MemxPro Flash Storage and DRAM Module Solutions for Embedded & Industrial Applications

Transcription

1 MemxPro Flash Storage and DRAM Module Solutions for Embedded & Industrial Applications

2 Vision. Passion. Make it Happen. MemxPro provides reliable DRAM and industrial flash memory and storage solutions with integrated design services to cater for demanding needs of enterprise and industrial EM customers. Products are used in a variety of applications including automation and manufacturing, environmental control, military and aerospace, network and communications, automotive and transportation, medical & healthcare, gaming, retail and more. With an experienced R&D project team, MemxPro s in-house developed VLSI, firmware, software and hardware devices, and high-quality industrial-grade storage solutions are developed under rigorous design and manufacturing procedures and quality management system practices. MemxPro strives to deliver high-quality products and unsurpassed service, becoming one of the leading brands for industrial memory solutions around the world. Experience & Industrial Expertise Familiar with controller & FPGA custom development Expertise in storage modules for industrial applications Partnering for new technology adoption Dedicated Service and Support Strong FAE teams to solve design and application challenges Product longevity support for longer product life cycles Trusted Quality and Reliability Tightly controlled and organized production and assembly 100% pre-shipment inspection Flexible and Customized Business Model Development of special functions and embedded peripherals & tools Software & firmware tailored solutions Core Competencies & Strengths 2

3 Committed to Quality Value added features and services are offered to satisfy functionality required for specific industrial market segments. MemxPro incorporates the latest technologies that deliver rugged protection, enhance data security and integrity, as well as optimize performance and endurance. MemxPro s in-house developed VLSI, firmware, software and hardware devices, and high-quality industrial-grade storage solutions are developed under rigorous design and manufacturing procedures and quality management system practices. A Customer Focused Company: The understanding of our customers expectations can help build mutually profitable and trusted relationships, and help us meet our commitments for quality, cost, schedules, safety, service and technology innovation. In addition to our professional experience, we actively research and make best use of preventive practices to ensure reliable risk management. ur continuous development and innovation is based upon efficient business processes, well-defined metrics, best practices, and customer surveys and feedback. Supply Chain Management: We strive to coexist and co-develop with our suppliers. We aim to form close partnerships to improve quality requirements and build consolidated and sustainable supplier relationships for reliable sourcing. The regular evaluation of suppliers materials helps us to improve supply chain quality assurance. Using the latest technology information and precise decision-making means we receive the best supply chain information, and through our structured data analysis, we can conduct effective control over cost, materials, and inventory. Increase customers overall satisfaction Continuous improvement in product innovation Proactively pursue quality and reliability Continual Internal Improvement and Innovation: Building quality into our day-to-day work is essential. MemxPro complies with IS standards and we constantly challenge ourselves to extend the limits for what is possible. We regularly conduct internal auditing and follow procedures that improve personnel training, the infrastructure and operational environment, equipment maintenance, and calibration management. At every stage including material purchasing, finished goods, stock and dispatch, production control and inspection, we ensure our customers can be assured of the best quality products and prices. Taking MemxPro DRAM Module & Flash Storage Quality to a ew Level Tested in the field for failure Tested for reliability during new product development Tested memory ICs from major brands 3

4 Storage Solutions for AI, Big Data and IoT The rise artificial intelligence (AI) and the needs of hyper-scale data centres demonstrate the highspeed and high-capacity demand of cloud storage facilities. It also reveals the tremendous opportunities for enterprise-class AI and data storage. Among the most notable AI and machine-learning storage trends, the use of memory and flash is predicted to increase. AI and machine learning will add yet more impetus to this trend, affecting all forms of storage as the primary storage medium to support faster decision-making at the network edge. Key among these is server-side flash storage, which is installed in a PCIe slot to work as local disk storage or a cache for a server. VMe/PCIe SSDs have several advantages when used for local server storage. ot only are they relatively cheaper than all-flash arrays of the same size, but PCIe eliminates the need for a host bus adapter (HBA) or drive controller while reducing latency and network connection costs. VMe operates over the flexible PCIe bus, and VMe SSDs have several options including PCIe AIC, M.2, and U.2. MemxPro launched two VMe SSDs U.2 PCIe and M.2 PCIe 2280, supporting PCIe Gen 3 x4 interface, paired with 3D AD, and high-density 7-mm height multi-terabyte MMC SSD, plus RDIMM and ECC DIMMs in various capacities. An essential objective of IoT is to obtain and analyze data from assets that were previously disconnected from most data processing tools. Fog and edge computing in manufacturing and automation applications are decentralized network and system architectures that attempt to collect, analyze, and process data from these assets more efficiently by reducing the amount of data sent to the cloud, decreasing network and Internet latency, and improving system response times in remote mission-critical applications. 4

