Aluminum Electrolytic Capacitors SMD (Chip), High Temperature

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1 Aluminum Electrolytic Capacitors SMD (Chip), High Temperature Fig. QUICK REFERENCE DATA DESCRIPTION Nominal case sizes (L x W x H in mm) 25 C VALUE 8 x 8 x 0 to 8 x 8 x 2 Rated capacitance range, C R 0 μf to 4700 μf Tolerance on C R ± 20 % Rated voltage range, U R 6.3 V to 63 V Category temperature range -55 C to +25 C Endurance test at 25 C Useful life at 25 C Lower temp. 50 CRZ Useful life at 40 C.8 x l R applied Shelf life at 0 V, 25 C Lower Z 46 CTI 000 h to 5000 h 500 h to 6000 h h to h 000 h Based on sectional specification IEC / CECC Climatic category IEC / 25 / 56 FEATURES Extended useful life: up to 6000 h at 25 C for MAL E3 parts Parts for advanced high temperature reflow soldering according to JEDEC J-STD-020 available Vibration proof, 4-pin version and 6-pin version AEC-Q200 qualified Polarized aluminum electrolytic capacitors, non-solid electrolyte, self healing SMD-version with base plate, lead (Pb)-free reflow solderable Charge and discharge proof, no peak current limitation High reliability Material categorization: for definitions of compliance please see APPLICATIONS SMD technology, for high temperature reflow soldering Industrial and professional applications Automotive, general industrial, telecom Smoothing, filtering, buffering MARKING Rated capacitance (in μf) Rated voltage (in V) Date code, in accordance with IEC Black mark or - sign indicating the cathode (the anode is identified by beveled edges) Code indicating group number (H) PACKAGING Supplied in blister tape on reel Revision: 3-Jan-7 Document Number: 28396

2 SELECTION CHART FOR C R, U R, AND RELEVANT NOMINAL CASE SIZES (L x W x H in mm) C R U R (V) (μf) x 8 x x 8 x x 8 x x 8 x 0 0 x 0 x x 8 x 0 0 x 0 x 0 0 x 0 x x 8 x 0 0 x 0 x 0 0 x 0 x x 2.5 x x 8 x 0 0 x 0 x x 8 x 0 0 x 0 x x 2.5 x x 2.5 x x 2.5 x x 8 x 0 0 x 0 x 0 0 x 0 x x 2.5 x x 2.5 x x 2.5 x x 0 x 0 0 x 0 x x 2.5 x x 2.5 x x 2.5 x 6 6 x 6 x x 0 x x 2.5 x x 2.5 x 6 6 x 6 x x 6 x 2 6 x 6 x 2 8 x 8 x 6 6 x 6 x 6 6 x 6 x 2 8 x 8 x 6 6 x 6 x 2 8 x 8 x 6 8 x 8 x 2 8 x 8 x 2 8 x 8 x 6-8 x 8 x 2-6 x 6 x 6 6 x 6 x x 2.5 x 6 8 x 8 x 6 8 x 8 x 2 6 x 6 x 2 6 x 6 x x 8 x x 6 x 6 6 x 6 x 6 6 x 6 x 2 8 x 8 x x 8 x 6 8 x 8 x x 6 x 2 8 x 8 x x 8 x x 6 x 2 8 x 8 x x 8 x x 8 x pin: 4-pin: Ø 0 mm Ø 2.5 mm H MAX. MAX V 220 u A4-H min. 0.4/max..0 (2 x) D 25V 2200u L4-H min. 0.4/max..0 (2 x) H MAX. MAX. 0.3 D 6-pin: Ø 6 mm 35V 000u 3R-H min. 0.4/max..0 (2 x) H MAX. MAX. 0.3 D W MAX. B W MAX. B W MAX. B L MAX. L MAX. S L MAX. S L MAX. L MAX. S L MAX. Fig. 2 - Dimensional outline Revision: 3-Jan-7 2 Document Number: 28396

3 Table DIMENSIONS in millimeters AND MASS NOMINAL CASE SIZE L x W x H CASE CODE L MAX. W MAX. H MAX. Ø D B MAX. S L MAX. MASS (g) 8 x 8 x x 0 x x 0 x x 2.5 x x 2.5 x x 6 x x 6 x x 8 x x 8 x Table 2 TAPE AND REEL DIMENSIONS in millimeters, PACKAGING QUANTITIES NOMINAL CASE SIZE L x W x H CASE CODE PITCH P TAPE WIDTH W TAPE THICKNESS T 2 REEL DIAMETER PACKAGING QUANTITY PER REEL 8 x8 x x 0 x x0 x x2.5 x x2.5 x x 6 x x 6 x x 8 x x 8 x Note For detailed tape dimensions please refer to packaging information: Revision: 3-Jan-7 3 Document Number: 28396

