Change Log. 10/2/2013 Original release 2013 LENOVO. ALL RIGHTS RESERVED.

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2 Change Log Version Change 10/2/2013 Original release 2

3 Overview Product Features Generational Differences Mechanicals Front View Mechanicals / HDD Configurations Rear View Under the Covers System Design System Block Diagram Motherboard Layout & Connections Expansion Capability Technologies / Key Subsystems - CPU Compatibility - Memory Subsystem - Storage Subsystem - Networking - Power Management Manageability / Serviceability - Server Management - Ease of Use & Serviceability - Diagnostic LED s Security Features - TPM - BIOS / BMC 3

4 Post Launch Content Support RD540 RD640 Date RDIMMs: DDR MHz TBD Feb 2014 block HDDs: /600GB 15k TBD Feb 2014 block 4

5 RD540 Technical Features Processor Support E v2 Series, up to 130W SKUs Intel C602-J chipset Memory 20 DIMM sockets o CPU 1: 12 DIMM (3DPC) o CPU 2: 8 DIMM (2DPC) LV-RDIMMs: DDR MHz ECC 4, 8, 16 GB DIMMs (max 320GB) RAS: ECC, Lock step, Mirroring, Sparing Storage 4x 3.5 HS HDD Bays up to 16TB SATA or 12 TB SAS storage 8x 2.5 HS HDD Bays up to 8TB SATA or 7.2TB SAS storage Support SATA/SAS/SSD HDD Storage Controller RAID500 adapter (RAID 0/1/10) w/ Upgrade Key (RAID 5/50) RAID700 adapter (RAID 0/1/5/6/10/50/60) w/ optional Battery RAID710 adapter (RAID 0/1/5/6/10/50/60) w/ 1GB cache and optional CacheVault / CacheCade / FastPath I/O Expansion Slots 1 PCIe x16 Gen3 FH/HL (x16 link) 1 PCIe x8 Gen3 LP (x8 link) RAID card uses this slot I/O Connectors Two 1 Gb/s Ethernet ports One 1 Gb/s Ethernet for shared or dedicated remote management USB 2.0 ports 2 front, 4 rear, 2 internal Video (VGA) 1 front 1, 1 rear Serial port 1 rear System Cooling 8x system fans,7+1 Redundant 2 Manageability/RAS/Service Intelligent Diagnostics Module TMM Remote Management / Optional TMM Premium (KVM) IPMI 2.0 / SOL / Node Manager / DCMI Configurable TPM (supports TCG 1.2) uefi BIOS Media Slim optical drive in 3.5 HDD configurations Packaging 1U Dimensions / Weights W: mm / 19 in (w/ handles) H: 43.6mm / 1.72 in D: 734 mm / 28.9 in (w/ handles) Weight: 12 kg (26.5 lbs) 17 kg (37.5 lbs) Power 1+1 Redundant Power 800W (80Plus Gold) Energy Star Server 1.1 compliant OS Support Windows Server 2012 (Including Hyper-V) Windows Server 2008 (x64) (Including Hyper-V) Windows Server 2008 R2 (Including Hyper-V) Windows SBS 2011 SLES 11 sp2 RedHat 5.9 / 6.4 VMware ESXi 5.1 U1 Citrix XenServer / Front VGA N/A for 4x 3.5" HDD config 2 - Fans are not redundant when using E W 4C & 135W or E v2 130W 4C/6C

6 RD640 Technical Features Processor Support E v2 Series, up to 135W SKUs Intel C602-J chipset Memory 20 DIMM sockets o CPU 1: 12 DIMM (3DPC) o CPU 2: 8 DIMM (2DPC) LV-RDIMMs: DDR MHz ECC 4, 8, 16 GB DIMMs (max 320GB) RAS: ECC, Lock step, Mirroring, Sparing Storage 8x 3.5 HS HDD Bays up to 32TB SATA or 24TB SAS storage 8x or 16x 2.5 HS HDD Bays up to 16TB SATA or 14.4TB SAS storage Support SATA/SAS/SSD HDD Storage Controller RAID500 adapter (RAID 0/1/10) w/ Upgrade Key (RAID 5/50) RAID700 adapter (RAID 0/1/5/6/10/50/60) w/ optional battery RAID710 adapter (RAID 0/1/5/6/10/50/60) w/ 1GB cache and optional CacheVault / CacheCade / FastPath Available I/O Expansion Slots With CPU 1 installed: o 1 x LP x8 mechanical, x8 electrical o 1 x FH/HL x16 mechanical, x16 electrical (RAID card uses this slot) o 2 x FH/HL x8 mechanical, x8 electrical (PCIe Expander Card for 16 HDD config uses one of these slots) With CPU 1 & CPU 2 installed: o 1 x LP x8 mechanical, x8 electrical o 1 x FH/HL x16 mechanical, x16 electrical (RAID card uses this slot) o 1 x FH/HL x16 mechanical, x8 electrical o 3 x FH/HL x8 mechanical, x8 electrical I/O Connectors Two 1 Gb/s Ethernet ports One 1 Gb/s Ethernet for shared or dedicated remote management USB 2.0 ports 2 front, 4 rear, 2 internal Video (VGA) 1 front, 1 rear Serial port 1 rear Manageability/RAS/Service Intelligent Diagnostics Module / Configurable Premium Module TMM Remote Management / Optional TMM Premium (KVM) IPMI 2.0 / SOL / Node Manager / DCMI Configurable TPM (supports TCG 1.2) uefi BIOS System Cooling 6 system fans, 5+1 Hot Swap Redundant 1 Media Slim optical drive Packaging 2U Dimensions / Weights W: mm /19 in (w/ handles) H: 87.6 mm / 3.45 in D: 734 mm / 28.9 in (w/ handles)max 26.5kg Weight: 16 kg (35.3 lbs) 26.5 kg (58.4 lbs) Power 1+1 Redundant Power 800W (80Plus Gold) Energy Star Server 1.1 compliant OS Support Windows Server 2012 (Including Hyper-V) Windows Server 2008 (x64) (Including Hyper-V) Windows Server 2008 R2 (Including Hyper-V) Windows SBS 2011 SLES 11 sp2 RedHat 5.9 / 6.4 VMware ESXi 5.1 U1 Citrix XenServer / Fans are not redundant when using E W 4C & 135W or E v2 130W 4C/6C

