Challenges and Trends on Microbolometer Design. Uwe Pulsfort Product & Applications Support, Europe

Transcription

1 Challenges and Trends on Microbolometer Design Uwe Pulsfort Product & Applications Support, Europe

2 Overview 1. Evolution of the Markets 2. Example Applications 3. Key Drivers for Low Cost Uncooled IR 4. Uncooled IR: How does it work? 5. Infrared Technologies Detector Technology Wafer Level Package technology 3D stacked Camera Technology 6. Teledyne DALSA Capabilities & Facilities 7. Teledyne DALSA Products 8. Conclusions 9. Questions & Answers

3 Low to Moderate Volumes: Evolution of the Markets Very High Volumes: Defense Security UAVs Industrial Smart Homes Smart Phones Automotive Gaming Internet of Things Others? Current main stream markets New Markets in Development Conclusion: The uncooled IR market follows a very similar path as the visible imaging market: from professional markets descending to consumer markets

4 Infrared Imaging: Industrial Examples Electrical Excess current Damage or Failure Maintenance Excessive wear and tear Hot spots due mechanical Malfunctions Process Control Fill levels (solid, liquid, gas) Material flow Leaks Confidential and Proprietary 4

5 Thermography Applications Features (beyond the general purpose features) Radiometric calibration to measure absolute temperatures in a scene Graphics overlay to display Text, Scales, and crosshair Applications General Thermography/Machine Vision/Inspection Firefighting Search and Rescue Medical/Physiotherapy Production Readiness: Q Comments: For several applications it is important to quantify the temperature in a scene and display the measured values. 5

6 Small UAV/Portable Applications Features (beyond the general purpose features) Input/integration of GPS and Gyroscope sensors to track whereabouts and orientation Battery operated Wireless interface Applications Perimeter control Portable law enforcement Autonomous Sensors Comments: The product idea is to provide a very compact OEM product that supports portable and autonomous sensor in the field. June 2015 Confidential and Proprietary 6

7 Key Drivers for Low Cost Uncooled IR Reduced Pixel size: Advancements in pixel technology allows for smaller pixels. Smaller pixels => More Devices per Wafer => Better Yield => Lower Cost. But more importantly: Lower Lens Cost! Wafer Level Packaging Although Conventional Packaging costs are declining, Wafer Level Packaging technology can drive the cost down by considerably Evolution of the pixel size 52 µm 45µm 35µm 25µm17µm 12µm 10µm 8µm Wafer Level vs. Conventional package

8 Key Drivers for Low Cost Uncooled IR 3D stacked camera modules with Wafer Level Optics Optics become a dominant cost in the overall camera cost. Advances in Wafer Level Optics in combination with smaller pixels will drive down the cost further 3D stacked uncooled IR module State of the Art MEMS Facilities In order to implement all these Technologies and develop integrated solutions require a MEMS infrastructure.

9 Uncooled IR: How does it Work? post platform Lens legs Lens mount High Vacuum VOx pixel Heat loss R +ΔR V Read Out IC Detector Board Infrarot Pixel platform leg TELEDYNE DALSA post Camera processing Board Interface module

10 Detector Technology Micro-bolometer process: Vanadium Oxide (VOx). In general more sensitive that Amorphous Silicon (αsi) More suitable for smaller pixels. More difficult to get uniformity on the wafer. Pixel node Current: 17 micron, which is mainstream Next Generation: 12 micron, which is expected in 2018 uncooled IR pixel 12 micron pixel

11 Detector Technology Resolution 17 micron: QVGA, VGA (2017) 12 micron: VGA, SXGA, QVGA (2018) Package Conventional Ceramic Package Wafer Level Package Performance* <50mK >99.5% Operates shutter-less High Speed Operation Ceramic package Wafer with packaged devices Wafer Level package *depends on detector grade

12 Wafer Level Package Technology Crucial for addressing low cost solutions, but challenging: 8 CMOS ROIC wafer: starting material High vacuum << 1mTorr Vanadium Oxide process: 14 steps 8 Cap wafer process: 12 steps ROIC + Vox wafer preparation: 5 steps Outgassing step uncooled IR pixel Cap wafer ROIC + VOx Sealed wafer pair High vacuum << 1mTorr Bonding step Separation step

13 3D Stacked Technology 3D stacked Cameras: Conceptual like our Calibir Infra Red Camera Technology, but a lot smaller: QVGA module: 6x6x6 mm 3 Technological Requirements for low cost 3D stacked camera: Wafer Level Packaging (WLP) technology: Available Camera thermal Calibration: Available Shutter-less operation: Available Functional Wafer to Wafer bonding: Process under development Copper Trough Silicon Via (TSV) Technology: Available Wafer Level Optics (WLO): Partnership in Place, to be developed IR Camera Application Specific IC (ASIC) design with embedded selfcalibrating algorithms: Capability in place, to be developed WLP ASIC WLO TSV

14 Teledyne DALSA Capabilities & Facilities Teledyne DALSA s State of art MEMS facility is used for the production of many different devices which rely on unique proprietary processes: Accelerometers, Gyroscopes, Pressure sensors, Micro-bolometers, BioMEMS etc., all requiring State of the Art equipment, tools and processes, all under one roof. 8 (200 mm) wafer line, highly automated equipment, advanced in-line metrology tools Capacity is wafers a year, up-scalable.

15 Teledyne DALSA Produkte QVGA VOx 320 x 240, 17µm NETD 50mK* up to 90Hz WLP option VGA VOx (pending) 640 x 480, 17µm NETD < 50mK Up to 120Hz WLP option Calibir Camera Core QVGA, VGA models NETD 50mK* up to 50Hz Board level option CSI2, parallel digital interface (selectable) 38 gram 29mm x29mm x 46mm Calibir Fusion Module QVGA, VGA models 2.1 Mpixel Low Light Camera 30Hz HDMI, GigE, USB3 interface options 90 and 73 HFOV option ~250 gram 58mm x29mm x 122mm Calibir Camera QVGA, VGA models NETD 50mK* up to 50Hz GigE, Analog interface options 38 gram 29mm x29mm x 46mm *depends on detector grade

16 Conclusions Teledyne DALSA offers a: Novel approach to microbolometer manufacturing in an optimized MEMS infrastructure Competitive VOx detector technology with advanced features like Wafer Level Packaging Teledyne DALSA Compact camera technology with excellent shutter-less operation and advanced features. Uniquely positioned to drive 3D stacked Camera Technologies Imaging Unique Facilities and Process Capabilities to drive the next phase in the evolution of Uncooled IR. Technology The Future of Uncooled Infrared in Commercial Markets? Teledyne DALSA is ready! Thank you for your attention!

17 Questions & Answers Any Questions? For additional information, please visit: