Accelerate with ATS. DS8870 R7.3 Technical Teleconference June 26, 2014

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1 Accelerate with ATS DS8870 R7.3 Technical Teleconference June 26, 2014 Brian Sherman, Craig Gordon, Hank Sautter, Paul Spagnolo, Charlie Burger, Yan Xu

2 Accelerate with ATS Storage Webinars The Free IBM Storage Technical Webinar Series Continues in ATS Technical Experts cover a variety of Storage topics Audience: Clients who are either currently have IBM Storage products or considering acquiring IBM Storage products. Business Partners and IBMers are also welcome. How to sign up? To automatically receive announcements of the Accelerate with ATS Storage webinar series, Clients, Business Partners or IBMers can send an to accelerate-join@hursley.ibm.com Information, schedules, and archives: Located in the Accelerate with ATS Blog: Upcoming webinars: July 15 th Accelerate with ATS: The New IBM TS4500 Tape Library - Overview and Demo August 19 th Accelerate with ATS: XIV Technical Update 2

3 DS8000 R 7.3 Introduction 3

4 DS8870 Unique Technology Advantages Provides Value Infrastructure Matters for Business Critical Environments - Don t settle for less than optimal OLTP and Batch Performance High Performance FICON (zhpf) advantages and DB2 integration Cache efficiency and optimization algorithms Easy Tier advancements QoS - IO Priority Manager (IOPM) Proven Availability Built on POWER7+ technology, fully non-disruptive operations Designed for highest levels of availability and data access protection IBM Servers and DS8870 Integration System z, Power i and p Available years ahead of competitors State-of-the-art Remote Copy Lowest latency with Metro Mirror Best RPO and lowest bandwidth requirements with Global Mirror Superior management with GDPS / TPC for Replication Ease of Use Common GUI across the IBM platform Simplified creation, assignment and management of volumes Standard Disk Encryption Zero performance overhead with drive based encryption Common key management across the IBM portfolio Business Critical Storage for the World s Most Demanding Clients 4

5 DS8870 R7.3 Enhancements DS8870 R7.3 announced May 13, 2014 (GA 6/6/14) and provides the following: Integration and optimization of flash technology in the DS8870 Hybrid and All Flash configurations Hybrid configuration: Up to 4 High Performance Flash enclosures per base (A) frame All Flash configuration: Up to 8 High Performance Flash enclosures per base (A) frame Each 1U High Performance Flash enclosure independently and concurrently installable Easy Tier VI enhanced to exploit performance benefits of High Performance Flash New SSD capacity options with 200GB / 800GB SSDs in addition to current 400GB SSD Withdraw of half drive sets for SSD Reduction of Concurrent Code Load times and improved Warmstart process Multi-Target Mirroring (RPQ with R7.2.7) Compliments current cascade implementation available with MGM Allows same primary volume to be a source to two mirroring relationships OpenStack support Original support with Havana and now enhanced with April 2014 release of Icehouse Advanced System Placement (aka Frame Ahead) IBM financial program covering DS8000, XIV and FlashSystem to provide a highly flexible way to purchase/lease storage to complement existing Capacity on Demand offerings 5

6 DS8870 High Performance Flash Enclosure 6

7 DS8870 High Performance Flash Enclosure New Raid Storage Enclosure 1U Storage enclosure with integrated RAID Developed in synergy with pseries, Flash Systems and DS8000 development teams Up to GB Flash cards (1.8 form factor) per enclosure Integrated RAID function and switch function Capabilities that are provided in the Device Adapter (RAID) and Storage Enclosure (switch) for traditional HDDs and SSDs High Performance Flash Enclosure is PCIe attached to both p7/p7+ servers in the base frame New adapter card (x2) and slot positions in I/O bays are used Adapter card function is only to redrive the PCIe signal to the enclosure PCIe cables attach adapter cards to flash enclosures 7

8 High Performance Flash Enclosure Configuration 1U High Performance Flash Enclosure 16 Flash Cards in first install group Two arrays with 8 drives each in a RAID5 6+P+S configuration 14 Flash Cards in second install group Two arrays with 7 drives each in a RAID5 6+P configuration Two spares shared across all 4 arrays in each enclosure No deferred maintenance, since only a single spare remains at first failure Concurrent MES to add to a DS8870 with R7.3 Supported for p7 and p7+ DS8870 s Exception is if non-encryption capable DS8800 was upgraded to DS8870 8

