Certificate of non-use of The Controlled Substances
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1 Certificate of non-use of The Controlled Substances Company name Littelfuse, Inc Product Covered Thyristor TO-92 Package EV series (Wire-Bonded) Issue Date It is hereby certified by Littelfuse, Inc, that there is neither RoHS (EU Directive 2002/95/EC)-restricted substance nor such use, for materials to be used for unit parts, for packing/packaging materials, and for additives and the like in the manufacturing processes. In addition, it is hereby reported to you that the parts and sub-materials, the materials to be used for unit parts, the packing/packaging materials, and the additives and the like in the manufacturing processes, are all composed of the following components. It is also certified by Littelfuse, Inc that the products listed in this report do not contain Halogens and their compounds judged per widely accepted industrial guidelines. Issued by < Koichiro Yoshimoto, Senior Product Engineer, > (1) Parts, sub-materials and unit parts This document covers Thyristor TO-92 Package EV series, supplied by Littelfuse, LP. Please see table 1 on page 2 for the list of products covered. <Materials used> Please see table 2 on page 3 and table 3 on page 4 of this document. (2) The ICP data on all measurable substances Please see annex 1 through 6 attached to this document. Remarks: 1. Pb (lead) contained in passivation glass on silicon wafer (item 6) to be categorized as exempt in RoHS Annex 7. Please refer to Annex 7 of this report for the extract of the applicable exemptions of RoHS (EU Directive 2002/95/EC) Page 1 of 3
2 Table 1: Littelfuse Part Number covered by this report Standard (Catalog) Part Number SPECIAL DEVICE P/N L0103DE L0103ME L0103NE MCR100-6 MCR100-8 S402ES Any Special P/N which has base standard P/N listed in this table. L0107DE S4X8ES S887S6X8ESRP L0107ME S4X8ES1 S890S4X8ES1 L1017NE S4X8ES2 S891S6X8ES1 L0109DE L0109ME L0109NE LX803DE LX803ME LX807DE LX807ME S602ES S6X8ES S6X8ES1 S6X8ES2 S8X8ES S8X8ES1 S8X8ES2 Any Standard Part Number listed here may be followed by suffix for packing options, such as RP or AP. # Description Table 2: Homogeneous Material Used Name of Type Analysis data Material 1 Lead finish Hot solder dip metal annex 1. 2 Molding compound Epoxy resin plastic annex 2. 3 Die bonding solder Solder metal annex 3. 4 Die bonding wire Gold metal annex 4 5 Lead frame copper alloy metal annex 5. 6 Silicon wafer silicon aluminum glass metal metal glass annex 6 Pb is from in passivation glass on wafer and is exempted by RoHS Annex 7. Please refer to Annex 7 for the RoHS exemption. Page 2 of 3
3 Table 3: RoHS-regulated substance in raw materials Components Analysis Result Cd Cadmium Cr Chromium Hg Mercury Pb Lead PBB PBDE Total Halogens As Component Total (Typical Values) < 2ppm < 2ppm < 2ppm <5 ppm* 1 < 5 ppm < 5 ppm <200ppm Outside lead finish (Hot-Tin dipping) See Annex 1 for the detail. Epoxy Resin compound (Mixture of resin, filler and fire retardant) See Annex 2 for the detail. Die Bonding Solder See Annex 3 for the detail. Die-bonding Wire (Au wire) See Annex 4 for the detail. Lead frame (Copper Alloy, KFC ) See Annex 5 for the detail. Silicon Die (Silicon + Metal electrode + passivation glass) See Annex 6 for