4 MOUNTING The capacitors are designed for automatic placement on to printed-circuit boards. Optimum dimensions of soldering pads depend amongst others on soldering method, mounting accuracy, print layout and / or adjacent components. For recommended soldering pad dimensions, refer to Fig. 3 and Table 3. SOLDERING Soldering conditions are defined by the curve, temperature versus time, where the temperature is that measured on the component during processing. For maximum conditions refer to Fig. 4 or Fig. 5. Any temperature versus time curve which does not exceed the specified maximum curves may be applied. As a general principle, temperature and duration shall be the minimum necessary required to ensure good soldering connections. However, the specified maximum curves should never be exceeded. e a c a d b b f b d a c a Case size Ø D 0 mm a c a Case size Ø D = 2.5 mm Case size Ø D 6 mm Fig. 3 - Recommended soldering pad dimensions Table 3 RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters CASE CODE a b c d e f Revision: 3-Jan-7 4 Document Number: 28396

5 STANDARD SOLDERING PROFILE FOR LEAD (Pb)-FREE REFLOW PROCESS T ( C) T Peak t 4 t 3 50 t t 2 time (s) Fig. 4 - Maximum temperature load during reflow soldering Table 4 REFLOW SOLDERING CONDITIONS for MAL24097xxxE3 PROFILE FEATURES CASE CODE 080 TO 04 CASE CODE 23 TO 26 Max. time from 25 C to T Peak 240 s 200 s Max. ramp-up rate to 50 C 3 K/s 3 K/s Max. time from 50 C to 200 C (t ) 50 s 20 s Ramp up rate from 200 C to T Peak 0.5 K/s to 3 K/s 0.5 K/s to 3 K/s Max. time from 200 C to 27 C (t 2 ) 60 s 60 s Max. time above T Liquidus (27 C) (t 3 ) 90 s 60 s Max. time above 230 C (t 4 ) 40 s 30 s Peak temperature T Peak 250 C 240 C Max. time above T Peak minus 5 C 5 s 0 s Max. ramp-down rate from T Liquidus 3 K/s to 6 K/s 3 K/s to 6 K/s Notes Temperature measuring point on top of the case and on terminals Max. 2 runs with pause of min. 30 min in between Revision: 3-Jan-7 5 Document Number: 28396

6 ADVANCED SOLDERING PROFILE FOR LEAD (Pb)-FREE REFLOW PROCESS ACCORDING TO JEDEC J-STD-020 T ( C) T Peak t 4 t 3 50 t 2 t 25 time (s) Fig. 5 - Maximum temperature load during reflow soldering Table 5 REFLOW SOLDERING CONDITIONS for MAL24099xxxE3 PROFILE FEATURES CASE CODE 00 CASE CODE 23 TO 26 CASE CODE 66 TO 82 Max. time from 25 C to T Peak 300 s 300 s 300 s Max. ramp-up rate to 50 C 3 K/s 3 K/s 3 K/s Max. time from 50 C to 200 C (t ) 50 s 50 s 50 s Max. time from 90 C to 200 C (t 2 ) 0 s 0 s 0 s Ramp up rate from 200 C to T Peak 0.5 K/s to 3 K/s 0.5 K/s to 3 K/s 0.5 K/s to 3 K/s Max. time above T Liquidus (27 C) (t 3 ) 90 s 90 s 90 s Max. time above 230 C (t 4 ) 70 s 65 s 60 s Peak temperature T Peak 260 C 250 C 245 C Max. time above T Peak minus 5 C 40 s 30 s 30 s Ramp-down rate from T Liquidus 3 K/s to 6 K/s 3 K/s to 6 K/s 3 K/s to 6 K/s Notes Temperature measuring point on top of the case and on terminals Max. 2 runs with pause of min. 30 min in between Revision: 3-Jan-7 6 Document Number: 28396

