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1 SPECIFICATION CUSTOMER : MODULE NO.: WH42A-YYH-JT# APPROVED BY: ( FOR CUSTOMER USE ONLY ) PCB VERSION: DATA: SALES BY APPROVED BY CHECKED BY PREPARED BY ISSUED DATE: Page 1 of 28

2 MODLE NO: RECORDS OF REVISION DOC. FIRST ISSUE VERSION DATE REVISED PAGE NO. SUMMARY First issue Page 2 of 28

3 Contents 1.Module Classification Information 2.Precautions in use of LCD Modules 3.General Specification 4.Absolute Maximum Ratings 5.Electrical Characteristics 6.Optical Characteristics 7.Interface Pin Function 8.Contour Drawing & Block Diagram 9.Function Description 1.Character Generator ROM Pattern 11.Instruction Table 12.Timing Characteristics 13.Initializing of LCM 14.Reliability 15.Backlight Information 16. Inspection specification 17. Material List of Components for RoHs Page 3 of 28

4 1.Module Classification Information W H 4 2 A-Y Y H- JT# Brand:WINSTAR DISPLAY CORPORATION 2 Display Type:H Character Type, G Graphic Type 3 Display Font:Character 4 words, 2Lines. 4 Model serials no. 5 Backlight Type: N Without backlight B EL, Blue green D EL, Green W EL, White F CCFL, White Y LED, Yellow Green T LED, White A LED, Amber R LED, Red O LED, Orange G LED, Green P LED, Blue 6 LCD Mode: B TN Positive, Gray T FSTN Negative N TN Negative, G STN Positive, Gray Y STN Positive, Yellow Green M STN Negative, Blue F FSTN Positive 7 LCD Polarize Type/ Temperature range/ View direction 8 Special Code A Reflective, N.T, 6: D Reflective, N.T, 12: G Reflective, W. T, 6: J Reflective, W. T, 12: B Transflective, N.T,6: E Transflective, N.T.12: H Transflective, W.T,6: K Transflective, W.T,12: C Transmissive, N.T,6: F Transmissive, N.T,12: I Transmissive, W. T, 6: L Transmissive, W.T,12: JT: English and Japanese standard font; #:Fit in with the ROHS Directions and regulations; Page 4 of 28

5 2.Precautions in use of LCD Modules (1)Avoid applying excessive shocks to the module or making any alterations or modifications to it. (2)Don t make extra holes on the printed circuit board, modify its shape or change the components of LCD module. (3)Don t disassemble the LCM. (4)Don t operate it above the absolute maximum rating. (5)Don t drop, bend or twist LCM. (6)Soldering: only to the I/O terminals. (7)Storage: please storage in anti-static electricity container and clean environment. 3.General Specification Item Dimension Unit Number of Characters 4 characters x 2 Lines - Module dimension 182. x 33.5 x 13.6(MAX) mm View area x 16.5 mm Active area x 11.5 mm Dot size.6 x.65 mm Dot pitch.65 x.7 mm Character size 3.2 x 5.55 mm Character pitch 3.7 x 5.95 mm LCD type STN, Positive, Transflective, Yellow Green Duty 1/16 View direction Backlight Type 6 o clock LED Yellow green Page 5 of 28

6 4.Absolute Maximum Ratings Item Symbol Min Typ Max Unit Operating Temperature T OP Storage Temperature T ST Input Voltage V I V SS - V DD V Supply Voltage For Logic VDD-V SS V Supply Voltage For LCD V DD -V V 5.Electrical Characteristics Item Symbol Condition Min Typ Max Unit Supply Voltage For Logic V DD -V SS V Ta= V Supply Voltage For V DD -V Ta= V LCD Ta= V Input High Volt. V IH -.7 V DD - V DD V Input Low Volt. V IL - V SS -.6 V Output High Volt. V OH V Output Low Volt. V OL V Supply Current I DD V DD =5.V ma Page 6 of 28

