SEMI 大半导体产业网 MEMS Packaging Technology Trend

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1 MEMS Packaging Technology Trend Authors Name: KC Yee Company Name: ASE Group Present Date:9/9/2010 1

2 Overview Market Trend Packaging Technology Trend Summary 2 2

3 MEMS Applications Across 4C Automotive / Medical Computer Airbag Accelerometer Microfluidic Medical Tester Printer inkjet head Hard-disk protection Communications Consumer Accelerometer for smarter UI & power management MEMS Microphone Image Stabilizer Gyroscope Gaming Inertia sensor 3

4 Market Forecast by Device Application 4 High growth segments : Accelerometers, Gyroscopes, Microfluidics Emerging segments : RF MEMS, Si Microphones, MOEMS, Microbolometers '-12' 09'-12' CAGR CAGR Total MEMS Market 7,002 6,833 6,893 7,969 9,874 13,202 18% 24% IJ Heads 1,867 1,658 1,462 1,610 1,820 2,327 9% 17% Pressure Sensors 1,116 1, ,041 1,141 1,314 6% 10% Accelerometers ,122 1,377 1,747 18% 23% Microfluids ,052 1,546 1,947 25% 29% G yro s cop es ,100 1,474 15% 21% Microdispla ys ,007 1,495 21% 31% RF MEMS ,154 45% 54% MOEMS % 15% Microbolometers % 16% Si Microphones % 27% Micro tops & Probes % 14% Micro Fuel Cells % 158% Emerging ME MS (autof % 59% Source:Yole,

5 MEMS Growth in Consumer Market Demands: Smart Phone as a case µp + Memory Mini Projector Display Flash RF Gyroscope for Image Stabilization Auto Focus ECM MEMS Microphone Buffe r Me mory An BB Tx Dpxr PA Spxr MEMS HD SD µp PM Rx Cus tomer Request RF Switch RF Passive FPS * 0 # SRAM Baseband BT WiFi GPS DVB Plus discrete components 3D accelerometer Gyroscope Connectivity Module Micro Fuel Cell 5 Source: QCT & ASE

6 Working Principles Gyroscope Gyroscope = Image stabilization, Gaming Accelerometer = Airbag, Gaming Acoustic = Microphone Accelerometer Acoustic 6

7 Observations of MEMS Market Highly fragmented market One Product, One Process, One Packaging - Key challenge to mass market production - Packaging and Test are more than 50%~60% of the cost of a MEMS device, and package is moving toward 3D packaging Highly Competitive Market - Top 10 dominates only 54% of the market - More market consolidation through merger and acquisition Small players on niche market; big player on the mass market Automotive & Inkjet are established market, Consumer & Communications MEMS is the next catalyst to fuel the MEMS market growth 7

8 High Values in MEMS Packaging & Test 8 Source: ADI

9 MEMS Packaging Challenges MFG Challenges Environment Materials Process Cost Clean Room Particles Moisture Outgasing Contamination Warpage Parts Accuracy Parts Cleanness Anit-stiction MEMS Release ESD P&P Accuracy Warpage Control PKG / Wafer Level Hermetic Seal Testing Gross Margin Yield Volume 9

10 Technology Building Blocks & Infrastructures to Realize Emerging MEMS Package Bumping & WLCSP WB & FC SiP Packaging D2W, W2W, Bonding Glass Interposer MEMS Wafer TSV Hermetic Bonding Si Glass Frit Si Embedded Passives & Actives Substrate Concurrent TH, ME/MTL, EE Co-design & Modeling 10

11 Packaging Technology & Cost Trend Form Factor Hermetic Plastic Package Molded Cavity Seam Weld Soldered Over-mold Capping Si Glass Frit Si TSV + WL Bond 11 Unit Cost

12 Values Chain to Customer Standardization & Diversification in Packaging & Test - Process + Materials + Equipment + Cost Effectiveness - High Yield + Large Capacity + Low Cost Packaging Capacity - Killer Applications + Sizable Wafers & Packages Supply Chain Integration - System House + MEMS House + Foundry + SATS & Test Chip-Package-System know-how - Chipset + Software & Firmware + System Integration 12

13 ASE MEMS Technology Building IC Packaging SiP Packaging and Passive IPs WL MEMS Packaging MEMS OEM/ODM Non-hermetic MEMS Package High Q Inductor Capacitor/ Resistor Integrated Passives Semistandardized Wafer Level MEMS Assembly Sensors Actuators MOEMS RF MEMS IC Bio-Chip Substrate Design & Simulation and MEMS device + Chipsets Packaging + Customers 13

14 TSV 3D IC Market Applications - Speed (S), Form Factor (F), PM (P), Bandwidth (B), Heterogeneous Integration (H) Functional Complexity Si Interposer (S,F,P, H) in RF, GPU Heterogeneous 3D IC Integration (S, F, P, B, H) in Remote Medicare & Diagnosis RF Memory + Logic (CPU) 3D Stack (S, F, P, B) in AP & BB Memory Memory Processor Si Interposer MEMS 3D Memory Stack (S, F, B) in GDDR, SDRAM, Flash Logic / CPU CIS (F) in Mobile Phone & Medical WL MEMS (F) in RF Sensor & Analog Image Sensor Digital Signal Processor 2.5D IC Interposer & 3D IC Stacking 14 Low 3D Via Density High

15 Adoption of 3D Packaging in Sensor MEMS Die to Wafer Bonding Bonded Wafer Singulation 15 Source: 2008 Yole Development & ASE Data

16 Versatile MEMS Microphone Packaging Solution 3D Packaging 16 Source: Chipworks

17 Adoption of 3D Packaging in Microphone Bumping & FC Solder Bonding Si TSV & Interposer 17 Source: 2008 Yole Development

18 MEMS Microdisplay Packaging Micro mirrors Light Glass substrate Wafer to Wafer Bonding Spacers CMOS substrate Electrodes Bonded Wafer Singulation Solder Seal Package Projection Test Fine Leak Test 18

19 Adoption of 3D Packaging in Micro Display?? Wafer Level Package Level MEMS IQA CMOS IQA Substrate IQA Window IQA Wafer Dispense Die Attach Hermetic Seal Wafer Bonding Wire Bond Fine/Gross Leak Bond Inspection Mirror Testing Projection Wafer Dicing Getter Apply Wafer Break Pre-Bake ASE Confidential 19

20 Summary MEMS is widely adopted in applications across 4C. Accelerometer, Gyroscope Sensor, and Micro phone are most highly grown sectors MEMS packaging is migrating from wire bond to FC, 1 chip to 2+ chips, 2D to 3D to meet chips integration in a smaller form factor. Bumping and WLCSP infrastructures are critical to support 3D MEMS packaging. This will expedite the MEMS IDM outsourcing to SATS for scale & cost down MEMS packaging & test cost is about 50%~60% of package cost due to package special design, packaging & materials design. Need industry standard for package design! System software & firmware and chip integration solution play important roles in providing added-values to system company 20