9 High Performance Flash Enclosure Front View 30 Flash Cards Photo above is of 2 enclosures, the top has the EMI shields removed and the bottom has the EMI shields installed. All enclosures are shipped with EMI shields to comply with emissions standards. High Performance Flash Enclosure Rear View Redundant Power Supplies Must remove EMI shield to repair disks Redundant RAID Controllers 9

10 DS8870 Integrated Flash Options Hybrid and All Flash Hybrid Flash DS8870 Up to 4 High Performance Flash enclosures in base (A) frame Enclosures mounted vertically Supports up to 120 Flash cards HDDs All Flash DS8870 Adds 4 more I/O bays in base (A) frame Adds 4 more High Performance Flash enclosures in base (A) frame which are mounted horizontally No support for additional frames with HDD 10

11 Hybrid DS8870 integrated w/ High Performance Flash Enclosure Performance optimized High Performance Flash enclosure Enclosure is 1U, independently and concurrently installable Higher performance than SSD as the High Performance Flash enclosure extends the PCIe fabric from I/O drawer to the enclosure Directly connects to DS8000 internal PCIe Gen2 fabric via currently open slots in the I/O Bays Each enclosure is it s own DA pair Enclosure contains up to 30 encryption capable emlc Flash cards Provides up to 12 TB raw / 9TB usable RAID5 capacity Up to 4 enclosures in base (A) frame Up to 48TB Raw (36TB Usable) Flash capacity per base (A) frame Enterprise class reliability, availability and serviceability RAID5 protected with two spares per enclosure Redundancy provided with dual power supplies, sensors, adapters and fans Components are concurrently replaceable Easy Tier enabled to exploit High Performance Flash Hybrid DS8870 allows up to 120 Flash cards HDD/SSDs (or standard mix of 2.5 and 3.5 drives) 11

12 All Flash DS8870 integrated with High Performance Flash Enclosures Up to 8 High Performance Flash Enclosures 4.5TB to 72TB usable RAID5 Flash capacity in base (A) frame 4 High Performance Flash enclosures mounted vertically Same as Hybrid DS additional High Performance Flash enclosures mounted horizontally All Flash configuration adds 4 more I/O bays in DS8870 base frame Up to 128 8Gb FICON / FCP ports All Flash DS8870 is base frame only configuration and no HDD/SSD supported 12

13 High Performance Flash Enclosure Population Order Hybrid Flash DS8870 Hybrid A-Rack Front View Flash Enclosure B01 Flash Enclosure B02 Flash Enclosure B03 Flash Enclosure B DC-UPS Gigapack10 Gigapack9 Gigapack8 Gigapack7 Gigapack6 Gigapack5 Gigapack4 Gigapack3 Gigapack2 Gigapack1 HMC / Ethernet CEC0 Population order shown in orange circles The first 4 High Performance Flash enclosures are populated in the same order regardless of Hybrid or All Flash All Flash DS8870 All Flash A-Rack Front View Flash Enclosure B01 Flash Enclosure B02 Flash Enclosure B03 Flash Enclosure B DC-UPS Flash Enclosure B08 Flash Enclosure B07 Flash Enclosure B06 Flash Enclosure B05 I/O Bay 5 I/O Bay 4 I/O Bay 7 I/O Bay 6 HMC / Ethernet CEC0 DC-UPS CEC1 I/O Bay 1 I/O Bay 0 High Performance Flash enclosures are installed individually, not in pairs. DC-UPS CEC1 I/O Bay 1 I/O Bay 0 I/O Bay 3 I/O Bay 2 I/O Bay 3 I/O Bay 2 13

14 Flash Card Population Order Vertical Position Horizontal Position FLS 1 FLS 2 FLS 3 FLS 4 FLS 5 FLS 6 FLS 7 FLS 8 FLS 9 FLS 10 FLS 11 FLS 12 FLS 13 FLS 14 FLS 15 FLS 16 FLS 17 FLS 18 FLS 19 FLS 20 FLS 21 FLS 22 FLS 23 FLS 24 FLS 25 FLS 26 FLS 27 FLS 28 FLS 29 FLS 30 Detailed Photo of Flash Locations FLS FLS FLS FLS FLS 1 FLS 2 FLS 3 FLS 4 FLS 5 FLS 6 FLS 7 FLS 8 FLS 9 FLS 10 FLS 11 FLS 12 FLS 13 FLS 14 FLS 15 FLS 16 FLS 17 FLS 18 FLS 19 FLS 20 FLS 21 FLS 22 FLS 23 FLS 24 FLS 25 FLS 26 FLS 27 FLS 28 FLS 29 FLS 30 14

