TFT DISPLAY MODULE. Product Specification. Internal Approvals. Product Number DMT043WVNMCMI 1A. Customer Part Number. Customer.

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1 TFT DISPLAY MODULE Product Specification Customer Standard Product Number DMT043WVNMCMI 1A Customer Part Number Customer Approval Date: Internal Approvals Product Mgr Doc. Control Electr. Eng Luo Luo Luo Luo Eric Wan Date: 14/09/17 Date: 14/09/17 Date: 14/09/17

2 Revision Record Rev. Date Page Chapt. Comment ECR no Sept 17 All All Initial Release 2 of 34

3 Table of Contents 1.0 MAIN FEATURES MECHANICAL SPECIFICATION Mechanical Characteristics Mechanical Drawing ELECTRICAL SPECIFICATION Absolute Maximum Ratings TFT PCT Electrical Characteristics TFT PCT Interface Pin Assignment TFT Pin Assignment PCT PIN ASSIGNMENT Timing Characteristics High Speed Mode Clock Channel Timing High Speed Mode Data Clock Channel Timing High Speed Mode Rise and Fall Timings Low Speed Mode Bus Turn Around Data Lanes from Low Power Mode to High Speed Mode Data Lanes from High Speed Mode to Low Power Mode DSI Clock Burst High Speed Mode to/from Low Power Mode Reset input timing Power on/off sequence PCT I2C Timing OPTICAL SPECIFICATION Optical Characteristics Test Method BACKLIGHT SPECIFICATION LED Driving Conditions LED Circuit QUALITY ASSURANCE SPECIFICATION of 34

4 6.1 Delivery Inspection Standards Inspection Conditions Environmental Conditions Sampling Conditions Definition of Area Basic Principle Inspection Criteria Classification of Defects Identification / marking criteria Dealing with Customer Complaints Non conforming analysis Handling of non conforming displays RELIABILITY SPECIFICATION Reliability Tests HANDLING PRECAUTIONS of 34

5 1.0 Main Features Item Contents Screen Size 4.3 Diagonal Display Format 480 x RGB x 800 Dots N of Colour 65K/262K/16.7M Active Area 56.16mm (H) x 93.6mm (V) PCT View Area mm (H) x 94.6mm (V) LCD Type TFT Mode Transmissive / Normally Black Viewing Direction ALL TFT Interface 2 Lane MIPI PCT Interface I2C TFT Driver IC ILI9806E PCT Driver IC GT911 Simultaneous Touch Points 5 Backlight Type Operating Temperature Storage Temperature RoHS compliant LED 20 C ~ +70 C 30 C ~ +80 C Yes 5 of 34

6 2.0 Mechanical Specification 2.1 Mechanical Characteristics Item Characteristic Unit Overall Dimensions 62.5 mm (H) x mm (V) x 3.93mm (D) mm pixel Pitch 117 (H) x 117 (V) µm Weight 59 g 6 of 34

7 2.2 Mechanical Drawing A A B B C Component & Driver IC C D D E LEDK E 0.4Max(Soliding) F F G Revision content description Date Pin Name NC LEDK NC LEDA NC VCI IOVCC TE RESET GND MIPI_D1P MIPI_D1N GND MIPI_CLP MIPI_CLN GND MIPI_D0P MIPI_D0N GND GND PIN LEDA G of 34

8 3.0 Electrical Specification 3.1 Absolute Maximum Ratings TFT Item Symbol Condition Min Max Unit Note Power Supply Voltage LCM Digital interface supple Voltage VCI V IOVCC V Operating Temperature TOP C 1 Storage Temperature TST C 1,2,3 Note % RH Max for Ta<50 C, and 60% RH for Ta 50 C. Note 2. In case of below 0 C, the response time of liquid crystal (LC) becomes slower and the colour of panel becomes darker than normal one. Level of retardation depends on temperature, because of LC's characteristic. Note 3. Only operation is guaranteed at operating temperature. Contrast, response time, another display quality are evaluated at +25 C PCT Item Symbol Condition Min Max Unit Note Power Supply Voltage VDD V 4 Operating Temperature TOP C Storage Temperature TST C Note 4. If used beyond the absolute maximum ratings, GT911 may be permanently damaged. It is strongly recommended that the device be used within the electrical characteristics in normal operations. If exposed to the condition not within the electrical characteristics, it may affect the reliability of the device. 8 of 34