7 6.Optical Characteristics Item Symbol Condition Min Typ Max Unit View Angle (V)θ CR deg (H)φ CR deg Contrast Ratio CR Response Time T rise ms T fall ms Definition of Operation Voltage (Vop) Definition of Response Time ( Tr, Tf ) Intensity Selected Wave Non-selected Conition Selected Conition Non-selected Conition 1% Non-selected Wave Intensity 1% Cr Max Cr = Lon / Loff 1% 9% Vop Driving Voltage(V) Tr Tf [positive type] [positive type] Conditions : Operating Voltage : Vop Viewing Angle(θ,φ) :, Frame Frequency : 64 HZ Driving Waveform : 1/N duty, 1/a bias Definition of viewing angle(cr 2) θf θl θb θr φ= 18 φ= 27 φ= 9 φ= Page 7 of 28

8 7.Interface Pin Function Pin No. Symbol Level Description 1 V SS V GND 2 V DD 5.V +3V or 5V 3 VO (Variable) Contrast Adjustment 4 RS H/L Register select signal 5 R/W H/L H/L Read /Write signal 6 E H,H L Chip enable signal 7 DB H/L Data bus line 8 DB1 H/L Data bus line 9 DB2 H/L Data bus line 1 DB3 H/L Data bus line 11 DB4 H/L Data bus line 12 DB5 H/L Data bus line 13 DB6 H/L Data bus line 14 DB7 H/L Data bus line 15 A for LED/ 16 K - Power supply for B/L Page 8 of 28

9 8.Contour Drawing &Block Diagram (VA) (AA) (VA) 147.5(AA) PTH PTH A K MAX 8.95 LED B/L Vss Vdd Vo RS R/W E DB DB1 DB2 DB3 DB4 DB5 DB6 DB7 A K (P4*7) PTH PAD The non-specified tolerance of dimension is.3mm. PIN DETAIL.4 DOT SIZE MPU 8 series or 68 series RS R/W E DB~DB7 Controller/Com Driver HD4478 or Equivalent Com1~16 4X2 LCD VR 1K~2K Vdd Vo Vss Bias and Power Circuit Seg1~4 D Seg41~12 Seg Driver Seg12~2 Seg Driver Vee External contrast adjustment. N.V. Generator Optional M CL1 CL2 Vdd,Vss,V1~V5 Character located DDRAM address B DDRAM address B Page 9 of 28

10 9.Function Description The LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an instruction register (IR) and a data register (DR). The IR stores instruction codes, such as display clear and cursor shift, and address information for display data RAM (DDRAM) and character generator (CGRAM). The IR can only be written from the MPU. The DR temporarily stores data to be written or read from DDRAM or CGRAM. When address information is written into the IR, then data is stored into the DR from DDRAM or CGRAM. By the register selector (RS) signal, these two registers can be selected. RS R/W Operation IR write as an internal operation (display clear, etc.) 1 Read busy flag (DB7) and address counter (DB to DB7) 1 Write data to DDRAM or CGRAM (DR to DDRAM or CGRAM) 1 1 Read data from DDRAM or CGRAM (DDRAM or CGRAM to DR) Busy Flag (BF) When the busy flag is 1, the controller LSI is in the internal operation mode, and the next instruction will not be accepted. When RS= and R/W=1, the busy flag is output to DB7. The next instruction must be written after ensuring that the busy flag is. Address Counter (AC) The address counter (AC) assigns addresses to both DDRAM and CGRAM Display Data RAM (DDRAM) This DDRAM is used to store the display data represented in 8-bit character codes. Its extended capacity is 8 8 bits or 8 characters. Below figure is the relationships between DDRAM addresses and positions on the liquid crystal display. High bits Low bits Example: DDRAM addresses 4E AC (hexadecimal) AC6 AC5 AC4 AC3 AC2 AC1 AC Page 1 of 28

