MAX14653/MAX14654/ MAX14655/MAX High-Current Overvoltage Protectors with Adjustable OVLO
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1 EVALUATION KIT AVAILABLE MAX14653/MAX14654/ General Description The MAX14653/MAX14654/ overvoltage protection devices feature a low 38mΩ (typ) R ON internal FET and protect low-voltage systems against voltage faults up to +28V DC. An internal clamp also protects the devices from surges up to +8V. When the input voltage exceeds the overvoltage threshold, the internal FET is turned off to prevent damage to the protected downstream components. The overvoltage protection threshold can be adjusted with optional external resistors to any voltage between 4V and 2V. With the input set below the external select voltage, the MAX14653/MAX14654/MAX14655/ MAX14717 automatically choose the accurate internal trip thresholds. The internal overvoltage thresholds () are preset to 15.5V typical (MAX14653), 6.8V typical (MAX14654/MAX14717), or 5.825V typical (MAX14655). The devices feature an open-drain ACOK output indicating a stable supply between minimum supply voltage and V. The MAX14653/MAX14654/MAX14655/ MAX14717 are also protected against overcurrent events by an internal thermal shutdown. The MAX14653/MAX14654/ are offered in a small 12-bump WLP package and operate over the -4ºC to +85ºC extended temperature range. Applications Smartphones Tablet PCs Mobile Internet Devices Benefits and Features Protect High-Power Portable Devices Wide Operating Input Voltage Protection from +2.5V to +28V Integrated 38mΩ (typ) n-channel MOSFET Switch Flexible Overvoltage Protection Design Adjustable Overvoltage Protection Trip Level Wide Adjustable Threshold Range from +4V to +2V Preset Internal Accurate Thresholds: 15.5V ±3.3% (MAX14653) 6.8V ±2.9% (MAX14654/MAX14717) 5.825V ±3% (MAX14655) Additional Protection Features Increase System Reliability Surge Immunity to +8V Soft-Start to Minimize In-Rush Current Internal 15ms Startup Debounce Thermal-Shutdown Protection Minimize PCB Area 12-Bump WLP (1.29mm x 1.83mm) Package -4ºC to +85ºC Operating Temperature Range Ordering Information appears at end of data sheet. Typical Application Circuit POWER ADAPTER.1µF 1µF R1* MAX14653 MAX14654 V I/O MAX14655 MAX14717 R2* GND ACOK CHARGER PMIC Li-ION BATTERY APPS PROCESSOR *R1 AND R2 ARE ONLY REQUIRED FOR ADJUSTABLE ; OTHERWISE, CONNECT TO GND ; Rev 2; 5/14
2 Absolute Maximum Ratings (All voltages referenced to GND.) (Note 1)...-.3V to +29V...-.3V to V +.3V...-.3V to +24V ACOK...-.3V to +6V Continuous, Current...4.5A (Note: Continuous current limited by thermal design.) Peak, Current (1ms)...8A Continuous Power Dissipation (T A = +7ºC) WLP (derate 13.7mW/ºC above +7ºC)...196mW Operating Temperature Range...-4ºC to +85ºC Junction Temperature ºC Storage Temperature Range...-65ºC to +15ºC Soldering Temperature (reflow) ºC Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 2) WLP Junction-to-Ambient Thermal Resistance (θ JA )...73 C/W Note 1: Survives burst pulse up to 8V with 2Ω series resistance. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to Electrical Characteristics (V = +2.5V to +28V, C =.1μF, T A = -4ºC to +85ºC, unless otherwise noted. Typical values are at V = +5.V, I 3A, and T A = +25ºC.) (Note 3) PARAMETER SYMBOL CONDITIONS M TYP MAX UNITS Input Voltage Range V V Input Clamp Voltage V _CLAMP I = 1mA, T A = +25ºC 33 V Input Supply Current I V = 5V 7 12 µa Supply Current I _Q V = 3V, V = 5V, V = V Internal Overvoltage Trip Level V _ V rising V falling µa MAX MAX14654/ MAX MAX MAX MAX14654/ MAX MAX MAX Set Threshold V _TH MAX14654, MAX14655, MAX Adjustable Threshold Range External Select Threshold 4 2 V V _SELECT.2.3 V Switch On-Resistance R ON V = 5V, I = 1A, T A = +25ºC mω Load Capacitance C V = 5V 1 µf Input Leakage Current I V = V _TH -1 1 na V V Maxim Integrated 2