5 Cloud Computing Server/Storage Solutions Enterprise class Built to last High capacity High performance Fog Computing Data Processing in a ode or IoT Gateway Security/encryption Data & network security Power loss protection Intelligent device monitoring Edge Computing Storage Solutions Industry standards & durability Small footprint Low power consumption Extended endurance In IoT applications, the ability to perform advanced on-device processing and analytics is referred to as "edge computing". Edge devices are now being created with increasingly sophisticated processing, analytical, and data storage capabilities. With edge computing, the opportunity for system architects is to learn how to harness the benefits of the available distributed computing power from end to end tapping into the capabilities of field devices, gateways, and cloud computing. In IoT applications, all edge devices at entry points at the front end sense and store data through gateways into local enterprise or cloud server providers. MemxPro provides application-specific storage devices targeted at four segments smart factory (Industry 4.0), smart city (smart retail, gaming, healthcare, and surveillance, etc.), government/defence/aerospace, and invehicle and transportation. MemxPro addresses different market needs by providing special technology features for different product lines. Aligned with emmc flash and proven mature SSD technology, MemxPro's new emmc SSD series provides a highcapacity solution with industry reliability and long-term support. MemxPro DRAM modules include SDRAM, DDR, and DDR2 legacy products for industrial usage. For DDR 3 and DDR 4, protective coating, anti-shock & vibration fixture design, and industrial grade wide temperature RAM modules are available and tailored to the customers specific application needs. In addition, MemxPro ARM/RISC DRAM modules use 32/64/72-bit SDIMMs for non-x86 architectures whose main application will be small footprint ARM and RISC based industrial tablets and portable devices. 5

6 IoT & Smart Device Applications In the era of IoT and big data, smart devices are developing fast and their storage requirements will become a fundamental part of their innovation and application. To meet this need, MemxPro s core technology advantage and renowned craftsmanship will focus on a wide range of DRAM memory and flash storage solutions committed to quality and reliability. Target Applications Embedded & Industrial IT In-vehicle & Transportation Defense & Aerospace Smart City Servers & Workstations (Retail/Medical/Gaming) ptimal capacities & 16GB /SATA III 16GB /SATA III 256GB /SATA III 8GB /SATA III 256GB /PCIe interface Price Moderate Moderate Less Sensitive Sensitive Less Sensitive Performance Average Average Sustainable Average Sustainable Durability (certification) High Highest Highest Moderate Highest Reliability High High Highest Moderate Highest Supply Consistent Consistent Consistent Moderate Consistent Small footprint High High Customized High Moderate Data security & encryption Moderate Moderate High Moderate High Lifespan optimization Moderate Moderate High Moderate High Power management Moderate High High Moderate High Device monitoring High High High High High Industrial-grade Automotive or rail standards Military standards Lite version Enterprise-grade Advanced Product Features The ability to compete in the enterprise and industrial market necessitates availability of products tailored to comply with militarygrade robustness, IP-based waterproof and dust-proof standards, industrial wide temperature operating ranges, power loss protection, and data security functions that can meet all the challenges of tough operating environments. Wide Temperature (-40 to 85 C) AES 256-bits Data Encryption Dust & Water Proof Through Conformal Coating Data Self-destruction (triggered by hardware or software) Side Fill for Shock & Resistant Power Plus for Sudden Power Failure Data Loss Prevention Write Protection (triggered by hardware or software) CP/VP (over current & voltage protection) Quick Erase (triggered by hardware or software) 30µ" Gold Finger Thickness 6

7 Flash Storage Solutions Product List Wide Temperature Solutions Dust & Water Proof Shock & Resistant Write Protect Quick Erase AES Data Encryption Data Selfdestruction Power Plus CP/VP 30µ" Gold Finger Thickness U.2 PCIe A4E M.2 PCIe A4E 2.5" SSD GT M3M 2.5" SSD GT-P M3M 2.5" SSD M3M 2.5" SSD Lite M3B 2.5" SSD Lite G3B 2.5" SSD M3A 2.5" SSD G3A 2.5" SSD M3A-A 2.5" SSD G3A-A 2.5" SSD M3A-B 2.5" SSD G3A-B 2.5" SSD M3A-P 2.5" SSD G3A-P 2.5" SSD M3A-C 2.5" SSD M3A-F 2.5" SSD M3A-H M.2 SATA M3M (2242) M.2 SATA M3B (2242) M.2 SATA G3B (2242) M.2 SATA M3M (2260) M.2 SATA M3M (2280) M.2 SATA M3B (2280) M.2 SATA G3B (2280) M.2 SATA M3A-C (2280) M.2 SATA M3M (22110) msata M3M msata M3B msata G3B Mini msata M3M Mini msata M3B Mini msata G3B Slim SATA M3M Slim SATA M3B Slim SATA G3B SATA Module II M3B-A SATA Module II G3B-A SATA Module M3B SATA Module G3B CFast M3B CFast G3B CF Card S6F ote: : Support, : ptional, : ot available 7