11 Display position DDRAM address Line by 4-Character Display Character Generator ROM (CGROM) The CGROM generate 5 8 dot or 5 1 dot character patterns from 8-bit character codes. See Table 2. Character Generator RAM (CGRAM) In CGRAM, the user can rewrite character by program. written, and for 5 1 dots, four character patterns can be written. For 5 8 dots, eight character patterns can be Write into DDRAM the character code at the addresses shown as the left column of table 1. To show the character patterns stored in CGRAM. Page 11 of 28

12 Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns Table 1. F o r 5 * 8 d o t c h a r a c te r p a tte r n s C h a r a c te r C o d e s ( D D R A M d a ta ) C G R A M A d d r e s s C h a r a c te r P a tte r n s ( C G R A M d a ta ) H ig h L o w H ig h L o w H ig h L o w * * * 1 * * * 1 * * * 1 1 * * * * 1 * * * 1 1 * * * 1 1 * * * * * * * * * 1 * * * 1 * * * 1 1 * * * * * * * 1 1 * * * 1 1 * * * * * * * * * 1 C h a r a c te r p a tte r n ( 1 ) C u r s o r p a tte r n C h a r a c te r p a tte r n ( 2 ) C u r s o r p a tte r n * F o r 5 * 1 d o t c h a r a c te r p a tte r n s C h a r a c te r C o d e s ( D D R A M d a ta ) C G R A M A d d r e s s * * * C h a r a c te r P a tte r n s ( C G R A M d a ta ) H ig h L o w H ig h * L o w H ig h L o w * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * C h a r a c te r p a tte r n C u r s o r p a tte r n : " H ig h " * * * * * * * * Page 12 of 28

13 1.Character Generator ROM Pattern Table.2 Upper 4 bit Lower 4 bit LLLL LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL HHHH CG RAM ( 1 ) LLLH ( 2 ) LLHL ( 3 ) LLHH ( 4 ) LHLL ( 5 ) LHLH ( 6 ) LHHL ( 7 ) LHHH ( 8 ) HLLL ( 1 ) HLLH ( 2 ) HLHL ( 3 ) HLHH ( 4 ) HHLL ( 5 ) HHLH ( 6 ) HHHL ( 7 ) HHHH ( 8 ) Page 13 of 28

14 11.Instruction Table Instruction Instruction Code RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB Description Execution time (fosc=27khz) Clear Display 1 Write H to DDRAM and set DDRAM address to H from AC 1.53ms Return Home 1 - Entry Mode Set Display ON/OFF Control Cursor or Display Shift 1 I/D SH 1 D C B 1 S/C R/L - - Function Set 1 DL N F - - Set CGRAM Address Set DDRAM Address Read Busy Flag and Address Write Data to RAM Set DDRAM address to H from AC and return cursor to its original position if shifted. The contents of DDRAM are not changed. Assign cursor moving direction and enable the shift of entire display. Set display (D), cursor (C), and blinking of cursor (B) on/off control bit. Set cursor moving and display shift control bit, and the direction, without changing of DDRAM data. Set interface data length (DL:8-bit/4-bit), numbers of display line (N:2-line/1-line)and, display font type (F:5 11 dots/5 8 dots) 1.53ms 39μs 39μs 39μs 39μs 1 AC5 AC4 AC3 AC2 AC1 AC Set CGRAM address in address counter. 39μs 1 AC6 AC5 AC4 AC3 AC2 AC1 AC Set DDRAM address in address counter. 39μs Whether during internal operation or not can be known by reading BF. The 1 BF AC6 AC5 AC4 AC3 AC2 AC1 AC contents of address counter can also be 1 D7 D6 D5 D4 D3 D2 D1 D read. Write data into internal RAM (DDRAM/CGRAM). μs 43μs Read Data from RAM 1 1 D7 D6 D5 D4 D3 D2 D1 D Read data from internal RAM (DDRAM/CGRAM). 43μs * - :don t care Page 14 of 28