3 Electrical Characteristics (continued) (V = +2.5V to +28V, C =.1μF, T A = -4ºC to +85ºC, unless otherwise noted. Typical values are at V = +5.V, I 3A, and T A = +25ºC.) (Note 3) PARAMETER SYMBOL CONDITIONS M TYP MAX UNITS Leakage Voltage by V _LEAK V = 2V, V = unconnected, R = 1MΩ.5 V Thermal Shutdown 13 ºC Thermal-Shutdown Hysteresis 2 ºC DIGITAL SIGNALS (ACOK) ACOK Output Low Voltage V OL V I/O = 3.3V, I SK = 1mA, see the Typical Application Circuit ACOK Leakage Current V ACOK_LEAK V I/O = 3.3V, ACOK deasserted, see the Typical Application Circuit TIMG CHARACTERISTICS (Figure 1).4 V µa Debounce Time MAX14653/ MAX14654/MAX14655 t DEB Time from 2.5V < V < V _ to V = 1% of V 15 ms Debounce Time MAX14717 t DEB Time from 2.5V < V < V _ to V = 1% of V 15 ms Soft-Start Time MAX14653/ MAX14654/MAX14655 t SS V = 1% of V to soft-start off 3 ms Soft-Start Time MAX14717 t SS V = 1% of V to soft-start off 165 ms 2 ms Switch Turn-On Time t ON C LOAD = 1µF, V from 1%, V = 5V, R L = 1Ω, V to 9% V Switch Turn-Off Time t OFF V > V to V = 8% of V, R L = 1Ω, V rising at 2V/µs ESD PROTECTION 2 µs Human Body Model All pins ±2 kv IEC Contact Discharge IEC Air Gap Discharge pin ±8 kv pin ±15 kv Note 3: All specifications are 1% production tested at T A = +25ºC, unless otherwise noted. Specifications are over -4ºC to +85ºC and are guaranteed by design. Maxim Integrated 3
4 2.5V t ON t ON THERMAL SHUTDOWN 1% t DEB 9% t OFF t DEB 1% 9% t OFF t DEB t DEB t SS V _TH ACOK NOTE: WAVEFORMS ARE NOT TO SCALE Figure 1. Timing Diagram Maxim Integrated 4
5 Typical Operating Characteristics (V = +5.V, C =.1µF, C = 1µF, T A = +25ºC, unless otherwise noted.) SUPPLY CURRENT (µa) MAX14653 SUPPLY CURRENT vs. SUPPLY VOLTAGE T A = +25 C T A = +85 C T A = -4 C MAX14653 toc1 LEAKAGE CURRENT (µa) LEAKAGE CURRENT vs. V MAX14653 toc2 NORMALIZED ON-RESISTANCE NORMALIZED R ON vs. TEMPERATURE I = 1A NORMALIZED TO T A = +25 C MAX14653 toc VOLTAGE (V) V (V) TEMPERATURE ( C) NORMALIZED ON-RESISTANCE NORMALIZED R ON vs. PUT CURRENT NORMALIZED TO.1A MAX14653 toc4 NORMALIZED THRESHOLD NORMALIZED THRESHOLD vs. TEMPERATURE NORMALIZED TO T A = +25 C MAX14653 toc PUT CURRENT (A) TEMPERATURE ( C) NORMALIZED THRESHOLD NORMALIZED EXTERNAL SET THRESHOLD vs. TEMPERATURE NORMALIZED TO T A = +25 C MAX14653 toc6 NORMALIZED THRESHOLD NORMALIZED EXTERNAL SELECT THRESHOLD vs. TEMPERATURE NORMALIZED TO T A = +25 C V = +16V, MAX14653 MAX14653 toc TEMPERATURE ( C) TEMPERATURE ( C) Maxim Integrated 5
6 Typical Operating Characteristics (continued) (V = +5.V, C =.1µF, C = 1µF, T A = +25ºC, unless otherwise noted.) NORMALIZED DEBOUNCE TIME NORMALIZED DEBOUNCE TIME vs. TEMPERATURE NORMALIZED TO T A = +25 C TEMPERATURE ( C) MAX14653 toc8 POWER-UP RESPONSE (C L = 1µF) MAX14653 toc9 4ms/div V 5V/div V 5V/div I 1mA/div POWER-UP RESPONSE (C L = 1µF) MAX14653 toc1 OVERVOLTAGE FAULT RESPONSE MAX14653 toc11 V 5V/div V 1V/div V 5V/div I 1mA/div V 1V/div I 5mA/div 4ms/div 4ms/div 8V SURGE TEST WAVEFORM (WITH MAX14653) MAX14653 toc12 8V SURGE TEST WAVEFORM (WITH MAX14653) MAX14653 toc13 2V/div V 2V/div 1µs/div 1µs/div Maxim Integrated 6
7 Pin Configuration TOP VIEW (BUMPS ON BOTTOM) A MAX14653 MAX14654 MAX14655 MAX GND GND ACOK GND B GND C WLP (1.3mm x 1.86mm) Pin Description P NAME FUNCTION A1, A4, B4, C4 GND Ground. Connect GND pins together for proper operation. A2, A3, B2, Output Voltage. Output of internal switch. Connect pins together for proper operation. B1 ACOK Open-Drain Flag Output. ACOK is driven low after input voltage is stable between minimum V and V after debounce. Connect a pullup resistor from ACOK to the logic I/O voltage of the host system. ACOK is high impedance after thermal shutdown. B3, C2, C3 C1 Voltage Input. Bypass with a.1µf ceramic capacitor as close as possible to the device. Connect pins together for proper operation. External Adjustment. Connect to GND when using the internal threshold. Connect a resistor-divider to to set a different threshold; this external resistor-divider is completely independent of the internal threshold. Maxim Integrated 7
8 Functional Diagram MAX14653 MAX14654 MAX14655 MAX14717 CHARGE PUMP V BG REFERENCE TEMPERATURE FAULTS LOGIC CONTROL ACOK SEL GND Detailed Description The MAX14653/MAX14654/ overvoltage protection devices feature a low on-resistance (R ON ) internal FET and protect low-voltage systems against voltage faults up to +28V DC. An internal clamp also protects the devices from surges up to +8V. If the input voltage exceeds the overvoltage threshold, the internal FET is turned off to prevent damage to the protected components. The 15ms debounce time built into the device prevents false turn-on of the internal FET during startup. Device Operation The devices contain timing logic that controls the turn-on of the internal FET. The internal charge pump is enabled