9 3.2 Electrical Characteristics TFT Item Symbol Condition Min Typ Max Unit Note Supply Voltage VCI Ta=25 C V Digital interface supple Voltage Input Voltage for Logic Output Voltage for Logic IOVCC Ta=25 C VIH 0.7 IOVCC IOVCC V VIL IOVCC VOH 0.8 IOVCC IOVCC V VOL GND 0.2 IOVCC Current Consumption IDD 25 ma 1 V V Note 1: The specified power consumption is under the conditions of VDD=3.3V PCT Item Symbol Condition Min Typ Max Unit Note Supply Voltage VDD Ta=25 C V Input Voltage for Logic VIH 0.75 VDD VDD +0.3 VIL VDD V V Output Voltage for Logic Normal operation mode Current Consumption Green mode Current Consumption Sleep mode Current Consumption VOH 0.85 VDD V VOL 0.15 VDD V IOPR ma IMON 3.3 ma ISLP ua 9 of 34

10 3.3 Interface Pin Assignment TFT Pin Assignment No. Symbol Function 1 NC Not Connected 2 LEDK Cathode pin of backlight 3 NC Not Connected 4 LEDA Anode pin of backlight 5 NC Not Connected 6 VCI Supply Voltage (3.3V) 7 IOVCC I/O power supply voltage 8 TE 9 RESET 10 GND Ground 11 MIPI_D1P 12 MIPI_D1N Red data input 13 GND Ground 14 MIPI_CLP 15 MIPI_CLN Green data input 16 GND Ground 17 MIPI_D0P 18 MIPI_D0N Green data input 19 GND Ground 20 GND Ground Tearing effect output Leave the pin to open when not in use The external reset input Initializes the chip with a low input. Be sure to execute a power on reset after supplying power MIPI DSI differential data pair (DSI Dn+/ ) If MIPI are not used, they should be connected to DGND MIPI DSI differential clock pair (DSI CLK+/ ) If MIPI are not used, they should be connected to DGND. MIPI DSI differential data pair (DSI Dn+/ ) If MIPI are not used, they should be connected to DGND 10 of 34

11 3.3.2 PCT PIN ASSIGNMENT No. Symbol Function 1 GND Ground 2 NC Not Connected 3 VDD Supply voltage 4 SCL I2C clock input 5 SDA I2C data input and output 6 INT External interrupt to the host 7 RST External Reset, Low is active 8 GND Ground. 11 of 34

12 3.4 Timing Characteristics High Speed Mode Clock Channel Timing 12 of 34

13 3.4.2 High Speed Mode Data Clock Channel Timing High Speed Mode Rise and Fall Timings 13 of 34

14 3.4.4 Low Speed Mode Bus Turn Around 14 of 34

15 3.4.5 Data Lanes from Low Power Mode to High Speed Mode Data Lanes from High Speed Mode to Low Power Mode 15 of 34

16 3.4.7 DSI Clock Burst High Speed Mode to/from Low Power Mode Reset input timing 16 of 34

17 3.4.9 Power on/off sequence 17 of 34

18 18 of 34

19 PCT I2C Timing GT911 provides a standard I2C interface for SCL and SDA to communicate with the host. GT911 always serves as slave device in the system with all communication being initialized by the host. It is strongly recommended that transmission rate be kept at or below 400Kbps. The I2C timing is shown below: GT911 supports two I2C slave addresses: 0xBA/0xBB and 0x28/0x29. The host can select the address by changing the status of Reset and INT pins during the power on initialization phase. See the diagram below for configuration methods and timings: 19 of 34