15 12.Timing Characteristics 12.1 Write Operation Ta=25, VDD=5.V Item Symbol Min Typ Max Unit Enable cycle time T C ns Enable pulse width T PW ns Enable rise/fall time T R,T F ns Address set-up time (RS, R/W to E) t AS - - ns Address hold time t AH ns Data set-up time t DSW ns Data hold time t H ns Page 15 of 28

16 12.2 Read Operation Ta=25, VDD=5V Item Symbol Min Typ Max Unit Enable cycle time T C ns Enable pulse width (high level) T PW ns Enable rise/fall time T R,T F ns Address set-up time (RS, R/W to E) t AS - - ns Address hold time t AH ns Data delay time t DDR ns Data hold time t H ns Page 16 of 28

17 13.Initializing of LCM Power on Wait for more than 4 ms after VDD rises to 4.5 V RS R/W DB7 DB6 DB5 DB4 DB3 1 1 * DB2 * DB1 * DB * BF can not be checked before this instruction. Function set RS R/W Wait for more than 39us DB7 DB6 N F DB5 DB4 DB3 DB2 DB1 DB 1 * * * * * * * * * * BF can not be checked before this instruction. Function set Wait for more than 39 µs RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB BF can not be checked before this instruction. 1 * * * * N F * * * * * * Function set Wait for more than 37us RS R/W DB7 1 DB6 D DB5 C DB4 B DB3 * * DB2 * * DB1 * * DB * * Display ON/OFF control Wait for more than 37 µs RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB * * * * 1 * * * * Display Clear Wait for more than 1.53ms RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB * * * * 1 I/D SH * * * * Entry Mode Set Initialization ends 4-Bit Ineterface Page 17 of 28

18 Power on Wait for more than 4 ms after VDD rises to 4.5 V RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB 1 1 N F * * BF can not be checked before this instruction. Function set Wait for more than 39us RS R/WDB7 DB6 DB5 1 DB4 DB3 DB2 DB1 DB 1 N F * * BF can not be checked before this instruction. Function set Wait for more than 37us RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB 1 B C D Display ON/OFF control Wait for more than 37 µs RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB 1 Display Clear Wait for more than 1.53ms RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB 1 I/D S Entry Mode Set Initialization ends 8-Bit Ineterface Page 18 of 28

19 14.Reliabili Reliability Content of Reliability Test (wide temperature, -2 ~7 ) Note1: No dew condensation to be observed. Environmental Test Test Item Content of Test Test Condition Note High Temperature Endurance test applying the high storage 8 storage temperature for a long time. 2hrs 2 Low Temperature Endurance test applying the high storage -3 storage temperature for a long time. 2hrs 1,2 Endurance test applying the electric stress High Temperature 7 (Voltage & Current) and the thermal stress to the Operation element for a long time. 2hrs Low Temperature Operation High Temperature/ Humidity Operation Thermal shock resistance Vibration test Static electricity test Endurance test applying the electric stress under low temperature for a long time. The module should be allowed to stand at 6,9%RH max For 96hrs under no-load condition excluding the polarizer, Then taking it out and drying it at normal temperature. The sample should be allowed stand the following 1 cycles of operation min 5min 3min 1 cycle Endurance test applying the vibration during transportation and using. Endurance test applying the electric stress to the terminal. Note2: The function test shall be conducted after 4 hours storage at the normal Temperature and humidity after remove from the test chamber. -2 2hrs 6,9%RH 96hrs -2 /7 1 cycles Total fixed amplitude : 1.5mm Vibration Frequency : 1~55Hz One cycle 6 seconds to 3 directions of X,Y,Z for Each 15 minutes VS=8V,RS=1.5k Ω CS=1pF 1 time Note3: Vibration test will be conducted to the product itself without putting it in a container. 1 1,2 3 Page 19 of 28

