω R 14 I = 200 µa ±30% 7 kω 2/7 DocID Rev 1

ESD response to IEC61000-4-2 (+8 kv contact discharge) Figure 7.

3 Electrical characteristics Figure 4. Attenuation versus frequency Figure 5. Analog crosstalk versus frequency Figure 6. ESD response to IEC (+8 kv contact discharge) Figure 7. ESD response to IEC (-8 kv contact discharge) Figure 8. Junction capacitance versus reverse voltage applied (typical values) DocID Rev 1 3/7 7

4 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. 2.1 Flip-Chip package information Figure 9. Flip-Chip package outline 4/7 DocID Rev 1

5 Package information 2.2 Packing information Figure 10. Tape and reel outline Figure 11. Footprint Figure 12. Marking DocID Rev 1 5/7 7

6 Ordering information 3 Ordering information Figure 13. Ordering information scheme Table 4. Ordering information Order code Marking Package Weight Base qty Delivery mode LK Flip chip 5.3 mg 5000 Tape and reel 7 Note: More information are available in the application notes: AN1235:"Flip chip: Package description and recommendations for use" 4 Revision history Table 5. Document revision history Date Revision Changes 02-Mar Initial release. 6/7 DocID Rev 1

7 IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document STMicroelectronics All rights reserved DocID Rev 1 7/7 7

8 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: STMicroelectronics:

EMIF06-HSD04F3. 6-line low capacitance IPAD for micro-sd card with EMI filtering and ESD protection. Features. Application.

EMIF06-HSD04F3. 6-line low capacitance IPAD for micro-sd card with EMI filtering and ESD protection. Features. Application. 6-line low capacitance IPAD for micro-sd card with EMI filtering and ESD protection Features Datasheet production data Figure 1. Pin configuration (bump side) Very low line capacitance to compensate long