7 New Features Explained CPU: Intel Xeon E v2 Series - Increased performance via Higher frequency and core count: up to 12 cores / 24 threads - Increased energy efficiency via Lower Idle Power design (was 12W, now 7.5W for LV CPU s) Expansion: PCIe Riser Card with Additional x8 slot gives RD640 5 available PCIe slots after RAID card is installed HDDs: 3.5-4TB SATA 7200 RPM & 3TB SAS 7200 RPM GB, 200GB, 400GB emlc SSD (2.5 SSD in 3.5 carrier) 2.5-1TB SATA 7200 RPM & 900GB SAS 10k RPM RAID solution: RAID 710 adapter (RAID 0/1/5/6/10/50/60) w/ 1GB cache and options for CacheVault / CacheCade / FastPath 7

8 Intel Xeon E v2 Improvements Feature Xeon E (Sandy Bridge-EP) Xeon E v2 (Ivy Bridge-EP) Threads Per Socket Up to 16 threads Up to 24 threads Last-level Cache Up to 20MB Up to 30MB Max Memory Speed Up to 1600 Up to 1866 Idle Power Targets 15W, 12W for LV CPU's 10.5W, 7.5W for LV CPU's 8

9 OS Support RD540 RD640 Windows Server 2008 Editions (x64) (Including Hyper-V) Windows Server 2008 Editions R2 with SP1 (Including Hyper-V) Windows Small Business Server 2011 Windows Server 2012 Editions (Including Hyper-V) Windows Server 2012 Hyper-V SUSE Linux Enterprise Server 11 sp2 RedHat Enterprise Linux 5.9 RedHat Enterprise Linux 6.4 VMware ESXi 5.1 U1 Citrix XenServer (1) (1) Citrix XenServer 6.1 Notes: 1- No 82574/82579 driver for Citrix XenServer

10 RD530 vs RD540 RD530 RD540 BMC TMM/TMM Premium TMM/TMM Premium RAID and Capabilities RAID 500 RAID 700 RAID 500 RAID 700 RAID 710 w/ 1GB cache and optional CacheVault / CacheCade / FastPath Certified (Supported) OS Windows Server 2008 (x64) (Including Hyper-V) Windows Server 2008 R2 (Including Hyper-V) Windows SBS 2011 SLES 11.1 / 11.2 RedHat 5.7 / 6.1 VMware ESXi 5.0 Windows Server 2012 (Including Hyper-V) Windows Server 2008 (x64) (Including Hyper-V) Windows Server 2008 R2 (Including Hyper-V) Windows SBS 2011 SLES 11 sp2 RedHat 5.9 / 6.4 VMware ESXi 5.1 U1 Citrix XenServer / 6.1 CPU Xeon E (Sandy Bridge) Xeon E v2 (Ivy Bridge) PCIe Memory 1 PCIe x16 Gen3 FH/HL (x16 link) 1 PCIe x8 Gen3 LP (x8 link) RAID card uses this slot 1600 MHz Memory Supports maximum 16 LV-RDIMM s at 1.35V setting 1 PCIe x16 Gen3 FH/HL (x16 link) 1 PCIe x8 Gen3 LP (x8 link) RAID card uses this slot 1600 MHz Memory Supports 20 LV-RDIMM s at 1.35V setting 10