8 High-speed VMe SSD Solution 1 2 What is VMe? Architected for VM The industry standard interface for PCI Express Solid-State Devices +8% Eliminates hard drive legacy that SATA and SAS are based upon Power +4% 4.0GB/s % Baseline Power 2.0GB/s SATA 6Gb/s PCIe 8Gb/s (1 lane) 5 3 ptimized for ext Generation VM Works out of the Box Drivers for all major operating environments ew storage stack with low latency and small overhead 4 1.0GB/s 0.6GB/s Performance 3.5 PCIe 16Gb/s (6 lanes) PCIe 32Gb/s (4 lanes) Efficient & Scalable Streamlined protocol & command set, fewer clock cycles per I/ VM Express (VMe) is an open collection of standards and information designed to benefit non-volatile memory in all types of computing environments from mobile to data centres. VMe is designed from the ground up to deliver high bandwidth and low latency storage access for current and future VMe technologies. VMe was formed to remove the bottlenecks in legacy storage infrastructures designed for hard drives, with a streamlined protocol, scalable performance, and industry standard software and drivers. VMe benefits customers in several ways. First, unprecedented input/output operations per second (IPS). Second, performance across multiple cores to quickly access critical data through an optimized register interface and command set that simplifies host software, device firmware, and results in fewer CPU cycles per I/. Third, scalability with headroom for current and future VMe performance. Forth, end-to-end data protection capabilities and support for standard security protocols. And last but not the least, lower power consumption resulting in a lower total cost of ownership and carbon footprint. 8

9 U.2 & M.2 PCIe Take advantage of PCIe 3.0 x4 32Gb/s interface and the VMe protocol, MemxPro VMe SSDs greatly enhance computing performance. PCIe Gen3 x4 allows many times faster potential bandwidth than SATA 6Gb/s Paired with innovative 3D AD Flash Available in capacities from 128GB~512GB (U.2) Server datacenter, cloud computing, IoT and gaming platform for high speed requirements 3D AD 3D AD flash is an innovative type of flash memory in which the memory cells can be stacked vertically in multiple layers. Flash manufacturers developed 3D AD to address challenges they encountered in scaling 2D/planar AD technology to achieve higher densities at a lower cost per bit. 3D MLC allows flash capacity, performance, endurance, and power efficiency to be easily increased. 100,000 90, ,000 2D Planar AD 2D max. mono die density is limited to 128Gb for 11.5x13mm mobile package ECC Requirement 80,000 P/E Cycle 70,000 60,000 50,000 40,000 60, Gb 1Tb 30,000 20,000 10,000 10,000 5, GB 3,000 3, ,500 3D AD 3D allows further density scaling without increasing die size. 0 3xnm SLC 2xnm SLC 5xnm MLC 3xnm MLC 2xnm MLC 1xnm MLC TLC Process ode Product Model U.2 PCIe A4E M.2 PCIe M4E Interface PCIe Gen3 x4 PCIe Gen3 x4 Form Factor U.2 M.2 PCIe (2280) Flash Type 3D MLC 3D MLC Max. Channel 8 8 Density 128GB~512GB 128GB~256GB Sequential R/W (MB/sec, max.) 1441/ /497 perating Temperature 0 C~+70 C/-25 C~+85 C/-40 C~+85 C 0 C~+70 C/-25 C~+85 C/-40 C~+85 C Max. Power Consumption 5.82W (12Vx485mA) 4.39W (3.3Vx1330mA) Dimensions (LxWxH/mm) 100x70x9.3 22x80x3.5 perating Voltage 12V±5% 3.3V±5% Storage Temperature -55 C~+85 C -55 C~+85 C External DRAM Buffer ü ü Thermal Sensor ü ü S.M.A.R.T. ü ü TRIM ü ü Shock Resistance 1500G@0.5ms 1500G@0.5ms MTBF >3 million hours >3 million hours 9

10 SATA III emmc SSD Solution emmc integrates MLC AD Flash memory and an intelligent emmc controller inside one JEDEC standard package, providing a standard interface to the host. MemxPro emmc SSD series provides a scalable quality product line for industry and embedded system design. AD Flash e-mmc AD Flash AD Flash AD Flash Controller ECC Bad block management Wear levelling AD Flash driver 10 CLK CMD ECC Bad block management Wear levelling Data CE# WP# RB# RE# WE# ALE CLE I\'s Managed AD Controller emmc controller Managed AD driver

11 emmc SSD - M3M Series MemxPro M3M emmc SSD product family offers JEDEC emmc v5.1 features and is backward compatible to earlier emmc standards. High storage capacity up to 4TB Slim single board design in 7mm mechanical height up to 8 channels Extended and industrial temperature range (-25~+85 C/-40~+85 C) Enterprise data center, defense, transportation and portable applications Form factor: 2.5 SSD, M.2 SATA, msata, Mini msata, Slim SATA, SATA Module Features Standard, mature interface by JEDEC Reliability and longevity Small size, high capacity ptimal sequential write performance riginal extended temp ICs Benefits emmc integrates quality MLC AD memory and an intelligent emmc controller inside one JEDEC standard package, providing a standard interface to the host. Commonly used for mobile devices and enhanced storage solutions with recognized reliability. Proven endurance with integration of MLC AD memory. Achieves a smaller package size for higher storage capacity and better signal quality in a single board design. (Up to 4TB 2.5"-inch SSD / Up to 1TB msata & Slim SATA). Better sequential write speed for write-heavy applications, such as retail PS and video surveillance. Supports extended and industrial operating temperature range (-25~+85 C/-40~+85 C). MLC/StrongMLC/SLC SLC flash uses a single cell to store one bit of data and is rated at 60,000 program/erase cycles. MLC flash is more complex with four digital states in a single cell. This makes it denser for a specified area and cheaper to produce, but it wears out faster. The primary consideration of implementation determines which technology to use. MemxPro StrongMLC solution positions itself between SLC and MLC types to create endurance, performance, and a good price balance for a multitude of applications in industrial markets and embedded systems. StrongMLC has higher program/erase cycles of 20,000 times and its read/write performance is comparable with those of SLC. Flash technology SLC StrongMLC MLC TLC Bits per cell 1 bit 1 bit 2 bits 3 bits 1 0 1x 0x Higher performance and endurance Higher density / lower cost P/E cycle 60,000 20,000 3, ,500 P/E time Program µs/page µs/page µs/page ~ µs/page Erase 1.5-2ms/block 3ms/block 3ms/block ~4.5ms/block Cost per GB High Moderate Low Very Low 11

