9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

Transcription

1 9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) info@systemplus.fr - website : August Version 1 Written by: Sylvain HALLEREAU DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners by SYSTEM PLUS CONSULTING, all rights reserved. Analog Devices ADMP421 Microphone MEMS 1

2 Table of Contents Glossary 1. Overview / Introduction Executive Summary Reverse Costing Methodology 2. Company Profiles Physical Analysis Physical Analysis Methodology Package Characteristics & Markings Package X-Ray Package Composition Package Opening & Bonding Number Package Cross-Section ASIC Markings ASIC Dimensions ASIC Minimal Dimension and Metal Layers ASIC Transistor Details ASIC Process Characteristics Microphone Markings Microphone Dimensions Microphone Details Microphone Structure Microphone Cross-Section Microphone process characteristics 4. Manufacturing Process Flow.. 44 Overview ASIC Process Flow Microphone Process Flow Packaging Process Flow Description of the Wafer Fabrication Units 5. Cost Analysis Synthesis of the Cost Analysis Main Steps of Economic Analysis Supply Chain Analysis Yields Explanation ASIC Wafer Cost Hypothesis ASIC Wafer Cost ASIC Probe & Dicing cost ASIC Die Cost Microphone Wafer Cost Hypothesis Microphone Wafer Cost Microphone Wafer : Equipment Cost per Family Microphone Wafer : Material Cost per Family Microphone Probe Cost Microphone Dicing Cost Microphone Die cost ADMP421 Packaging Cost Hypothesis ADMP421 Packaging Process Flow ADMP421 Packaging Cost Details ADMP421 Final Test Cost ADMP421 Component Manufacturing Cost Yield Synthesis ADMP421 Cost Analysis Evolution 6. Estimated Manufacturer Price Analysis...85 Manufacturer financial ratios Estimated manufacturer Price Conclusion Glossary 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Analog Devices ADMP421 Microphone MEMS 2

3 Package Composition The Package is composed of a Metal Cap electrically connected with a conductive adhesive on a FR4 substrate. The two dies are glued with a silver filled epoxy resin on the bottom portion of the package and wire bonded. The ASIC die is encapsulated with a glob-top epoxy resin. Package bottom view Glob-Top Wire bonding Conductive adhesive Copper layer ASIC Micro Bottom portion Schematic package composition Acoustic Port 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Analog Devices ADMP421 Microphone MEMS 3

4 Package Opening Bondings number Microphone ASIC die covered by hard glob-top (epoxy resin with silicon filler) Package Opening Bonding number : 7 Bonding material : Au Bonding number between ASIC & Microphone : 2 Bonding number between ASIC & Package : by SYSTEM PLUS CONSULTING, all rights reserved. Analog Devices ADMP421 Microphone MEMS 4

5 Package Cross-Section The PCB Substrate is drilled to form the Acoustic Port The MEMS and the ASIC circuit are glued on the substrate. 7 wire bondings are performed. Excess Glue The Metal Cap is glued with a silver epoxy glue on the substrate. Metal Cap Cavity Glob Top ASIC Acoustic MEMS PCB Substrate Acoustic Port Silver epoxy glue 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Analog Devices ADMP421 Microphone MEMS 5

6 1.04mm Microphone Dimensions 1.026mm MEMS area: mm² 1.04mm x 1.03mm MEMS thickness : 330µm Pads number : 2 connected to ASIC 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Analog Devices ADMP421 Microphone MEMS 6

7 Microphone Dimensions Anti Stiction Dispositif Diaphragm spring Diaphragm A distortion above each acoustic hole Small holes used to avoid the stiction between the back plate and the diaphragm during the release step by SYSTEM PLUS CONSULTING, all rights reserved. Analog Devices ADMP421 Microphone MEMS 7

8 MEMS Process Flow The 3 sacrificial oxides are etched. The resin is etched with a plasma. The MEMS are diced using a stealth dicing equipment by SYSTEM PLUS CONSULTING, all rights reserved. Analog Devices ADMP421 Microphone MEMS 8

9 Packaging Process Flow Package: Substrate: Process: 4-layers FR4 PCB panel Wire Bonding Package PCB substrate Package Dies bonding ASIC + MEMS ASIC Micro Package Wire Bonding ASIC Glob-top Deposition + Curing ASIC Micro 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Analog Devices ADMP421 Microphone MEMS 9

10 Microphone Wafer Cost per equipment family The main part of the equipment cost is due to the etching steps (50%). The very long DRIE etching step and the sacrificial etching steps explain that. Details of the cost per step are given in the Excel Spreadsheet. Microphone Equipment Cost per Family 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Analog Devices ADMP421 Microphone MEMS 10

11 Conclusion The reverse costing analysis represents the best cost/price evaluation given the publically available data, completed with industry expert estimates. Given the hypothesis presented in this analysis the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated) IC +/- 8% MEMS +/- 5% Packaging +/- 10% Test +/- 20% These results are open for discussion. We can re-evaluate this circuit with your information. Please contact us: 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Analog Devices ADMP421 Microphone MEMS 11