20 15.Backlight Information Specification PARAMETER SYMBOL MIN TYP MAX UNIT TEST CONDITION Supply Current ILED ma V=4.2V Supply Voltage V V - Reverse Voltage VR V - Luminous Intensity IV CD/M 2 ILED=23mA Wave Length λp nm ILED=23mA Life Time - - 1K - Hr. ILED 23mA Color Yellow Green Note: The LED of B/L is drive by current only, drive voltage is for reference only. drive voltage can make driving current under safety area (current between minimum and maximum). 2.Drive from pin15,pin16 R R A K B/L LCM ill never get Vee output from pin15) Page 2 of 28

21 16. Inspection specification NO Item Criterion AQ L 1 Electrical Testing 1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character, dot or icon. 1.3 Display malfunction. 1.4 No function or no display. 1.5 Current consumption exceeds product specifications. 1.6 LCD viewing angle defect. 1.7 Mixed product types. 1.8 Contrast defect Black or white spots on LCD (display only) 2.1 White and black spots on display.25mm, no more than three white or black spots present. 2.2 Densely spaced: No more than two spots or lines within 3mm 3.1 Round type : As following drawing Φ=( x + y ) / 2 SIZE Acceptable Q TY Φ.1 Accept no dense 3 LCD black spots, white spots, contamination (non-display).1< 2 Φ.2.2< 1 Φ.25.25<Φ 3.2 Line type : (As following drawing) Length Width Acceptable Q TY --- W.2 Accept no dense L 3. L.2<W.3.3<W <W As round type 4 Polarizer bubbles If bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction. Size Φ Acceptable Q TY Φ.2 Accept no dense.2<φ.5 3.5<Φ <Φ Total Q TY 3 Page 21 of 28

22 NO Item Criterion AQ L 5 Scratches Follow NO.3 LCD black spots, white spots, contamination Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length: 6.1 General glass chip : Chip on panel surface and crack between panels: z: Chip thickness y: Chip width x: Chip length 6 Chipped glass Z 1/2t Not over viewing x 1/8a area 1/2t<z 2t Not exceed 1/3k x 1/8a If there are 2 or more chips, x is total length of each chip Corner crack: z: Chip thickness y: Chip width x: Chip length Z 1/2t Not over viewing x 1/8a area 1/2t<z 2t Not exceed 1/3k x 1/8a If there are 2 or more chips, x is the total length of each chip. Page 22 of 28

NO Item Criterion AQL Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length 6.2

23 NO Item Criterion AQL Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length 6.2 Protrusion over terminal : Chip on electrode pad : y: Chip width x: Chip length z: Chip thickness y.5mm x 1/8a < z t Non-conductive portion: 6 Glass crack y: Chip width x: Chip length z: Chip thickness y L x 1/8a < z t If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications. If the product will be heat sealed by the customer, the alignment mark not be damaged Substrate protuberance and internal crack. y: width x: length y 1/3L x a Page 23 of 28

24 NO Item Criterion AQL 7 Cracked glass The LCD with extensive crack is not acceptable. 8 Backlight elements 8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using LCD spot, lines and contamination standards. 8.3 Backlight doesn t light or color wrong Bezel 9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 9.2 Bezel must comply with job specifications PCB COB 1.1 COB seal may not have pinholes larger than.2mm or contamination. 1.2 COB seal surface may not have pinholes through to the IC. 1.3 The height of the COB should not exceed the height indicated in the assembly diagram. 1.4 There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places. 1.5 No oxidation or contamination PCB terminals. 1.6 Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts. 1.7 The jumper on the PCB should conform to the product characteristic chart. 1.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold pad, make sure it is smoothed down Soldering 11.1 No un-melted solder paste may be present on the PCB No cold solder joints, missing solder connections, oxidation or icicle No residue or solder balls on PCB No short circuits in components on PCB..65 Page 24 of 28

25 NO Item Criterion AQL 12 General appearance 12.1 No oxidation, contamination, curves or, bends on interface Pin (OLB) of TCP No cracks on interface pin (OLB) of TCP No contamination, solder residue or solder balls on product The IC on the TCP may not be damaged, circuits. 1 The uppermost edge of the protective strip on the interface pin must be present or look as if it cause the interface pin to sever The residual rosin or tin oil of soldering (component or chip component) is not burned into brown or black color Sealant on top of the ITO circuit has not hardened Pin type must match type in specification sheet LCD pin loose or missing pins Product packaging must the same as specified on packaging specification sheet Product dimension and structure must conform to product specification sheet Page 25 of 28