12 2.5 SSD 2.5" SSD GT M3M/M3M-P 2.5" SSD M3M 2.5" SSD Lite M3B/G3B 2.5" SSD M3A Product Model 2.5" SSD GT M3M 2.5" SSD GT M3M-P 2.5" SSD M3M 2.5 SSD Lite M3B 2.5 SSD Lite G3B 2.5" SSD M3A Interface SATA III Form Factor 2.5" SSD GT (SFF-8201) 2.5" SSD (SFF-8201) Flash Type MLC emmc MLC StrongMLC MLC Max. Channel 8 4 Density 2TB~4TB 16GB~1TB 16GB~256GB 8GB~128GB 16GB~512GB Sequential R/W (MB/sec, max.) 516/ / / / /453 perating Temperature -25 C~+85 C/-40 C~+85 C 0 C~+70 C/-25 C~+85 C/-40 C~+85 C Max. Power Consumption 6.6W (5Vx1320mA) 7.5W (5Vx1500mA) 5.5W (5Vx1100mA) 2.75W (5Vx550mA) 6W (5Vx1.2A) Dimensions (LxWxH/mm) 100x69.85x7 perating Voltage 5V±5% Storage Temperature -55 C~+95 C External DRAM Buffer /A Thermal Sensor ü ü ü ü ü ü DEVSLP Mode /A <5mW ATA Security ü ü ü ü ü ü S.M.A.R.T. ü ü ü ü ü ü TRIM ü ü ü ü ü ü Shock Resistance 1500G@0.5ms MTBF >3 million hours 2.5" SSD G3A 2.5" SSD M3A-P/G3A-P/M3A-H 2.5" SSD M3A-C Product Model 2.5" SSD G3A 2.5" SSD M3A-P 2.5" SSD G3A-P 2.5 SSD M3A-C 2.5" SSD M3A-H Interface SATA III Form Factor 2.5" SSD (SFF-8201) Flash Type StrongMLC MLC StrongMLC MLC MLC Max. Channel 4 Density 8GB~256GB 16GB~512GB 8GB~256GB 16GB~512GB Sequential R/W (MB/sec, max.) 552/ / / /453 perating Temperature 0 C~+70 C/-25 C~+85 C/-40 C~+85 C Max. Power Consumption 6W (5Vx1.2A) Dimensions (LxWxH/mm) 100x69.85x7 100x69.85x x69.85x x69.85x7 100x69.85x9.3 perating Voltage 5V±5% Storage Temperature -55 C~+95 C External DRAM Buffer ü ü ü ü ü Thermal Sensor ü ü ü ü ü DEVSLP Mode <5mW /A <5mW /A ATA Security ü ü ü ü ü S.M.A.R.T. ü ü ü ü ü TRIM ü ü ü ü ü Shock Resistance 1500G@0.5ms MTBF >3 million hours 12