11 RD630 vs RD640 RD630 RD640 BMC TMM/TMM Premium TMM/TMM Premium RAID and Capabilities RAID 500 RAID 700 RAID 500 RAID 700 RAID 710 w/ 1GB cache and optional CacheVault / CacheCade / FastPath Certified (Supported) OS Windows Server 2008 (x64) (Including Hyper-V) Windows Server 2008 R2 (Including Hyper-V) Windows SBS 2011 SLES 11.1 / 11.2 RedHat 5.7 / 6.1 VMware ESXi 5.0 Windows Server 2012 (Including Hyper-V) Windows Server 2008 (x64) (Including Hyper-V) Windows Server 2008 R2 (Including Hyper-V) Windows SBS 2011 SLES 11 sp2 RedHat 5.9 / 6.4 VMware ESXi 5.1 U1 Citrix XenServer / 6.1 CPU Xeon E (Sandy Bridge) Xeon E v2 (Ivy Bridge) PCIe Memory With 2 CPU s installed: o 1 PCIe x16 Gen3 FH/HL (x8 link) RAID card uses this slot o 1 PCIe x8 Gen3 FH/HL (x8 link) RAID expander uses this slot in optional 6x 2.5" config o 1 PCIe x8 Gen3 LP (x8 link) o 1 PCIe x16 Gen3 FH/HL (x8 link) o 1 PCIe x8 Gen3 FH/HL (x8 link) 1600 MHz Memory Supports maximum 16 LV-RDIMM s at 1.35V setting With 2 CPU s installed: o 1 PCIe x16 Gen3 FH/HL (x8 link) RAID card uses this slot o 1 PCIe x8 Gen3 FH/HL (x8 link) RAID expander uses this slot in optional 6x 2.5" config o 1 PCIe x8 Gen3 LP (x8 link) o 1 PCIe x16 Gen3 FH/HL (x8 link) o 2 PCIe x8 Gen3 FH/HL (x8 link) 1600 MHz Memory Supports 20 LV-RDIMM s at 1.35V setting 11

12 RD540 Front View Modular design accommodates multiple rack configurations Flat fronts to simplify visual work area Vent pattern maximizes cooling and visual synergy Red stripe accents on touch points Power and ID button USB Ports VGA Port Intelligent Diagnostic Module HDD bays Localized control panels HDD capacity tag Simple snap-in rail lock Pull-out information cards HDD Status Indicators Red touch points 12

13 RD640 Front View Modular design accommodates multiple rack configurations Flat fronts to simplify visual work area Vent pattern maximizes cooling and visual synergy Red stripe accents on touch points Power and ID button USB Ports VGA Port HDD bays HDD Status Indicators Simple snap-in rail lock Intelligent Diagnostic Module Premium Localized control panel Pull-out information cards Red touch points HDD capacity tag 13

14 RD540 Drive / Mechanical Configurations 4x 3.5 Hot Swap SAS/SATA HDDs + ODD (Intelligent Diagnostics Module) 8x 2.5 Hot Swap SAS/SATA HDDs (Intelligent Diagnostics Module) 14

15 RD640 Drive / Mechanical Configurations 8x 3.5 Hot Swap SAS/SATA HDDs + ODD (Basic or Premium Intelligent Diagnostics Module) 8x 2.5 Hot Swap SAS/SATA HDDs + ODD (Basic or Premium Intelligent Diagnostics Module) 16x 2.5 Hot Swap SAS/SATA HDDs + ODD (Basic or Premium Intelligent Diagnostics Module) 15

16 RD540 Rear View Identifier Description Identifier Description 1 Hot-swap redundant power supply #2 (some models) 2 Hot-swap redundant power supply #1 8 Ethernet port 1 7 Ethernet port 0 System management port 3 PCIe card slot 2 (*8 LP) RAID 500 / 700 use this slot 9 VGA DB-15 connector 4 PCIe card slot 1 (*16 FH/HL) 10 USB ports 5 System ID LED 11 Ethernet port 2 6 Serial Port 16

17 RD640 Rear View Identifier Description Identifier Description 1 2 PCIe card slot 5 (*8 FH/HL) (available when CPU 2 is installed) PCIe card slot 6 (*8 FH/HL) (available when CPU 2 is installed) 9 VGA DB-15 connector 10 Ethernet port 1 3 PCIe card slot 4 (*8 LP) 11 Ethernet port 0 System management port 4 PCIe card slot 1 (*16 FH/H) (RAID 500 / 700 use this slot) 12 Serial Port 5 PCIe card slot 2 (not available) 13 System ID LED 6 PCIe card slot 3 (*8 FH/HL) (expander in this slot for 16 drive config) 14 Hot-swap redundant power supply #2 (some models) 7 Ethernet port 2 15 Hot-swap redundant power supply #1 8 USB ports 17

18 RD540 Under the Covers (3.5 HDD config) ID Description 1 Cooling shroud 2 Riser card assembly slot 1 (Riser Card 4) 3 PCIe card 4 Riser card assembly slot 2 (Riser card 3) 5 One or two HS redundant power supplies 6 CPU2 DIMMs 7 Heat Sink(s) with microprocessors under 8 HDD backplane 9 Rack handle (right) 10 HDD bay 3 11 Optical drive 12 HDD bay 2 13 Pull out information card 14 HDD bay 1 15 Diagnostic module 16 HDD bay 0 17 Front panel 18 Rack handle (left) 19 System fans 20 CPU1 DIMMs 21 System board 22 System board battery 23 PCIe card 18

19 RD640 Under the Covers (2.5 HDD config) ID Description 1 Cooling shroud 2 Power supply cooling shroud 3 Riser card assembly slot 2 (Riser card 2) 4 One or two HS redundant power supplies 5 PCIe cards 6 CPU2 DIMMs 7 HDD backplanes 8 Rack handle (right) 9 HDD cage (right) 10 HDD cage (middle) 11 Pull out information card 12 VGA DB-15 connector 13 Slim Optical drive 14 Diagnostic module (varies by model) 15 Rack handle (left) 16 Front panel board 17 System fans 18 CPU1 DIMMs 19 Heat Sink(s) with microprocessors under 20 System board 21 System board battery 22 PCIe cards 23 Riser card assembly slot 1 (Riser card 1) 19