7 ELECTRICAL DATA SYMBOL DESCRIPTION C R Rated capacitance at 00 Hz, tolerance ± 20 % I R Rated RMS ripple current at 00 khz, 25 C I L2 Max. leakage current after 2 min at U R tan Max. dissipation factor at 00 Hz Z Max. impedance at 00 khz ORDERING EXAMPLE Electrolytic capacitor series 220 μf / 50 V; ± 20 % Nominal case size: 2.5 mm x 2.5 mm x 3 mm; taped on reel Ordering code: MAL24099E3 Note Unless otherwise specified, all electrical values in Table 6 apply at T amb = 20 C, P = 86 kpa to 06 kpa, RH = 45 % to 75 % Table 6 ELECTRICAL DATA AND ORDERING INFORMATION U R (V) C R (μf) NOMINAL CASE SIZE L x W x H (mm) I R 00 khz 25 C (ma) I L2 2 min (μa) tan 00 Hz Z 00 khz 20 C () LIFE CODE (3) ORDERING CODE () MAL ORDERING CODE (2) MAL x 8 x L 97303E x 0 x L 9730E x 0 x L E x 0 x L 97302E x 8 x L 97403E x 0 x L 9740E x 0 x L E x 0 x L 97402E x 2.5 x L2 974E x 2.5 x L3-994E x 2.5 x L2 9742E x 2.5 x L4-9942E x 6 x L5-9943E x 6 x L5-9944E x 8 x L5-9945E x 8 x L5-9946E x 8 x L 97502E x 0 x L 9750E x 2.5 x L2 975E x 2.5 x L3-995E x 2.5 x L2 9752E x 2.5 x L4-9952E x 6 x L5-9953E x 6 x L5-9954E x 6 x L5-9955E x 8 x L5-9956E x 6 x L5-9957E x 8 x L5-9958E x 8 x L5-9959E x 8 x L 97602E x 0 x L 9760E x 0 x L E x 2.5 x L2 976E x 2.5 x L3-996E x 2.5 x L2 9762E x 2.5 x L4-9962E x 6 x L5-9963E x 6 x L5-9964E x 6 x L5-9965E x 8 x L5-9966E x 8 x L5-9967E3 Notes () Standard reflow soldering profile, see Fig. 4 and Table 4 (2) Advanced reflow soldering profile, according to JEDEC J-STD-020, see Fig. 5 and Table 5 (3) Determines the applicable row in the table Endurance Test Duration and Useful Life Revision: 3-Jan-7 7 Document Number: 28396

8 ELECTRICAL DATA AND ORDERING INFORMATION U R (V) C R (μf) NOMINAL CASE SIZE L x W x H (mm) I R 00 khz 25 C (ma) I L2 2 min (μa) tan 00 Hz Z 00 khz 20 C () 68 8 x 8 x L 97003E x 0 x L 9700E x 0 x L E x 0 x L 97002E x 2.5 x L2 970E x 2.5 x L3-990E x 2.5 x L2 9702E x 2.5 x L3-9902E x 2.5 x L2 9703E x 2.5 x L4-9903E x 6 x L5-9904E x 6 x L5-9905E x 8 x L5-9906E x 8 x L5-9907E x 8 x L5-9908E x 8 x L 9703E x 0 x L 970E x 0 x L - 990E x 0 x L 9702E x 2.5 x L2 97E x 2.5 x L3-99E x 2.5 x L2 972E x 2.5 x L4-992E x 6 x L5-993E x 6 x L5-994E x 8 x L5-995E x 8 x L5-996E x 8 x L5-997E x 8 x L5-998E3 0 8 x 8 x L 97805E x 8 x L 97803E x 8 x L 97804E x 0 x L 9780E x 0 x L E x 0 x L 97802E x 2.5 x L2 978E x 2.5 x L3-998E x 2.5 x L2 9782E x 2.5 x L4-9982E x 6 x L5-9983E x 6 x L5-9984E x 8 x L5-9985E x 6 x L5-9986E x 8 x L5-9987E x 8 x L5-9988E x 8 x L5-9989E3 Notes () Standard reflow soldering profile, see Fig. 4 and Table 4 (2) Advanced reflow soldering profile, according to JEDEC J-STD-020, see Fig. 5 and Table 5 (3) Determines the applicable row in the table Endurance Test Duration and Useful Life LIFE CODE (3) ORDERING CODE () MAL ORDERING CODE (2) MAL Revision: 3-Jan-7 8 Document Number: 28396