13 M.2 SATA M.2 SATA M3M (22110) M.2 SATA M3M (2280) M.2 SATA M3B/G3B (2280) Product Model M.2 SATA M3M (22110) M.2 SATA M3M (2280) M.2 SATA M3B (2280) M.2 SATA G3B (2280) Interface SATA III SATA III SATA III Form Factor M.2 SATA (22110/D2) M.2 SATA (2280/D2) M.2 SATA (2280/S2/D2) Flash Type MLC emmc MLC StrongMLC Max. Channel 4 Density 16GB~512GB 16GB~256GB 8GB~128GB Sequential R/W (MB/sec, max.) 270/ / /421 perating Temperature -25 C~+85 C/-40 C~+85 C 0 C~+70 C/-25 C~+85 C/-40 C~+85 C Max. Power Consumption 2.64W (3.3Vx800mA) 3.3W (3.3Vx1.0A) Dimensions (LxWxH/mm) 22x110x3.5 22x80x3.5 22x80x2.15 / 22x80x3.5 perating Voltage 3.3V±5% Storage Temperature -55 C~+95 C External DRAM Buffer /A Thermal Sensor ü ü ü ü DEVSLP Mode /A <5mW ATA Security ü ü ü ü S.M.A.R.T. ü ü ü ü TRIM ü ü ü ü Shock Resistance 1500G@0.5ms MTBF >3 million hours M.2 SATA M3M (2260) M.2 SATA M3M (2242) M.2 SATA M3B/G3B (2242) Product Model M.2 SATA M3M (2260) M.2 SATA M3M (2242) M.2 SATA M3B (2242) M.2 SATA G3B (2242) Interface SATA III SATA III Form Factor M.2 SATA (2260/D2) M.2 SATA (2242/D2) M.2 SATA (2242/S2/D2) Flash Type MLC emmc MLC StrongMLC Max. Channel Density 16GB~512GB 16GB~256GB 16GB~128GB 8GB~64GB Sequential R/W (MB/sec, max.) 270/ / / /304 perating Temperature -25 C~+85 C/-40 C~+85 C 0 C~+70 C/-25 C~+85 C/-40 C~+85 C Max. Power Consumption 2.64W (3.3V x 800mA) 1.98W (3.3Vx600mA) 1.16W (3.3Vx350mA) Dimensions (LxWxH/mm) 22x60x3.5 22x42x3.5 22x42x2.15 / 22x42x3.5 perating Voltage 3.3V±5% Storage Temperature -55 C~+95 C External DRAM Buffer /A Thermal Sensor ü ü ü ü DEVSLP Mode /A <5mW ATA Security ü ü ü ü S.M.A.R.T. ü ü ü ü TRIM ü ü ü ü Shock Resistance 1500G@0.5ms MTBF >3 million hours 13

14 msata Product Model msata M3M msata M3B msata G3B Interface SATA III Form Factor msata (M300A) Flash Type MLC emmc MLC StrongMLC Max. Channel 8 4 Density 16GB~1TB 16GB~256GB 8GB~128GB Sequential R/W (MB/sec, max.) 532/ / /421 perating Temperature -25 C~+85 C/-40 C~+85 C 0 C~+70 C/-25 C~+85 C/-40 C~+85 C Max. Power Consumption 3.63W (3.3Vx1100mA) 2.9W (3.3Vx880mA) Dimensions (LxWxH/mm) 50.8x29.85x3.75 perating Voltage 3.3V±5% Storage Temperature -55 C~+95 C External DRAM Buffer /A Thermal Sensor ü ü ü DEVSLP Mode /A < 5mw ATA Security ü ü ü S.M.A.R.T. ü ü ü TRIM ü ü ü Shock Resistance 1500G@0.5ms MTBF >3 million hours msata M3M msata M3B/G3B Mini msata Product Model Mini msata M3M Mini msata M3B Mini msata G3B Mini msata M3M Mini msata M3B/G3B Interface SATA III Form Factor Mini msata (M300B) Flash Type MLC emmc MLC StrongMLC Max. Channel 2 Density 16GB~256GB 16GB~64GB 8GB~32GB Sequential R/W (MB/sec, max.) 133/ / /154 perating Temperature -25 C~+85 C/-40 C~+85 C 0 C~+70 C/-25 C~+85 C/-40 C~+85 C Max. Power Consumption 1.8W (3.3Vx550mA) 1.1W (3.3Vx320mA) Dimensions (LxWxH/mm) 26.8x29.85x3.5 perating Voltage 3.3V±5% Storage Temperature -55 C~+95 C External DRAM Buffer /A Thermal Sensor ü ü ü DEVSLP Mode /A <5mW ATA Security ü ü ü S.M.A.R.T. ü ü ü TRIM ü ü ü Shock Resistance 1500G@0.5ms MTBF >3 million hours Slim SATA Product Model Slim SATA M3M Slim SATA M3B Slim SATA G3B Interface SATA III Form Factor Slim SATA (M297) Flash Type MLC emmc MLC StrongMLC Max. Channel 8 4 Density 16GB~1TB 16GB~256GB 8GB~128GB Sequential R/W (MB/sec, max.) 532/ / /421 perating Temperature -25 C~+85 C/-40 C~+85 C 0 C~+70 C/-25 C~+85 C/-40 C~+85 C Max. Power Consumption 5.5W (5Vx1100mA) 2.75W (5Vx550mA) Dimensions (LxWxH/mm) 39.8x54x4 perating Voltage 5V±5% Storage Temperature -55 C~+95 C External DRAM Buffer /A Thermal Sensor ü ü ü DEVSLP Mode /A <5mW ATA Security ü ü ü S.M.A.R.T. ü ü ü TRIM ü ü ü Shock Resistance 1500G@0.5ms MTBF >3 million hours Slim SATA M3M Slim SATA M3B/G3B 14