26 17. Material List of Components for RoHs 1. WINSTAR Display Co., Ltd hereby declares that all of or part of products (with the mark # in code), including, but not limited to, the LCM, accessories or packages, manufactured and/or delivered to your company (including your subsidiaries and affiliated company) directly or indirectly by our company (including our subsidiaries or affiliated companies) do not intentionally contain any of the substances listed in all applicable EU directives and regulations, including the following substances. Exhibit A:The Harmful Material List Material (Cd) (Pb) (Hg) (Cr6+) PBBs PBDEs Limited Value ppm ppm ppm ppm ppm ppm Above limited value is set up according to RoHS. 2.Process for RoHS requirement: (1) Use the Sn/Ag/Cu soldering surface;the surface of Pb-free solder is rougher than we used before. (2) Heat-resistance temp.: Reflow:25,3 seconds Max. ; Connector soldering wave or hand soldering:32, 1 seconds max. (3) Temp. curve of reflow, max. Temp.:235±5 ; Recommended customer s soldering temp. of connector:28, 3 seconds. Page 26 of 28

27 LCM Sample Estimate Feedback Sheet Module Number: Page: 1 1 Panel Specification: 1. Panel Type: Pass NG, 2. View Direction: Pass NG, 3. Numbers of Dots: Pass NG, 4. View Area: Pass NG, 5. Active Area: Pass NG, 6. Operating Temperature: Pass NG, 7. Storage Temperature: Pass NG, 8. Others: 2 Mechanical Specification: 1. PCB Size: Pass NG, 2. Frame Size: Pass NG, 3. Materal of Frame: Pass NG, 4. Connector Position: Pass NG, 5. Fix Hole Position: Pass NG, 6. Backlight Position: Pass NG, 7. Thickness of PCB: Pass NG, 8. Height of Frame to PCB: Pass NG, 9. Height of Module: Pass NG, 1. Others: Pass NG, 3 Relative Hole Size: 1. Pitch of Connector: Pass NG, 2. Hole size of Connector: Pass NG, 3. Mounting Hole size: Pass NG, 4. Mounting Hole Type: Pass NG, 5. Others: Pass NG, 4 Backlight Specification: 1. B/L Type: Pass NG, 2. B/L Color: Pass NG, 3. B/L Driving Voltage (Reference for LED Type): Pass NG, 4. B/L Driving Current: Pass NG, 5. Brightness of B/L: Pass NG, 6. B/L Solder Method: Pass NG, 7. Others: Pass NG, >> Go to page 2 << Page 27 of 28

28 Module Number: Page: 2 5 Electronic Characteristics of Module: 1. Input Voltage: Pass NG, 2. Supply Current: Pass NG, 3. Driving Voltage for LCD: Pass NG, 4. Contrast for LCD: Pass NG, 5. B/L Driving Method: Pass NG, 6. Negative Voltage Output: Pass NG, 7. Interface Function: Pass NG, 8. LCD Uniformity: Pass NG, 9. ESD test: Pass NG, 1. Others: Pass NG, 6 Summary: Page 28 of 28

Number of Characters 20 characters x 4Lines - Module dimension 98.0 x 60.0 x 13.6(MAX) mm. View area 77.0 x 25.2 mm. Active area 70.4 x 20.

Number of Characters 20 characters x 4Lines - Module dimension 98.0 x 60.0 x 13.6(MAX) mm. View area 77.0 x 25.2 mm. Active area 70.4 x 20. 2.Precautions in use of LCD Modules (1)Avoid applying excessive shocks to the module or making any alterations or modifications to it. (2)Don t make extra holes on the printed circuit board, modify its