9 Table 7 ADDITIONAL ELECTRICAL DATA PARAMETER CONDITIONS VALUE Voltage Surge voltage for short periods IEC , subclause 4.4 U s.5 x U R Reverse voltage for short periods IEC , subclause 4.6 U rev V Current Leakage current After 2 min at U R I L2 0.0 x C R x U R Inductance Equivalent series inductance (ESL) Resistance Ø D = 8 mm Ø D = 0 mm Ø D 2.5 mm Typ. 6 nh Typ. 8 nh Typ. nh Equivalent series resistance (ESR) at 00 Hz Calculated from tan max. and C R (see Table 6) ESR = tan /2fC R CAPACITANCE (C) DISSIPATION FACTOR (tan ).2 C C tan tan Curve : 0 V Curve 2: 63 V T C 0 = Capacitance at 20 C, 00 Hz amb ( C) Fig. 6 - Typical multiplier of capacitance as a function of ambient temperature T amb ( C) tan δ 0 = Typical tan δ at 20 C, 00 Hz Fig. 7 - Typical multiplier of dissipation factor (tan ) as a function of ambient temperature Revision: 3-Jan-7 9 Document Number: 28396

10 EQUIVALENT SERIES RESISTANCE (ESR) 0 ESR ESR 0 IMPEDANCE (Z) f (Hz) 0 5 ESR T amb = 20 C 0 = Typical ESR at 20 C, 00 Hz Fig. 8 - Typical multiplier of ESR as a function of frequency 0 2 Z (Ω) Curve : Curve 2: Curve 3: Curve 4: Curve 5: Curve 6: Z Curve : (Ω) Curve 2: Curve 3: Curve 4: Curve 5: Curve 6: Curve 7: f (Hz) T amb = 20 C Fig. 9 - Typical impedance as a function of frequency f (Hz) 0 5 T amb = 20 C Fig. 0 - Typical impedance as a function of frequency RIPPLE CURRENT AND USEFUL LIFE Table 8 ENDURANCE TEST DURATION AND USEFUL LIFE LIFE CODE Note Multiplier of useful life code: MBC242 ENDURANCE AT 25 C (h) USEFUL LIFE AT 25 C (h) USEFUL LIFE AT 40 C.8 x I R APPLIED (h) L L L L L Revision: 3-Jan-7 0 Document Number: 28396

11 .0 I A I R MBC Lifetime multiplier I A = Actual ripple current at 00 khz I R = Rated ripple current at 00 khz, 25 C () Useful life at 25 C and I R applied; see Table () T amb ( C) Fig. - Multiplier of useful life as a function of ambient temperature and ripple current load Table 9 MULTIPLIER OF RIPPLE CURRENT (I R ) AS A FUNCTION OF FREQUENCY FREQUENCY (Hz) U R (V) I R MULTIPLIER Revision: 3-Jan-7 Document Number: 28396

12 Table 0 TEST PROCEDURES AND REQUIREMENTS TEST NAME OF TEST REFERENCE PROCEDURE (quick reference) REQUIREMENTS Mounting IEC , subclause 4.3 Shall be performed prior to tests mentioned below; reflow soldering; for maximum temperature load refer to chapter Mounting C/C: ± 5 % tan spec. limit I L2 spec. limit Endurance IEC / CECC 32300, subclause 4.5 T amb = 25 C; U R applied; for test duration see Table 8 U R = 6.3 V; C/C: ± 25 % U R 0 V; C/C: ± 20 % tan 2 x spec. limit I L2 spec. limit Useful life CECC 3030, subclause.8. T amb = 25 C; U R and I R applied; for test duration see Table 8 C/C: ± 30 % tan 3 x spec. limit I L2 spec. limit no short or open circuit total failure percentage: % Shelf life (storage at high temperature) IEC / CECC 32300, subclause 4.7 T amb = 25 C; no voltage applied; 000 h after test: U R to be applied for 30 min, 24 h to 48 h before measurement For requirements see Endurance test above Reverse voltage IEC / CECC 32300, subclause 4.6 T amb = 25 C: 25 h at U = -0.5 V, followed by 25 h at U R C/C: ± 5 % tan.5 x spec. limit I L2 spec. limit Statements about product lifetime are based on calculations and internal testing. They should only be interpreted as estimations. Also due to external factors, the lifetime in the field application may deviate from the calculated lifetime. In general, nothing stated herein shall be construed as a guarantee of durability. Revision: 3-Jan-7 2 Document Number: 28396

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