when V < V _ if internal trip thresholds are used or when V < V _TH if external trip thresholds are used. The charge-pump startup, which occurs after a 15ms debounce delay, turns the internal FET on (see the Functional Diagram). After the debounce time, soft-start limits the FET inrush current for 3ms (typ). At any time, if V rises above V _THRESH, is disconnected from. Internal Switch The MAX14653/MAX14654/ incorporate an internal FET with a 38mΩ (typ) R ON. The FET is internally driven by a charge pump that generates a necessary gate voltage above. Overvoltage Lockout () The MAX14653 has a 15.5V (typ) overvoltage threshold (). The MAX14654/MAX14717 and MAX14655 have 6.8V and 5.825V (typ) thresholds, respectively. Thermal Shutdown Protection The MAX14653/MAX14654/ feature thermal shutdown circuitry. The internal FET turns off when the junction temperature exceeds +13ºC (typ). The device exits thermal shutdown once the junction temperature cools by 2ºC (typ). ACOK Output An open-drain ACOK output gives the MAX14653/ MAX14654/ the ability to communicate a stable power source to the host system. ACOK is driven low after input voltage is stable between minimum V and V after debounce. Connect a pullup resistor from ACOK to the logic I/O voltage of the host system. ACOK is high impedance after thermal shutdown. Maxim Integrated 8
9 Applications Information Bypass Capacitor For most applications, bypass to GND with a.1µf ceramic capacitor as close as possible to the device. If the power source has significant inductance due to long lead length, the device clamps the overshoot due to LC tank circuit. HIGH- VOLTAGE DC SOURCE Figure 2a. Human Body ESD Test Model AMPERES CHARGE-CURRENT- LIMIT RESISTOR I P 1% 9% 36.8% 1% R C 1MΩ C s 1pF t RL R D 1.5kΩ DISCHARGE RESISTANCE STORAGE CAPACITOR I R TIME t DL CURRENT WAVEFORM DEVICE UNDER TEST PEAK-TO-PEAK RGG (NOT DRAWN TO SCALE) Output Capacitor The slow turn-on time provides a soft-start function that allows the MAX14653/MAX14654/ to charge an output capacitor up to 1µF without turning off due to an overcurrent condition. External Adjustment Functionality If is connected to ground, the internal comparator uses the internally set value. If an external resistor-divider is connected to and V exceeds the select voltage, V _ SELECT, the internal comparator reads the fraction fixed by the external resistor divider. R 1 = 1MΩ is a good starting value for minimum current consumption. Since V _, V _THRESH, and R 1 are known, R 2 can be calculated from the following formula: R1 V_ V = _TH 1+ R 2 This external resistor-divider is completely independent from the internal resistor-divider. ESD Test Conditions ESD performance depends on a number of conditions. The MAX14653/MAX14654/ are specified for ±2kV HBM typical ESD on all pins, Contact and Air-Gap Discharge on pin. Contact Maxim for a reliability report that documents test setup, test methodology, and test results. HBM ESD Protection Figure 2a shows the Human Body Model, while Figure 2b shows the current waveform it generates when discharged into low impedance. This model consists of a 1pF capacitor charged to the ESD voltage of interest, which is then discharged into the device through a 1.5kΩ resistor. Figure 2b. Human Body Current Waveform Maxim Integrated 9
10 Ordering Information PART Note: All devices are specified over the -4ºC to +85ºC temperature range. +Denotes lead(pb)-free/rohs-compliant package. T = Tape and reel. P- PACKAGE TOP MARK (V) MAX14653EWC+T 12 WLP ACS 15.5 MAX14654EWC+T 12 WLP ACT 6.8 MAX14655EWC+T 12 WLP ACU MAX14717EWC+T 12 WLP ADJ 6.8 Package Information For the latest package outline information and land patterns (footprints), go to Note that a +, #, or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE LE NO. 12 WLP W121G LAND PATTERN NO. Refer to Application Note 1891 Chip Information PROCESS: BiCMOS Maxim Integrated 1
11 Revision History REVISION NUMBER REVISION DATE 1/13 Initial release DESCRIPTION PAGES CHANGED 1 3/13 Removed future product asterisks for the MAX14653 and MAX /14 Added MAX For pricing, delivery, and ordering information, please contact Maxim Direct at , or visit Maxim Integrated s website at Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. 214 Maxim Integrated Products, Inc. 11
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