15 SATA Module II SATA Module II (with housing) M3B/G3B SATA Module II M3B/G3B Product Model SATA Module II M3B-A SATA Module II G3B-A SATA Module II M3B-A SATA Module II G3B-A (with housing/180 ) (with housing/180 ) (no housing/180 & 90 ) (no housing/180 & 90 ) Interface SATA III Form Factor 7-pin (180 ) with housing 7-pin (180 / 90 ) Flash Type MLC StrongMLC MLC StrongMLC Max. Channel 2 Density 16GB~64GB 8GB~32GB 16GB~64GB 8GB~32GB Sequential R/W (MB/sec, max.) 348 / / / /154 perating Temperature 0 C~+70 C/-25 C~+85 C/-40 C~+85 C Max. Power Consumption 1.25W (5Vx250mA) Dimensions (LxWxH/mm) 40.4x24.4x x23.0x7.5 / 34.8x23.0x12.5 perating Voltage 5V±5% Storage Temperature -55 C~+95 C External DRAM Buffer /A Thermal Sensor ü ü ü ü DEVSLP Mode /A ATA Security ü ü ü ü S.M.A.R.T. ü ü ü ü TRIM ü ü ü ü Shock Resistance 1500G@0.5ms MTBF 3 million hours SATA Module SATA Module M3B/G3B SATA Module (with screw holes) M3B/G3B Product Model SATA Module M3B SATA Module G3B SATA Module M3B SATA Module G3B (180 & 90 ) (180 & 90 ) (with screw holes/180 & 90 ) (with screw holes/180 & 90 ) Interface SATA III Form Factor 7-pin (180 / 90 ) Flash Type MLC StrongMLC MLC StrongMLC Max. Channel 2 Density 16GB~64GB 8GB~32GB 16GB~64GB 8GB~32GB Sequential R/W (MB/sec, max.) 348 / / / /154 perating Temperature 0 C~+70 C/-25 C~+85 C/-40 C~+85 C Max. Power Consumption 1.25W (5Vx250mA) Dimensions (LxWxH/mm) 29.3x30.0x8.0 / 24.5x30.0x x40.4x12.5/36.5x40.4x8.0 perating Voltage 5V±5% Storage Temperature -55 C~+95 C External DRAM Buffer /A Thermal Sensor ü ü ü ü DEVSLP Mode /A ATA Security ü ü ü ü S.M.A.R.T. ü ü ü ü TRIM ü ü ü ü Shock Resistance 1500G@0.5ms MTBF 3 million hours 15

16 CFast /CF Card CFast M3B/G3B CF Card M6F/S6F Product Model CFast M3B CFast G3B CF Card S6F Interface SATA III PATA Form Factor CFast Type I CF Type I Flash Type MLC StrongMLC SLC Max. Channel 4 2 Density 16GB~256GB 8GB~128GB 256MB~16GB Sequential R/W (MB/sec, max.) 526/ / /142 perating Temperature 0 C~+70 C/-25 C~+85 C/-40 C~+85 C Max. Power Consumption 3.6W (3.3Vx1090mA) 1W (5Vx200mA), 0.72W (3.3Vx218mA) Dimensions (LxWxH/mm) 36.4x42.8x x42.8x3.3 perating Voltage 3.3V±5% 3.3V±5%, 5V±5% Storage Temperature -55 C~+95 C External DRAM Buffer /A Thermal Sensor ü ü A DEVSLP Mode <5mW A ATA Security ü ü ü S.M.A.R.T. ü ü ü TRIM ü ü /A Shock Resistance 1500G@0.5ms MTBF >3 million hours Flash Storage Product aming Guide 2.5" SSD M 3 A - P Form Factor Function 2.5" SSD Lite M.2 SATA A: Write Protect 2.5" SSD SATA Module B: Quick Erase 2.5" SSD GT M.2 PCIe C: AES Slim SATA U.2 PCIe F: Data Self-destruction & Power Plus msata CFast H: AES & Data Self-destruction & Quick Mini msata CF Card Erase & Write Protect & Power Plus Space: Standard Flash Type P: Power Plus M: MLC J: SATA Module + aluminum case S: SLC G: StrongMLC Controller Model A: 3D-MLC A: SMI SM2246E B: SMI SM2246XT Interface C: SMI SM619 1: SATA 1 D: SMI SM659 2: SATA 2 E: SMI SM2260 3: SATA 3 F: SMI2232EAC 4: PCIe Gen 3 M: MP808 6: PATA 16

17 SoftPro Service AP SDK S Customized UI SMARTPro SaveS Customer AP Customized Functions Pre-installed Service S.M.A.R.T. Library Monitor Analysis Reporting Windows Security Library Write Protect Data Selfdestruction Linux Rescue Library Backup Recovery Android SoftPro service supports solutions for S to applications, including pre-installed S, SSD related SDK, SMARTPro, and SaveS system recovery, simplifying your own software solution development. Pre-installed S Service MemxPro can help pre-install S into our storage products before delivering to you, so you won t need to bother with the hassle of loading an S. Multiple operating systems such as Microsoft Windows, Linux, or Android are supported. SDK for Customer Applications A software API layer sits between the S and user applications. MemxPro SDK supports a comprehensive portfolio of tools for SSD solutions and provides programmatic access to our storage devices. Currently the SDK includes S.M.A.R.T information, and security and rescue libraries that can be easily customized and integrated into your application. SMARTPro Professional and easy to use, SMARTPro is a MemxPro self-build intelligent monitoring management tool which is designed to provide product details and S.M.A.R.T. information for MemxPro SSDs. In addition to supporting MemxPro SATA 3 SSD series, SMARTPro 3.0 for Windows provides disk status for MemxPro s DRAM DIMMs and VMe PCIe Gen3 x4 SSDs. SMARTPro 3.0 also reveals a whole new user-friendly interface to display more disk information and graphs. ou can remotely monitor the health status, temperature and lifespan of each installed disk in the system anytime, anywhere. SaveS MemxPro s SaveS tool is a flexible system backup and recovery utility which is designed to protect your data in a few clicks. Under a Windows environment, SaveS protects against data failures from accidental file deletion, virus attack, S/ software corruption or overall system slowdown. 17