20 RD540 / RD640 System Block Diagram Not Used Not Used 20

21 RD540 / RD640 Motherboard Connections 21 ID Name Description A Front Panel Front Panel Connector B USB1 Internal 2x5 USB connector 1 C USB2 Internal 2x5 USB connector 2 D DIT CONN Intelligent Diagnostics Module connector E F_VGA Front Panel VGA connector F SATA0 SATA connector 0 for ODD G SAS 4-7 SAS connector 4-7 (NOT USED) H IBTN ibutton socket I PCH Platform Controller Hub (PCH) J SAS 0-3 SAS connector 0-3 (NOT USED) K BAT System board battery L SKT3 Internal USB Type A connector 1 M IKVM CONN ThinkServer Management Module Premium Connector N SKT4 Internal USB Type A connector 2 O TPM/TCM TPM/TCM connector P BMC ThinkServer Management Module Q Riser Slot1 Riser card assembly 1 slot R Riser Slot2 Riser card assembly 2 slot S PSU1 Redundant power supply connector 1 T PSU2 Redundant power supply connector 2 U BP PWR1 Backplane power connector 1 V BP PWR2 Backplane power connector 2 W DIMM Memory slots X FAN_8 System fan 8 connector Y FAN_7 System fan 7 connector Z CPU2 Microprocessor 2 AA FAN_6 System fan 6 connector BB DIMM Memory slots CC FAN_5 System fan 5 connector DD DIMM Memory slots EE FAN_4 System fan 4 connector FF FAN_3 System fan 3 connector GG FAN_2 System fan 2 connector HH CPU1 Microprocessor 1 II DIMM Memory slots JJ FAN_1 System fan 1 connector

22 RD540 / RD640 Expansion & Connectivity RD540 Slot # Riser Card ID Type Supported Card Types (Mechanical) Bus width Gen Form Factor Comments 1 RC4 PCIe PCIe x16, x8, x4, x2, x1 x16 3 FH/HL From CPU1; NHP 2 RC3 PCIe PCIe x8, x4, x2, x1 x8 3 LP From CPU1; NHP; RAID Card uses this slot RD640 Slot # Riser Card ID Type Supported Card Types (Mechanical) Bus width Gen Form Factor Comments 1 PCIe PCIe x16, x8, x4, x2, x1 x8 3 FH/HL From CPU1; NHP; RAID Card uses this slot 2 PCIe PCIe x8, x4, x2, x1 X8 3 FH/HL From CPU1; NHP RC1 3 PCIe PCIe x8, x4, x2, x1 x8 3 FH/HL From CPU1; NHP; RAID expander uses this slot in 16x 2.5 HDD configuration 4 PCIe PCIe x8, x4, x2, x1 x8 3 LP From CPU1; NHP 5 RC2 PCIe PCIe x16, x8, x4, x2, x1 x8 3 FH/HL From CPU2; NHP 6 PCIe PCIe x8, x4, x2, x1 x8 3 FH/HL From CPU2; NHP 22

23 RD540 Riser Cards Riser Card 3 in System Board Slot 2: Slot 2 = 1x LP PCIe x8 slot (Primary RAID controller occupies this slot) Riser Card 4 in System Board Slot 1: Slot 1 = 1x HL/FH PCIe x16 slot Lenovo. All rights reserved.

24 RD640 Riser Cards Riser Card in System Board slot 1: Slot 1 = 1x HL/FH PCIe x16 (Primary RAID controller occupies this slot) Slot 2 = 1x HL/FH PCIe x8 slot Slot 3 = 1x HL/FH PCIe x8 slot (HDD expander card occupies this slot in the 16x 2.5 HDD config) Riser Card in System Board slot 2: Slot 5 = 1x HL/FH PCIe x16 (covered and unavailable without CPU2) Slot 6 = 1x HL/FH PCIe x8 (covered and unavailable without CPU2) Slot 4 = 1x LP PCIe x8 24

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26 RD530 RD630 RD540 / RD640 Supported CPUs Existing (Sandy Bridge) SKU Core Clock Speed (GHz) TDP (W) Cache (MB) Cores / Threads Memory DDR3 Speed Support (MHz) LV- DDR3 Turbo Boost AESNI TXT VT HT E /16 n/a E /16 E /16 E /12 E /16 E /16 E /16 E5-2650L /16 E /8 E /12 n/a E /4 n/a n/a E /12 n/a E5-2630L /12 n/a E /12 n/a E /4 n/a n/a n/a n/a E /4 n/a n/a n/a n/a 26

27 RD540 RD640 RD540 / RD640 Supported CPUs New v2 (Ivy Bridge) SKU Core Clock Speed (GHz) TDP (W) Cache (MB) Cores / Memory DDR3 Speed Support (MHz) QPI Speed Threads Turbo Boost AESNI TXT VT HT E v / E v / E v / n/a E v / E v / E v / E v / E v / E5-2650L v / n/a E v / n/a E v / n/a n/a E v /8 8.0 n/a E v / n/a E5-2630L v / n/a E v / n/a E v /4 6.4 n/a n/a n/a n/a E v /4 6.4 n/a n/a n/a n/a 27