15 Easy Tier Support for High Performance Flash Enclosure Easy Tier VI High Performance Flash enclosure with Flash cards can provide higher IOPs capacity compared with traditional SSDs Response times are similar to DS8870 SSD performance so Easy Tier considers both Flash and traditional SSDs as Tier0 Easy Tier Auto Rebalance within Tier0 Will distribute higher proportion of the IOPs workload to High Performance Flash All other existing Easy Tier functions work the same as Easy Tier V Tier0 Flash/SSD Configuration Traditional SSD and Flash cards ENT (10 K / 15 K SAS or FC) NL (NL - SAS or SATA) ENT 15K/10K Flash/SSD, ENT, and NL Tier 0 Tier 1 Tier 2 Tier1 Flash/SSD and ENT Tier 0 Tier 1 N/A Tier2 NL Flash/SSD and NL Tier 0 N/A Tier 2 ENT and NL N/A Tier 1 Tier 2 15

16 RAS Improvements Multi-Target PPRC 16

17 North America ATS Storage DS8000 Code Load Duration Improvements Code Load Improvements Planned for R7.3 (2Q14) Major CCL Activation Time Improvements Decreasing activation times from 2-3 hours to 45 minutes for Dual HMC, 1-3 Frame configurations CDA Preload capable and includes decreases in Preload times by 50% 12 HA/SE Single CEC Autonomic Code Load Recovery Redesigned CCL Recovery code drastically reduces CCL suspends which require next level of support Allows for completion of the code load even with certain hardware failures Automatic methods to resume code load without human intervention Allows for repairs to be handled after code update complete instead of in the middle of activation HA/SE 4 Single CEC HA/SE 2 Distribute Distribute HMC HMC DS8000 Migra on (R1 to R2) DS8000 HA/SE Single CEC Single CEC HA/SE Single CEC DS8800 & DS8870 DS8870 (1H 2014) 0 17 DS8700 HS/SE Host Adapter Code activation

18 First Time Data Capture Improvements Warmstart Recovers Components from Hardware Failures and Microcode Logic Errors (MLE) Duration reduced to less than 6 sec (may delay Host I/O) All System components are involved in the process On Demand Dump (ODD) ODD allows data capture for analysis Limited pause to host I/O (70ms 90ms) Processor complex (SMP Data) Host Adapters and Device Adapters Post Warmstart Data Lightweight ODD A reduced set of the data captured in ODD No Pause to host I/O to capture data Post Warmstart Data Error Recovery Process Enhancements MLE recovery can now use ODD (instead of Warmstart) Data is collected with low impact to system operations Minimizing any host impact is important in environments with high I/O rates Hardware Errors will use ODD dump to capture data Quick Start will recover the subset of resources effected (duration < 500ms) All Power ERP conditions will use Quick Start for recovery in R7.3 Batteries, RPC, DC-UPS 18

19 Multi-Target PPRC Statement of Direction Multiple Site Disaster Recovery / High Availability Solution Mirrors data from a single primary site to two secondary sites Builds upon and extends Metro Mirror and Global Mirror Increased capability and flexibility in Disaster Recovery solutions Improves Cascaded Metro/Global Mirror This is currently a Statement of Direction GA Release time frame is 4Q 2014 (RPQ for 7.2.7) Multi-Target Architecture Synchronous and Asynchronous Replication Two Metro Mirror relationships One Metro Mirror and one Global Copy Two Global Copy relationships Incremental Resynchronization between the two secondary sites 19

20 Single Source with Multiple Targets Two Metro Mirror pairs H2 provides for local recovery in case of a failure of H1 H3 provides for a remote recovery site in the case of a more widespread failure that affects both H1 and H2 Two Global Copy pairs Also supported and is useful for migration Metro Mirror plus Global Copy Metro Mirror provides a high availability copy at H2 Global Copy provides a long distance copy at H3 20 Production I/O Production I/O H1 H2 H1 H2 Metro Mirror Metro Mirror Metro Mirror Global Copy H3 H3 This is currently a Statement of Direction

21 Incremental Resynchronization In the case of a failure at the H1 production site: Swap to the local site H2 H1 Metro Mirror H3 Resume H2 H3 with an Incremental Resynchronization Mirroring is quickly resumed with minimal data transfer Production I/O H2 Metro Mirror Incremental Resynchronization When H1 becomes available: Resume H2 H1 Back to a Multi-Target configuration, with production running to H2 May swap back to H1, if desired This is currently a Statement of Direction 21