20 Timing for setting slave address to 0xBA/0xBB: 20 of 34

21 21 of 34

22 22 of 34

23 4.0 Optical Specification 4.1 Optical Characteristics Measuring instruments : Driving condition: Backlight: Measured temperature: LCD 5100, Eldim, Topcon BM 7 VDD = 3.3V, VSS = 0V IF=40mA Ta = 25 C Item Symbol Condition Min Typ Max Unit Note Response Time TR+TF θ=ф= ms 2 Contrast Ratio CR Normal Viewing Angle Viewing Angle Left θl 80 deg Right θr 80 deg CR 10 4 Up φu 80 deg Down φd 80 deg Red Rx Ry Colour Chromaticity Green Blue Gx Gy CR Bx By White Wx Wy Centre Brightness cd/m² 6 Brightness Distribution 80 % 7 23 of 34

24 4.1.1 Test Method Note Item Test Method 1 Setup The display should be stabilised at a given temperature for 30 minutes to avoid abrupt temperature change during measuring. In order to stabilise the luminance, measurements should be executed after lighting the backlight for 30 minutes in a windless room. 2 Response time Measure output signal waveform by the luminance meter when raster of window pattern is changed from white to black and from black to white. 3 Contrast ratio Measure maximum brightness and minimum brightness at the centre of the screen by displaying raster or window pattern. Then calculate the ratio between these two values. 4 Viewing angle Horizontal θ Vertical Ø Brightness of unselected position (white) Contrast Ratio (CR) = Brightness of selected position (black) Move the luminance meter from right to left and up and down and determinate the angles where contrast ratio is 10 5 Colour chromaticity 6 Centre brightness 7 Brightness distribution Measure chromaticity coordinates x and y of CIE1931 colorimetric system Measure the brightness at the centre of the screen (Brightness distribution) = 100 x B/A % A: max. brightness of the 9 points B: min. brightness of the 9 points 24 of 34

25 5.0 Backlight Specification 5.1 LED Driving Conditions Item Symbol Condition Min Typ Max Unit Forward Current IF Ta=25 C ma Forward Voltage VF Ta= 25 C 12.8 V LED life time Hr 50k hour Note: - The lifetime of the LED is defined as a period till the brightness of the LED decreases to the half of its initial value. - This figure is given as a reference purpose only, and not a guarantee. - This figure is estimated for an LED operating alone. The performance of an LED may differ when assembled as a monitor together with a TFT panel due to different environmental temperature. - Estimated lifetime could vary on a different temperature and usually higher temperature could reduce the life significantly. 5.2 LED Circuit LEDK LEDA LED Circuit Drawing 25 of 34

26 6.0 Quality Assurance Specification 6.1 Delivery Inspection Standards Inspection Conditions Inspection distance: 30 cm ± 2 cm Viewing angle: ± Environmental Conditions Ambient temperature: Ambient humidity: Ambient illumination: 25 C ±5 C 65±10% RH 300~700 lux Sampling Conditions 1. Lot size: quantity of shipment lot per model 2. Sampling method: GB/T Sampling Plan Normal inspection, Class II AQL No Major Defect 0.65% Minor Defect 1.5% Items to be inspected 1 Functional defects 2 Missing Missing component 3 Outline dimension Classification Criteria of defects 1) No display, Open or miss line 2) Display abnormally, Short 3) Backlight no lighting, abnormal lighting. 4) TP no function Major Overall outline dimension beyond the drawing is not allowed 4 Color tone Color unevenness, refer to limited sample 5 Spot Line defect 6 Soldering appearance Light dot,dim spot,polarizer Bubble ; Polarizer accidented spot. Good soldering, Peeling off is not allowed. Minor 26 of 34

27 6.1.4 Definition of Area Basic Principle A set of sample to indicate the limit of acceptable quality level shall be discussed should a dispute occur. 27 of 34