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29 E v 2 Series Memory Architecture Summary Memory Types Architecture Intel POR Supports DDR3 & DDR3L memory UDIMM RDIMM LV- RDIMM LR-DIMM (Load Reduced) 24 DIMMs 4 channels per CPU / 3 DIMMs per channel maximum Memory Capacity UDIMM: 128 GB (16x 8GB) RDIMM: 768GB (24x 32GB) LV-RDIMM: 512 GB (16x 32GB) RD540 / RD640 Implementation Supports DDR3 & DDR3L memory LV RDIMMs (provides RDIMM and LV-RDIMM capability) 20 DIMMs CPU1: 4 CH / 3 DIMMs Per Channel maximum CPU2: 4 CH / 2 DIMMs Per Channel maximum For E SNB Series CPU with LV-RDIMM running at default 1.5V: 320GB (20x 16GB) For E v2 IVB Series CPU - LV-RDIMM: 320GB (20x 16GB) 1,2 Memory speed 1.5V memory: 1DPC up to 1866, 2DPC up to 1600, 3DPC at 1066 Operating at 1.5V: 1DPC up to 1866, 2DPC up to 1600, 3DPC up to V (LV memory): 1DPC up to 1600, 2DPC up to 1333, 3DPC at 800 Memory RAS ECC, Patrol Scrubbing, Demand Scrubbing, Sparing, Mirroring, Lockstep Mode, x4/x8 SDDC Operating at 1.35V: 1DPC up to 1600, 2DPC up to 1333, 3DPC at 800 Same Notes: 1. If only LV-RDIMM are installed, BIOS will provide a setup option to control memory voltage. Default value is 1.5V and can be changed manually to 1.35V (LV). 2. If changed to 1.35V then: - For SNB-CPU, only support 8 DIMMs w/cpu1 and 8 DIMMs w/cpu2. If more than more than 8 DIMMs/CPU, voltage will be changed to 1.5V automatically (to support all installed DIMM s) - For IVB-CPU, support 12 DIMMs w/cpu1 and 8 DIMMs w/cpu2 29

30 RD540 / RD640 Memory Support DDR3L memory LV-RDIMM (provides RDIMM and LV-RDIMM capability) 20 DIMMs CPU1: 4 CH / 3 DPC C0 C1 C2 C3 CPU 1 QPI x2 CPU2 C0 C1 C2 C3 CPU2: 4 CH / 2 DPC Max Memory Implemented Memory Architecture LV-RDIMM: 320GB (20x 16GB) 1 Memory speed 1.5V operating voltage: 1DPC up to 1866, 2DPC up to 1600, 3DPC up to V operating voltage: 1DPC up to 1600, 2DPC up to 1333, 3DPC at 800 Memory RAS ECC, Patrol Scrubbing, Demand Scrubbing, Sparring, Mirroring, Lockstep Mode, x4/x8 SDDC Notes: 1. For SNB-CPU, only support 8 DIMMs w/cpu1 and 8 DIMMs w/cpu2, for max of 256GB when running at 1.35V. For IVB-CPU, support 12 DIMMs w/cpu1 and 8 DIMMs w/cpu2 for 320GB when running at 1.35V. 30

31 Memory Population Rules Independent Mode DIMM capacities, voltage, frequency and rank may be mixed Mixing memory type (RDIMM, LVDIMM) is not supported Populate DIMM farthest from CPU of any given channel first RAS Mode (Mirroring, Sparing, Lockstep) DIMM capacities, voltage, frequency, rank and type must be identical Populate DIMM farthest from CPU of any given channel first Memory Physical Layout 31

32 RD540 / RD640 Memory Support DIMM Type Memory Operating Voltage (BIOS Setting) DIMMs Populated per Channel Integrated Memory Controller (IMC) Frequency of Installed Processors 1066 MHz 1333 MHz 1600MHz 1866MHz LV-RDIMM 1.5V 1 Y Y Y Y LV-RDIMM 1.5V 2 Y Y Y N LV-RDIMM 1.5V 3 Y N N N Remarks 1 DPC (SR/DR) runs at fastest common frequency of DIMMs and CPU IMC 2 DPC (SR/DR) runs at a maximum frequency of 1600MHz regardless of DIMM or CPU IMC frequency 3 DPC (SR/DR) runs at a maximum frequency of 1066MHz regardless of DIMM or CPU IMC frequency LV-RDIMM 1.35V 1 Y Y Y N LV-RDIMM 1.35V 2 Y Y N N LV-RDIMM 1.35V 3 N N N N 1 DPC (SR/DR) runs at a maximum frequency of 1600MHz regardless of DIMM or CPU IMC frequency 2 DPC (SR/DR) runs at a maximum frequency of 1333MHz regardless of DIMM or CPU IMC frequency 3 DPC (SR/DR) runs at a maximum frequency of 800MHz regardless of DIMM or CPU IMC frequency 1066 MHz 1333 MHz 1600 MHz 1866 MHz Memory DIMM Frequency Supported Based on version 2.2 of system AVL s 32