22 Multi-Target PPRC - Migration Migrate to a new secondary: Starting with an existing H1 H2 pair. Production I/O H1 Metro Mirror H2 Install new secondary H2 Start Multi-Target for H1 H2 When H1 H2 reaches full duplex, the original H1 H2 pair may be terminated and H2 removed. Metro Mirror H2 To migrate to a new primary: Starting with an existing H1 H2 pair. Install the new primary (to-be) H1 Start Multi-Target for H1 H1 When H1 H1 reaches full duplex, hyperswap to H1 Resume H1 H2, using incremental resync Terminate H1 H1 relationship and remove the original H1. 22 Production I/O Production I/O H1 H1 H1 H1 Metro Mirror Metro Mirror Incremental Resynchronization Metro Mirror H2 H2 This is currently a Statement of Direction

23 DS8000 and OpenStack 23

24 OpenStack is massively scalable, open source software for cloud infrastructure Designed for public, private and hybrid cloud environments It is not a storage platform, Hypervisor replacement, even a standalone product. One of IBM s key strategic missions for Cloud and Software Defined Systems Extremely strong community backed by top vendors covering all components of the offering 24

25 OpenStack Design Tenets Basic Design Tenets 1)Scalability and elasticity are our main goals 2)Any feature that limits our main goals must be optional OpenStack Open Source Cloud Mission to produce the ubiquitous Open Source Cloud Computing platform that will meet the needs of public and private clouds regardless of size, by being simple to implement and massively scalable 3)Everything should be asynchronous 4)All required components must be horizontally scalable 5)Always use shared nothing architecture (SN) or sharding 6)Distribute everything Especially logic. Move logic to where state naturally exists. 7)Accept eventual consistency and use it where it is appropriate. 8)Test everything. Sources:

26 OpenStack Major Components OpenStack is a modular architecture for virtualization of various resources to build a cloud computing platform. Horizon Dashboards Graphical interface Nova - Compute (Virtualization) Virtual Machines, Supports multiple hypervisors (KVM, Hyper-V, ESX) Glance Stores and retrieves virtual machine disk images Swift/Cinder - Storage Object Storage - Swift An object store which allows reliable, scaleable storage on clusters of low cost servers Block Storage Cinder A block storage interface to provision persistent block storage (LUNs) for the other modules (dashboard, compute) of the Open Stack system Neutron Framework for Software Defined Networking Keystone Manages users, tenants, roles and authorization 26

27 DS8000 Plays in OpenStack Cinder Component Cinder exposes bootable block devices to compute instances to Nova These block devices are persistent and independent from the VMs that attach them. Support for backup, snapshots and cloning Contains a scheduler which allows for selected block devices based on capabilites and capacity Tiering exists though only selected from create volume 27

28 OpenStack Support for DS8000 Horizon (dashboard) Nova (compute) Nova API / Scheduler Hypervisor (esx, kvm, etc) SAN/FC Data Path DS8000 Cinder Driver 1. The cloud administrator adds compute and storage resources to the OpenStack infrastructure FC 8Gb 2. OpenStack creates the new VM in KVM and the IBM Cinder/Nova driver sends storage request to the DS New storage volume is provisioned, mapped, and configured to the newly created VM. 28

29 OpenStack Cinder Architecture cinder client REST SQL DB cinder-api cinder-scheduler (Determines placement for new volumes) cinder-volume Manager Driver Storage (Bold+underline = not yet merged, expected in Havana) 29

30 IBM is enabling, extending and differentiating our products with Cinder Openstack allows for seamless decision of data placement based on service level and capabilities of the block storage managed by Cinder OLTP DB workload on OpenStack compute MM Web workload on OpenStack compute Tier 1 Hybrid distributed data with consistent response time, high performance, reliability and resiliency allows Cinder to choose DS8870 extent pools for Tier 1 data placement Tier 1 SSD Pool Tier 1b Tier 2 IBM DS8870 Hybrid Pool Tier 2c Future proof enhancements such as remote replication, site failover and VM migration are planned Easy Tier Enabled Easy Tier Disabled 30

31 Example : Create a CirrOS VM on a DS GB volume 31

32 Example : Continued DST VM is created, IP address assigned and activated Allocated block storage used for the VM 32

33 Example : Continued 2 Volume mapped and exists on DS8000 OpenStack Cinder Driver Actions: Created Volume Selected Correct Volume Group based on Host connectivity 33