28 6.1.6 Inspection Criteria Number Items Criteria(mm) 1.0 LCD Crack/Broken NOTE: X: Length Y: Width Z: Height L: Length of ITO, T: Height of LCD (1) The edge of LCD broken X Y Z 3.0mm <Inner border line of the seal T (2)LCD corner broken X Y Z 3.0mm L T (3) LCD crack Crack Not allowed 28 of 34

29 1 light dot(lcd/tp/polarizer black/white spot, light dot, pinhole, dent, stain) Acceptable Qty Zone Size (mm) A B C Φ 0.10 Ignore 0.10<Φ ( distance 10mm) 0.25<Φ Ignore Φ> Dim spot(lcd/tp/polarizer dim dot, light leakage dark spot) Acceptable Qty Zone Size (mm) A B C Φ 0.1 Ignore 0.10<Φ ( distance 10mm) 0.25<Φ Ignore 2.0 Spot defect Y X Φ=(X+Y)/2 Φ> Polarizer accidented spot Zone Acceptable Qty Size (mm) A B C Φ 0.2 Ignore 0.3<Φ 0.5 2( distance 10mm) Ignore Φ> Pixel bad points(light dot,dim dot, color dot) Zone Acceptable Qty Size (mm) A B C Φ 0.1 Ignore 0.15<Φ ( distance 10mm) Ignore Φ> Polarizer Bubble Zone Acceptable Qty Size (mm) A B C Φ 0.2 Ignore 0.3<Φ 0.4 3(distance 10m) 0.5<Φ Ignore 0.6<Φ 0 29 of 34

30 3.0 Line defect (LCD/TP /Polarizer backlight black/white line, scratch, stain) Width(mm) Length(mm) Acceptable Qty A B C Φ 0.05 Ignore Ignore 0.05<W 0.06 L 4.0 N 3 Ignore 0.07<W 0.08 L 3.0 N <W Define as spot defect 4.0 Electronic Components SMT Not allow missing parts,solderless connection,cold solder joint,mismatch, The positive and negative polarity opposite 5.0 Display color& Brightness 1. Color:Measuring the color coordinates, The measurement standard accordin g to the datasheet or samples. 2. Brightness:Measuring the brightness of White screen, The measurement stan dard according to the datasheet or Samples. PCT Cover sensor accidented black/white spot Size Φ(mm) Φ <Φ 0.2 Acceptable Qty A B C Ignore 3(distance 10mm) 0.20<Φ Ignore Φ> Width(mm) Ignore(mm) Acceptable Qty A B C PCT Related PCT Cover scratch Φ 0.05 Ignore Ignore 0.05<W 0.06 L 4.0 N <W 0.08 L 3.0 N <W Define as spot defect PCT Cover Pinhole/ Lack of ink Zone Size (mm) Φ <Φ 0.2 Acceptable Qty C Ignore 3(distance 10mm) 0.25<Φ Φ> PCT Bonding bubble/ accidented spot Size Φ(mm) Φ <Φ 0.2 A Acceptable Qty Ignore 0.2<Φ B 3(distance 10mm) Φ> Assembly deflection beyond the edge of backlight 0.2mm 30 of 34

31 X Y Z TP cover broken X:length Y:width Z:height X 0.5mm Y 0.5m m Z<cover thickness * Circuitry broken is not allowed. X Z Y TP cover broken X:length Y:width Z:height X Y Z X 0.3mm Y 0.3mm Z<LCD thickness * Circuitry broken is not allowed. X Y Z Criteria ( functional items) Number Items Criteria (mm) 1 No display Not allowed 2 Missing segment Not allowed 3 Short Not allowed 4 Backlight no lighting Not allowed 5 TP no function Not allowed Classification of Defects Visual defects (except no or wrong label) are treated as minor defects, while electrical defects are treated as major defects. Two minor defects are equal to one major defect in lot sampling inspection Identification / marking criteria Any unit with illegible / wrong / double or no marking / label shall be rejected. 31 of 34