18 DRAM Module Solutions DRAM modules are used across a variety of industries. MemxPro DRAM modules include UDIMM, SDIMM, ECC DIMM, RDIMM, ARM/RISC based Mini DIMM, and customized DIMMs in a variety of DDR generations, DIMM types, transmission frequencies, and densities. Below are some of the products listed by features. Product List Wide Temperature Solutions Dust & Water Proof Write Protect Quick Erase AES Data Encryption Data Selfdestruction Power Plus CP/VP 30µ" Gold Finger Thickness DDR UDIMM DDR2 UDIMM DDR3/DDR3L UDIMM DDR4 UDIMM DDR SDIMM DDR2 SDIMM DDR3/DDR3L SDIMM DDR4 SDIMM DDR3/DDR3L Server/Workstation DDR4 Server/ Workstation XRDIMM RuggedDIMM DDR3/DDR3L ARM/RISC DDR4 ARM/RISC ote: : Support, : ptional, : ot available 18 Shock & Resistant

19 Three Industrial Memory Solutions Conformal Coating Memory Solution When electrical components need to withstand harsh environments, conformal coatings are an option to add protection. To meet customer requirements, we apply a special protective coating more than 60μ" thick on our DRAM module products. This process maintains long-term surface insulation resistance levels to ensure the operational integrity of the assembly. The coating also provides a barrier to moisture, dust, and chemical contaminants from the operating environment, such as salt spray, acid erosion, electrostatic damage and vulcanization, thus preventing short circuits and corrosion to achieve an IP65/68 rating. The coating enhances protection for components on DRAM modules from various aspects of environmental degradation. Anti and Shock Memory Solution MemxPro XRDIMM and RuggedDIMM are DDR3 and DDR4 expansion memory module products designed to meet embedded system requirements and work reliably in harsh shock and vibration environments. Enhanced ruggedness is achieved through the implementation of a pin-and-socket connector system and the use of standoffs with screw attachments firmly holding the CPU board and memory module together. The pin definition closely follows the SDIMM pin definition, so that a SBC or CM originally designed with a S-DIMM can be easily adapted to XRDIMM and RuggedDIMM operations. Industrial Wide Temperature perating Range All MemxPro DRAM modules series support -40 C~+85 C industrial wide operating temperatures for high reliability and superior performance under extremely cold and hot environments. MemxPro DRAM modules series are also available in standard and extended grade (-25 C~+85 C) temperatures. A thermal sensor built-into MemxPro memory modules helps prevent systems from overheating to further ensure stability. -40 C 85 C 19

20 UDIMM Product Model DDR DDR2 DDR3 / DDR3L DDR4 DIMM Type UDIMM Data Rate / Frequency 266/333/400 MT/s 533/667/800 MT/s 1066/1333/1600/1866 MT/s 2133/2400/2666 MT/s Capacity 256MB/512MB/1GB 512MB/1GB/2GB/4GB 1GB/2GB/4GB/8GB/16GB 4GB/8GB/16GB/32GB Voltage 2.5V 1.8V 1.5V / 1.35V 1.2V Pin Count 184-pin 240-pin 288-pin Width 16-Bit/32-Bit/64-Bit/72-Bit 32-Bit/64-Bit/72-Bit PCB Height 31.75mm 18.75mm ~ 30.00mm perating Temperature 0 C~+70 C/-25 C~+85 C/-40 C~+85 C 0 C~+85 C/-25 C~+85 C/-40 C~+85 C Shock Resistance 1500G@0.5ms SDIMM Product Model DDR DDR2 DDR3 / DDR3L DDR4 DIMM Type SDIMM Data Rate / Frequency 266/333/400 MT/s 533/667/800 MT/s 1066/1333/1600/1866 MT/s 2133/2400/2666 MT/s Capacity 256MB/512MB/1GB 512MB/1GB/2GB/4GB 1GB/2GB/4GB/8GB/16GB 4GB/8GB/16GB/32GB Voltage 2.5V 1.8V 1.5V / 1.35V 1.2V Pin Count 200-pin 204-pin 260-pin Width 16-Bit/32-Bit/64-Bit/72-Bit 32-Bit/64-Bit/72-Bit PCB Height 31.75mm 30.00mm 25.4mm ~ 30.00mm 25.4mm ~ 30.00mm perating Temperature 0 C~+70 C/-25 C~+85 C/-40 C~+85 C 0 C~+85 C/-25 C~+85 C/-40 C~+85 C Shock Resistance 1500G@0.5ms 20