34 Cinder Node Support DS8000 Cinder Node OS Support RHEL 6.4, 6.5 Ubuntu LTS DS8000 Microcode Technically any level of DS8000 Microcode will support all Cinder features currently available in Havana and Icehouse Officially supported DS8700/DS8800 R6.3 DS8870 R7.2, R7.3 For Pre-Production and Test environments, Openstack Cinder can work with existing DS8700, DS8800, DS8870 systems without microcode upgrades Cinder Driver Joint XIV/DS8k Cinder Driver Havana: IBM_Storage_Driver_for_OpenStack_1.3.0 Icehouse: IBM_Storage_Driver_for_OpenStack_

35 OpenStack Cinder Capabilities Capabilities w/ DS8000 Support Create/Delete Volume Volume Attach/Detach (via Nova Compute) Snapshots (Flashcopy) Clones (Fully Provisioned Flashcopy with Background Copy) Backups (Copy Volume Images to Object Store) Swift, Ceph and TSM Support Volume Types Quotas New Icehouse features for Storage: 1. Storwize support for FC management 2. Manage/unmanage volume, including support for Storwize and LVM 3. Volume re-type - supported for GPFS and Storwize (No support in DS8k/XIV) 4. Update TSM driver to support including support GPFS 5. Backup export/import 6. Driver: V7000 Unified/SONAS driver Openstack drives 6 month release cycles Austin, Bexar, Cactus, Diablo, Essex, Folsom, Grizzly, Havana, Icehouse (April 2014) 35

36 Trademarks The following are trademarks of the International Business Machines Corporation in the United States, other countries, or both. Not all common law marks used by IBM are listed on this page. Failure of a mark to appear does not mean that IBM does not use the mark nor does it mean that the product is not actively marketed or is not significant within its relevant market. Those trademarks followed by are registered trademarks of IBM in the United States; all others are trademarks or common law marks of IBM in the United States. For a complete list of IBM Trademarks, see *, AS/400, e business(logo), DBE, ESCO, eserver, FICON, IBM, IBM (logo), iseries, MVS, OS/390, pseries, RS/6000, S/30, VM/ESA, VSE/ESA, WebSphere, xseries, z/os, zseries, z/vm, System i, System i5, System p, System p5, System x, System z, System z9, BladeCenter The following are trademarks or registered trademarks of other companies. Adobe, the Adobe logo, PostScript, and the PostScript logo are either registered trademarks or trademarks of Adobe Systems Incorporated in the United States, and/or other countries. Cell Broadband Engine is a trademark of Sony Computer Entertainment, Inc. in the United States, other countries, or both and is used under license therefrom. Java and all Java-based trademarks are trademarks of Sun Microsystems, Inc. in the United States, other countries, or both. Microsoft, Windows, Windows NT, and the Windows logo are trademarks of Microsoft Corporation in the United States, other countries, or both. Intel, Intel logo, Intel Inside, Intel Inside logo, Intel Centrino, Intel Centrino logo, Celeron, Intel Xeon, Intel SpeedStep, Itanium, and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. UNIX is a registered trademark of The Open Group in the United States and other countries. Linux is a registered trademark of Linus Torvalds in the United States, other countries, or both. ITIL is a registered trademark, and a registered community trademark of the Office of Government Commerce, and is registered in the U.S. Patent and Trademark Office. IT Infrastructure Library is a registered trademark of the Central Computer and Telecommunications Agency, which is now part of the Office of Government Commerce. * All other products may be trademarks or registered trademarks of their respective companies. Notes: Performance is in Internal Throughput Rate (ITR) ratio based on measurements and projections using standard IBM benchmarks in a controlled environment. The actual throughput that any user will experience will vary depending upon considerations such as the amount of multiprogramming in the user's job stream, the I/O configuration, the storage configuration, and the workload processed. Therefore, no assurance can be given that an individual user will achieve throughput improvements equivalent to the performance ratios stated here. IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply. All customer examples cited or described in this presentation are presented as illustrations of the manner in which some customers have used IBM products and the results they may have achieved. Actual environmental costs and performance characteristics will vary depending on individual customer configurations and conditions. This publication was produced in the United States. IBM may not offer the products, services or features discussed in this document in other countries, and the information may be subject to change without notice. Consult your local IBM business contact for information on the product or services available in your area. All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only. Information about non-ibm products is obtained from the manufacturers of those products or their published announcements. IBM has not tested those products and cannot confirm the performance, compatibility, or any other claims related to non-ibm products. Questions on the capabilities of non-ibm products should be addressed to the suppliers of those products. Prices subject to change without notice. Contact your IBM representative or Business Partner for the most current pricing in your geography. 36

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