32 6.2 Dealing with Customer Complaints Non conforming analysis Purchaser should supply Densitron with detailed data of non conforming sample. After accepting it, Densitron should complete the analysis in two weeks from receiving the sample. If the analysis cannot be completed on time, Densitron must inform the purchaser Handling of non conforming displays If any non conforming displays are found during customer acceptance inspection which Densitron is clearly responsible for, return them to Densitron. Both Densitron and customer should analyse the reason and discuss the handling of nonconforming displays when the reason is not clear. Equally, both sides should discuss and come to agreement for issues pertaining to modification of Densitron quality assurance standard. 32 of 34

33 7.0 Reliability Specification 7.1 Reliability Tests Durability Test Test Item Test Condition Sample Size High Temperature Operation Low Temperature Operation High Temperature Storage Low Temperature Storage ESD Test Thermal Shock Resistance Box Drop Test Ta= 70 C 96h 3pcs Ta= 20 C 96h 3pcs Tp= 80 C 96h 3pcs Tp= 30 C 96h 3pcs 150pF, 330Ω, ±6KV (Contact)/±8KV (Air), 5 Points/panel, 10 times/point The sample should be allowed to stand the following 5 cycles of operation: LTS for 30 minutes > normal temperature for 5 minutes > HTS for 30 minutes > normal temperature for 5 minutes, as one cycle, then taking it out and drying it at normal temperature, and allowing it stand for 24 hours 1 Corner 3 Edges 6 faces, 80 cm (Medium Box) Note: Ta=ambient temperature Tp= Panel temperature 3pcs 3pcs 1 box Notes: 1. No dew condensation to be observed. 2. The function test shall be conducted after 4 hours storage at the normal temperature and humidity after removed from the test chamber. 3. No cosmetic or functional defects should be allowed. 4. Total current consumption should be less than twice the initial value. 33 of 34

34 8.0 Handling Precautions Safety If the LCD panel breaks, be careful not to get the liquid crystal fluid in your mouth or in your eyes. If the liquid crystal touches your skin or clothes, wash it off immediately using soap and plenty of water. Mounting and Design Place a transparent plate (e.g. acrylic, polycarbonate or glass) on the display surface to protect the display from external pressure. Leave a small gap between the transparent plate and the display surface. When assembling with a zebra connector, clean the surface of the pads with alcohol and keep the surrounding air very clean. Design the system so that no input signal is given unless the power supply voltage is applied. Caution during LCD cleaning Lightly wipe the display surface with a soft cloth soaked with Isopropyl alcohol, Ethyl alcohol or Trichlorotriflorothane. Do not wipe the display surface with dry or hard materials that will damage the polariser surface. Do not use aromatic solvents (toluene and xylene), or ketonic solvents (ketone and acetone). Caution against static charge As the display uses C MOS LSI drivers, connect any unused input terminal to VDD or VSS. Do not input any signals before power is turned on. Also, ground your body, work/assembly table and assembly equipment to protect against static electricity. Packaging Displays use LCD elements, and must be treated as such. Avoid strong shock and drop from a height. To prevent displays from degradation, do not operate or store them exposed directly to sunshine or high temperature/humidity. Caution during operation It is indispensable to drive the display within the specified voltage limit since excessive voltage shortens its life. Direct current causes an electrochemical reaction with remarkable deterioration of the display quality. Give careful consideration to prevent direct current during ON/OFF timing and during operation. Response time is extremely delayed at temperatures lower than the operating temperature range while, at high temperatures, displays become dark. However, this phenomenon is reversible and does not mean a malfunction or a display that has been permanently damaged. If the display area is pushed on hard during operation, some graphics will be abnormally displayed but returns to a normal condition after turning off the display once. Even a small amount of condensation on the contact pads (terminals) can cause an electro chemical reaction which causes missing rows and columns. Give careful attention to avoid condensation. Storage Store the display in a dark place where the temperature is 25 C ± 10 C and the humidity below 50%RH. Store the display in a clean environment, free from dust, organic solvents and corrosive gases. Do not crash, shake or jolt the display (including accessories). 34 of 34