33 Number of DIMMs DIMMA1 DIMMA2 DIMMA3 DIMMB1 DIMMB2 DIMMB3 DIMMC1 DIMMC2 DIMMC3 DIMMD1 DIMMD2 DIMMD3 DIMMA1 DIMMA2 DIMMB1 DIMMB2 DIMMC1 DIMMC2 DIMMD1 DIMMD2 Memory Population Rules (Independent mode) CPU 1 CPU 2 1 X 2 X X 1 CPU Populated 3 X X X 4 X X X X 6 X X X X X X 8 X X X X X X X X 12 X X X X X X X X X X X X 2 X X 4 X X X X 2 CPU s Populated 6 X X X X X X 8 X X X X X X X X 12 X X X X X X X X X X X X 16 X X X X X X X X X X X X X X X X 20 X X X X X X X X X X X X X X X X X X X X Independent Mode Install Order CPU 1: A1 - B1 - C1 - D1 - A2 - B2 - C2 - D2 - A3 - B3 - C3 - D3 CPU 1 & CPU 2: (1)A1 - (2)A1 - (1)B1 - (2)B1 - (1)C1 - (2)C1 - (1)D1 - (2)D1 - (1)A2 - (2)A2 - (1)B2 - (2)B2 - (1)C2 - (2)C2 - (1)D2 - (2)D2 - (1)A3 - (1)B3 - (1)C3 - (1)D3 33

34 Population Rules for Memory RAS Modes Mirroring Mode: CPU 1 CPU 1 & CPU 2 A1B1 - C1D1 - A2B2 - C2D2 - A3B3 - C3D3 (1)A1B1 - (2)A1B1 - (1)C1D1 - (2)C1D1 - (1)A2B2 - (2)A2B2 - (1)C2D2 - (2)C2D2 - (1)A3B3 - (1)C3D3 Sparing Mode: CPU 1 CPU 1 & CPU 2 A1A2 - B1B2 - C1C2 - D1D2 - A1A2A3 - B1B2B3 - C1C2C3 - D1D2D3 (1)A1A2 - (2)A1A2 - (1)B1B2 - (2)B1B2 - (1)C1C2 - (2)C1C2 - (1)D1D2 - (2)D1D2 - (1)A1A2A3 - (1)B1B2B3 - (1)C1C2C3 - (1)D1D2D3 LockStep Mode: CPU 1 CPU 1 & CPU 2 A1B1 - C1D1 - A2B2 - C2D2 - A3B3 - C3D3 (1)A1B1 - (2)A1B1 - (1)C1D1 - (2)C1D1 - (1)A2B2 - (2)A2B2 - (1)C2D2 - (2)C2D2 - (1)A3B3 - (1)C3D3 34

35 Memory Performance Considerations General Guidelines Best memory performance can be obtained by using a balanced memory configuration, which requires DIMMs to be identical in size, organization, and speed in each socket Maximum Performance Considerations Populate both processors with equal amounts of memory to ensure a balanced system Populate all memory channels on each processor with equal memory capacity Ensure an even number of ranks are populated per channel Have at least 2 ranks available on each channel Use Dual-rank DIMM s whenever appropriate Examples For optimal 1866MHz performance, populate 8 dual rank DIMMs (4 per CPU) For optimal 1600MHz performance, populate 16 dual rank DIMMs (8 per CPU) For optimal 1333MHz performance, populate 16 dual rank DIMM s (8 per CPU) Power Consumption Considerations Use fewer larger DIMM s. For example 8x 8GB DIMM s will generally have lower power requirements than 16x 4GB DIMM s x8 DIMM s will generally draw less power than equivalently sized x4 DIMM s 35

36 Storage Subsystem The PCH C602-J includes integrated Serial ATA (SATA) controller PCH C602-J (Patsburg J) SATA III Port 0 1x SATA III (6 Gbps) Optical Drive Supports one 6 Gb/s SATA connection for Optical Drive ThinkServer RAID 500 adapter RAID 0, 1, 10 RAID 0, 1, 10, 5, 50 with optional upgrade key RAID 500 Adapter RAID 500 Upgrade Key ThinkServer RAID 700 adapter and optional battery RAID 0, 1, 10, 5, 50, 6, 60 ThinkServer RAID 710 adapter and optional CacheVault RAID 0, 1, 10, 5, 50, 6, 60 Also options for CacheCade and FastPath (see separate RAID deck) RAID 700 Adapter RAID 700 Battery RAID 710 CacheVault 36 RAID 710 Adapter

37 Storage Subsystem Drive Support Enterprise class SATA / SAS / SSD SATA 3.5 7,200RPM 6Gbps SATA: 500GB, 1TB, 2TB, 3TB, 4TB 2.5 7,200RPM 6Gbps SATA: 500GB, 1TB SAS 3.5 7,200RPM 6Gbps SAS: 1TB, 2TB, 3TB ,000RPM 6Gbps SAS: 300GB, 450GB, 600GB, 900GB ,000PM 6Gbps SAS: 300GB SSD 3.5 emlc SSD 3Gbps: 100GB, 200GB, 400GB (2.5 SSD in 3.5 carrier) 2.5 emlc SSD 3Gbps: 100GB, 200GB, 400GB HDD mix population rules Support mixed HDD Capacity in system, but not in the same RAID array (delta capacity will go unused) Support mixed SAS/SATA/SSD in system, but not in the same RAID Array Do not supported mixed 2.5 and 3.5 HDDs 37