21 Server / Workstation Product Model DDR3 / DDR3L DDR4 DIMM Type ECC DIMM / RDIMM Data Rate / Frequency 1066/1333/1600/1866 MT/s 2133/2400/2666 MT/s Capacity 1GB/2GB/4GB/8GB/16GB 4GB/8GB/16GB/32GB/64GB/128GB Voltage 1.5V/1.35V 1.2V Pin Count 240-pin 288-pin Width 72-Bit PCB Height 18.75mm ~ 30.00mm 18.75mm ~ 60.00mm perating Temperature 0 C~+85 C/-25 C~+85 C/-40 C~+85 C Shock Resistance 1500G@0.5ms ARM / RISC Product Model DDR3 / DDR3L DDR4 DIMM Type Mini DIMM Data Rate / Frequency 1066/1333/1600/1866 MT/s 2133/2400/2666 MT/s Capacity 1GB/2GB/4GB/8GB/16GB 4GB/8GB/16GB/32GB Voltage 1.5V/1.35V 1.2V Pin Count 244-pin 288-pin Width 32-Bit/64-Bit/72-Bit PCB Height 18mm ~ 30.00mm 18.75mm ~ 30.00mm perating Temperature 0 C~+85 C/-25 C~+85 C/-40 C~+85 C Shock Resistance 1500G@0.5ms 21

22 XRDIMM Product Model DDR3 / DDR3L DDR4 DIMM Type XRDIMM Data Rate / Frequency 1066/1333/1600/1866 MT/s 2133/2400/2666 MT/s Capacity 1GB/2GB/4GB/8GB/16GB 4GB/8GB/16GB/32GB Voltage 1.5V/1.35V 1.2V Pin Count 240-pin 300-pin Width 64-Bit/72-Bit PCB Height 37.30mm perating Temperature 0 C~+85 C/-25 C~+85 C/-40 C~+85 C Shock Resistance 1500G@0.5ms Rugged DIMM Product Model DDR3 / DDR3L DDR4 DIMM Type Rugged DIMM Data Rate / Frequency 1066/1333/1600/1866 MT/s 2133/2400/2666 MT/s Capacity 1GB/2GB/4GB/8GB/16GB 4GB/8GB/16GB/32GB Voltage 1.5V/1.35V 1.2V Pin Count 204-pin 260-pin Width 32-Bit/64-Bit/72-Bit PCB Height 40.00mm perating Temperature 0 C~+85 C/-25 C~+85 C/-40 C~+85 C Shock Resistance 1500G@0.5ms 22

23 DRAM Module Product aming Guide D 3 U 8G X X X X X X MemxPro DIMM Grade C: Commercial Memory Type W: Wide temp. S: SDRAM I: Industrial temp. 1: DDR1 E: Extended temp. 2: DDR2 3: DDR3 PCB S/ D: DDR3L 4: DDR4 CL 1: CL-2 A: CL-10 DIMM Type 2: CL-2.5 B: CL-11 A: FB-DIMM FR APPLEM: Mini RDIMM 3: CL-3 C: CL-12 B: 32-Bit DIMM : Mini ECC DIMM 4: CL4 D: CL-13 C: VLP RDIMM : C Unbuffered long DIMM 5: CL-5 E: CL-14 D: ECC SDIMM P: PLL/ECC SDIMM 6: CL-6 F: CL-15 E: ECC DIMM Q: Registered SDIMM 7: CL-7 G: CL-17 F: Fully Buffer DIMM R: Registered DIMM 8: CL-8 H: CL-19 G: VLP ECC DIMM S: SDIMM 9: CL-9 H: VLP ECC SDIMM T: FPDIMM 72PI K: VLP SDIMM U: UDIMM DIMM Data Rate L: Mini UDIMM V: VLP UDIMM A: 100 J: 800 B: 133 K: 1066 DIMM Density C: 166 L: : 8MB 2G: 2GB D: 200 M: : 32MB 4G: 4GB E: 266 : : 64MB 8G: 8GB F: 333: : 128MB AG: 16GB G: 400 P: : 256MB BG: 32GB H: 533 Q: : 512MB CG: 64GB I: 667 R: G: 1GB DG: 128GB Configuration IC Brand A: 16M *16 H:256*16 H: HynixB: 32M *16 I:512*8 M: MicronC: 64M *8 J:512*16 : anyad: 64M *16 K:1G*4 P: PromosE: 128M *8 L:1G*8 S: SamsungF: 128M *16 M:2048*4 X: MemxProG : 256M *8 :512Mx4 U: Uni-IC 23

24 The Memory Professional 4F.,. 32, Xiwei St., Sanchong Dist., ew Taipei City 241, Taiwan Tel: Fax: MXP V04 MemxPro reserves the right to change products, information and specifications without notice and is provided on an AS IS basis, without warranties of any kind. Products and specifications discussed herein are for reference purposes only. o license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppels or otherwise. For updates or additional information about MemxPro products, please contact MemxPro office.