the detail. < 2ppm < 2ppm < 2ppm 53ppm *2 < 5ppm < 5ppm --- < 0.5ppm < 1ppm < 2ppm < 5ppm < 5ppm < 5ppm 277 ppm < 2ppm < 2ppm < 2ppm 88wt% *3 < 5ppm < 5ppm --- < 0.5ppm < 1ppm < 2ppm < 5ppm < 5ppm < 5ppm --- < 2ppm < 2ppm < 2ppm < 2ppm < 2ppm < 2ppm < 2ppm 1.9% *4 < 5ppm < 5ppm < 50ppm *1 Less than 5ppm Pb content overall, excluding Pb from passivation glass on the silicon die. *2 Pb (lead) contained in outside finish is not exempted from restriction by RoHS, but considered as process contamination. Littelfuse does not add Pb (lead) intentionally. *3 Pb (lead) contained in die-bonding solder is exempted from restriction by RoHS Annex 7. *4 Pb (lead) contained in Silicon wafer is from passivation glass and is exempted from restriction by RoHS Annex 5. Please refer to Annex 7 of this report for the applicable exemptions of RoHS (EU Directive 2002/95/EC) Page 3 of 3
4 Annex 1: Analysis Result of Outside Lead Finish Material (Page 1 of 5) Annex 1-1
5 Annex 1: Analysis Result of Outside Lead Finish Material (Page 2 of 5) Annex 1-2
6 Annex 1: Analysis Result of Outside Lead Finish Material (Page 3 of 5) Annex 1-3
7 Annex 1: Analysis Result of Outside Lead Finish Material (Page 4 of 5) Annex 1-4
8 Annex 1: Analysis Result of Outside Lead Finish Material (Page 5 of 5) Annex 1-5
9 Annex 2: Analysis Result of Molding Compound (Page 1 of 6) Annex 2-1
10 Annex 2: Analysis Result of Molding Compound (Page 2 of 6) Annex 2-2
11 Annex 2: Analysis Result of Molding Compound (Page 3 of 6) Annex 2-3
12 Annex 2: Analysis Result of Molding Compound (Page 4 of 6) Annex 2-4
13 Annex 2: Analysis Result of Molding Compound (Page 5 of 6) Annex 2-5
14 Annex 2: Analysis Result of Molding Compound (Page 6 of 6) Annex 2-6
15 Annex 3: Analysis Result of Die-Bonding Solder (Page 1 of 6) Annex 3-1
16 Annex 3: Analysis Result of Die-Bonding Solder (Page 2 of 6) Annex 3-2
17 Annex 3: Analysis Result of Die-bonding Solder (Page 3 of 6) Annex 3-3
18 Annex 3: Analysis Result of Die-Bonding Solder (Page 4 of 6) Annex 3-4
19 Annex 3: Analysis Result of Die-Bonding Solder (Page 5 of 6) Annex 3-5
20 Annex 3: Analysis Result of Die-Bonding Solder (Page 6 of 6) Annex 3-6
21 Annex 4: Analysis Result of Die-bonding Wire (Page 1 of 4) Annex 4-1
22 Annex 4: Analysis Result of Die-bonding Wire (Page 2 of 4) Annex 4-2
23 Annex 4: Analysis Result of Die-bonding Wire (Page 3 of 4) Annex 4-3
24 Annex 4: Analysis Result of Die-bonding Wire (Page 4 of 4) Annex 4-4
25 Annex 5: Analysis Result of Lead Frame (page 1 of 4) Annex 5-1
26 Annex 5: Analysis Result of Lead Frame (page 2 of 4) Annex 5-2
27 Annex 5: Analysis Result of Lead Frame (page 3 of 4) Annex 5-3
28 Annex 5: Analysis Result of Lead Frame (page 4 of 4) Annex 5-4
29 Annex 6: Analysis Result of Silicon Wafer (Page 1 of 7) Annex 6-1
30 Annex 6: Analysis Result of Silicon Wafer (Page 2 of 7) Annex 6-2
31 Annex 6: Analysis Result of Silicon Wafer (Page 3 of 7) Annex 6-3
32 Annex 6: Analysis Result of Silicon Wafer (Page 4 of 7) Annex 6-4
33 Annex 6: Analysis Result of Silicon Wafer (Page 5 of 7) Annex 6-5
34 Annex 6: Analysis Result of Silicon Wafer (Page 6 of 7) Annex 6-6
35 Annex 6: Analysis Result of Silicon Wafer (Page 7 of 7) Annex 6-7
36 Annex 7: Applicable RoHS exemptions Annex 7
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