38 Embedded Ethernet Three embedded GbE ports ideal for virtualization and I/O intensive workloads I350 (Powerville) Dual GbE Controller Best 1GbE Server LOM for Virtualization, iscsi, Manageability, & Low Power Virtualization Support Virtual Machine Device Queues (VMDq) VM Direct Connect (VMDc) PCI-SIG SR-IOV with VM migration capability NAS and iscsi support Storage over Ethernet support Intelligent offloads optimized to accelerate OS S/W initiators Energy savings features with Energy Efficient Ethernet (EEE), and DMA Coordination features 82574L (Hartwell) GbE Controller Shared with TMM management port Performance features Jumbo frames I/O acceleration technologies (Receive Side Scaling, MSI-X) 38

39 82574L (Hartwell) GbE Network Controller Fully-integrated Gigabit Ethernet MAC and PHY port Interfaces to Patsburg PCH chipset PCIe Rev. 1.1 (2.5GT/s) x1 Low Power ~710 mw GbE fully active ~300 mw 10/100 fully active Standards Support MDI (Copper) support for standard IEEE Ethernet interface for 1000BASE-T, 100BASE-TX, and 10BASE-T applications (802.3, 802.3u, and 802.3ab) IEEE JTAG Advanced features Receive Side Scaling (RSS) MSI-X and Low Latency Interrupt (LLI) Supports PXE, iscsi boot 2Tx/Rx queues for improved performance in multi-core systems IEEE 1588 / 802.1as Time Synchronization Virtualization Support VMware, XEN, Hyper-V PCI-E x1 SmBus NC-SI PCI-Express Mgmt Packet Buffer Ethernet MAC Ethernet PHY LAN Config 1000 Base-T Network Interface SPI Flash/ EEPROM 39 39

40 i350 (Powerville) Dual GbE Controller Two fully-integrated Gigabit Ethernet MAC and PHY ports Interfaces to Patsburg PCH chipset Energy Efficiency PCIe v2.1 Gen2 (5.0GT/s) x4 EEE Energy Efficient Ethernet DMA Coordination for up to 8W lower platform power Standards Support MDI (Copper) support for standard IEEE Ethernet interface for 1000BASE-T, 100BASE-TX, and 10BASE-T applications (802.3, 802.3u, and 802.3ab) Advanced Features Intel I/O Acceleration Technology MSI-X and Direct Cache Access (DCA) PCIe v2.0 (5GT/s) (x4/x2/x1) PCIe NC-SI Mgmt SMBus Queue Management & DMA Receive Side Scaling (RSS) and Low Latency Interrupt (LLI) IEEE 1588 / 802.1as time stamping Q0 Qn Q0 Qn Supports PXE, iscsi boot Virtualization Support Virtual Machine Device Queues (VMDq) Max queues: 8 Rx/Tx queues/port Sorting based on: MAC address, 802.1q tag VM Direct Connect with PCI-SIG SR I/O Virtualization VMware, XEN, Hyper-V I/O enhancements: 8 Rx/Tx queues/port IEEE 1588/802.1as (pre-standard) time stamping Unified networking Storage over Ethernet support iscsi acceleration - Intelligent offloads optimized to accelerate OS SW initiators TX FIFO RX FIFO TX FIFO RX FIFO Virtual Ethernet Bridge GbE MAC GbE MAC SerDes PHY SerDes PHY SerDes/ 1000 SerDes/ 1000 SGMII Base T SGMII Base T 40

41 Lenovo design features reduce power consumption High efficiency power supplies 80 Plus Gold (90% efficiency) Energy Star Compliance (Computer Server Ver 1.1) all models Low-voltage components for power savings (available CPU, Memory, SSD) Low power laptop style optical drive Dual internal USB ports enable diskless hypervisor support Unused devices moved to a minimum power consumption state Lenovo. All rights reserved.

42 Latest Intel technologies help cut and manage power consumption Intel Intelligent Power Technology minimizes power consumption when server components are not fully utilized Processor and memory automatically put into lowest available power state that meets current workload requirements Results in power consumption based on real-time load Integrated power gates allow individual idle cores to be reduced to near-zero power independent of other operating cores Idle power consumption cut to 10 watts, versus 16 or 50 watts in prior-generations of Intel quad-core processors Reduces server idle power consumption up to 50% vs. previous generation two-socket server processors Turbo Boost Technology provides performance on demand Processors can operate above the rated frequency to meet specific workload demands Lowers frequency to reduce power consumption during low utilization periods New design for lower Idle Power, reduced to 7.5W for LV CPU s 42

43 PMBus Intel Node Manager monitors and regulates server power consumption Integrated technology accessible through industry standard IPMI interface Dynamic power monitoring Measures / reports actual system level, CPU and memory power consumption (+/-5%) Processors SMBus DIMMs Provides real-time data PECI Platform power capping Receives policies setting platform power budget while maintaining maximum performance for the given power level PCH Manageability Engine SMBus BMC To Network & Mgmt Console Enforces power caps dynamically adjusts processor performance, memory power, or dynamically allocating processor cores SPI Flash Board & System Sensors Power threshold alerting If targeted power budget (policy) cannot be maintained, sends alerts to the management console Power Supply (PMBus 1.2) 43

44 Server Management See Embedded Server Management with TMM.pptx 44

45 Ease of Use and Serviceability Quicker Serviceability Tool-less replaceable parts Covers Power supplies System fans HDD and Optical drives Fans Riser cards / PCIe adapters Diagnostics Panel Snap-in rails Fully extends to on-line service position Parts commonality Common HDD carriers across the portfolio Common Mechanical Building Blocks including rails Common options across the portfolio (RAID, memory, Power supplies, Ethernet adapters, TMM Premium module, etc.) Internal CRU replaceable components easily identifiable by blue color 1U System Fans, PSU dummy, air duct buckle, ODD bracket Reliability Features Power supply redundancy Hot swap HDD s RD redundant system fans RD640 - Hot swap 5+1 redundant system fans Dual embedded USB ports for failover hypervisor support Easier Fault Isolation Front Panel Intelligent Diagnostics LED s 45

46 Diagnostic Panel Intelligent Diagnostics Panel Intelligent Diagnostics Premium Panel Digit indicates failed component. MEM1 & MEM2 specify actual DIMMs available. Definition Sys Fans CPU1 DIMMS CPU2 DIMMS OVER TEMP CPU PSU Error Condition Fan Tachometer reading < 500 rpm Memory ECC fault occurred or over temperature Memory ECC fault occurred or over temperature System over-temperature System has experienced a catastrophic error Redundant PSU is uninstalled or has failed: PSU over temperature No AC input PSU failure detected Output out of range 46

47 Security Features Integrated Trusted Program Module (TPM) Optional HW-based system security feature supporting TCG 1.2 Securely stores passwords, certificates and encryption keys, which can be used to authenticate the platform Also can be used to store platform measurements that help ensure that the platform remains trustworthy. Server usage models Disk encryption Windows BitLocker Drive Encryption is a data protection feature available in Windows Server. BitLocker leverages the TPM to protect user data and to ensure that a server running Windows Server has not been tampered with while the system was offline. Password Security BIOS Administrator / User Password BMC User access control TPM Block Diagram 47

48

49 SNB Turbo Boost Frequency Bin upside by SKU SKU Base Frequency (GHz) Cores 1 Core Active 2 Cores Active 3 Cores Active 4 Cores Active 5 Cores Active 6 Cores Active 7 Cores Active 8 Cores Active E (+9) 3.6 (+7) 3.6 (+7) 3.4 (+5) 3.4 (+5) 3.3 (+4) 3.3 (+4) 3.3 (+4) E (+8) 3.5 (+8) 3.4 (+7) 3.2 (+5) 3.2 (+5) 3.2 (+5) 3.1 (+4) 3.1 (+4) E (+7) 3.3 (+7) 3.2 (+6) 3.2 (+6) 3.1 (+5) 3.1 (+5) 3.0 (+4) 3.0 (+4) E (+6) 3.4 (+5) 3.3 (+4) 3.2 (+3) 3.2 (+3) 3.2 (+3) n/a n/a E (+7) 3.1 (+7) 3.0 (+6) 3.0 (+6) 2.9 (+5) 2.9 (+5) 2.8 (+4) 2.8 (+4) E (+8) 3.0 (+8) 2.9 (+7) 2.9 (+7) 2.8 (+6`) 2.8 (+6) 2.7 (+5) 2.7 (+5) E (+8) 2.8 (+8) 2.7 (+7) 2.5 (+5) 2.5 (+5) 2.5 (+5) 2.4 (+4) 2.4 (+4) E5-2650L (+5) 2.3 (+5) 2.2 (+4) 2.2 (+4) 2.1 (+3) 2.1 (+3) 2.0 (+2) 2.0 (+2) E (+2) 3.5 (+2) 3.4 (+1) 3.4 (+1) n/a n/a n/a n/a E (+5) 3.0 (+5) 2.9 (+4) 2.9 (+4) 2.8 (+3) 2.8 (+3) n/a n/a E (+2) 3.2 (+2) n/a n/a n/a n/a n/a n/a E (+5) 2.8 (+5) 2.7 (+4) 2.7 (+4) 2.6 (+3) 2.6 (+3) n/a n/a E5-2630L (+5) 2.5 (+5) 2.4 (+4) 2.4 (+4) 2.3 (+3) 2.3 (+3) n/a n/a E (+5) 2.5 (+5) 2.4 (+4) 2.4 (+4) 2.3 (+3) 2.3 (+3) n/a n/a E Turbo Boost not supported E Turbo Boost not supported Max Turbo Boost Frequency based on number of 100 MHz increments above marked frequency (+1 = MHz, etc.) 49

50 IVB Turbo Boost Frequency Bin upside by SKU 50 Max Turbo Boost Frequency based on number of 100 MHz increments above marked frequency (+1 = MHz, etc.) 50

51 RD540 Hero Photography 8 x 2.5 HDD (no optical) 51

52 RD540 Hero Photography 4 x 3.5 HDD 52

53 RD640 Hero Photography 16x 2.5 HDD 53

54 RD640 Hero Photography 8 x 3.5 HDD 54

55 RD540 Inside 55

56 RD640 Inside 56

57 Panels 57